KR100864569B1 - Heat sink - Google Patents

Abstract

A heat sink is provided to improve a radiation efficiency of a heat sink by coupling radiation pins having a relatively high thermal conductivity. A heat sink includes a body plate(110), an inner pin set(120), and an outer pin set(130). The body plate has a relatively shallow absorbing region of which a rear plane is contacted with a radiator. The inner and outer pin sets are coupled to a front plane of the body plate. The inner pin set is coupled to a front unit of the body plate to be located on a rear part of the absorbing region. The outer pin set is coupled to an outer side of the front part of the body plate to be located on a circumference of the inner pin set. The outer pin set is composed of a relatively light aluminum material. The inner pin set is composed of a relatively high conductivity copper material. The inner and outer pin sets have a plurality of radiation pins. Each of radiation pins is inserted into a plurality of coupling grooves which are formed on the body plate.

Description

Heatsink {HEAT SINK}

1 is a perspective view showing a conventional heat sink.

Figure 2a is a plan view showing a first embodiment of a heat sink according to the present invention.

FIG. 2B is a cross-sectional view along the line AA ′ of FIG. 2A; FIG.

FIG. 2C is a cross-sectional view along the line B-B 'in FIG. 2A; FIG.

Figure 3a is a plan view showing a second embodiment of the heat sink according to the present invention.

3B is a cross-sectional view taken along the line C-C 'in FIG. 3A.

3C is a cross-sectional view taken along the line D-D 'in FIG. 3A;

4 is a sectional view showing a third embodiment of a heat sink according to the present invention;

<Description of the symbols for the main parts of the drawings>

10: heating element 101: endothermic region

103: communication path 110: main body plate

111: coupling groove 120: internal pin assembly

121, 131: heat radiation fins 123, 133: connecting rib

130: outer pin assembly

The present invention relates to a heat sink used for cooling electronic / electrical components, devices, and devices, and more particularly, to a structure capable of rapidly dissipating heat in an endothermic region in which heat is concentrated by being in direct contact with a heating element. The present invention relates to a heat sink in which a heat dissipation function can be maintained at all times by easily miniaturizing and reducing weight and obtaining a high heat dissipation effect, and preventing contact state with a heating element due to deformation due to thermal expansion.

In general, heat sinks are used to prevent damage caused by excessive heat to electronic / electrical components, devices, and devices (hereinafter, referred to as 'heating elements') that generate heat during operation. As shown in FIG. 1, in a typical heat sink, an endothermic region 20 closely contacting the surface of the heating element 10 is formed at a rear side thereof, and a plurality of heat dissipation fins 30 protruding in parallel to a predetermined height are formed at the front side thereof. Consists of the provided shape, it has a structure capable of dissipating heat transferred through the heat absorbing region 20 to the outside air through the heat radiation fin (30).

In the heat sink, since the endothermic region 20 directly contacting the heating element 10 is a heat-concentrating portion, it is necessary to be able to release heat to the air or transfer heat to the peripheral portion more quickly than other portions. Is manufactured in a structure in which an aluminum material is integrally molded through extrusion or the like. Accordingly, poor heat dissipation in the heat absorbing region 20 adversely affects the performance and lifespan of the heat generating element 10 equipped with the heat sink, and in order to obtain the required heat dissipation effect, the heat sink must be enlarged. There is a problem that the miniaturization is limited.

In order to solve this problem, other materials having higher thermal conductivity than aluminum may be used, for example, gold, silver, and copper. However, these materials have relatively low strength, high weight, and particularly material costs. It is expensive and difficult to commercialize.

In addition, the above-described conventional heat sink is deformed in the heat sink due to the thermal expansion is different depending on the position due to the temperature difference between the heat absorbing region 20 and the surroundings, and thus the contact state between the heating element 10 and the heat sink There is a problem in that poor heat dissipation is worse.

The present invention is to solve the above problems, an object of the present invention is to heat the endothermic area directly in contact with the heating element is released more quickly to provide a heat sink with high heat dissipation effect and easy manufacturing cost is low To provide.

Another object of the present invention is to provide a heat sink capable of maintaining a good heat dissipation function by preventing contact failure with a heating element due to deformation due to variation in thermal expansion.

According to the present invention for achieving the above object, in the heat sink that is installed in close contact with the heat generating element including the electronic / electrical components, elements and devices to heat dissipation, the heat sink is formed wider than the heat generating element is in contact with the heat generating portion A main body plate having a relatively narrow area, and a plurality of fin assemblies coupled to the front portion of the main body plate, each of which includes a plurality of heat dissipation fins, wherein the pin assemblies are located immediately after the endothermic region. An inner pin assembly coupled to the inside of the front portion of the front pin assembly and an outer pin assembly coupled to the outside of the front portion of the body plate so as to be positioned around the inner pin assembly, wherein the inner pin assembly is a material having a higher thermal conductivity than the outer pin assembly. Provided is a heat sink, characterized in that consisting of.

