KR100814649B1 - Substrate gap adjusting device, substrate gap adjusting method, and method of manufacturing liquid crystal display device - Google Patents

Abstract

(assignment)

Provided is a substrate spacing adjusting device, a substrate spacing adjusting method, and a method for manufacturing a liquid crystal display device capable of adjusting a substrate spacing corresponding to a gathered region at a time while in contact with only a part of the substrate surface.

(Solution)

The board | substrate gap adjustment apparatus 1 is an apparatus for adjusting the space | interval of the element substrate 51 and the opposing board | substrate 52, and consists of the lower jig 11 and the upper jig 12. As shown in FIG. The lower jig 11 has a support ring 41 and a mounting portion 26 for mounting the upper part, and the upper jig 12 is in contact with the element substrate 51 at any position of the movable range in the vertical direction. And a micrometer head 33 for applying a force for displacing the substrate pressing portion 32 and the substrate pressing portion 32 to the movable range. The board | substrate gap adjustment apparatus 1 makes contact with the element board | substrate 51 and the support ring 41 with respect to the element board | substrate 51, and makes contact with the element board | substrate 51 and the board | substrate press part 32. The element substrate 51 is deformed by applying a force with the region as the inversion point.

Board Spacer

Description

Substrate Spacing Device, Substrate Spacing Method, and Manufacturing Method of Liquid Crystal Display {SUBSTRATE GAP ADJUSTING DEVICE, SUBSTRATE GAP ADJUSTING METHOD, AND METHOD OF MANUFACTURING LIQUID CRYSTAL DISPLAY DEVICE}

BRIEF DESCRIPTION OF THE DRAWINGS The schematic diagram which shows the component of a board | substrate spacing adjustment apparatus.

2 is a schematic diagram illustrating a substrate gap adjusting device.

3 shows a substrate gap adjusting device, (a) is a plan view, and (b) is a side cross-sectional view.

4 is a side sectional view showing a substrate gap adjusting device and an external drive device;

5 is a block diagram showing an electrical configuration of an external drive device;

6 is a process chart showing an adjustment procedure of the substrate spacing.

FIG. 7: (a)-(e) is lateral sectional drawing which shows the board | substrate gap adjustment method using a board | substrate gap adjustment apparatus. FIG.

8 is a process chart showing a manufacturing procedure of the liquid crystal display device.

9 shows a substrate gap adjusting device, (a) is a plan view, and (b) is a side cross-sectional view.

10 shows a substrate gap adjusting device, (a) is a plan view, and (b) is a side cross-sectional view.

Fig. 11 is a side cross-sectional view showing a substrate gap adjusting method using the substrate gap adjusting device shown in Fig. 10.

12: (a) and (b) are schematic diagrams showing a liquid crystal display device.

Fig. 13 is a cross-sectional view showing a liquid crystal encapsulation method by liquid crystal dropping method (a) and (b).

14 is a process chart showing a manufacturing procedure of the liquid crystal display device using the liquid crystal dropping method.

(Explanation of the sign)

1: substrate spacing device

2: external drive unit

11: Lower jig as "the first donation"

12: upper jig

26: mounting part

32: substrate pressing unit

33: Micrometer head as a "rotation input mechanism" included in an "external force applying unit"

41, 42: Support ring as `` ring support ''

50: composite substrate

51: Device substrate as "first substrate"

52: Opposing substrate as "second substrate"

61: hand

62: lifting and lowering mechanism

63: motor

64L: first polarizer

64U: second polarizer

65: light source

72: dustproof glass

73: cover

100: liquid crystal display device

[Patent Document 1] Japanese Unexamined Patent Publication No. 2000-347198

The present invention relates to a substrate gap adjusting device, a substrate gap adjusting method, and a manufacturing method of a liquid crystal display device for adjusting the gap of the substrate attached via the sealing agent to an appropriate state.

Generally, the manufacturing process of a liquid crystal display device includes the process of injecting a liquid crystal between a pair of board | substrates attached through the sealing compound, and the process of sealing an injection hole after liquid crystal injection. As shown in Patent Literature 1, sealing of the injection port is generally performed in a state in which a pressure at which the substrate gap is in an appropriate state is applied to the substrate. According to this technique, the substrate spacing is maintained in an appropriate state even after the application of pressure is released after sealing.

Although the board | substrate of a sealing process is various, one form of the board | substrate has the form in which many opposing board | substrates of about 1 inch-2 inches diagonally corresponding to a single item are arrange | positioned on a wafer-shaped board | substrate. It is a fact that the process of sealing the composite board | substrate of this form includes the process of adjusting the board | substrate spacing by directly pressing the said single article with human hands one by one. This is because the pressurizing device interferes with the sealing operation when all of the units are pressurized with the pressurizing device at once to adjust the substrate gap.

However, when the substrate gap is adjusted by directly pressing the substrate in the sealing step, minute defects may occur on the substrate surface. In particular, as described above, such a problem is likely to occur when the pressure is directly applied by a human hand. Moreover, since pressurization by a human hand has to pressurize board | substrate one by one, processing takes time, and there exists a problem that it takes a long time for an operator to become accustomed.

This invention is made | formed in view of the said situation, One of the objectives is the board | substrate spacing adjustment apparatus and board | substrate spacing adjustment which can adjust the board | substrate spacing corresponding to the gathered area at once in the state which contacted only a very part of the board | substrate surface. It is providing the method and the manufacturing method of a liquid crystal display device.

Means to solve the problem

The board | substrate spacing adjustment apparatus by this invention is a 1st board | substrate, the 2nd board | substrate with a smaller area than the said 1st board | substrate attached to the 1st board | substrate through the sealing compound, and the said 1st board | substrate and the said 2nd board | substrate. And a substrate gap adjusting device for adjusting a gap between the first substrate and the second substrate in a composite substrate having a liquid crystal injected into a space surrounded by the sealing agent, the first base having a mounting portion; An annular support which is mounted on a mounting portion and supports the composite substrate in contact with a second surface on the side opposite to the first surface to which the second substrate is attached, among the two surfaces of the first substrate, A substrate pressing portion having a movable range in the normal direction of the plane and contacting the first substrate at a peripheral edge portion of the first surface at any one of the movable ranges; and the substrate pressing portion The peripheral edge portion provided with the external force applied to the force transmitted to the art board pressing portion for displacement in the movable range of parts, characterized in that the bore located on the outer side of the support in the normal direction.

This board | substrate spacing adjustment apparatus makes a 1st board | substrate the point where the contact point of the said 1st board | substrate and an annular support stand with respect to a 1st board | substrate, and applies a force as the point of contact | contact area of the said 1st board | substrate and a board | substrate pressurization part, The substrate can be modified. Moreover, by the said deformation | transformation, the space | interval of a 1st board | substrate and the 2nd board | substrate arrange | positioned facing this can be changed. Here, if the board | substrate press part sets the force applied to the circumferential edge part of a 1st board | substrate appropriately, the board | substrate spacing corresponding to any gathered area | region of a 1st board | substrate can be adjusted to an appropriate state simultaneously. At the time of adjusting the substrate spacing, the annular support and the substrate pressing portion are in contact with the first substrate, but the contact point with the former is only a circumferential region determined from the shape of the support, and the contact region with the latter is the first substrate. Only the peripheral edge of the first side of the. In addition, nothing touches the second substrate. Thus, since this apparatus touches only a part of a board | substrate in adjustment of a board | substrate spacing, it is difficult to damage or damage a board | substrate.

