KR100839532B1 - Polyamide resin composition with excellent flexibility - Google Patents
Polyamide resin composition with excellent flexibility Download PDFInfo
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- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
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Abstract
본 발명은 유연성한 폴리아미드 수지 조성물에 관한 것으로서, 폴리아미드 수지 100 중량부에 대하여 말레익안하이드라이드가 그라프트된 이피러버 20~50 중량부와 다이머라이즈드 지방산(Dimerized Fatty Acid) 10~40 중량부가 포함되어 있는 것을 특징으로 한다.The present invention relates to a flexible polyamide resin composition, 20 to 50 parts by weight of an e-rubber grafted maleic hydride with respect to 100 parts by weight of polyamide resin and 10 to 40 parts by weight of dimerized fatty acid (Dimerized Fatty Acid) It is characterized in that the addition is included.
본 발명은 유연성이 우수하여 압출성형이 가능함과 동시에 내충격성도 뛰어나 굽힘용 파이프나 튜브를 만드는데 필요한 만드렐용 소재로 특히 유용하다.The present invention is particularly useful as a material for making mandel required to make a pipe or tube for bending because of its excellent flexibility and excellent extrusion resistance.
유연성, 압출성형, 만드렐, 폴리아미드, 수지조성물, 내충격성. Flexibility, Extrusion, Mandrerel, Polyamide, Resin Composition, Impact Resistance.
Description
본 발명은 유연성이 우수한 폴리아미드 수지 조성물에 관한 것으로서, 보다 상세하게는 유연성 및 내충격성이 뛰어나 압출 성형이 가능하여 굽힘용 파이프를 만드는데 필요한 만드렐용 소재등으로 유용한 폴리아미드 수지 조성물에 관한 것이다.The present invention relates to a polyamide resin composition having excellent flexibility, and more particularly, to a polyamide resin composition which is useful as a material for mandelels required to make a pipe for bending due to its excellent flexibility and impact resistance and being capable of extrusion molding.
종래에 고무호스 등을 성형하는데 필요한 만드렐은 주로 나일론 12 등을 사용하여 제조하여왔다. 나일론 12 는 그 유연 특성이 우수하나 가격이 고가여서 최근 산업계에서는 나일론 6 를 개질하여 사용하고 있다.Conventionally, mandrel required for molding rubber hoses and the like has been mainly manufactured using nylon 12 and the like. Nylon 12 has excellent flexibility, but is expensive, so the industry has been using nylon 6 in recent years.
일반적으로 폴리아미드 수지는 그 우수한 기계적 특성으로 널리 사용되는 소재로 현재까지는 흔히 사출성형 공정을 통하여 제품을 제조하여 사용되거나, 압출의 방법으로 화이버나 모노필라멘트 및 시트 등의 제품을 성형하여 왔다. 그러나 이러한 성형법으로 제조된 제품은 유연성을 요구하는 굽힘용 압출 제품의 성형용으로는 곤란하다는 단점을 갖고 있다. 프라스틱 파이프나 튜브의 특징은 부식이 없으 면서 가벼우며, 유연한 것이며, 이를 위해서는 성형시 적당한 용융 강도와 유연성을 가져야 한다. In general, polyamide resin is a material widely used for its excellent mechanical properties. Up to now, polyamide resins have been commonly used to manufacture products through injection molding processes, or have molded products such as fibers, monofilaments, and sheets by extrusion methods. However, the product manufactured by such a molding method has a disadvantage in that it is difficult for molding an extrusion product for bending that requires flexibility. The characteristics of plastic pipes or tubes are light, flexible and free from corrosion, which requires proper melt strength and flexibility in forming.
용융 강도는 성형이 가능하게 할 뿐만 아니라 성형품인 파이프나 튜브의 두께를 균일하게 하는 데 핵심역할을 하며, 유연성은 프라스틱 파이프나 특히 튜브가 가지는 장점이다. Melt strength not only enables molding, but also plays a key role in uniformizing the thickness of the pipe or tube being molded. Flexibility is an advantage of plastic pipes and tubes in particular.
파이프나 튜브용 소재로서의 프라스틱은 초기에 올레핀 고분자를 중심으로 그 개발이 꾸준하게 이루어져 현재는 다양한 형상의 제품을 성형할 수 있게 되었고, 최근 폴리아미드 수지의 특성인 가스 베리어 특성을 활용한 개발이 활발한 실정이다. 그러나 대부분의 경우 튜브나 파이프에는 폴리아미드 11 및 12 를 중심으로한 응용이며, 폴리아미드 6 의 경우 최근에 많은 노력을 경주하고 있는 상황이다. As a material for pipes and tubes, plastics have been steadily developed mainly in the early days of olefin polymers, and now various shapes of products can be molded. Recently, developments using gas barrier properties, which are characteristics of polyamide resins, have been actively developed. to be. In most cases, however, applications are centered around polyamides 11 and 12 in tubes and pipes, and polyamide 6 is currently undergoing a lot of effort.