In the heat sink of the present invention, the fin assemblies are preferably spaced apart from each other so as to form a communication path for the air flow in the direction orthogonal or cross with each of the heat radiation fin formation direction.

The fin assembly may be formed of a structure in which a plurality of heat dissipation fins are formed by bending the metal plate to be uneven.

Optionally, the fin assembly may be formed of an integrated structure in which a plurality of heat dissipation fins formed in a plate shape are connected by connecting ribs, and a plurality of coupling grooves into which the heat dissipation fins are inserted may be formed in the body plate.

In addition, the fin assembly is composed of a plurality of heat dissipation fins formed of a plate-shaped individual member, a plurality of coupling grooves are formed in each of the heat dissipation fins is formed in the body plate to select the coupling position and spacing of the heat dissipation fins It may be configured.

More preferably, the outer pin assembly may be made of aluminum, and the inner pin assembly may be made of copper.

The objects, features and advantages of the present invention described above will become more apparent from the following detailed description. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A is a plan view showing a first embodiment of a heat sink according to the present invention, and FIGS. 2B and 2C are sectional views taken along the line AA 'and BB' of FIG. 2A, respectively.

The heat sink of the present invention is installed in close contact with the heating element 10, such as electronic / electrical components and elements to perform a heat dissipation function, the circumferential portion is formed wider than the heating element 10 so as to protrude to the outside of the heating element 10, the heating element in the rear portion It consists of a main body plate 110 having a heat absorbing area 101 in close contact with the surface of (10) and a plurality of pin assemblies 120, 130 coupled to the front portion of the main body plate (110).

In the present invention, the pin assemblies 120 and 130 are coupled to the inner pin assembly 120 coupled to the inner side of the front portion of the body plate 110 so as to be located immediately after the heat absorbing region 101. It consists of an outer pin assembly (130). The outer fin assembly 130 is made of an aluminum material used in a conventional heat sink, the inner fin assembly 120 is a metal material having a higher thermal conductivity than the outer fin assembly 130, preferably copper having a high cost-effectiveness Made of material.

In the present embodiment, the outer fin assembly 130 and the inner fin assembly 120 are each formed by bending a thin metal plate to be uneven in the form of a pulse to form a plurality of heat dissipation fins 121 and 131, the illustrated bolt ( 105 and the like, and are coupled to the body plate 110 by conventional coupling means generally used to join metal materials, such as mechanical fastening members such as rivets and pins, or bonding materials such as adhesives and double-sided tapes.

In addition, the fin assemblies 120 and 130 are spaced apart from each other by a predetermined interval so that the communication path 103 is formed in a direction orthogonal to each of the heat dissipation fins 121 and 131 forming directions or intersecting in some cases.

The heat sink of the present invention configured as described above can more effectively dissipate heat generated from the heat generator 10 through the internal fin assembly 120 made of a material having high thermal conductivity.

That is, for example, when the internal fin assembly 120 is made of copper, the thermal conductivity of copper and aluminum having an average characteristic is about 320 kV / ° C and about 196 kV / ° C, respectively. Thermal conductivity is approximately 1.6 times higher than that of conventional aluminum heat sinks. Therefore, heat transferred to the heat absorbing region 101 in contact with the heating element 10 can be released at a significantly faster rate than the conventional heat sink through the internal fin assembly 120. This is very useful for providing heat sinks with lighter weight and smaller size, and high heat dissipation efficiency. It is possible to increase the cost, weight, and strength that can be generated when the entire heat sink is made of highly conductive metal materials such as gold, silver, and copper. Problems, such as a fall, can also be prevented.

In addition, the heat sink of the present invention has a structure in which a plurality of fin assemblies 120 and 130 divided from each other as described above are coupled to the body plate 110 to form one heat sink, so that the heat sink 10 is disposed at a distance of the heat sink 10. Even if there is a deviation in the thermal expansion of each portion according to the overall deformation through the gap between the pin assembly (120, 130) is canceled, thereby preventing the phenomenon that the contact state with the heating element is poor by the deformation.

Furthermore, since the communication path 103 is formed between the fin assemblies 120 and 130, air communication can be performed smoothly even in a direction intersecting with the direction in which the heat dissipation fins 121 and 131 are formed. The interior of the fin assembly (120, 130) is made to communicate with the communication path 103 can be prevented thermal resistance due to stagnant air therein.

Meanwhile, as another embodiment of the present invention, FIGS. 3A to 3C show a structure molded by a conventional extrusion method.