One of the effects obtained by the above configuration is that the substrate spacing corresponding to the gathered regions can be adjusted at once without breaking or damaging the substrate.

Moreover, the board | substrate gap adjustment apparatus which concerns on this invention is provided with the 2 or more said board | substrate pressurization parts which can press another part of the said peripheral part, and each said board | substrate pressurization part is displaced independently from each other, It is characterized by the above-mentioned. The board | substrate space adjusting apparatus which has this structure can apply a force to a 1st board | substrate with desired balance by changing the force which each board | substrate pressurizing part presses a 1st board | substrate according to the shape of a 1st board | substrate. For this reason, a board | substrate space | interval can be adjusted with respect to the composite board | substrate containing the 1st board | substrate chopped in a complicated shape.

Moreover, the said support stand is circular, and the said board | substrate pressurization part has a shape in which the contact area | region with the said 1st board | substrate becomes arc shape in the inner peripheral side, and the said arc-shaped part is concentric with the circle prescribed | regulated by the said support stand. It is characterized in that it is almost identical to a part of one circle. Here, it is preferable that the length of each arc-shaped part of the said contact area | region is substantially the same each, respectively. The substrate gap adjusting device having such a configuration can apply a force evenly or with a desired balance with respect to the peripheral portion of the substantially circular first substrate. One of the effects obtained by the above configuration is a composite substrate comprising a substantially circular first substrate and a second substrate arranged to face the first substrate, wherein the substrate corresponds to the gathered region without damaging or damaging the substrate. The interval can be adjusted at once.

Moreover, in the board | substrate gap adjustment apparatus which concerns on this invention, the said support stand is a ring-shaped, It is characterized by being provided with several pieces from which the diameter differs. According to the shape of a 1st board | substrate, the board | substrate gap adjusting apparatus of such a structure can increase the point at the time of applying a force to a 1st board | substrate. One effect obtained by the said structure is that a board | substrate space | interval can be adjusted with respect to the composite board | substrate containing the 1st board | substrate subtracted in a complicated shape.

Further, the first base is further provided with a detachable and annular second base, wherein the substrate pressing portion is attached so as to be movable relative to the second base to allow displacement in the movable range, The external force applying unit may be configured to include a rotational input mechanism that is rotatable and the rotation is converted into displacement with respect to the second base of the substrate pressurizing unit. The board | substrate spacing adjustment apparatus of such a structure can contact a board | substrate press part to the predetermined position of a 1st board | substrate without a special mechanism by combining and combining a 2nd base on the 1st base provided with a composite substrate. Further, by setting the correspondence between the displacement amount of the substrate pressing portion and the rotation amount of the rotation input mechanism to an appropriate ratio, the large rotation amount of the rotation input mechanism can be matched with the minute displacement of the substrate pressing portion. One of the effects obtained by the above configuration is that the displacement amount of the substrate pressing portion can be finely adjusted by simple operation, and further, the substrate spacing can be finely adjusted.

Moreover, the board | substrate spacing adjustment apparatus by this invention may be equipped with the hand which hold | maintains the said rotation input mechanism, and the motor which gives rotational drive force to the said hand. According to this structure, it is possible to rotate a rotation input mechanism by transmitting the rotation drive force of a motor to a rotation input mechanism via a hand. One of the effects obtained by the above configuration is that the operator can rotate the rotation input mechanism without directly rotating the rotation input mechanism, and further, the substrate spacing can be adjusted.

In addition, the substrate gap adjusting device according to the present invention includes a first polarizing plate, a second polarizing plate, and a light source, wherein the mounting portion has a light transmitting property, and a part of the light emitted from the light source is the first polarizing plate, the mounting portion, and the You may be comprised so that a composite substrate and a said 2nd polarizing plate may be transmitted in order. The light which passed through the optical path mentioned above is colored according to the space | interval of a 1st board | substrate and a 2nd board | substrate in a composite substrate. In addition, it is sufficient if the mounting portion has light transmittance with respect to the region corresponding to the arrangement region of the second substrate. One of the effects obtained by the above configuration is to be able to visually recognize the degree of the adjusted substrate spacing.

The substrate spacing adjusting method according to the present invention includes a first substrate, a second substrate having a smaller area than the first substrate, and a first substrate and the second substrate, which are attached to each other via a sealing agent against the first substrate. And a substrate gap adjusting method for adjusting a gap between the first substrate and the second substrate in a composite substrate having a liquid crystal injected into a space surrounded by the sealing agent, and mounted on a mounting portion of a first base. A first step of installing the composite substrate so that the second surface on the opposite side of the first surface to which the second substrate is attached, of the two surfaces of the first substrate is in contact with the support, A second step of bringing the substrate pressing portion having a movable range in the normal direction of the plane defined by the support into contact with the first substrate at a peripheral edge of the first surface, and the substrate pressing portion in the normal direction; Of and in said first plane; and a third step for pressing in a direction toward the second surface.

According to this substrate spacing adjusting method, a force is applied to the first substrate as a point of contact between the first substrate and the annular support, and the force is applied to the contact region of the first substrate and the substrate pressing portion as a focus point. The first substrate can be modified. Moreover, by the said deformation | transformation, the space | interval of a 1st board | substrate and the 2nd board | substrate arrange | positioned facing this can be changed. Here, if the board | substrate press part sets the force applied to the circumferential edge part of a 1st board | substrate suitably, the board | substrate spacing corresponding to any gathered area | region in a 1st board | substrate can be adjusted simultaneously in an appropriate state. At the time of adjusting the substrate spacing, the annular support and the substrate pressing portion are in contact with the first substrate, but the contact point with the former is only a circumferential region determined from the shape of the support, and the contact region with the latter is the first substrate. It is only the peripheral edge of a 1st surface. In addition, nothing touches the second substrate. Thus, at the time of board | substrate spacing adjustment, since this apparatus contacts only a part of board | substrate, it is difficult to damage or damage a board | substrate.

One of the effects obtained by the above method is that the substrate spacing corresponding to the gathered regions can be adjusted at once without breaking or damaging the substrate.

Moreover, the said 2nd process may include the process of contacting 2 or more said board | substrate pressurization part with the said 1st board | substrate in the circumferential edge part of a said 1st surface so that the different location of the said circumferential edge part may be pressed. 3rd process may include the process of pressing each board | substrate pressurization part independently from each other in the direction toward the said 2nd surface from the said 1st surface among the said normal lines directions. According to this board | substrate gap adjustment method, each board | substrate pressurization part pressurizes a 1st board | substrate with a suitable force, and can deform | transform a 1st board | substrate to a form near a desired state more. For this reason, the board | substrate spacing corresponding to the desired area | region in a 1st board | substrate can be adjusted in a suitable state.

In addition, the support is circular, and the plurality of substrate pressing portions have a shape in which a contact area with the first substrate is arc-shaped on an inner circumferential side, and the arc-shaped portion is concentric with a circle defining the support. The configuration may be substantially the same as part of one circle. Here, it is preferable that the length of each arc-shaped part of the said contact area | region is substantially the same each, respectively. According to such a substrate spacing adjustment method, a force can be applied evenly or at a desired balance with respect to the peripheral portion of the substantially circular first substrate. One of the effects obtained by the above method is a composite substrate comprising a substantially circular first substrate and a second substrate arranged to face the first substrate, wherein the substrate corresponds to the gathered region without damaging or damaging the substrate. The interval can be adjusted at once.

