KR100866045B1 - Method for manufacturing cluster lamp device - Google Patents

Abstract

A method for manufacturing a cluster lamp device is provided to improve a dampproof effect, a waterproof effect, and workability by coupling or fixing components and applying a molding member and a protective member at the same. A body(10), an LED module, a cover(30), a cable, and a protective member are prepared. An input side cable(42) of the cable is connected to an input terminal of the LED module. An output terminal of a terminal is connected to an output side cable(44) of the cable. The LED module connected to the cable is arranged at a support unit. The body and the LED module are mutually fixed by applying a transparent molding member to the body and the LED module. The transparent molding member is applied to each LED of the LED module for dampproofing and waterproofing. A protective member is sealed inside the bottom of the body. A coupling unit is fixed and coupled to a connection unit of the body.

Description

Method for manufacturing cluster lamp device

The present invention relates to a method for manufacturing a cluster lamp device for irradiating the light produced by being installed on various installation structures, and more particularly, dust, waterproof and moisture proof effect is improved, in particular damage of components that may occur during manufacturing And it relates to a method of manufacturing a cluster lamp device capable of completely preventing a failure.

In general, various types of lamps are used to provide light or to irradiate an object at night or indoors. Such lamps are powered by converting electrical energy into light energy to provide light or irradiate an object, and generally use incandescent lamps or fluorescent lamps.

Recently, due to the advantage of being able to perform a variety of color output in spite of being expensive, a lamp using an LED (Light Emitting Diode) has been proposed and widely used. However, such LED lighting has a problem that the efficiency is lowered by the heat generated when used for a certain time, the long-term use eventually increases the amount of heat generated to shorten the life.

On the other hand, techniques for preventing shortening of life due to long-term use and excessive heat generation have been proposed, as an example of the lamp, also known as a light emitting diode cluster lamp disclosed in Korea Patent Publication No. 10-2008-0025692 It is.

Korean Patent Publication No. 10-2008-0025692 discloses a light emitting diode cluster lamp including a plurality of light emitting diode lamp packages, and a control circuit module for controlling the light emitting diode lamp packages, wherein each of the light emitting diode lamp packages includes: A heat transfer / dissipation module including a heat transfer device having a flat portion, at least one heat dissipation fin installed on an outer circumference of the heat transfer device, and a light emitting diode module disposed on the flat portion of the heat transfer device, When the diode cluster lamp is connected to a power supply, the control circuit module selectively controls the light emitting diode modules to emit light, and heat generated while one of the light emitting diode modules emits light is emitted from the one light emitting diode module. From at least the flat portion of the heat transfer device corresponding to It is configured and operated to be divergent to the at least one heat dissipation pin after being delivered to one of the heat dissipation pins.

By such a configuration and operation, it is possible to immediately dissipate the heat generated by the light emitting diode module to improve heat dissipation efficiency, high intensity and high brightness is maintained, it is possible to implement a variety of colors. Various types of lamps or lights are used to provide light or illuminate objects at night or indoors.

However, the conventional Korean Patent Publication No. 10-2008-25692 discloses a gap in the connection or coupling portion between the components, in which water or dust flows in, or moisture is generated in the LED module, causing failure and malfunction. In addition, it cannot be installed easily and quickly according to the installation location or installation object, and the product quality is deteriorated due to the inconspicuous appearance. There is a problem that is not easy.

In particular, the production of such a conventional lamp due to excessive heat in the process for the waterproof or moisture-proof, there is a problem that causes damage or failure of the components of the LED module or poor adhesion.

The present invention has been made in view of the above-mentioned various problems, and an object of the present invention is excellent in moisture-proof, waterproof and dust-proof effects, can be easily and stably combined or fixed to each other components, and during the moisture-proof and waterproof treatment It is to provide a cluster lamp device manufacturing method that can prevent thermal damage and failure of the components of the LED module.