That is, in the heat sink of the embodiment illustrated in FIGS. 3A to 3C, a heat absorbing region 101 is formed in the rear portion of the main body plate 110, and a plurality of fin assemblies 120 and 130 are formed in the front surface of the main body plate 110. ) Is coupled to the structure, the pin assembly (120, 130) is made of a structure in which a plurality of heat dissipation fins (121, 131) made of a plate shape of a predetermined thickness is integrated by the connecting ribs (123, 133), the body A plurality of coupling grooves 111 into which the heat dissipation fins 121 and 131 forming the fin assemblies 120 and 130 are inserted into the plate 110 is provided. In the same manner as in the above-described embodiment, the fin assemblies 120 and 130 are formed of a material having a higher thermal conductivity than aluminum bonded to the front surface opposite to the endothermic region 101, preferably, the internal fin assembly 120 and its peripheral portion. It consists of an outer pin assembly 130 of aluminum material to be bonded.

The heat sink of the present invention is the same as in the above-described embodiment, since the rapid heat dissipation is made through the internal fin assembly 120, it is easy to miniaturize and light weight, and can obtain an improved heat dissipation effect while the manufacturing cost is low, Through the divided fin assembly structure, there is an advantage of preventing deformation due to thermal expansion variation of each portion and a decrease in thermal conductivity. In addition, since a plurality of heat dissipation fins 121 and 131 are integrated to maintain a fixed shape, there is an advantage in that the assembling work is very simple.

Meanwhile, the heat sink of the present invention is similar to the above-described second embodiment, but the heat dissipation fins 121 and 131 constituting the fin assemblies 120 and 130 are not connected by the connecting ribs 123 and 133. It may be made of separate members separated from each other as shown. In this case, the heat dissipation fins 121 and 131 constituting each of the fin assemblies 120 and 130 may be used in combination with a desired position according to a user's need. In particular, the heat dissipation fins 121 and 131 may be different from a portion where heat is concentrated, such as the heat absorbing region 101. The heat dissipation effect can be further enhanced by combining a larger number of heat dissipation fins 121 and 131 at narrower intervals than the portion. This structure is useful for reducing the weight of the entire heat sink, since the heat dissipation fins 121 and 131 may be intensively installed at necessary portions.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.

As described above, the present invention has the following effects.

(A) Heat dissipation fins of a material having a relatively high thermal conductivity are coupled to an endothermic region where the heat is concentrated in contact with the heating element, thereby improving heat dissipation efficiency of the heat sink, thereby making the heat smaller and lighter at lower cost. A sink can be provided.

(B) By forming the heat sink fin structure of the heat sink by the divided fin assemblies, it is possible to manufacture the heat sink thinner and lighter without fear of poor thermal conductivity of the heating element due to deformation caused by the thermal expansion deviation.

(C) By forming a communication path between each divided fin assembly to facilitate the air flow in the direction orthogonal to or intersecting the direction of formation of the heat dissipation fins, it is possible to improve the heat dissipation effect of the heat sink, in particular the bent plate structure In the case of manufacturing the furnace fin assembly, the air inside the fin assembly may be circulated / communicated to the outside so that more effective heat dissipation may be achieved.

(D) Forming a plurality of coupling grooves in the body plate, by making the heat dissipation fins constituting the fin assembly into a separate member to be selectively inserted into the coupling groove, by mounting the heat radiation fins at different densities according to the concentration of heat generated by the heat dissipation lighter Highly effective heat sinks can be provided.

Claims (6)

In the heat sink which is installed in close contact with the heat generating element 10 including the electronic / electrical components, elements and devices, the heat sink, The body plate 110 is formed to be wider than the heating element 10, and the heat absorbing region 101 in which the heating element 10 is in contact with the rear surface thereof is relatively narrow, and a plurality of fins coupled to the front portion of the body plate 110. Including aggregates 120, 130, The pin assemblies 120 and 130 may include an inner pin assembly 120 coupled to an inside of the front portion of the body plate 110 so as to be positioned immediately after the heat absorbing region 101, and the pin assembly 120 of the inner fin assembly 120. The outer pin assembly 130 is coupled to the outside of the front portion of the body plate 110 to be positioned around the outer pin assembly 130 is made of a relatively light aluminum material and the inner pin assembly 120 is relative It is made of a high thermal conductivity copper material, the inner fin assembly 120 and the outer fin assembly 130 is composed of a plurality of heat dissipation fins (121, 131) each formed of a plate-shaped individual member, the body plate 110 Heat sinks, characterized in that a plurality of coupling grooves 111 are formed in each of the heat radiation fins (121, 131) is inserted to select the coupling position and spacing of the heat radiation fins (121, 131). The method of claim 1, The fin assemblies 120 and 130 are heat sinks, which are spaced apart from each other so as to form a communication path 103 for air flow in a direction orthogonal to or intersecting with each of the heat dissipation fins 121 and 131. . delete delete delete delete

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