Moreover, the said 1st process is a process of providing the said composite board | substrate so that the 2nd surface of the said 1st board | substrate may contact the said support stand on the circular annular support body from which two or more diameters arrange | positioned on the said 1st board | substrate differ. It may include. According to such a substrate gap adjustment method, it is possible to increase the point at the time of applying a force to the first substrate in accordance with the shape of the first substrate. One of the effects obtained by the above method is that the substrate spacing can be adjusted with respect to the composite substrate including the first substrate sliced into a complicated shape.

In addition, the second step includes a step of combining the second base with the substrate pressing portion to the first base, and simultaneously contacting the substrate pressing portion with the first substrate at the peripheral edge of the first surface. The third step may include a step of rotating the rotation input mechanism as the external force applying unit that is configured to be rotatable and that can convert the rotation into displacement of the substrate pressurizing unit. In such a substrate spacing adjustment method, the substrate pressing portion can be brought into contact with a predetermined position of the first substrate without a special mechanism by combining the first base provided with the composite substrate with the second base. Further, by setting the correspondence between the displacement amount of the substrate pressing portion and the rotation amount of the rotation input mechanism to an appropriate ratio, the large rotation amount of the rotation input mechanism can be matched with the minute displacement of the substrate pressing portion. One of the effects obtained by the above method is that the displacement amount of the substrate pressing portion can be finely adjusted by simple operation, and further, the substrate spacing can be finely adjusted.

Moreover, the board | substrate spacing adjustment method by this invention may include the process of the hand holding the said rotation input mechanism, and the process of transmitting the rotation drive force of a motor to the said hand, and rotating the said hand and the said rotation input mechanism. . One of the effects obtained by this method is that the operator can rotate the rotation input mechanism without directly rotating the rotation input mechanism, and further, the substrate spacing can be adjusted.

The manufacturing method of the liquid crystal display device which concerns on this invention is a process of attaching the 2nd board | substrate whose area is smaller than the said 1st board | substrate on a 1st board | substrate through a sealing compound to face the said 1st board | substrate, and the said 1st board | substrate. And injecting a liquid crystal from an opening formed of the sealing agent into a space surrounded by the second substrate and the sealing agent to produce a composite substrate having the first substrate, the second substrate, the sealing agent, and the liquid crystal. And a step of installing the composite substrate on a ring-shaped support such that a second surface of the two surfaces of the first substrate opposite to the first surface to which the second substrate is attached is in contact with the support. A step of contacting the substrate pressing portion having the movable range in the normal direction of the plane defined by the support with the first substrate at the peripheral edge of the first surface, and the substrate pressing portion in the normal direction And adjusting the substrate gap between the first substrate and the second substrate by pressing in the direction from the first surface to the second surface, and sealing the opening.

According to the manufacturing method of such a liquid crystal display device, the board | substrate spacing corresponding to the gathered area | region in a 1st board | substrate can be adjusted at once, without damaging or damaging a board | substrate. Moreover, sealing can be performed in this state. With such a feature, according to the manufacturing method of the liquid crystal display device by this invention, a liquid crystal display device can be manufactured with high yield. Moreover, since the board | substrate spacing corresponding to a some single item can be adjusted at once, a liquid crystal display device can be manufactured with a short manufacturing time.

The manufacturing method of the liquid crystal display device which concerns on this invention is a process of apply | coating a sealing compound to the area | region of a closed circumference shape on a 1st board | substrate, a process of dripping a liquid crystal to the site | part enclosed with the said sealing agent on the said 1st board | substrate, Attaching a second substrate through the sealing agent so as to face the first substrate to produce a composite substrate having the first substrate, the second substrate, the sealing agent, and the liquid crystal; an annular support A step of installing the composite substrate such that the first substrate is in contact with the support, a step of bringing the substrate pressing portion having a movable range in the normal direction of the plane defined by the support into contact with the second substrate, and the And pressing a substrate pressing portion from the second substrate side to the first substrate side to adjust a substrate gap between the first substrate and the second substrate. The.

According to the manufacturing method of such a liquid crystal display device, when the technique of sealing a liquid crystal between substrates by the liquid crystal dropping method is used, the board | substrate space | interval corresponding to the gathered area | region in a 1st board | substrate does not break or damage a board | substrate at once, I can adjust it. According to this feature, according to the manufacturing method of the liquid crystal display device which concerns on this invention, a liquid crystal display device can be manufactured with high yield. Moreover, since the board | substrate spacing corresponding to a some single item can be adjusted at once, a liquid crystal display device can be manufactured with a short manufacturing time.

Implement the invention  Best form for

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings.

(A. Substrate Spacing Device)

FIG. 1: is a schematic diagram which decomposed | disassembled the board | substrate space adjusting apparatus 1 of this embodiment into components. As shown in FIG. 1, the board | substrate gap adjustment apparatus 1 consists of the lower jig 11 and the upper jig 12 as a "first base." In FIG. 1, the composite substrate 50 which the board | substrate gap adjustment apparatus 1 adjusts a board | substrate gap also shows.

The composite board | substrate 50 is one of the forms in the manufacturing process of the liquid crystal display device 100 (refer FIG. 12 (b)), Comprising: The element substrate 51 as a "1st board | substrate", and the opposition as a "2nd board | substrate." It is made of a substrate 52. The element substrate 51 is a substrate manufactured based on a disk-shaped quartz glass having a diameter of 12 inches, and a TFT (Thin Film Transistor) element, a metal wiring, a transparent electrode, an alignment film, and the like are formed on the upper surface 511. On the other hand, nothing is laminated on the lower surface 512 of the element substrate 51. One element substrate 51 includes components corresponding to a plurality of liquid crystal display devices. Here, the upper surface 511 corresponds to the "first surface" in the present invention, and the lower surface 512 corresponds to the "second surface" in the present invention, respectively. In addition, the element substrate 51 may not be a perfect disk shape, for example, an orientation flat may be formed.

Since the element substrate 51 has several layers of components stacked only on the upper surface 511, the entirety of the element substrate 51 is bent, as shown in FIG. There are many. In this figure, however, for the convenience of explanation, the above-described warpage is emphasized, and the actual warpage is almost indistinguishable with the naked eye.

The opposing substrate 52 is attached to the upper surface 511 of the element substrate 51 via a sealing agent. The counter substrate 52 is a glass substrate having a diagonal of about 1 inch to 2 inches corresponding to the size of one liquid crystal display device, and a transparent electrode and an alignment film are formed on the surface facing the element substrate 51. The liquid crystal injected from the injection hole formed in the sealing compound is enclosed in the space surrounded by the element substrate 51, the counter substrate 52 and the sealing agent to form a liquid crystal layer.

The display quality of the liquid crystal display device 100 is sensitively affected by the thickness of the liquid crystal layer determined by the substrate gap between the element substrate 51 and the counter substrate 52. For example, when the thickness of the liquid crystal layer deviates from an appropriate value, a decrease in contrast of the display is caused. In order to avoid such a problem, the manufacturing process of the liquid crystal display device 100 includes the process of sealing the said injection hole in the state which adjusted the board | substrate spacing of the element substrate 51 and the opposing board | substrate 52 suitably. After sealing in this way, the thickness of a liquid crystal layer is maintained at an appropriate value. The board | substrate gap adjustment apparatus 1 of this embodiment is an apparatus for adjusting the board | substrate gap mentioned above.