In order to achieve the above object, the cluster lamp device manufacturing method according to the present invention includes: a main body having a connection part, a support jaw and a support part formed of a heat dissipation part, a horizontal part and a vertical part of an uneven shape; A printed circuit board, a plurality of LEDs, a DC-DC converter, an IC, a plurality of resistors, a capacitor and a diode, a terminal comprising an input side terminal having first to fifth contacts and an output side terminal having first to fifth contacts, An LED module comprising a molding member applied to both surfaces of the printed circuit board and a local molding member applied locally to each of the LEDs; A cover having a coupling part formed of an irradiation part, a horizontal part and a vertical part, a support end, and two installation members; A cable comprising an input side cable having an input side wire having a first wire and a fifth wire and an input side cable having an input side wire having a first wire and a fifth wire; A method of manufacturing a cluster lamp device including a protection member for closing a lower inner space of the main body, comprising: preparing the main body, an LED module, a cover, a cable, and a protection member; Connecting the input side cable of the cable to the input side terminal of the terminal of the LED module, and connecting the output side cable of the cable to the output side terminal of the terminal; Arranging an LED module to which the cable is connected to a support of the main body such that a rear surface of the LED is installed upward; First fixing the main body and the LED module to each other by applying a transparent molding member to the entire printed circuit board of the LED module and a boundary between the main body and the LED module; Applying a transparent molding member to each of the LEDs for moisture proof and waterproofing of each of the LED modules;

Closes a part of the inner space of the lower part of the main body and protects the surface of the LED module 20 and the DC-DC converter, IC, a plurality of resistors, capacitors and diodes, the connection between the LED module and the cable and the main body Sealing a protection member on the inside of the body for coupling and fixing between the LED module; And coupling and fixing the coupling part of the cover to the connection part of the main body to complete the cluster lamp device.

As described above, according to the method of manufacturing the cluster lamp device according to the present invention, the coupling or fixing between the respective components is performed simultaneously with the application of the molding member and the protection member, so that the moisture-proof, dust-proof and waterproof effect and workability are improved. By reversing the module to prevent failure, failure and malfunction of the components constituting the LED module, there is a remarkable effect that can prevent thermal damage and failure of the components during the molding member and protective member coating process.

Best Mode for Carrying Out the Invention An embodiment of a cluster lamp device according to the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view showing a cluster lamp device to which the manufacturing method of the present invention is applied, FIG. 2 is a perspective view in which the cluster lamp device of FIG. 1 is assembled, and FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2. 4 is a perspective view showing the structure of the cable of the cluster lamp device of Figure 1 in detail, Figure 5 is a connection and installation state diagram of the cluster lamp device manufactured by the manufacturing method according to the invention, Figures 6 to 12 Process diagram showing a method of manufacturing a cluster lamp device according to the present invention.

First, the cluster lamp device manufactured by applying the manufacturing method according to the present invention will be described. In FIGS. 1 to 5, reference numeral 10 denotes a main body which can be stably fixed or arranged at various installation places and positions. The main body 10 is made of aluminum which is lightweight and has excellent heat dissipation performance. In addition, the body 10 may be surface treated by an anodizing process to prevent oxidation and to improve durability.

On the outer side of the main body 10, a heat radiating portion 11 is formed in a concave-convex shape so as to dissipate heat generated by the LED module to be described later to the outside, as well as the operator can easily grip during installation.

On the upper surface of the main body 10 is formed a coupling portion 12 to be detachably connected to the cover to be described later. As shown in the drawing, the connection part 12 includes a horizontal part 122 forming a horizontal portion and a vertical part 124 formed vertically upwardly on the horizontal part 122.

In particular, the horizontal portion of the connection portion 12 is formed in a circular shape along the whole of the O-ring groove 1222 is inserted into the O-ring (O) to achieve a waterproof and dust-proof action with the bottom of the cover to be described later, On the outside of the vertical portion 124 of 12, a spiral 1242 is formed in which a spiral formed inside the cover to be described later is releasably coupled.

