KR100837607B1 - Electroless nikel plating method of a water metel - Google Patents
Electroless nikel plating method of a water metel Download PDFInfo
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- KR100837607B1 KR100837607B1 KR1020070023525A KR20070023525A KR100837607B1 KR 100837607 B1 KR100837607 B1 KR 100837607B1 KR 1020070023525 A KR1020070023525 A KR 1020070023525A KR 20070023525 A KR20070023525 A KR 20070023525A KR 100837607 B1 KR100837607 B1 KR 100837607B1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/168—Control of temperature, e.g. temperature of bath, substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
Abstract
Description
도 1 은 본 발명이 실시되는 예시도를 나타낸 단면도1 is a cross-sectional view showing an exemplary view of the present invention
도 2 는 본 발명의 수도미터기에 대한 사시도2 is a perspective view of the water meter of the present invention
도 3 은 본 발명의 수도미터기에 대한 정면도3 is a front view of the water meter of the present invention
도 4 는 본 발명의 수도미터기에 대한 평면도4 is a plan view of the water meter of the present invention
[도면의 주요부분에 대한 부호의 설명][Explanation of symbols on the main parts of the drawings]
10 : 수도미터기 11 : 몸체10: water meter 11: body
12 : 뚜껑 13 : 연결부12: lid 13: connection
15 : 보호통15: protective case
본 발명은 수도미터기 무전해 니켈 도금방법에 관한 것으로, 더욱 상세하게 는 수도미터기의 몸체 표면에 무전해 니켈 도금층을 형성하여 줌으로써, 수도미터기의 강도를 향상시키고 부식을 방지하여 납 용출시험에서 0.005ppm 이하가 검출되도록 하는 수도미터기 무전해 니켈 도금방법에 관한 것이다.The present invention relates to a electroless nickel plating method of the water meter, and more particularly, by forming an electroless nickel plating layer on the body surface of the water meter, to improve the strength of the water meter and to prevent corrosion by 0.005ppm in the lead dissolution test The present invention relates to a water meter electroless nickel plating method for detecting the following.
일반적인 수도미터기(10)의 형태는 내부에 유체가 통과하는 유량을 측정하는 장치가 설치되며, 몸체(11)의 양쪽으로 형성한 연결부(13)에 앵글 밸브(17)가 연결되어 유체의 공급 유무를 결정할 수 있도록 하고 상측에는 유리에 의해 내부를 육안으로 확인할 수 있도록 하는 뚜껑(12)이 설치된 것으로 황동으로 성형하여 조립부위를 가공하여 사용하게 된다.In general, the type of
그러나 이러한 수도미터기의 몸체는 납 용출 시험을 하는 경우 일반적으로 1ppm 이하로 유지되지만, 그 기준이 0.005ppm 이하로 강화되므로 황동으로만 성형한 수도미터기는 그 기준을 통과할 수 없는 불합격 제품으로 성형된다.However, the body of such water meter is generally kept below 1ppm in the lead dissolution test, but since the standard is strengthened to 0.005ppm or less, the water meter made of brass is molded into a product that cannot pass the standard. .
이러한 불합격 제품을 유통하는 경우 물이 공급되면서 납이 혼입되어 인체에 치명적인 오류를 제공하거나, 여러 가지 나쁜 영향을 미치게 된다.In the case of distribution of such a rejected product, lead is mixed with water to provide a fatal error to the human body or have various adverse effects.
아울러, 도금이란 소재의 표면에 금속을 코팅하는 과정을 말하며 일반적으로 부식을 방지하기 위해서나, 내마모성(스크레치에 대한 저항성)을 부여하거나, 고온에서 사용하는 금속을 보호하기 위해서나, 밀착성을 제공하기 위하여 또는 적절한 전기적 성질을 얻기 위하여, 혹은 소재에 반사성을 부여하고 외형을 좋게 하기 위하여 등등의 여러 가지 목적을 달성하기 위해 사용한다.In addition, plating refers to a process of coating a metal on the surface of the material, and generally to prevent corrosion, to impart wear resistance (resistance to scratches), to protect metals used at high temperatures, or to provide adhesion or It is used to achieve various purposes such as to obtain proper electrical properties, or to reflect the material and improve its appearance.
그러나 전기도금방법은 니켈 - 크롬 도금과 같이 니켈을 도금한 후 크롬을 도금하는 방법을 이용하고 있으나, 수도미터기의 경우에는 몸체의 외부로 노출된 부분만 도금이 이루어지고 내부에는 도금이 이루어지지 않기 때문에 외관은 미려하지만 실제 유체(수돗물)가 통과하는 부분은 내부이므로 통과하는 유체에 납 성분이 접촉되어 물을 오염시키는 원인이 되며 실제 납 용출시험을 하는 경우 1ppm 이하에서 0.1ppm 정도가 용출되므로 기준에 합격할 수 없는 것이었다.However, the electroplating method uses a method of plating chromium after plating nickel, such as nickel-chromium plating. However, in the case of a water meter, only the part exposed to the outside of the body is plated, and plating is not performed inside. Therefore, the exterior is beautiful, but the part where the actual fluid (tap water) passes through is inside, which leads to contamination of water by contacting the lead component with the passing fluid.In the case of the actual lead dissolution test, about 0.1 ppm is eluted at less than 1 ppm. I could not pass on.