The lower jig 11, which is one of the components of the substrate gap adjusting device 1, has a lower jig base 21, a support ring groove 22, a micrometer head through hole 23, a screw hole 24, and a leg. The part 25, the mounting part 26, and the support ring 41 as a "ring support stand" are provided. Among them, the support ring 41 is detachable from the lower jig 11. The lower jig base 21 and the leg 25 are made of metal and serve as a basis for supporting the substrate gap adjusting device 1. The micrometer head passage hole 23 formed in the lower jig base 21 is a hole for passing the micrometer head 33 to be described later when combining the lower jig 11 and the upper jig 12, and the screw The hole 24 is similarly for fixing the lower jig 11 and the upper jig 12.

The support ring groove 22 is a groove formed on the mounting portion 26 in accordance with the size of the support ring 41, and the support ring 41 slides when the support ring 41 is mounted on the lower jig 11. To prevent movement The support ring grooves 22 are formed in plural so as to form concentric circles having different diameters, and can support the support rings having the same diameters as those circles. The mounting portion 26 on which the support ring grooves 22 are formed is made of translucent acrylic and is fixed to the lower jig base 21. The support ring 41 fitted into the support ring groove 22 contacts the lower surface 512 of the element substrate 51 to support the composite substrate 50. The support ring 41 is made of a material which is not scratched even when it comes in contact with the element substrate 51. For example, a metal coated with a fluorine resin can be used.

The upper jig 12, which is one of the components of the substrate gap adjusting device 1, has an upper jig base 31, a substrate pressing part 32, a micrometer head 33, and a screw as a “second base”. 34). The upper jig base 31 is made of metal, and serves to fix the relative position of the components of the upper jig 12 including the substrate pressing portion 32. The upper jig base 31 is in contact with the lower jig base 21 when the upper jig 12 is combined with the lower jig 11. At this time, by fitting the screw 34 into the screw hole 24 of the lower jig 21, the combined lower jig 11 and the upper jig 12 are fixed.

On the upper jig base 31, six substrate pressing portions 32 having a shape in which the ring having a width is divided into six equally are attached in point symmetry, as seen from the normal direction of the plane defined by the upper jig base 31. The micrometer head 33 as a "rotation input mechanism" which is one form of an "external force application part" is connected to each board | substrate press part 32. As shown in FIG. The substrate pressing portion 32 is in the normal direction of the plane defined by the upper jig base 31 (that is, the plane defined by the support ring 41 when the lower jig 11 and the upper jig 12 are combined). Has a movable range. Specifically, the inside of the movable range is displaced according to the rotation of the micrometer head 33 connected to the substrate pressing part 32, and the relative distance to the upper jig base 31 changes. In addition, when the rotation of the micrometer head 33 is stopped, the relative position with the upper jig base 31 is fixed at that position. The pitches of the six micrometer heads 33 are all the same, and when the rotation amount of the micrometer head 33 is the same, the displacement amount of the substrate pressing part 32 accompanying it is also the same. One board | substrate press part 32 displaces only depending on the rotation amount of the micrometer head 33 directly connected to this, and is not influenced by the rotation amount of the other micrometer head 33. FIG. That is, each substrate pressing portion 32 is displaced independently of each other.

The substrate pressing portion 32 is in contact with the peripheral edge of the upper surface 511 of the element substrate 51 when the lower jig 11 and the upper jig 12 are combined through the composite substrate 50. 51) Apply force to it. The board | substrate press part 32 consists of cured resin which withstands application of the force obtained by deforming the element board | substrate 51, and has a hardness enough to damage the element board | substrate 51. FIG. Examples of such resins include PEEK (R) (trade name) manufactured by Viktrex Corporation.

Each board | substrate press part 32 has a shape where the contact area | region with the peripheral edge part of the element substrate 51 becomes arc shape in the inner peripheral side, and this arc-shaped part is the support ring 41 and the element substrate ( 51) almost identical to a portion of a circle (not shown) concentric with. That is, the contact area | region of the board | substrate press part 32 and the element substrate 51 is a part of circular region along the outer periphery of the element substrate 51. The said contact area in this embodiment exists in the range of 3 mm from the outer periphery of the element substrate 51.

FIG.2 and FIG.3 is a schematic diagram which shows the board | substrate spacing adjustment apparatus 1 of the state which combined the lower jig 11 and the upper jig 12 through the composite substrate 50. As shown in FIG. Fig. 2 is a perspective view of the substrate gap adjusting device 1 in this state, Fig. 3 (a) is a plan view, and Fig. 3 (b) is a sectional view taken along the line A-A in Fig. 3 (a). The lower jig 11 and the upper jig 12 are fixed by the screw 34 in a state where the lower jig base 21 and the upper jig base 31 are in contact with each other. At this time, the element substrate 51 is supported by the support ring 41, and the peripheral edge portion of the upper surface 511 is pressed by the six substrate pressing portions 32 to be fixed in the substrate gap adjusting device 1. . On the other hand, nothing is in contact with the opposing substrate 52. In addition, below, suppose that the normal line direction of the plane prescribed | regulated by the support ring 41 is parallel to a gravity acceleration direction, and it makes a gravity acceleration direction, and makes the opposite direction to this.

The substrate gap adjusting device 1 rotates the micrometer head 33 in this state and displaces the substrate pressurizing portion 32 downward, so that the element substrate 51 and the support ring with respect to the element substrate 51. The force can be applied with the contact point of the 41 as a point, and the contact area of the element substrate 51 and the board | substrate press part 32 as an emphasis point. At this time, the element substrate 51 is deformed by the application of the force. Specifically, the circumferential edge portion is displaced downward, and the central portion is slightly displaced upwardly and deformed (see FIGS. 7D and 7E). Since the board | substrate press part 32 displaces independently from each other, by setting the force which each board | substrate press part 32 applies to the element substrate 51 suitably, in the arbitrary position of the element substrate 51, The deformation amount can be manipulated to some extent. When the element substrate 51 is deformed, the substrate spacing with the opposing substrate 52 arranged opposite to this is changed. Since the deformation amount of the element substrate 51 varies from place to place, the substrate spacing also varies from place to place, and when the force applied by the substrate presser 32 to the element substrate 51 is appropriately set, the substrate corresponding to the gathered region The interval can be adjusted at a time with an appropriate state.

When the substrate spacing is adjusted, the support ring 41 and the substrate pressurizing portion 32 are in contact with the element substrate 51, but the contact point with the electrons is only a circumferential region determined from the shape of the support ring 41, The contact area with the latter is only the circumferential edge portion of the upper surface 511. In addition, nothing is in contact with the opposing substrate 52. Thus, since the board | substrate gap adjusting apparatus 1 only touches a very small part of the composite substrate 50 in adjustment of a board | substrate gap, the problem which damages or damages a board | substrate hardly arises. As mentioned above, the board | substrate space | interval adjusting apparatus 1 can adjust the board | substrate space | interval corresponding to the gathered area | region at once, without damaging or damaging a board | substrate.

Although the board | substrate gap adjusting apparatus 1 can adjust board | substrate gap by rotating the micrometer head 33 by a human hand also in the state mentioned above, the board | substrate gap adjusting apparatus 1 of this embodiment is convenient. It is connected to an external drive device to further improve the castle. FIG. 4: is a schematic cross section which shows the board | substrate gap adjustment apparatus 1 in the state in which the external drive apparatus 2 was connected. The external drive device 2 includes a drive unit composed of a hand 61, a hand lift rotation mechanism 62, and a motor 63, a polarizing plate 64L as a “first polarizing plate”, and a polarizing plate 64U as a “second polarizing plate”. ), A light source 65, and a support wall 66, which has a function of rotating the micrometer head 33 and an illumination function for visually recognizing the shape of the substrate gap adjustment.