In addition, the support jaw 13 is formed along the periphery of the upper surface of the main body 10 so as to maintain the coupling range of the cover to be described later as well as to support the cover more stably.

In addition, the upper portion of the main body 10 is formed with a support 14 for supporting and fixing the LED module to be described later in the form of a stage (段).

Reference numeral 20 is an LED module for actually emitting light for lighting or image realization. The LED module 20 is formed in a circular shape to correspond to the cross-sectional shape of the main body 10, that is, to be stably supported and fixed to the support 14 of the main body 10.

The LED module 20 includes a disk-shaped printed circuit board 21 disposed on the support part 14 of the main body 10. Basically, the printed circuit board 21 is provided with a plurality of LEDs 22 capable of emitting light of various colors at appropriate positions of the printed circuit board 21. The number of the LEDs 22 may be selectively determined according to the size or capacity of the cluster lamp. In particular, each of the LED 22 is protruded to the rear surface of the printed circuit board 21. The reason why the respective LEDs 22 are installed on the rear surface of the printed circuit board 21 is that the respective components constituting the LED module 20 may be generated by internal and external temperature differences. To protect from moisture.

On the surface, that is, the upper surface of the printed circuit board 21, various kinds of resistors, capacitors, terminals, etc. connected to the respective LEDs 22 are installed at appropriate positions. In particular, the upper surface of the printed circuit board 21, even when a plurality of cluster lighting lamps are connected to each other in series over a long range or a wide range, the control signal and the rated power to the LED 22 of each cluster lighting lamp constant The DC-DC converter 23 is installed to transmit and maintain the same to provide uniform color and illuminance. That is, the DC-DC converter 23, the rated voltage of each LED 22 is set to 5.2V, 5 to 36V in the server or power supply (not shown) to operate a plurality of cluster lamps connected in series In the case of supplying 24V within the SPEC Voltage range, each cluster lamp, as well as the final cluster lamp, is converted to the rated voltage and supplied to the LED 22, thereby maintaining a uniform color and illuminance at all times. Do it. The DC-DC converter 23 includes a power inductor 23a for receiving power, an IC 23b for converting DC-DC power to a rated voltage, and a capacitor 23c for accumulating and maintaining a rated voltage. And a diode 23d for maintaining the electric shock voltage without a load and a short circuit. In addition, the printed circuit board 21 is provided with an IC 24a for stably receiving a control signal transmitted from a server (not shown) or a previous cluster lamp. Of course, the surface of the printed circuit board 21, a plurality of resistors (24b), capacitors for maintaining the function of the respective LED 22, DC-DC converter 23 and IC 24a normal and stable 24c and diodes 24d are respectively installed in position and are connected to the circuit.

In addition, a plurality of terminals 25 are provided on the printed circuit board, and the terminal 25 has an input side terminal 252 connected to an input side cable among the cables to be described later and an output side terminal 254 corresponding thereto in a line with each other. It is installed symmetrically. The input terminal 252 includes a first contact 2521, a second contact 2522, a third contact 2523, a fourth contact 2524, and a fifth to which five wires constituting an input side cable to be described later are connected. The contact 2525 is configured to correspond to the output terminal 254. The first contact 2581, the second contact 2542, and the third contact 2543 are connected to five wires constituting the output-side cable described below. And a fourth contact 2544 and a fifth contact 2545. On the other hand, between each of the contacts corresponding to each other, the identification characters corresponding to the color of each wire of the cable described later is printed or indexed. That is, RED, which means red color, between the first contacts 2521 and 2581, BK, which means black, between the second contacts 2522 and 2542, and green between the third contacts 2523 and 2543. The GRN means WHITE which means white color between the fourth contact points 2524 and 2544, and the BLUE means blue means between the fifth contact points 2525 and 2545.