이에 본 발명은 이와 같은 종래의 결점을 해소하기 위하여 안출된 것으로, 수도미터기를 욕조에 직접 넣어 무전해 니켈 도금에 의해 수도미터기의 몸체 전체면에 니켈 도금층을 피복하여 이루어지도록 함을 목적으로 한다.Accordingly, the present invention has been made in order to solve such a conventional drawback, and is intended to be made by coating a nickel plating layer on the entire surface of the body of the water meter by electroless nickel plating by putting the water meter directly into the bath.
본 발명은 니켈 도금층을 피복하여 이루어지는 무전해 니켈 도금방법을 통하여 납 용출시험에서 0.005ppm 이하가 되도록 함을 목적으로 한다.The present invention aims to be 0.005 ppm or less in the lead dissolution test through the electroless nickel plating method formed by coating a nickel plating layer.
이러한 목적으로 이루어지는 본 발명의 바람직한 실시예를 첨부시킨 도면에 따라서 상세하게 설명하기로 한다.According to the accompanying drawings, preferred embodiments of the present invention for this purpose will be described in detail.
수도미터기(10)는 내부에 공급하는 유체의 유량을 측정하는 측정장치가 설치되는 몸체(11)의 양측으로 연결부(13)가 형성되어 앵글밸브(17)와 연결되도록 하며 상측으로 유리에 의해 내부를 육안으로 확인할 수 있도록 하는 뚜껑(12)으로 이루 어진다.The
상기 수도미터기(10)는 건축물의 실내, 외에 다양하게 설치하며, 보호통(15)에 설치하는 경우에는, 도 1에 도시한 바와 같이, 앵글밸브(17)에 파이프(18)가 연결되고 이 파이프(18)는 동파를 방지하기 위하여 다리(19)의 내부에 설치하는 한편, 수도미터기(10)와 앵글밸브(17)는 보호통(15)의 내부에서 보온재(16)로 감싸지도록 보관하는 것이다.The
상기 수도미터기(10)는 황동으로 성형한 후 뚜껑(12)이 설치되는 부분과 내부 및 연결부(13)가 가공되어 사용하는 것으로 황동으로 성형한 수도미터기(10)의 몸체(11)를 납 용출시험하면 대략 1ppm 이하가 나온다.The
이러한 수도미터기(10)의 몸체(11)를 무전해 니켈 도금하여 0.005ppm 이하의 납이 용출되도록 하는 것이다.The
본 발명에 있어서, 통상적인 무전해 니켈 도금과정에서 수도미터기(10)의 몸체 전체면에 무전해 니켈 도금을 5∼9㎛두께로 하는 것이다.In the present invention, in the conventional electroless nickel plating process, the electroless nickel plating is made to have a thickness of 5 to 9 μm on the entire body surface of the
무전해 니켈의 온도는 83∼92℃ 정도가 적당하며, 도금시간은 35∼43분이 좋고, ph는 4.4∼4.9가 되도록 한다.The temperature of the electroless nickel is suitably about 83 to 92 占 폚, the plating time is preferably 35 to 43 minutes, and the pH is 4.4 to 4.9.
이와 같이 무전해 니켈을 도금함에 있어서, 7㎛의 두께로 도금하는 경우, 수도미터기(10)의 몸체(11) 전체면에 균일하게 도금이 이루어짐을 확인할 수 있으며, 납 용출시험을 한 결과 0.0041ppm이 검출됨을 확인하였다.As described above, in plating electroless nickel, when plating with a thickness of 7 μm, the plating was uniformly performed on the entire surface of the
이하에서, 본 발명의 바람직한 실시예를 상세하게 설명하기로 한다.Hereinafter, preferred embodiments of the present invention will be described in detail.
[실시예]EXAMPLE
(1) 주물 성형(1) casting molding
몸체(11)의 개략적인 형태를 갖도록 제조된 틀에 용융된 황동을 공급하여 수도미터기(10)를 성형한다.The
(2) 주물 가공(2) casting processing
주물로 성형한 후 뚜껑(12)과 그 내부 및 연결부(13)를 가공하여 수도미터기(10)의 외형을 성형한다.After molding into a casting, the
(3) 탈지 및 수세(3) degreasing and washing
알카리에 25∼35분간 침적시켜 탈지한 후 수세 한다.Dip it in alkaline for 25 to 35 minutes to degrease and wash with water.
(4) 산세 및 수제(4) pickling and handmade
45∼55%의 질산 수용액에 10∼15분간 산세한 후 수세 한다.After pickling in 45-55% nitric acid aqueous solution for 10-15 minutes, it is washed with water.