The drive unit is a unit that is in charge of the function of rotating the micrometer head 33. Among the components of the drive unit, the motor 63 is electrically connected to the processing unit 69 (see FIG. 5) via the motor drive unit 68 (see FIG. 5), and mechanically connected to the lifting and lowering rotation mechanism 62. do. The motor 63 is a device that generates a rotational driving force in accordance with the instruction of the motor drive unit 68. The lifting lowering rotation mechanism 62 is electrically connected with the hand 61 while being electrically connected to the processing unit 69 via the lifting lowering rotation mechanism drive unit 67 (see FIG. 5). The lifting lowering rotation mechanism 62 transmits the rotational driving force generated by the motor 63 to the hand 61 to rotate the hand 61 and lifts itself up and down along the props vertically extended from the motor 63. By doing so, the hand 61 is raised and lowered. When the hand 61 is moved to the position where the micrometer head 33 can be held in accordance with the lift of the lifting rotation mechanism 62, the hand 61 presses the micrometer head 33 by inflation by injecting air therein and expands it. It is a device to maintain. These drive units are provided corresponding to each of the six substrate pressing portions 32 and the micrometer head 33 and operate independently of each other.

Subsequently, an electrical configuration of the drive unit will be described with reference to the block diagram of FIG. 5. In FIG. 5, only the electrical configuration of the first drive unit 81 is shown in detail among the six drive units 81 to 86, but the electrical configurations of the remaining drive units 82 to 86 are also the same. When the start signal is transmitted from the input device 60 to the processing unit 69 in the state where the substrate gap adjusting device 1 is set to a predetermined position, the processing unit 69 moves up and down relative to the lifting lowering rotation mechanism drive unit 67. The rise of the mechanism 62 is instructed. The lifting- lowering rotation mechanism drive part 67 which received the said instruction raises the lifting-rotation mechanism 62 and the hand 61 connected to this to the position where the hand 61 can hold the micrometer head 33. When the lifting and lowering of the lifting mechanism 62 and the hand 61 connected thereto is finished, the hand 61 presses the micrometer head 33 by holding air and expands it to hold it. In this state, when the instruction | indication of the displacement amount of the board | substrate press part 32 is input to the input device 60, the processing part 69 which received this converts the said displacement amount into the rotation amount of the motor 63, and the motor drive part The rotation of the motor 63 is instructed with respect to 68. The motor drive unit 68 which has been instructed rotates the motor 63 by the indicated amount of rotation. At this time, the lifting lowering rotation mechanism 62 transmits the rotation driving force of the motor 63 to the hand 61 to rotate the hand 61 and the micrometer head 33 held therein. In connection with this, the board | substrate press part 32 displaces by the quantity according to the rotation amount of the micrometer head 33. As shown in FIG. Thus, the 1st drive unit 81 rotates the micrometer head 33 according to the displacement amount of the board | substrate press part 32 input from the input device 60. As shown in FIG. The above operation is performed independently of each other in the six drive units 81 to 86.

Here, returning to FIG. 4 again, the other component of the external drive apparatus 2 is demonstrated. The support wall 66 supports the leg 25 of the lower jig 11 to support the substrate gap adjusting device 1. The light source 65 is arrange | positioned in the downward position corresponding to the mounting part 26 of the board | substrate gap adjusting apparatus 1 provided in this state. In addition, the polarizing plate 64L is disposed between the light source 65 and the substrate gap adjusting device 1, and the polarizing plate 64U is disposed above the substrate gap adjusting device 1, respectively.

The light source 65 and the polarizing plates 64L and 64U are in charge of an illumination function for visually recognizing the shape of the substrate gap adjustment. The light generated upward from the light source 65 passes through the polarizing plate 64L, the mounting portion 26 of the substrate gap adjusting device 1, the composite substrate 50, and the polarizing plate 64U in order, and is visible to the worker. . Here, the light which permeate | transmitted the liquid crystal layer contained in the composite substrate 50 among the transmitted light is colored according to the retardation of a liquid crystal layer. Specifically, the polarization state of the light transmitted through the polarizing plate 64L, when passing through the liquid crystal layer, the refractive index anisotropy, which is a parameter inherent in the liquid crystal layer, and the thickness of the liquid crystal layer (that is, the element substrate 51 and the counter substrate 52). It changes from linearly polarized light to elliptically polarized light according to the magnitude | size of the retardation determined by the product of the space | interval of (). Since the ellipse has a different shape for each wavelength, when the elliptical polarization passes through the polarizing plate 64U again and only one polarization axis component is extracted, the intensity distribution at each wavelength changes with that of the incident light and is colored. As described above, since the polarization state of the elliptical polarization depends on the distance between the element substrate 51 and the opposing substrate 52, the color of the transmitted light visually recognized by the operator changes depending on the distance between the substrates. By comparing the color of the transmitted light with this on the basis of the color of the light when passing through the region of the appropriate substrate spacing, the operator can determine which region of the substrate of the composite substrate 50 is properly adjusted.

As mentioned above, the board | substrate space adjusting device 1 with which the external drive device 2 was connected is based on the displacement amount of the board | substrate pressurization part 32 inputted, and the micrometer head 33 of the board | substrate space adjusting device 1 is carried out. It has a function to rotate, and the illumination function to visually recognize the shape of adjustment of a board | substrate spacing. By these functions, the operator can adjust the board | substrate spacing by the board | substrate gap adjusting apparatus 1 more efficiently.

(B. Substrate Spacing Adjustment Method)

Subsequently, a method of adjusting the substrate gap using the above-described substrate gap adjusting device 1 and the external drive device 2 will be described with reference to FIGS. 6 and 7. FIG. 6 is a process chart showing the substrate gap adjusting procedure of the present embodiment, and FIG. 7 is a cross-sectional view of the substrate gap adjusting apparatus 1 in each step of FIG. 6. The substrate gap adjusting method of the present embodiment includes steps P331 to P335. Hereinafter, the process P331 to the process P335 are also collectively referred to as process P33.

Step P331 is a step of attaching the support ring 41 to the support ring groove 22 formed in the mounting portion 26 of the lower jig base 21 (see FIG. 7 (a)).

Step P332 is a step of installing the composite substrate 50 including the element substrate 51 and the opposing substrate 52 under the element substrate 51 on the support ring 41 mounted in the step P331. (See FIG. 7 (b)). As described above, the entire element substrate 51 is bent, and the peripheral edge portion thereof is relatively high with respect to the center portion.

Step P333 is a step of fixing the upper jig 12 including the upper jig base 31, the substrate pressurizing portion 32, and the micrometer head 33 in combination with the lower jig 11 (FIG. 7 ( c)). This process is performed so that the board | substrate press part 32 may contact the peripheral part of the upper surface 511 (refer FIG. 1) of the element substrate 51. As shown in FIG.

Step P334 is a step of connecting the hand 61 included in the external drive device 2 described above with the micrometer head 33 (see FIG. 7 (d)). Since the operation of the external drive device 2 at the time of this connection has already been described in detail, the description is omitted here.