On the other hand, it is preferable that the molding member 26 is applied to both surfaces of the printed circuit board 21 for firm and stable coupling or fixing with the main body 10. The molding member 26 is formed of a transparent epoxy.

In particular, each LED 22 is coated with a local molding member 27, also called transparent clear mold, in order to prevent penetration of moisture or moisture. The local molding member 27 is formed by mixing a transparent epoxy and a transparent waterproof coating liquid. The weight ratio of the transparent epoxy to the transparent coating solution is mixed 95 ~ 97: 5 ~ 3. Here, if the weight ratio of the transparent coating liquid is 95% or less, the viscosity or concentration may be lowered, thereby lowering the adhesion to the LED 22, and if it is more than 97%, the resistance to moisture or moisture may be lowered. Therefore, the weight ratio of the most transparent transparent epoxy and the clear coating liquid is 96: 4.

Reference numeral 30 denotes a cover for shielding the upper portion of the main body 10 and the entire LED module 20. The cover 30 is formed of durable polycarbonate to prevent damage due to external impact and to stably protect the LED module 20.

The upper part of the cover 30 is formed with an irradiation unit 31 for emitting the light produced by the light emission of each of the LED 22 of the LED module 20 to the outside. The irradiation part 31 is formed in a semi-circular or hemispherical shape and is formed in a transparent or semi-transparent.

The lower portion of the cover 30 is formed with a coupling portion 32 corresponding to the connection portion 12 of the main body 10 and releasably connected to the connection portion 12. The coupling part 32 is a horizontal part 322 corresponding to the horizontal part 122 of the connection part 12 of the main body 10, and is formed perpendicularly upwardly to the horizontal part 322 and the connection part 12. It consists of a vertical portion 324 corresponding to the vertical portion 124 of the ().

The horizontal portion 322 of the coupling portion 32 corresponds to the O-ring groove 1222 of the horizontal portion 122 of the connecting portion 12 of the main body 10 so that the O-ring (O) can be inserted into Another o-ring groove 3222 is formed in a semi-circular shape so as to form a complete circle with the O-ring groove 1222.

In addition, the spiral portion 3242 releasably coupled to the spiral 1242 formed on the outer side of the vertical portion 124 of the connecting portion 12 of the main body 10 to the vertical portion 324 of the coupling portion 32. Is formed.

On the other hand, the entire outer surface of the coupling portion 32 when the cover 30 is coupled to the main body 10, a plurality of protrusions (3244) for preventing the operator's hand slipping formed at a predetermined interval do.

And the upper end of the coupling portion 32, the support end 33 that can be stably supported and fixed to the support jaw 13 of the main body 10 is formed along the periphery.

In particular, at an appropriate position of the lower portion of the cover 30, the installation member 34 for easy, robust and stable installation in the bracket 100, the installation hole 102 is formed protrudes outward symmetrically with each other Is formed.

Each installation member 34 is formed corresponding to the through coupling hole 104 formed in the installation hole 102 of the bracket 100. The mounting member 34 may be used to insert and fix the front of the mounting hole 102 of the bracket 100 to the front.

In particular, one side of each of the mounting member 34, more specifically inserted into the installation hole 102 of the bracket 100, and then easily reversed to rotate in a fixed direction or reverse removal The support surface 342 in contact with the surface of the bracket 100 when rotating in the direction forms a curved surface for stable and warning contact fixation with the surface of the bracket 100 at the same time as the cluster lamp device is easily rotated. Or rounded. In addition, the support surface 342 of the installation member 34 is rounded in this way, so that the gap between the both ends of the support surface 342 and the surface of the bracket 100 when rotating in the fixed direction or the release direction. By this, easy rotation can be performed. Of course, the support surface 342 is able to achieve a firm and stable fixing with each other by the pressure contact with the surface of the bracket 100 by the convex shape of the central portion.