그러한 종래 기술로서, 미국특허 제,5,408,000호에서는 폴리아미드 수지에 여러 종류의 에칠렌 코폴리머 및 모디파이된 폴리테트라프로로에칠렌을 첨가하여 압출 성형이 가능한 폴리아미드 수지조성물을 제안하였고, 미국특허4,987,168호에서는 폴리아미드 6에 폴리에틸렌/폴리프로필렌 코폴리머를 내충격제로 첨가하고, 카프로락탐을 가소제로 첨가하고, 카보디이미드를 증점제로 첨가한 폴리아미드 수지 조성물을 조성을 제안하고 있다. As such a prior art, US Patent No. 5,408,000 proposes a polyamide resin composition which can be extruded by adding various kinds of ethylene copolymers and modified polytetraproloethylene to a polyamide resin, and US Patent No. 4,987,168. Has proposed a polyamide resin composition in which polyethylene / polypropylene copolymer is added to polyamide 6 as an impact agent, caprolactam is added as a plasticizer, and carbodiimide is added as a thickener.
국내등록특허 제 10-0846491호 에서는 폴리아미드 수지의 중합시에 인계의 핵제를 첨가하여 폴리아미드 수지 조성물의 유연성을 향상시키는 방법을 제안하고 있고, 국내등록특허 1997-0042830 호 에서는 폴리아미드 수지 조성물의 유연성을 개선하기 위해서, 벤젠술폰아미드 유도체를 폴리아미드 수지와 배합방법을 제안하고 있다.Korean Patent No. 10-0846491 proposes a method of improving the flexibility of a polyamide resin composition by adding a phosphorus-based nucleating agent at the time of polymerization of the polyamide resin. In order to improve the flexibility, a method of blending a benzenesulfonamide derivative with a polyamide resin has been proposed.
상기와 같은 종래 기술을 상세히 검토에 보면, 폴리아미드 수지에 에틸렌 코폴리머 및 모디파이된 폴리테트라프로로에칠렌을 첨가하는 방법은 용융 강도를 증가시켜 압출 성형은 가능하나, 파이프나 튜브류의 용도로서의 유연성은 부족한 문제가 있다. 또한 가소제로 카프로락탐을 첨가하는 경우에는 융점이 낮아 성형시 다량의 가스를 발생시켜서 표면을 불량하에 하여 외관을 가공하여야 할 뿐만 아니라, 가공 조건에 따라 가공중 카프로락탐이 대기중으로 빠져나가서 유연성을 저하시킨다. Considering the prior art in detail, the method of adding ethylene copolymer and modified polytetraproloethylene to the polyamide resin can increase the melt strength and can be extruded, but it can be used as a pipe or tube. Flexibility is a problem. In addition, when caprolactam is added as a plasticizer, the melting point is low, so that a large amount of gas is generated during molding, and the surface must be processed poorly, and the caprolactam escapes into the atmosphere during processing depending on the processing conditions, thereby deteriorating flexibility. Let's do it.
또한 수지 제조에 있어서 컴파운딩 후 건조가 필수적인데 카프로락탐이 휘발성이 강하므로 건조 온도를 낮추어 장시간 건조해야 하기 때문에 생산성 저하의 문제점이 있을뿐 아니라, 제품인 만드렐에 있어서 카프로락탐이 제품 표면으로의 마이그레이션 현상으로 반복 사용을 어렵게 한다. In addition, drying after compounding is essential in resin production. Since caprolactam is highly volatile, it has to be dried for a long time by lowering the drying temperature. Thus, caprolactam is migrated to the product surface in the product Mandrell. Phenomenon makes repeated use difficult.
본 발명은 이와 같은 종래의 문제점들을 해소할 수 있도록 유연성이 우수하여 압출성형이 가능함과 동시에 내충격성과 생산성을 갖고 있어서, 굽힘용 파이프를 만드는데 사용되는 만드렐등의 소재로 유용한 폴리아미드 수지 조성물을 제공하고자 한다.The present invention provides a polyamide resin composition that is useful as a material such as Mandrel used to make a pipe for bending because of its excellent flexibility and extrusion resistance and impact resistance and productivity to solve such conventional problems. I would like to.
이를 위해, 본 발명에서는 폴리아미드6 수지에 내충격제로 말레익안하이드라 이드가 그라프트된 이피러버와 유연제로 다이머라이즈드 지방산(Dimerized Fatty Acid)이 첨가된 폴리아미드 수지 조성물을 제공한다.To this end, the present invention provides a polyamide resin composition in which the dimerized fatty acid is added to the polyamide 6 resin and the dimerized fatty acid as the softener and maleic anhydride grafted as an impact agent.
이와 같은 과제를 달성하기 위한 본 발명의 폴리아미드 수지 조성물은, 폴리아미드 수지 100 중량부에 대하여 말레익안하이드라이드가 그라프트된 이피러버 20~50 중량부와 다이머라이즈드 지방산(Dimerized Fatty Acid) 10~40 중량부가 포함되어 있는 것을 특징으로 한다.The polyamide resin composition of the present invention for achieving the above object is 20 to 50 parts by weight of two-fiber grafted maleic hydride with respect to 100 parts by weight of polyamide resin and dimerized fatty acid (Dimerized Fatty Acid) 10 It is characterized by that it contains -40 parts by weight.
이하, 본 발명을 상세하게 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail.
본 발명의 조성물에 있어서, 바람직하게 사용되는 폴리아미드 수지는 하기 화학식 1을 기본구조로 하는 폴리아미드6 이며, 폴리아미드6의 상대점도는 3.0~3.5(20℃, 96% 황산 100㎖ 중 폴리아미드6 수지 1g 용액)인 것이 좋다. In the composition of the present invention, the polyamide resin preferably used is polyamide 6 having a basic structure of the following general formula (1), and the relative viscosity of polyamide 6 is 3.0 to 3.5 (20 ° C, polyamide in 100 ml of 96% sulfuric acid). 6 resin 1g solution).