Step P335 rotates the micrometer head 33 in accordance with the rotation of the hand 61 to displace the substrate pressurizing portion 32 downward, so that the element substrate 51 and the support ring with respect to the element substrate 51. It is a process of applying a force by making the contact point of 41 into a point, and making the contact area of the element substrate 51 and the board | substrate press part 32 into an emphasis point (refer FIG. 7 (e)). At this time, the element substrate 51 is deformed by the application of the force. Specifically, as shown in FIG. 7E, the peripheral edge portion of the element substrate 51 is displaced downward, and the central portion is slightly displaced upward, thereby deforming in the direction of eliminating the warpage described above. When the curvature of the element substrate 51 is eliminated and deformed to a state close to the flat plate, the substrate spacing is adjusted to an appropriate state in a part of the region where the substrate spacing with the opposing substrate 52 deviates from an appropriate value due to the initial curvature. do. Even if the curvature of the element substrate 51 is not constant and is a complicated shape, by appropriately setting the force applied to the element substrate 51 by each substrate press section 32, the element substrate 51 as a whole is close to the flat plate. It is possible to transform into Therefore, the board | substrate spacing of the gathered area | region can be adjusted at once also about the composite substrate 50 which has a thin element substrate 51 in a complicated shape.

As shown in FIG. 7E, the support ring 41 and the substrate pressurizing portion 32 are in contact with the element substrate 51 at the time of adjusting the substrate gap. Only the region of the circumference shape determined from the shape, and the contact area with the latter is only the peripheral edge of the upper surface 511. Further, nothing is in contact with the counter substrate 52. For this reason, according to the board | substrate spacing adjustment method of this embodiment, the board | substrate spacing corresponding to the gathered area | region can be adjusted at once, without damaging or damaging a composite substrate.

(C. Manufacturing Method of Liquid Crystal Display)

Next, the manufacturing method of the liquid crystal display device containing the above-mentioned substrate gap adjustment method is demonstrated with reference to FIG. 8 is a flowchart showing a manufacturing procedure of the liquid crystal display device of the present embodiment. 8, steps P11 to P14 are steps for forming the element substrate 51, and steps P21 to P23 are steps for forming the counter substrate 52. Steps P31 to P36 are the steps of completing the liquid crystal display device 100 by combining the element substrate 51 and the counter substrate 52. Step P11 to step P14 and step P21 to step P23 are each independently performed.

The process P11 is a process of laminating | stacking and forming the component containing TFT element, a metal wiring, and a transparent electrode on the surface of the disk shaped quartz glass substrate used as the base of the element substrate 51. These components corresponding to the some liquid crystal display device 100 are formed in one piece of quartz glass substrate. This process is performed by the photolithographic method, for example.

Step P12 is a step of forming an alignment film made of polyimide by the flexographic printing method by repeating the components formed in step P11.

Step P13 is a step called rubbing which rubs the surface of the alignment film formed in step P12 with cloth. The alignment film which passed through the rubbing process has a function which orientates the liquid crystal contacting this according to the direction of the said rubbing.

Process P14 is a process of apply | coating a sealing compound by the screen printing method to the surface which rubbing was performed in process P13. The sealing agent is applied to the circumferential edge portion of the region to which the opposing substrate 52 is attached, except for the portion that serves as an injection hole for injecting liquid crystal, which will be described later. That is, a sealing compound is apply | coated in the circumferential shape which has an opening part as an injection hole. The element substrate 51 is completed through the above processes P11 to P14.

 Step P21 is a step of forming a transparent electrode on the surface of the glass substrate serving as the base of the counter substrate 52. This process is performed by the photolithographic method, for example.

Step P22 is a step of forming an alignment film made of polyimide by the flexographic printing method by repeating the transparent electrode formed in step P21.

Step P23 is a step called rubbing which rubs the surface of the alignment film formed in step P22 with cloth. The alignment film which passed through the rubbing process has a function which orientates the liquid crystal contacting this according to the direction of the said rubbing. The counter substrate 52 is completed through the above process P21-process P23.

In addition, when manufacturing the opposing board | substrate 52 similarly to this one liquid crystal display device about 1 inch-2 inches diagonally, when manufacturing the opposing board | substrate 52 correspond to the some opposing board | substrate 52 to a large glass substrate. After forming a transparent electrode and an oriented film, ie, passing a process (P21, P22), it is common to cut | disconnect to a predetermined magnitude | size and manufacture.

Process P31 is a process of attaching the opposing board | substrate 52 to the element board | substrate 51 through a sealing compound, and forming the composite substrate 50. FIG. Adhesion is performed by contacting and crimping | bonding in the state which aligned (positioning) between the element substrate 51 and the opposing board | substrate 52, and drying a sealing compound after that.

Process P32 is a process of inject | pouring a liquid crystal to the area | region enclosed by the element substrate 51, the opposing board | substrate 52, and a sealing compound. This step is carried out by dropping the liquid crystal into the above-mentioned injection hole under vacuum, and introducing the liquid crystal into the region by capillary action.

Step P33 is a step of adjusting the distance between the element substrate 51 and the counter substrate 52 using the substrate gap adjusting device 1. This process includes the above-mentioned process P331-process P335. Since each of steps P331 to P335 has already been described in detail, it will not be described here to avoid duplication.

Step P34 is a step of sealing the injection port in a region where the substrate gap is adjusted in an appropriate state in step P33. Sealing is performed by applying ultraviolet curable resin to the injection hole, that is, the portion corresponding to the opening of the sealing agent, and then irradiating ultraviolet rays to cure the resin. In the step P33, the area in which the substrate gap is not properly adjusted is not sealed, and the process is returned to the previous step P33, the substrate gap in the area is adjusted to an appropriate state, and then sealed again.

Process P35 is a process of manufacturing the composite substrate 50 'by braking the composite substrate 50 in which liquid crystal injection and sealing were completed to the shape corresponding to each liquid crystal display device 100. FIG. The brake is performed by forming a scribe groove on the surface of the element substrate 51 and cutting the element substrate 51 at the position of the scribe groove. The composite substrate 50 'has an element substrate 51' and an opposing substrate 52 obtained by cutting the element substrate 51. As shown in FIG.

Step P36 is a foreign matter on the surface of the composite substrate 50 'and the FPC (Flexible Printed Circuit) 71 (refer to FIG. 12 (a)) for electrically connecting to the composite substrate 50' obtained in step P35. It is a process of mounting the dustproof glass 72 (refer FIG. 12 (a)) which prevents this from sticking, and the cover 73 (refer FIG. 12 (b)) for protection or heat dissipation of the composite board | substrate 50 '. Through the above process, the liquid crystal display device 100 is manufactured.

According to the manufacturing method of the liquid crystal display device 100 mentioned above, sealing can be performed in the state which adjusted the board | substrate spacing corresponding to the gathered area | region at once, without damaging or damaging a board | substrate. By this feature, the liquid crystal display device 100 can be manufactured with high yield. In addition, since the board | substrate spacing corresponding to a some single item can be adjusted at once, the liquid crystal display device 100 can be manufactured with a short manufacturing time.

As mentioned above, although embodiment of this invention was described, various deformation | transformation can be added about the said embodiment in the range which does not deviate from the meaning of this invention. As a modification, the following can be considered, for example.