Reference numeral 40 is a cable connected to the LED module 20. The cable 40 is an input cable 42 connected to the input terminals 252 of the LED module 20 and an output cable connected to the output terminals 254 of the LED module 20 accordingly. It consists of 44.

The input side cable 42 has a plurality of wires 422 connected to the input side terminal 252 of the terminal 25 of the LED module 20. Each of the plurality of wires 422 has one end connected to a first wire 4221 connected to a first contact 2521 of the input side terminal 252, and a second wire 4422 connected to a second contact 2522. , The third wire 4223 connected to the third contact 2523, the fourth wire 4224 connected to the fourth contact 2524, and the fifth wire 4225 connected to the fifth contact 2525. Is done. In this case, each of the wires may be color-coded corresponding to the contacts, so that the first wire 4221 is red, the second wire 4422 is black, and the third wire 4223 is green. The fourth wire 4224 is identified as white, and the fifth wire 4225 is identified as blue.

In addition, one end of the input side cable 42 is provided with a plug 424 to which the other end of each of the wires 4221 to 4225 are connected. The plug 424 is, of course, a first plug terminal 4241 connected to the first wire 4221, a second plug terminal 4242 connected to the second wire 4422, and the third wire ( The third plug terminal 4241 connected to the 4223, the fourth plug terminal 4244 connected to the fourth wire 4224, and the fifth plug terminal 4245 connected to the fifth wire 4225. Is made of.

In addition, the input side cable 42 includes a covering member 426 for protecting the respective wires 4221 to 4225. The covering member 426 may include an inner material 4421 formed of paper to prevent the generation of moisture as well as primarily wrapping the respective wires 4221 to 4225, and the inner material 4421 and the respective wires. It is made of an outer material 4422 formed of rubber or synthetic resin in order to finally protect (4221 ~ 4225).

Meanwhile, a support line 427 is provided at the center of the input side cable 42, that is, at the center of each of the wires 4221 to 4225 to prevent twisting between the respective wires 4221 to 4225 and to maintain a stable state. The support line 427 is formed of a thread.

In addition, an end portion of the input side cable 42 is provided with a connector 428 for protecting the respective plug terminals 4241 to 4245 and for connecting to the output side cable described later. A male spiral 4421 is formed around the end of the connector 428 so as to be screwed with the connector of the output side cable to be described later. In addition, an index 429 is formed to protrude in the longitudinal direction on the inside of the connector 428 for accurate connection with the output side cable.

The output cable 44 is formed corresponding to the input cable 42 described above. That is, the output side cable 44 has an output side wire 442 connected to the output side terminal 254 of the LED module 20. Each of the output wires 442 has a first wire 4421 connected at one end thereof to a first contact 2551 of the output terminal 254, and a second wire 4422 connected to a second contact 2542. A third wire 4423 connected to the third contact 2543, a fourth wire 4424 connected to the fourth contact 2544, and a fifth wire 4425 connected to the fifth contact 2545. Is done. In this case, the first wire 4421 is red, the second wire 4422 is black, and the third wire 4423 is formed so that the respective wires may be color-coded to correspond to the contacts 2541 to 2545. ) Are identified as green, fourth wire 4424 as white, and fifth wire 4425 as blue.

In addition, one end of the output cable 44 is provided with a socket portion 444 to which the other end of each of the wires 4421 to 4425 is connected and to which the plug 424 is connected. The socket portion 444 as well as a first socket hole 4442 connected to the first wire 4421, a second socket hole 4442 connected to the second wire 4422, and the third wire A third socket hole 444243 connected to the 4423, a fourth socket hole 4444 connected to the fourth wire 4424, and a fifth socket hole 4445 connected to the fifth wire 4425. )

In addition, the output side cable 44 includes a covering member 446 for protecting the respective wires 4421 to 4425. The covering member 446 may include an inner material 4451 formed of paper to surround the respective wires 4421 to 4425 and prevent generation of moisture, and the inner material 4451 and the respective wires ( In order to finally protect the 4421 ~ 4425, it is made of an outer material 4442 formed of rubber or synthetic resin.