[ 상기식에서 n은 200 내지 15,000 까지의 정수이다 ][Where n is an integer from 200 to 15,000]
상기 폴리아미드6 수지의 점도가 3.0 미만인 경우 압출 성형으로 제품 가공시 성형 온도 구간이 좁아 압출 성형성이 불량하고, 3.5를 초과하는 경우에는 용융 중합에서 제조가 어려워 고상 중합 공정을 거쳐서 폴리아미드6 수지를 제조해야 하기 때문에 비용적으로 불리하여 바람직하지 못할 뿐만 아니라 성형온도의 상승을 초래하 여 압출 작업성에 있어서도 유리하게 작용을 하지 못한다.When the viscosity of the polyamide 6 resin is less than 3.0, the extrusion temperature is poor due to the narrow molding temperature range when the product is processed by extrusion molding, and when it exceeds 3.5, the polyamide 6 resin is subjected to a solid phase polymerization process because of difficulty in manufacturing in melt polymerization. It is disadvantageous in terms of cost because it must be prepared and not only is not preferable, but also leads to an increase in the molding temperature does not advantageously act on extrusion workability.
상기의 폴리아마이드6 수지는 ∈-카프로락탐 100 중량부에 대해 물 7.17 중량부, 기포억제제 0.004 중량부, 내열제인 트리스-(2.4-디 터셔리 부틸페닐)-포스파이트 와 N-N'-헥사메틸렌 비스 (3.5-디 터셔리 부틸-4-하이드록시- 하이드로시나마미드) 의1대1 혼합물인 이가녹스(Irganox)B1171 (상품명, 제조회사 :씨바 가이지) 0.09 중량부를 260℃의 반응관에 투입하고 압력 15Kg/㎠까지 승압하여 1시간 반응시킨 후 30분 정도 계속 압력을 유지하면서 서서히 압력을 떨어뜨려 대기와 같은 압력으로 2시간 정도 반응을 진행시킨 후 서서히 -360mmHg로 감압하여 1시간 정도 반응을 더 진행시켜 질소를 투입하면서 반응을 종료하여 제조할 수 있다. The polyamide 6 resin includes 7.17 parts by weight of water, 0.004 parts by weight of bubble inhibitor, and tris- (2.4-dibutyl butylphenyl) -phosphite and N-N'-hexa, which are heat-resistant agents, based on 100 parts by weight of V-caprolactam. 0.09 parts by weight of Irganox B1171 (trade name, manufactured by Ciba Gaiji), a 1: 1 mixture of methylene bis (3.5-dibutyl butyl-4-hydroxy-hydrocinamide), was added to a reaction tube at 260 ° C. After the reaction, the pressure was raised to 15Kg / ㎠ and reacted for 1 hour, and then the pressure was gradually reduced while maintaining the pressure for about 30 minutes. It can be prepared by further proceeding to terminate the reaction while adding nitrogen.
상기의 방법으로 얻게되는 폴리아미드6 수지는 본 발명에 맞는 최종 수지 조성물을 위해 칩(chip)형태로써 만들어 제습형 건조기에서 85℃, 6시간 건조하여 사용하는 것이 바람직하다.The polyamide 6 resin obtained by the above method is preferably made into a chip form for the final resin composition according to the present invention and used after drying at 85 ° C. for 6 hours in a dehumidifying dryer.
본 발명에서는 이러한 첨가제외에 수지의 컴파운딩 가공시 필요한 내열제로서 다음과 같은 아민계 및 페놀계 산화방지제를 사용할 수 있다.In the present invention, in addition to these additives, the following amine-based and phenol-based antioxidants may be used as the heat-resistant agent required for the compounding process of the resin.