(Modification 1)

Instead of the support ring 41 in the above-described embodiment, a support ring different in diameter from the support ring 41 may be used. FIG. 9 (a) is a plan view of the substrate gap adjusting device 1 when the support ring 42 having a diameter larger than that of the support ring 41 is used, and FIG. 9 (b) is in FIG. 9 (a). It is sectional drawing in the BB line. The support ring 42 has the same features as the support ring 41 except for the diameter. When the composite substrate 50 is supported by such a support ring 42 and the force is applied to the peripheral edge of the element substrate 51 by the substrate pressing portion 32, the point at which the force is applied is It differs from this embodiment. For this reason, the element substrate 51 can deform | transform in the state different from this embodiment, and can adjust a board | substrate space | interval to an appropriate state in the area | region different from this embodiment. In addition, instead of the support ring 42, a support ring having a smaller diameter than the support ring 41 may be used.

The diameter of the support ring to be used can be selected according to the shape characteristic including the degree of warpage of the element substrate 51. Alternatively, the same device substrate 51 is first sealed by adjusting a substrate gap using a support ring having an arbitrary diameter, and then the support described above is continued for the region where the substrate gap could not be adjusted in an appropriate state. You may make adjustment using the support ring from which a diameter differs from a ring. For example, the substrate spacing can be adjusted first using the support ring 41, and then the substrate spacing can be adjusted using the support ring 42. Moreover, you may further use the support ring from which the diameter differs with any of the support rings 41 and 42. According to this modification, in the composite substrate 50 which has the element substrate 51 of various shapes, a board | substrate spacing can be adjusted with respect to a wide area | region.

(Modification 2)

In the above-mentioned embodiment, although the board | substrate spacing is adjusted by supporting the composite substrate 50 with one support ring 41, you may adjust using two or more support rings from which a diameter differs simultaneously. 10 (a) is a plan view of the substrate gap adjusting device 1 when the support ring 41 and the support ring 42 having a larger diameter are used at the same time, and FIG. 10 (b) is shown in FIG. It is sectional drawing in a CC line.

The method of adjusting a board | substrate spacing with respect to the composite board | substrate 50 which has a thin element substrate 51 in a complicated shape using the board | substrate space adjusting apparatus 1 of such a structure is demonstrated using FIG. In FIG. 11A, the element substrate 51 fixed in the substrate gap adjusting device 1 has a complex shape in which the entirety of the element substrate 51 is bent and partially deformed in the opposite direction to the bend. It is supported by the small support ring 41 among two support rings. Here, by displacing the substrate pressurizing portion 32 downward, a force can be applied to the element substrate 51 with the contact point of the substrate and the support ring 41 as a point. In this way, the element substrate 51 can be deformed, and the substrate spacing in any gathered region can be appropriately adjusted. About the area | region in which the board | substrate space | interval was adjusted appropriately, it seals here.

In addition, when the element substrate 51 is deformed by applying a force, as shown in FIG. 11B, the element substrate 51 deviates from the support ring 41 and has a larger diameter than the support ring 41. It comes in contact with the support ring 42. At this time, the element substrate 51 is deformed to a form different from the above-described case in contact with the support ring 41 because the element substrate 51 receives a force with the contact point between the substrate and the support ring 42 as a point. Therefore, if the displacement amount of the board | substrate press part 32 is set suitably, the board | substrate space | interval can be adjusted also about the area | region where the board | substrate space | interval cannot be adjusted in the state which contacted the support ring 41. FIG. In this way, the region where the substrate spacing is newly adjusted is sealed here. Thus, by using two support rings with different diameters, the board | substrate spacing may be adjusted also with respect to the composite substrate 50 which has the thin element substrate 51 in a complicated shape.

(Modification 3)

Although the above-mentioned embodiment is a structure which makes the micrometer head 33 the rotation input mechanism which is one form of an external force application part, and rotates this, the board | substrate press part 32 is displaced, but the board | substrate press part 32 displaces. The configuration of the mechanism and the external force applying unit for applying the external force for the displacement is not limited to this, and various ones can be used.

For example, the structure which connected the board | substrate press part 32 to the air cylinder as an external force application part may be sufficient. In this case, an external force is applied by sending compressed air to an air cylinder, and the board | substrate press part 32 displaces with the operation | movement of the air cylinder accompanying this. Or the structure which connected the board | substrate press part 32 to the piezoelectric actuator as an external force application part may be sufficient. In this case, the board | substrate press part 32 connected to this can be displaced by applying a voltage to a piezoelectric actuator, and displacing the said piezoelectric actuator.

(Modification 4)

In the above-described embodiment, the substrate spacing is adjusted by arranging them so that the circle defined by the outer periphery of the element substrate 51 and the circle defined by the support ring 41 are concentric, but the centers of the circles do not have to coincide. . For example, when the substrate spacing is to be adjusted with respect to the composite substrate 50 including the nearly circular element substrate 51 which is bent asymmetrically with respect to the center, or only for a portion biased from the center of the element substrate 51. In some cases, it may be appropriate to provide the support ring 41 so as to be shifted from the center of the element substrate 51 on the basis of the purpose, for example, to adjust the substrate spacing. In such a case, the substrate spacing can be adjusted in a desired state by displacing the center of the support ring 41 and the element substrate 51.

(Modification 5)

In the above-described embodiment, although the circular support ring 41 is used as the annular support, the substrate spacing is adjusted with respect to the composite substrate 50 including the almost circular element substrate 51. The shape of the support and the substrate is not limited thereto, and various shapes may be used depending on the application. For example, the board | substrate spacing can be adjusted with respect to the composite board | substrate containing a rectangular board | substrate using the square-ring support stand. The board | substrate press part 32 in this case is comprised by the shape which can contact the peripheral part of a rectangular board | substrate. In the present invention, as long as it has a closed circumference, various shapes such as hexagonal ring and octagonal ring can be used in addition to the above-described circular ring and square ring type regardless of the shape.

(Modification 6)

The said embodiment injects a liquid crystal after affixing a board | substrate, and after that seals the opening part of a sealing compound, and encapsulates a liquid crystal, Instead, a liquid crystal can also be encapsulated by the liquid crystal dropping method which does not require sealing operation.

Here, the liquid crystal dropping method is demonstrated using sectional drawing of FIG. First, the sealing agent 91 is apply | coated to the closed periphery area | region on the element substrate 51, and the appropriate amount of liquid crystal 90 is dripped at the site | part enclosed with the sealing agent 91 (FIG. 13 (a)). ). Next, the opposing substrate 52 is attached to the element substrate 51 via the sealing agent 91 (Fig. 13 (b)). Thereby, the liquid crystal 90 is enclosed in the area | region enclosed by the element substrate 51, the opposing board | substrate 52, and the sealing compound 91. As shown in FIG. This is because the sealing agent 91 is applied in a closed circumferential shape and does not have an opening. The quantity of the appropriate liquid crystal 90 mentioned above is a quantity which the liquid crystal 90 between board | substrates turns into a layer of suitable thickness in the state enclosed in this way.

The manufacturing method of the liquid crystal display device by this modification is demonstrated with reference to the process diagram of FIG. The manufacturing method of this modification is different only in the manufacturing method (refer FIG. 8) of the said embodiment, and the point mentioned later. That is, the opposing board | substrate 52 is a board | substrate of substantially the same size as the element substrate 51, and the component corresponding to the some liquid crystal display device 100 is formed, and the area | region which apply | coats a sealing compound in process P14. These are the differences, the liquid crystal dropping step (step P15) after step P14, the liquid crystal injection step after the substrate attaching step of step P31, and the point of no sealing step after the substrate gap adjusting step of step P33. Hereinafter, description will be given focusing on these differences.