Meanwhile, a support line 447 is provided at the center of the output cable 44, that is, at the center of each of the wires 4421 to 4425 to prevent twist between the wires 4421 to 4425 and to maintain a stable line. The support line 447 is formed of a coated wire.

In addition, an end of the output side cable 44 is provided with a connecting member 448 that is releasably connected to the connector 428 of the input side cable 42. The connecting member 448 is formed of an idling nut formed with a female spiral 4481 releasably coupled to a male spiral 4421 formed around an end of the connector 428.

On the other hand, the socket portion 444 is formed with a guide groove 449 so that the index 429 formed in the connector 428 of the input side cable 42 is inserted to be accurately connected to each other.

In practice, the first wires 4221 and 4421 shown in red among respective wires identified by colors in the input cable 42 and the output cable 44 are responsible for transmitting and receiving the positive signal. The green second wires 4222 and 4422 are responsible for the transmission and reception of color and brightness data signals, and the black third wires 4223 and 4423 are responsible for the transmission and reception of negative (-) pole signals. The four wires 4224 and 4424 are responsible for transmitting and receiving clock driving signals, and the blue fifth wires 4225 and 4425 are responsible for setting image frames and transmitting / receiving separate signals when an image is implemented on a screen.

Reference numeral 50 is a protective member for closing a part or the entire inner space of the lower part of the main body 10 and protecting the surface of the LED module 20. The protective member 50 is formed to maintain rigidity as well as to have some elasticity.

The protective member 50 is preferably formed to have a predetermined thickness for the connection or connection between the LED module 20 and the cable 40 as well as for firmly coupling or fixing between the main body 10 and the LED module 20. Do.

In addition, the protective member 50 may maintain some rigidity, but may have some ductility, in particular, epoxy and ductility that provide rigidity to prevent cracking or rupture due to freezing of the protective member 50 in winter. The silicon provided is properly mixed and formed. In practice, the mussel weight ratio of epoxy and silicone is set from 92 to 96: 8 to 4. Here, when the weight ratio of epoxy is 92 or less, winter freezing may be prevented but stiffness may be insufficient, whereas when it is 96 or more, rigidity may be maintained but winter freezing may be caused.

Hereinafter, a method of manufacturing the cluster lamp device will be described in detail with reference to FIGS. 6 to 12 and FIGS. 1 to 5.

First, the manufacturer prepares the main body 10, the LED module 20, the cover 30, the cable 40 and the protective member 50 (S100). Here, the main body 10 is made of aluminum and anodized.

Next, the input cable 42 of the cable 40 is connected to the input terminal 252 of the terminal 25 of the LED module 20, and the cable () is connected to the output terminal 254 of the terminal 25. The output side cable 44 of the 40) is connected (S102). More specifically, the terminal 25 exposing the first to fifth wires 4221 to 4225 of the input wire 422 of the input cable 42 of the cable 40 to the surface of the LED module 20. First to fifth contacts 2521 to 2525 of the input terminal 252, respectively, and the first to fifth wires of the output wire 442 of the output cable 44 of the cable 40. 4421 to 4425 are respectively connected to the first to fifth contacts 2541 to 2545 of the output terminal 254 of the terminal 25 of the LED module 20 to connect the cable to the LED module 20. Connect 40). In the connection process of the cable 40 as described above, the division of the input cable 42 and the output cable 44 can be identified by the support lines 427 and 447, respectively.

Thereafter, the operator arranges the LED module 20 to which the cable 40 is connected to the support 14 of the main body 10 (S104). In particular, the LED module 20 is installed so that the rear surface where the LED 22 is installed is directed upward.