본 발명에서 사용할 수 있는 아민계 내열제는 2,2,4-트리메틸-1,2-디하이드로 퀴놀린 {2,2,4-Trimetyl-1,2-dihydro quinoline} 이나 이들의 중합체상태의 화합물, 페닐-베타-나프틸아민 {Phenyl--naphthylamine}, 페닐-알파-나프틸아민 {Phenyl--naphthylamine}, 알파-나프틸아민 {-naphthylamine}, ,N`-디-세칸더리-부틸-파라-페닐렌디아민 {N,N`-Di-sec-butyl-p-phenylenediamine}, N,N`-디페닐-파라-페닐렌디아민 {N,N`-Diphenyl-p-phenylenediamine}, N,N`-디-베타-나프틸-파라-페 닐렌디아민 {N,N`-Di--naphthyl-p-phenylenediamine}, 4,4`-테트라메틸디아미노디페닐메탄 {4,4`-Tetramethyl diamino diphenyl methane}, 알돌-알파-나프틸아민(Aldol--naphthylamine), N,N`-비스(1-메틸-헵틸)-파라-페닐렌디아민 {N,N`-bis -(1-methyl-heptyl)-p-phenylenediamine}, N,N`-디-세칸더리-부틸-파라-페닐렌디아민 {N,N`-Di-sec-butyl-p-phenylenediamine}, N,N`-비스(1-에틸-3-메틸-페닐)-파라-페닐렌디아민 {N,N`-Bis-(1-ethyl-3-methyl-phenyl)-p-phenylenediamine}, 파라-이소-프로폭실디페닐아민 {P-iso-propoxyl diphenylamine}, N,N`-디-베타-나프틸-파라-페닐렌디아민 {N,N`-Di--naphthyl-p-phenylenediamine}, 6-에톡시-2, 2,4-트리메틸-1,2-디하이드로퀴놀린 {6-Ethoxy-2,2,4-trimethyl-1,2-dihydroquino line}, N-페닐-N`-이소프로필-파라-페닐렌디아민 {N-Phenyl-N`-isopropyl-p-pheny lenediamine}, 4,4`-비스(4-알파,알파-디메틸벤조일)디페닐아민 {4,4`-Bis-(4- -methylbenzoyl) diphenylamine}, 2,6-디-터셔리-부틸-알파-디메틸아미노-파라-크레졸 {2,6-Di-t-butyl--dimethylamino-p-cresol}, N-사이클로헥실-N`-페닐-파라-페닐렌디아민 {N-Cyclohexyl-N`-phenyl-p-phenylenediamine}, 디옥틸-파라-페닐렌디아민 {Dioctyl-p-phenylenediamine}, 페닐헥실-파라-페닐렌디아민 {Phenyl hexyl-p-phenylenediamine}, 페닐옥틸-파라-페닐렌디아민 {Phenyloctyl-p-phenyl enediamine}, 디헵틸-파라-페닐렌디아민 {Diheptyl- p-phenylenediamine}, 옥살릴 비스(벤질리덴 하이드라지드) {Oxalyl bis (benzylidene hydrazide)}, 6-(4-하이드록시-3,5-디-터셔리-부틸아닐리노)-2,4-비스-옥틸-티오-1,3,5-트리아진 {6-(4- hyrdoxy-3,5-di-t-butyl anilino)-2,4-bis-octyl-thio- 1,3,5-triazine}, 3-(N-살 리실로일)아미노-1,2,4-트리아졸 {3-(N-Salicyloyl) amino-1,2,4-triazole}, P,P`-디옥틸 디페닐아민 {P,P`-dioctyl-diphenylamine}, 디카테콜보레이트의 디-오르토-토릴-구아니딘 염 {Di-o-tolyl-guanidine salt of di-cathechol borate}, N-페닐-N`-이소프로필-파라-페닐렌디아민{N-phenyl-N`-iso-propyl-p-phenylenediamine}, 디-오르토-토릴 티오우레아 {Di-o-tolyl-thiourea}, 티오카바닐리드 {Thiocar banilide}, 징크 디에틸 디티오카바메이트 {Zinc diethyl dithiocarbamate}, 2-멀캅토벤지미다졸 {2-Mer captobenzimidazole}, 2-멀캅토벤지미다졸의 아연염 {Zn salt of 2-Mer captobenz imidazole}, 2-멀캅토메틸벤지미다졸 {2-Mer captomethyl benzimidazole}, 2-멀캅토메틸벤지미다졸의 아연염 {Zn salt of 2-Mer capto methylbenzimidazole}, N-1,3-디메틸부틸-N`-페닐-파라-페닐렌디아민{N-1,3-Di methylbutyl-N`-phenyl-p-phenylene diamine}, 디에틸하이드록실아민 {Diethyl hydroxylamine}, 1,3-디부틸티오우레아 {1,3-Dibutylthiourea}, 1,3-디에틸티오우레아 {1,3-Diethylthiourea}, 페노티아진 {Phenothiazine}, N-(2-에틸-페닐-)-N`-(2-에톡시-5-터셔리-부틸 페놀)옥살릭산디아민 {N-(2-Ethyl-phenyl)-N`- (2-ethoxy-5-t-butyl phenol)oxalic acid diamide}, 오르토-토릴-비구아니드 {O-Tolyl-biguanide}, N,N`-디페닐에틸렌디아민 {N,N`-Diphenylethylenediamine}, N,N`-디페닐프로필렌디아민 {N,N`-Diphenyl propylenediamine}, N,N`-디-오르토-토릴-에틸렌디아민 {N,N`-Di-o-tolyl-ethyl enediamine}, N-라우릴-파라-아미노페놀 {N-Lauryl-p-aminophenol}, N-스테아릴-파라-아미노페놀 {N-Stearyl- p-aminophenol}, 에틸렌티오우레아 {Ethylene thio urea}, P,P-디메톡시 디페닐아민 {P,P-dimethoxy diphenylamine}, N-옥틸-N`-페닐-파라-페닐렌디아민 {N-Octyl-N`- phenyl-p-phenylenediamine}, N,N`-디-(1,4-디메틸-펜틸)-파라-페닐렌디아민{N,N`-Di-(1,4-dimethyl-pentyl)-p-phenylenediamine} 등을 사용할 수 있다. Amine-based heat-resistant agent that can be used in the present invention is 2,2,4-trimethyl-1,2-dihydro quinoline {2,2,4-Trimetyl-1,2-dihydro quinoline} or a polymer compound thereof, Phenyl-naphthylamine {Phenyl--naphthylamine}, Phenyl-naphthylamine}, Alpha-naphthylamine {-naphthylamine}, N`-di-secondary-butyl-para -Phenylenediamine {N, N`-Di-sec-butyl-p-phenylenediamine}, N, N`-Diphenyl-para-phenylenediamine {N, N`-Diphenyl-p-phenylenediamine}, N, N `-Di-beta-naphthyl-para-phenylenediamine {N, N`-Di--naphthyl-p-phenylenediamine}, 4,4`-tetramethyldiaminodiphenylmethane {4,4`-Tetramethyl diamino diphenyl methane}, aldol-naphthylamine, N, N`-bis (1-methyl-heptyl) -para-phenylenediamine {N, N`-bis-(1-methyl- heptyl) -p-phenylenediamine}, N, N`-di-secondary-butyl-para-phenylenediamine {N, N`-Di-sec-butyl-p-phenylenediamine}, N, N`-bis -Ethyl-3-methyl-phenyl) -wave -Phenylenediamine {N, N`-Bis- (1-ethyl-3-methyl-phenyl) -p-phenylenediamine}, para-iso-propoxyl diphenylamine}, N, N `-Di-beta-naphthyl-para-phenylenediamine {N, N`-Di--naphthyl-p-phenylenediamine}, 6-ethoxy-2, 2,4-trimethyl-1,2-dihydroquinoline {6-Ethoxy-2,2,4-trimethyl-1,2-dihydroquino line}, N-phenyl-N`-isopropyl-para-phenylenediamine {N-Phenyl-N`-isopropyl-p-pheny lenediamine }, 4,4`-bis (4-alpha, alpha-dimethylbenzoyl) diphenylamine {4,4`-Bis- (4- -methylbenzoyl) diphenylamine}, 2,6-di-tertiary-butyl-alpha -Dimethylamino-para-cresol {2,6-Di-t-butyl--dimethylamino-p-cresol}, N-cyclohexyl-N`-phenyl-para-phenylenediamine {N-Cyclohexyl-N`-phenyl -p-phenylenediamine}, dioctyl-p-phenylenediamine, phenylhexyl-para-phenylenediamine {Phenyl hexyl-p-phenylenediamine}, phenyloctyl-para-phenylenediamine {Phenyloctyl- p-phenyl enediamine}, diheptyl -Para-phenylenediamine {Diheptyl- p-phenylenediamine}, oxalyl bis (benzylidene hydrazide) {Oxalyl bis (benzylidene hydrazide)}, 6- (4-hydroxy-3,5-di-tertiary- Butylanilino) -2,4-bis-octyl-thio-1,3,5-triazine {6- (4-hyrdoxy-3,5-di-t-butyl anilino) -2,4-bis-octyl -thio- 1,3,5-triazine}, 3- (N-salicyloyl) amino-1,2,4-triazole {3- (N-Salicyloyl) amino-1,2,4-triazole} , P, P`-dioctyl-diphenylamine}, Di-o-tolyl-guanidine salt of di-cathechol borate}, N-phenyl-N`-isopropyl-para-phenylenediamine {N-phenyl-N`-iso-propyl-p-phenylenediamine}, di-ortho-tolyl thiourea {Di-o-tolyl-thiourea}, thio Thiocar banilide, zinc diethyl dithiocarbamate, 2-mercaptobenzimidazole, zinc salt of 2-mercaptobenzimidazole, Zn salt of 2 -Mer captobenz imidaz ole}, 2-mercaptomethylbenzimidazole {Zn salt of 2-Mer capto methylbenzimidazole}, N-1,3-dimethylbutyl- N`-phenyl-para-phenylenediamine {N-1,3-Di methylbutyl-N`-phenyl-p-phenylene diamine}, diethyl hydroxylamine {1,3-dibutylthiourea { 1,3-Dibutylthiourea}, 1,3-diethylthiourea {1,3-Diethylthiourea}, phenothiazine {Phenothiazine}, N- (2-ethyl-phenyl-)-N`- (2-ethoxy- 5-tert-butyl phenol) oxalic aciddiamine {N- (2-Ethyl-phenyl) -N`- (2-ethoxy-5-t-butyl phenol) oxalic acid diamide}, ortho-toryl-biguanide { O-Tolyl-biguanide}, N, N`-diphenylethylenediamine, N, N`-diphenylethylenediamine, N, N`-Diphenyl propylenediamine, N, N`-di -Ortho-toryl-ethylenediamine {N, N`-Di-o-tolyl-ethyl enediamine}, N-lauryl-para-aminophenol {N-Lauryl-p-aminophenol}, N-stearyl-para-amino Phenolic {N- Stearyl-p-aminophenol}, Ethylene thio urea}, P, P-dimethoxy diphenylamine {P, P-dimethoxy diphenylamine}, N-octyl-N`-phenyl-para-phenylenediamine {N -Octyl-N`-phenyl-p-phenylenediamine}, N, N`-di- (1,4-dimethyl-pentyl) -para-phenylenediamine {N, N`-Di- (1,4-dimethyl- pentyl) -p-phenylenediamine} may be used.