In the manufacturing process of the element substrate 51, process P11 to process P13 are implemented similarly to the said embodiment. Subsequent process P14 is a process of apply | coating the sealing compound 91 by the screen printing method or the dispenser application method to the surface which rubbing was performed in process P13. The sealing agent 91 is applied to the peripheral edge part of the area | region which affixes the opposing board | substrate 52 in a closed peripheral shape, ie, without forming the opening part as an injection hole.

Next, in the process P15, the liquid crystal 90 is dripped at the site | part enclosed with the sealing compound 91 on the element substrate 51. This step is performed by dropping the liquid crystal 90 by the liquid crystal discharge device. As described above, the dropping amount of the liquid crystal 90 is a quantity such that the liquid crystal 90 between the substrates becomes a layer having a suitable thickness when the counter substrate 52 is later attached. The element substrate 51 is completed through the above processes P11 to P15.

The manufacturing process of the opposing board | substrate 52 from process P21 to process P23 is performed similarly to the said embodiment.

In step P31, the counter substrate 52 is attached to the element substrate 51 via the sealing agent 91 to form a composite substrate 50. In this step, the sealing of the liquid crystal 90 is also performed simultaneously as described above.

Subsequent process P33 is a process of adjusting the space | interval of the element board | substrate 51 and the opposing board | substrate 52 using the board | substrate space adjusting device 1. This process includes the above-mentioned process P331-process P335. Since each of steps P331 to P335 has already been described in detail, it will not be described here to avoid duplication. In this step P33, the substrate gap between the element substrate 51 and the opposing substrate 52 is adjusted by applying a force to the element substrate 51 or the opposing substrate 52 to form a small amount of deformation. Step P33 may be performed in parallel with the substrate attaching step of step P31.

The remaining steps P35 and P36 are performed in the same manner as in the above embodiment. However, the brake in step P35 is performed by cutting both the element substrate 51 and the opposing substrate 52. Through the above process, the liquid crystal display device 100 is manufactured.

According to the manufacturing method of the liquid crystal display device 100 mentioned above, when the technique of encapsulating the liquid crystal 90 between substrates by the liquid crystal dropping method is used, the board | substrate corresponding to the gathered area | region in the element substrate 51 is used. The spacing can be adjusted at once without breaking or damaging the substrate. By this feature, the liquid crystal display device 100 can be manufactured with high yield. In addition, since the board | substrate spacing corresponding to a some single item can be adjusted at once, the liquid crystal display device 100 can be manufactured with a short manufacturing time.

According to the manufacturing method of such a liquid crystal display device, when the technique of sealing a liquid crystal between substrates by the liquid crystal dropping method is used, the board | substrate space | interval corresponding to the gathered area | region in a 1st board | substrate does not break or damage a board | substrate at once, I can adjust it. According to this feature, according to the manufacturing method of the liquid crystal display device which concerns on this invention, a liquid crystal display device can be manufactured with high yield. Moreover, since the board | substrate spacing corresponding to a some single item can be adjusted at once, a liquid crystal display device can be manufactured with a short manufacturing time.

Claims (11)

First substrate, A second substrate having a smaller area than the first substrate, which is attached to the first substrate via a sealing agent, and As a substrate spacing device for adjusting the space | interval of a said 1st board | substrate and a said 2nd board | substrate in the composite board | substrate which has the liquid crystal injected in the space enclosed by the said 1st board | substrate, the said 2nd board | substrate, and the said sealing compound. , A first base having a mount; An annular support mounted on the mounting portion and supporting the composite substrate in contact with a second surface of the two surfaces of the first substrate opposite to the first surface to which the second substrate is attached; A substrate pressing portion having a movable range in a first direction that intersects the plane defined by the support, and in contact with the first substrate at a peripheral edge portion of the first surface at any one of the movable ranges; And An external force applying unit for transmitting a force for displacing the substrate pressing unit to the movable range, the substrate pressing unit The peripheral edge portion is located on the outside of the support as viewed in the first direction, substrate spacing device. The method of claim 1, It is provided with the 2 or more said board | substrate pressurization parts which can press different locations of the said peripheral edge part, Each of the substrate pressing portions is displaced independently of each other. The method of claim 2, The support is circular, The plurality of substrate pressing portions have a shape in which a contact region with the first substrate becomes an arc shape on an inner circumferential side, And said arc-shaped portion is substantially equal to a portion of one circle concentric with the circle defined by said support. The method of claim 3, wherein The length of each arc-shaped part of the said contact area | region is substantially the same, respectively, The board | substrate gap adjusting apparatus. The method according to any one of claims 1 to 4, The said support stand is circular-type, and is provided with the several pieces from which the diameter differs. The board | substrate gap adjusting apparatus characterized by the above-mentioned. The method of claim 1, And a second base detachable from the first base and formed in an annular shape, The substrate pressing portion is attached to be movable relative to the second base such that displacement in the movable range is possible, And the external force applying unit is rotatable and includes a rotational input mechanism in which the rotation is converted into a displacement with respect to the second base of the substrate pressurizing unit. The method of claim 6, A hand holding the rotation input mechanism, and And a motor for imparting rotational driving force to the hand. The method of claim 6, The substrate gap adjusting device, A first polarizing plate; A second polarizer; And Further provided with a light source, The mounting portion is light-transmissive, A part of the light radiate | emitted from the said light source permeate | transmits the said 1st polarizing plate, the said mounting part, the said composite substrate, and the said 2nd polarizing plate in order. First substrate, A second substrate having a smaller area than the first substrate, which is attached to the first substrate via a sealing agent, and As a board | substrate spacing adjustment method for adjusting the space | interval of the said 1st board | substrate and the said 2nd board | substrate in the composite substrate which has the liquid crystal inject | poured in the space enclosed by the said 1st board | substrate, the said 2nd board | substrate, and the said sealing compound. , On the annular support mounted on the mounting portion of the first base, the composite has a second surface opposite to the first surface on which the second substrate is attached, of the two surfaces of the first substrate, in contact with the support. A first step of installing a substrate; A second step of bringing a substrate pressing portion having a movable range in a direction intersecting a plane defined by the support to contact the first substrate at a peripheral edge portion of the first surface; And And a third step of pressing the substrate pressing portion in a direction from the first surface to the second surface. Attaching, on the first substrate, a second substrate having a smaller area than the first substrate via a sealing agent so as to face the first substrate; A liquid crystal is injected from an opening formed in the sealing agent into a space surrounded by the first substrate, the second substrate, and the sealing agent, and the first substrate, the second substrate, the sealing agent, and the liquid crystal are Manufacturing a composite substrate having; Installing the composite substrate on an annular support such that a second surface of the two surfaces of the first substrate opposite to the first surface to which the second substrate is attached is in contact with the support; Contacting the substrate pressing portion having a movable range in a direction crossing the plane defined by the support, with the first substrate at the peripheral edge portion of the first surface; Pressing the substrate pressing portion in a direction from the first surface to the second surface to adjust a substrate gap between the first substrate and the second substrate; And And sealing the opening. Applying a sealing agent to a closed circumferential region on the first substrate; Dropping liquid crystal onto a portion surrounded by the sealing agent on the first substrate; Attaching a second substrate through the sealing agent so as to face the first substrate, and manufacturing a composite substrate having the first substrate, the second substrate, the sealing agent, and the liquid crystal; Installing the composite substrate on an annular support such that the first substrate is in contact with the support; Contacting the substrate pressing portion having a movable range in a first direction crossing the plane defined by the support, with the second substrate; And And pressing the substrate pressing portion from the second substrate side to the first substrate side to adjust a substrate gap between the first substrate and the second substrate.

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