When the LED module 20 is disposed in the main body 10 as described above, the transparent molding member on the entire printed circuit board 21 of the LED module 20 and the boundary between the main body 10 and the LED module 20. (26) by coating the main body 10 and the LED module 20 is fixed to each other (S106). Here, the molding member 26 is formed of a transparent epoxy, the liquid transparent epoxy is applied in a thin film form in the temperature range of 35 ℃ to 45 ℃ and dried for about 4 hours to complete the application and fixing. Here, if the coating temperature is 35 ° C or less, damage to the components due to heat is prevented, but the coating efficiency is lowered. If the coating temperature is 45 ° C or higher, the coating efficiency is improved, but thermal damage may be caused. The most ideal application temperature is about 40 ° C.

When the fixing between the LED module 20 and the main body 10 is completed as described above, the transparent molding member (1) on each of the LEDs 22 for moisture proof and waterproofing of the LEDs 20 of the LED module 20. 27) is applied (S108). Here, the local molding member 27 is formed by mixing a transparent epoxy and a transparent waterproof coating liquid. The mixing weight ratio of the transparent epoxy and the transparent coating liquid is mixed at a ratio of 95 to 97: 5 to 3, and when the transparent coating liquid is 95% or less, the viscosity or concentration may be lowered, and the adhesion to the LED may be lowered. Alternatively, the resistance to moisture may be lowered. Therefore, the ideal mixing ratio of transparent epoxy and transparent coating liquid is 96: 4.

Next, a part of the inner space below the main body 10 is closed, and the surface of the LED module 20 is protected, and the connection between the LED module 20 and the cable 40 and the main body 10 and In order to firmly couple or fix the LED modules 20, the protection member 50 is sealed inside the main body 10 (S110). Here, the protective member 50 is used by appropriately mixing the epoxy and silicon so as to maintain the rigidity and have some flexibility or elasticity. The mixture weight ratio of the epoxy and the silicon is set to 92 ~ 96: 8 ~ 4 bar, when the epoxy is 92 or less winter freeze is prevented but the rigidity is insufficient, while when the epoxy is more than 96, rigidity is maintained but winter freeze This is because the mixing weight ratio of the ideal epoxy and silicon is 94: 6.

Finally, the cover (10) in the connecting portion 12 of the main body 10 which works in a state where the main body 10, the LED module 20, the cable 40 and the protective member 50 are integrally coupled to each other. Combining and fixing the coupling portion of 30) to complete the cluster lamp device (S112). Here, the step of engaging the cover 30 after inserting the O-ring (O) in the O-ring groove 1222 (see step 110 (Fig. 11)) before the cover 30 is coupled to the main body 10 Maintain dustproof and waterproofing in advance.

Thereafter, of course, the cluster lamp device alone or to another cluster lamp device and then the input cable 42 to the test device to check whether each of the LEDs 22 of the LED module 20 emits light or operates normally. Install and ship after testing.

Of course, the cluster lamp device manufactured as described above is installed on an installation structure such as a bracket, and then the first cluster lamp is connected to the output cable 44 and the input cable 42 of the neighboring cluster lamp devices continuously and repeatedly. The input cable 42 of the device may be connected to a server (not shown) to complete and use a predetermined lighting device or screen.

1 is an exploded perspective view showing a cluster lamp device to which the manufacturing method of the present invention is applied.

FIG. 2 is a perspective view of the cluster lamp device of FIG. 1 assembled; FIG.

3 is a cross-sectional view taken along line III-III of FIG. 2;

4 is a perspective view showing in detail the structure of the cable of the cluster lamp device of FIG.

Figure 5 is a connection and installation state of the cluster lamp device manufactured by the manufacturing method according to the present invention.

6 to 12 is a process chart showing a manufacturing method of a cluster lamp device according to the present invention.