그리고, 페놀계 내열제로는 6-터셔리-부틸-2,3-디메틸-4-(디메틸아미노메틸)-페놀, 6-터셔리-옥틸-2,3-디메틸-4-(디메틸아미노메틸)-페놀, 6-터셔리-부틸-4-(디메틸아미노메틸)-5,6,7,8-테트라하이드로-1-나프톨, 5-터셔리-부틸-2,3-디메틸-4-하이드록시벤질포스포네이트, N,N`-핵사메틸렌비스(3,5-디-터셔리-부틸-4-하이드록시하이드로시나마미드 (N,N`-hexametylenebis(3,5-di-t-butyl-4-hydroxyhydAnd as a phenolic heat resistant agent, 6- tert- butyl- 2, 3- dimethyl- 4- (dimethylaminomethyl)-phenol, 6- tert- octyl- 2, 3- dimethyl- 4- (dimethylamino methyl) -Phenol, 6-tertiary-butyl-4- (dimethylaminomethyl) -5,6,7,8-tetrahydro-1-naphthol, 5-tertiary-butyl-2,3-dimethyl-4-hydroxy Benzylphosphonate, N, N`-nucleated methylenebis (3,5-di-tertiary-butyl-4-hydroxyhydrocinamide) (N, N`-hexametylenebis (3,5-di-t-butyl- 4-hydroxyhyd
rocinnamamide), N,N`-트리메틸렌비스(3,5-디-터셔리-부틸-4-하이드록시하이드로시나마미드(N,N`-trimetylenebis(3,5-di-t-butyl-4-hydroxyhydrocinnamamide), 테트라키스 [메틸렌-3(3,5-디-터셔리-부틸-4-하이드록시-페닐)프로피오네이트]메탄, 트리스[베타-(3,5-디-터셔리-4-하이드록시-페닐)프로피오닐-옥시에틸]이소시아눌레이트 등을 사용할 수 있다. 여기서 아민계 내열제와 페놀계 내열제중 내열성은 아민계가 우수하지만색상에서 페놀계가 우수하기 때문에 주로 페놀계를 사용하는 것이 더욱 바람직하다. rocinnamamide), N, N`-trimethylenebis (3,5-di-tert-butyl-4-hydroxyhydrocinamide) (N, N`-trimetylenebis (3,5-di-t-butyl-4- hydroxyhydrocinnamamide), tetrakis [methylene-3 (3,5-di-tert-butyl-4-hydroxy-phenyl) propionate] methane, tris [beta- (3,5-di-tertiary-4- Hydroxy-phenyl) propionyl-oxyethyl] isocyanurate, etc. Here, the heat resistance of the amine-based and phenolic heat-resistant agent is excellent in the amine-based, but phenol-based mainly because of the excellent phenol-based color. More preferably.
아민계 내열제 및/또는 페놀계 내열제는 폴리아미드 수지 100 중량부에 대하여 0.1-1.0 중량부 정도 사용하는 것이 좋은데, 0.1 중량부 미만에서는 성형가공공정 중에서 카르복실 말단기의 상승을 효과적으로 방지하기 어렵고, 1.0 중량부를 초과하면 내열제의 과도한 투입에 의한 물성의 저하가 우려되고, 과도한 투입량에 대한 내열성의 개선효과도 미미하다. Amine-based and / or phenolic heat-resistant agent is preferably used about 0.1-1.0 parts by weight with respect to 100 parts by weight of polyamide resin, but less than 0.1 parts by weight to effectively prevent the rise of carboxyl end groups during the molding process It is difficult, and when it exceeds 1.0 weight part, there exists a concern about the fall of the physical property by excessive addition of a heat resistant agent, and the effect of improving heat resistance with respect to excessive addition amount is also insignificant.
내충격제로서 말레익안하이드라이드가 그라프트된 이피러버를 폴리아미드 수지 100 중량부에 대하여 20~50 중량부 사용한다. 이피러버로는 말레익안하이드라이드가 그라프트되어 있다면 어느것을 사용해도 문제는 없으나 말레익안하이드라이드가 0.3~0.9%, 보다 바람직하기로는 0.4% 그라프트 되어있는 이피러버를 사용하는 것이 좋다.As the impact resistant agent, 20 to 50 parts by weight of an epi rubber grafted with maleic anhydride is used based on 100 parts by weight of a polyamide resin. If the maleic anhydride is grafted with maleic anhydride, there is no problem, but it is better to use an male rubber with 0.3 to 0.9% of maleic anhydride, more preferably 0.4%.
말레익안하이드라이드가 그라프트 비율이 0.3% 보다 낮으면 나일론과의상용성이 충분하지 못하여 압출시 다이 스웰링 현상이 발생할 수 있고 제품에서 박리 현상이 나타난다. If maleic anhydride has a graft ratio of less than 0.3%, compatibility with nylon may not be sufficient, and die swelling may occur during extrusion and peeling may occur in the product.
또한 0.9 %를 초과하는 경우에는 압출시 압력이 많이 걸리며, 유연성을 저해시키는 원인이 될 수 있으므로 적당한 비율을 선택하는 것이 필요하다. 폴리아미드 수지 100 중량부에 대한 이피러버의 함량이 20 중량부 미만일 경우에는 내충격성 및 유연성이 부족하여 본 발명의 용도에 적합하지 못하며, 50 중량부를 초과하는 경우에는 유동 특성의 부족으로 압출 작업이 어려워 제품 성형이 어려운 문제를 야기한다. In addition, if it exceeds 0.9%, it takes a lot of pressure during extrusion, and may cause a deterioration of flexibility, so it is necessary to select an appropriate ratio. If the content of this rubber to 100 parts by weight of polyamide resin is less than 20 parts by weight, the impact resistance and flexibility are insufficient, which is not suitable for the use of the present invention. Difficulties cause product shaping to be difficult.