(5) 전해탈지 및 수세(5) Electrolytic degreasing and washing
음극 전해탈지를 10∼20분간 수행한 후 수세 한다.After performing electrolytic degreasing for 10-20 minutes, it is washed with water.
(6) 산세 및 수세(6) Pickling and washing
8∼12%의 황산 수용액에 산세한 후 수세 한다.After washing with 8-12% sulfuric acid aqueous solution, it is washed with water.
(7) 무전해 니켈 및 수세(7) electroless nickel and flush
욕조의 온도를 83∼92℃ 정도가 되도록 하여 수도미터기(10)를 욕조에 담가서 ph는 4.4∼4.9가 되도록 하고 35∼43분간 도금하여 5∼9㎛두께가 되도록 한 후 수세 한다.The temperature of the bath is 83-92 ° C., the
(8) 중화 및 수세(8) neutralization and washing
8∼12%의 시안화나트륨 수용액에 넣어 중화한 후 수세 한다.It is neutralized after putting into 8-12% of sodium cyanide aqueous solution and washing with water.
(9) 중크롬산 및 수세(9) Dichromic acid and water washing
5∼10%의 크롬산 수용액에 5∼10분간 침지 한 후 수세와 온탕을 수행 한다.After immersing in 5-10% aqueous solution of chromic acid for 5-10 minutes, washing with water and hot water is performed.
(10) 건조과정(10) drying process
에어를 공급하여 수도미터기(10)를 건조한 후 건조로에 넣어 10∼15분간 건조한다.After supplying air to dry the water meter (10) in a drying furnace for 10 to 15 minutes.
(11) 완성(11) completion
외관검사 후 포장하여 완성한다. After packaging, complete packaging.
이와 같은 도금 방법에 대하여 표1에서 일실시예를 더욱 명확하게 밝히기로 한다.With respect to such a plating method, one embodiment will be more clearly shown in Table 1.
[표 1]TABLE 1
본 발명은 수도미터기를 욕조에 직접 넣어 무전해 니켈 도금에 의해 수도미터기의 몸체 전체면에 니켈 도금층을 피복하여 수도미터기로의 사용시에 공급하는 물이 유해물질에 노출되어 오염되지 않도록 하는 것이다.The present invention is to put the water meter directly into the bath to coat the nickel plating layer on the entire surface of the body of the water meter by electroless nickel plating so that the water supplied during use to the water meter is exposed to harmful substances and not contaminated.
본 발명은 니켈 도금층을 피복하여 이루어지는 무전해 니켈 도금방법을 통하여 납 용출시험에서 0.005ppm 이하가 되도록 하여 안전성을 보장할 수 있도록 하는 것이다.The present invention is to ensure the safety to be less than 0.005ppm in the lead dissolution test through the electroless nickel plating method is formed by coating the nickel plating layer.
Claims (3)
Priority Applications (1)
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KR1020070023525A KR100837607B1 (en) | 2007-03-09 | 2007-03-09 | Electroless nikel plating method of a water metel |
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KR1020070023525A KR100837607B1 (en) | 2007-03-09 | 2007-03-09 | Electroless nikel plating method of a water metel |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5625958A (en) | 1979-08-10 | 1981-03-12 | Mitsubishi Metal Corp | Electroless nickel plating method for high nickel chromium alloy |
JPH02141580A (en) * | 1988-11-22 | 1990-05-30 | Hitachi Chem Co Ltd | Method for evaluating active state of electroless nickel plating liquid |
JPH05129376A (en) * | 1991-11-07 | 1993-05-25 | Sumitomo Metal Mining Co Ltd | Method of applying electroless nickel planting to surface of copper film formed on surface of insulator |
KR940009362A (en) * | 1992-10-27 | 1994-05-20 | 황선두 | Electroless Nickel Plating Method for Iron Free Cutting Steels |
KR950006114A (en) * | 1993-08-07 | 1995-03-20 | 배순훈 | Surface treatment method of brake drum for clutch of washing machine |
-
2007
- 2007-03-09 KR KR1020070023525A patent/KR100837607B1/en not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5625958A (en) | 1979-08-10 | 1981-03-12 | Mitsubishi Metal Corp | Electroless nickel plating method for high nickel chromium alloy |
JPH02141580A (en) * | 1988-11-22 | 1990-05-30 | Hitachi Chem Co Ltd | Method for evaluating active state of electroless nickel plating liquid |
JPH05129376A (en) * | 1991-11-07 | 1993-05-25 | Sumitomo Metal Mining Co Ltd | Method of applying electroless nickel planting to surface of copper film formed on surface of insulator |
KR940009362A (en) * | 1992-10-27 | 1994-05-20 | 황선두 | Electroless Nickel Plating Method for Iron Free Cutting Steels |
KR950006114A (en) * | 1993-08-07 | 1995-03-20 | 배순훈 | Surface treatment method of brake drum for clutch of washing machine |
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