♣ Explanation of symbols for the main parts of the drawing ♣

10: main body 20: LED module

30: cover 40: cable

50: protective member

Claims (5)

A main body 10 having a heat dissipation portion 11, a horizontal portion 122, and a vertical portion 124 having a concave-convex shape, a connection portion 12, a support jaw 13, and a support portion 14; A printed circuit board 21, a plurality of LEDs 22, a DC-DC converter 23, an IC 24a, a plurality of resistors 24b, a capacitor 24c and a diode 24d, The printed circuit board includes a terminal 25 including an input terminal 252 having first to fifth contacts 2521 to 2525, and an output terminal 254 having first to fifth contacts 2541 to 2545, and the printed circuit board. An LED module (20) comprising a molding member (25) applied to both surfaces of the (21) and a local molding member (26) applied locally to each of the LEDs (22); A cover 30 having a coupling part 32 formed of an irradiation part 31, a horizontal part 322 and a vertical part 324, a support end 33, and two mounting members 34; With an input side cable 42 having an input side wire 422 having first to fifth wires 4221 to 4225 and an input side wire 442 having first to fifth wires 4421 to 4425. A cable 40 comprising an input side cable 44; In the cluster lamp device manufacturing method comprising a protection member 50 for closing the lower inner space of the main body 10, Preparing the main body 10, the LED module 20, the cover 30, the cable 40 and the protection member 50 (S100); The input cable 42 of the cable 40 is connected to the input terminal 252 of the terminal 25 of the LED module 20, and the cable 40 is connected to the output terminal 254 of the terminal 25. Connecting the output side cable (44) of the step (S102); Arranging the LED module 20 to which the cable 40 is connected, on the support part 14 of the main body 10 so that the rear surface on which the LED 22 is installed faces upward (S104); The transparent molding member 26 is applied to the entire printed circuit board 21 of the LED module 20 and the boundary between the main body 10 and the LED module 20, and primarily the main body 10 and the LEDs. Fixing the modules 20 to each other (S106); Applying a transparent molding member (27) to each of the LEDs (22) for moisture proof and waterproofing of each of the LEDs (20) of the LED module (S108); A part of the inner space below the main body 10 is closed and the surface of the LED module 20 and the DC-DC converter 23, the IC 24a, and the plurality of resistors 24b are closed. And the main body 10 for protecting the capacitor 24c and the diode 24d and for coupling between the LED module 20 and the cable 40 and coupling and fixing between the main body 10 and the LED module 20. Sealing the protection member 50 in the inner side (S110); And And a step (S112) of completing the cluster lamp device by coupling and fixing the coupling part (32) of the cover (30) to the connection part (12) of the main body (10). The method of claim 1, wherein the step (S102), the LED module 20 to the first to fifth wires (4221 ~ 4225) of the input wire 422 of the input cable 42 of the cable 40 Connecting to each of the first to fifth contacts 2521 to 2525 of the input terminal 252 of the terminal 25 exposed to the surface of the terminal 25, and the output wire of the cable 44 of the output side cable 44 of the cable 40. Connecting the first to fifth wires 4421 to 4425 of 442 to the first to fifth contacts 2551 to 2545 of the output terminal 254 of the terminal 25 of the LED module 20, respectively. Cluster lamp device manufacturing method comprising the step of. The method of claim 1, wherein in the step (S106), the molding member 26 is formed of a transparent epoxy, the liquid transparent epoxy is applied in a thin film form in the temperature range of 35 ℃ to 45 ℃ dried for 4 hours Cluster lamp device manufacturing method characterized in that. The method of claim 1, wherein in step S108, the local molding member 27 is formed by mixing a transparent epoxy and a transparent waterproof coating liquid, the mixing weight ratio of the transparent epoxy and the transparent coating liquid is 95 ~ 97: 5 ~ 3 Cluster lamp device manufacturing method characterized in that the set to. The method of claim 1, wherein in the step (S110), the protective member 50 is formed by mixing the epoxy and silicon so as to maintain the stiffness while having a ductility, the mixing weight ratio of the epoxy and silicon is 92 ~ 96 : Cluster lamp device manufacturing method characterized in that it is set to 8-4.

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