유연제로서는 다이머라이즈드 지방산(Dimerized Fatty Acid)를 사용한다. 상기의 다이머라이즈드 지방산은 18개의 탄소를 가진 불포화 지방산이 다양한 방법으로 결합한 것으로서 주요형태는 탄소수가 18개인 불포화 지방산에 탄소수가 9~18개인 분자쇄 2개가 결합된 것이다.Dimerized Fatty Acid is used as a softening agent. The dimerized fatty acid is an unsaturated fatty acid having 18 carbons, which is bound in various ways. The main form is two molecular chains having 9 to 18 carbon atoms bonded to an unsaturated fatty acid having 18 carbon atoms.
상기의 다이머라이즈드 지방산은 분자쇄내 전체 탄소수가 18~56개이고 카르복실기의 개수가 1~4개이다. The dimerized fatty acid has 18 to 56 carbon atoms in the molecular chain and 1 to 4 carboxyl groups.
상기의 다이머라이즈드 지방산(Dimerized Fatty Acids)의 구조 일례를 예시하면 하기 구조식(Ⅱ)와 같다.An example of the structure of the dimerized fatty acids (Dimerized Fatty Acids) is shown in the following structural formula (II).
[구조식Ⅱ][Formula II]
[상기식에서, R1 및 R2는 친소수가 9~18개인 분자쇄 이고, X는 선형, 지방족환 또는 방향족환 구조이다][Wherein R1 and R2 are molecular chains having 9 to 18 affinity, X is linear, aliphatic or aromatic ring structure]
상기구조식(Ⅱ) 의 X 가 선형구조로 된 성분의 대표적인 구조는 다음과 같다. Representative structures of components in which X in the above formula (II) has a linear structure are as follows.
상기구조식(Ⅱ) 의 X 가 지방족환구조로 된 성분의 대표적인 구조는 다음과 같다. The representative structure of the component whose X of the said Formula (II) becomes an aliphatic ring structure is as follows.
상기구조식(Ⅱ) 의 X 가 이중환구조를 가진 구조로 된 성분의 대표적인 구조 는 다음과 같다. Representative structures of the components having a structure in which X in the above formula (II) has a bicyclic structure are as follows.
상기구조식(Ⅱ) 의 X 가 방향족환구조로 된 성분의 대표적인 구조는 다음과 같다. Representative structures of the component in which X in the formula (II) is an aromatic ring structure are as follows.
본 발명에서 사용하는 상기의 유연제는 컴파운딩시 투입이 용이하며, 타 유연제들과는 달리 가공중에 휘발하여 그 성능을 저하시킬 염려가 없다. 본 발명에서는 상기 유연제를 폴리아미드 수지 100 중량부에 대하여 10 - 30 중량부 첨가한다. 10 중량부 미만에서는 그 효과가 미미하며, 40 중량부를 초과하는 경우에는 그 효과의 증진이 미미할뿐만 아니라 비용이 상승하는등 경제적이지 못하다. The softener used in the present invention is easy to add during compounding, and unlike other softeners, there is no fear of volatilization during processing to lower its performance. In this invention, 10-30 weight part of said softening agents are added with respect to 100 weight part of polyamide resins. If the amount is less than 10 parts by weight, the effect is insignificant, and if it is more than 40 parts by weight, the effect is not only small, but also the cost is not economical.
또한 폴리아미드 수지 100 중량부에 대하여 앞에서 설명한 내충격제와 유연제의 전체 함량을 30~60 중량부로 하는 것이 바람직하다. 상기 함량이 30 중량부 미만인 경우에는 유연성 등의 특성이 발현되지 못하고, 60 중량부를 초과하는 경우에는 용융 지수가 커서 압출시 문제가 발생할 뿐만아니라 용도에 따라서는 내열성에 문제가 될 수 있다. In addition, the total content of the impact-resistant agent and the softening agent described above with respect to 100 parts by weight of the polyamide resin is preferably 30 to 60 parts by weight. If the content is less than 30 parts by weight, such properties as flexibility is not expressed, and if it exceeds 60 parts by weight, the melt index is large, causing problems in extrusion as well as problems in heat resistance depending on the application.
본 발명에서 얻어진 폴리아미드 수지 조성물은 유연한 특성이 요구되는 압출 부분인 만드렐 및 기타 유연성과 내충격성이 요구되는 부품으로 신발 소올 등의 용도로 적용될 수 있다. The polyamide resin composition obtained in the present invention can be applied to the use of shoe soles, such as mandrel, which is an extruded part requiring flexible properties, and other parts requiring flexibility and impact resistance.
이하, 실시예 및 비교실시예를 통하여 본 발명을 더욱 구체적으로 살펴본다. 그러나 본 발명이 하기 실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples. However, the present invention is not limited by the following examples.
실시예 1Example 1
투입구가 3개인 이축압축기의 제1투입구에는 상대점도가 3.2인 폴리아미드6 수지 100 중량부와 6-터셔리-부틸-2.3-디메틸-4-(디메틸 아미노 메틸)-페놀인 내열제 0.5 중량부, 통상의 이형제 0.01 중량부 및 통상의 커플링제 0.01 중량부를 블렌딩하여 투입하고, 상기 이축압축기의 제2투입구에는 말레익안하이드라이드가 0.4% 그라프트된 이피러버의 내충격제 50 중량부를 투입하고, 상기 이축압축기의 제3투입구에는 탄소수가 18개인 불포화 지방산에 탄소수가 9개인 분자쇄 2개가 결합되어 분자쇄내 전체 탄소수가 36개이고 카르복실기가 2개인 다이머라이즈드 지방산(X=선형)의 유연제 10 중량부를 투입한 후 250℃로 용융, 혼련하여 폴리아미드 수지 조성물을 제조한 다음, 이를 칩상태로 토출하였다. 제조된 칩을 85℃의 열풍건조기에서 5시간 동안 건조한 후 이를 255℃의 스크류식 사출기에 투입하여 물성측정용 시편을 제조하였다.In the first inlet of the three-screw inlet, 100 parts by weight of polyamide 6 resin having a relative viscosity of 3.2 and 0.5 parts by weight of heat-resistant agent 6-tertiary-butyl-2.3-dimethyl-4- (dimethyl amino methyl) -phenol , 0.01 part by weight of a common release agent and 0.01 part by weight of a conventional coupling agent were blended, and 50 parts by weight of an impact agent of an epi rubber, in which 0.4% of maleic hydride was grafted, was introduced into the second inlet of the biaxial compressor. Into the third inlet of the twin-screw compressor, two unsaturated chains of 18 carbon atoms are bonded to 18 unsaturated fatty acids, and 10 parts by weight of a softener of dimerized fatty acid (X = linear) having 36 carbon atoms and two carboxyl groups in the molecular chain is added. After melting and kneading at 250 ° C. to prepare a polyamide resin composition, it was discharged in a chip state. The prepared chip was dried in a hot air dryer at 85 ° C. for 5 hours, and then put into a screw injection machine at 255 ° C. to prepare a specimen for measuring physical properties.
제조한 시편의 물성 및 성형성을 평가한 결과는 표 2와 같다.The results of evaluating the physical properties and formability of the prepared specimens are shown in Table 2.
실시예 2 ~ 실시예 4 및 비교실시예 1 내지 비교실시예 6Examples 2 to 4 and Comparative Examples 1 to 6
내충격제 및 유연제의 함량을 표 1과 같이 변경한 것을 제외하고는 실시예 1 과 동일한 방법으로 폴리아미드 수지 조성물 및 그의 시편을 제조하였다.A polyamide resin composition and a specimen thereof were prepared in the same manner as in Example 1 except that the contents of the impact resistant agent and the softening agent were changed as shown in Table 1.
제조한 시편의 물성 및 성형성을 평가한 결과는 표 2와 같다.The results of evaluating the physical properties and formability of the prepared specimens are shown in Table 2.
본 발명에 있어서, 시편의 각종 물성은 아래 방법으로 측정하였다.In the present invention, various physical properties of the specimen were measured by the following method.
ㅇ 인장강도 : ASTM D683에 의거, 1/8인치 시편을 제작한 후 측정하였다. ㅇ Tensile strength : According to ASTM D683, 1/8 inch specimens were prepared and measured.
ㅇ 유연성 : ASTM D-790에 의거 굴곡탄성율을 측정하였다. Flexibility : Flexural modulus was measured according to ASTM D-790.
ㅇ 용융지수 : 240℃에서 ASTM D-1238에 의거 용융지수를 평가 하였다. ㅇ Melt index : The melt index was evaluated according to ASTM D-1238 at 240 ℃.
ㅇ 충격강도 : ASTM D256에 의거하여 1/4인치 시편을 제작하여 상온에서 아이조드 노치(Izod Notched) 충격강도를 측정하였다. ㅇ Impact strength : Izod Notched impact strength was measured at room temperature by making 1/4 inch specimen according to ASTM D256.
본 발명은 유연성이 우수하여 압출성형이 가능하며, 내충격성 및 생산성이 뛰어나 굽힘용 파이프나 튜브를 만드는데 필요한 만드렐용 소재등으로 유용하다.The present invention is excellent in flexibility and can be extruded, and excellent in impact resistance and productivity, it is useful as a material for mandelels required to make a pipe or tube for bending.
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Citations (4)
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JPH04218530A (en) * | 1990-02-28 | 1992-08-10 | Bayer Ag | Flexible polyamide and its use |
KR19980040718A (en) * | 1996-11-29 | 1998-08-17 | 이웅열 | Reinforced flame retardant polyamide resin composition |
KR19980048236A (en) * | 1996-12-17 | 1998-09-15 | 이웅열 | Polyamide Resin Composition for Extrusion Tubing Molding |
US6548181B2 (en) | 1996-12-23 | 2003-04-15 | Dsm N.V. | Flexible polyamide composition |
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JPH04218530A (en) * | 1990-02-28 | 1992-08-10 | Bayer Ag | Flexible polyamide and its use |
KR19980040718A (en) * | 1996-11-29 | 1998-08-17 | 이웅열 | Reinforced flame retardant polyamide resin composition |
KR19980048236A (en) * | 1996-12-17 | 1998-09-15 | 이웅열 | Polyamide Resin Composition for Extrusion Tubing Molding |
US6548181B2 (en) | 1996-12-23 | 2003-04-15 | Dsm N.V. | Flexible polyamide composition |
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