KR100806813B1 - Printing plate, method of manufacturing the same, and method of pattrning thin layer using the same - Google Patents

Abstract

A printing plate, a manufacturing method thereof, and a thin film patterning method using the same are provided to form a convex pattern of a pattern area and an outline area so as to have the same height, thereby transferring organic liquid of a print roller corresponding to the outline area of a printing plate to the outline area and accordingly preventing print faults of a display device. A base substrate(131) having a pattern area and an outline area surrounding the pattern area is prepared. And then, a printing plate having a convex pattern and a concave pattern in the pattern area of the base substrate is formed by patterning the pattern area of the base substrate as protecting the outline area of the base substrate through an etching prevention pattern(130) so that a height of the outline area may be equal to a height of a convex pattern.

Description

Printing plate and manufacturing method thereof and thin film patterning method using same {PRINTING PLATE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF PATTRNING THIN LAYER USING THE SAME}

1 is a cross-sectional view showing a printing plate of a conventional thin film forming printing apparatus.

2 is a perspective view showing a printing apparatus for forming a thin film according to the present invention.

3 is a cross-sectional view showing in detail the printing plate shown in FIG.

4A to 4E are cross-sectional views showing a first embodiment of the manufacturing method of the printing plate shown in FIG. 3.

5A and 5B are plan views and cross-sectional views illustrating other forms of the etch stop pattern illustrated in FIG. 4C.

6A to 6C are cross-sectional views showing a second embodiment of the manufacturing method of the printing plate shown in FIG. 3.

7A to 7C are cross-sectional views illustrating a method of manufacturing a thin film pattern formed using a printing apparatus according to the present invention.

<Code Description of Main Parts of Drawing>

110: printing plate 111: substrate

112: convex pattern 114: concave pattern

120: protection plate 130: etching prevention pattern

131: base plate 132: mask layer

134: photoresist pattern 136: mask pattern

142: blanket 144: printing roller

146: organic liquid feeder 148: organic liquid

The present invention relates to a printing plate, a manufacturing method thereof, and a thin film patterning method using the same, and more particularly, to a printing plate and a manufacturing method thereof and a thin film patterning method using the same, which can prevent the back surface from being unevenly etched and prevent printing defects. will be.

Recently, various flat panel display devices that can reduce weight and volume, which are disadvantages of cathode ray tubes, have emerged. Such flat panel displays include a liquid crystal display, a field emission display, a plasma display panel, an electro-luminescence display, and the like.

The flat panel display includes a plurality of thin films formed by a mask process including a deposition (coating) process, an exposure process, a developing process, and an etching process. However, the mask process has a problem in that the manufacturing process is complicated, thereby increasing the manufacturing cost. Accordingly, in recent years, research has been conducted to form a thin film through a printing process using a printing roller.

This printing process is a process of forming a desired pattern by forming a predetermined pattern on a printing roller using a printing plate, and then transferring the pattern onto a substrate.

Here, the printing plate 10 includes a convex pattern 12 in contact with the printing roller and a concave pattern 14 formed between the convex patterns 12, as shown in FIG. 1. The printing plate 10 is formed through an etching process using a photoresist pattern formed by a photolithography process as a mask. Since the photoresist pattern is not formed in the outer region of the printing plate 10 except the pattern region of the printing plate during the etching process, the photoresist pattern is etched to play the same role as the concave pattern 14. That is, when the printing plate 10 and the printing roller are in contact with each other, the organic liquid of the printing roller corresponding to the outer area of the printing plate 10 remains on the surface of the printing roller and is transferred onto the substrate of the display element so that printing failure occurs. There is a problem.

In addition, when the printing plate 10 is etched through a spray type wet etching process, the etching liquid partially penetrates into the rear surface of the printing plate 10, so that the back surface of the outer area of the printing plate 10 is unevenly etched. .

Accordingly, the present invention has been made in an effort to provide a printing plate capable of preventing uneven etching of the back surface and preventing printing defects, a method of manufacturing the same, and a method of thin film patterning using the same.

In order to achieve the above technical problem, a method of manufacturing a printing plate according to the present invention comprises the steps of providing a base substrate having a pattern region, and the outer region surrounding the pattern region; The pattern region of the base substrate has a convex pattern and a concave pattern in the pattern region of the base substrate, and protects the outer region of the base substrate with an etch preventing pattern so that the height of the outer region of the base substrate is the same as the height of the convex pattern. It characterized in that it comprises a step of forming a printing plate by patterning.

In order to achieve the above technical problem, the printing plate according to the present invention is a printing plate in contact with the printing roller to which the organic liquid is applied, a convex pattern in contact with the printing roller, a pattern in which the concave pattern is in contact with the printing roller is formed An area; It is formed to surround the pattern region, and has an outer region formed at the same height as the convex pattern, wherein the printing plate is formed by patterning the pattern region while protecting the outer region with an etch stop pattern.

In order to achieve the above technical problem, the thin film patterning method according to the present invention comprises the steps of applying an organic liquid to the printing roller; The convex pattern and the convex pattern pattern area on the base substrate, and the outer surface is formed on the base substrate to surround the pattern area, the printing roller is rotated on the printing plate comprising a convex pattern having the same height as the convex pattern is convex Transferring the organic liquid to the pattern to form an organic pattern on the printing roller; And printing an organic pattern formed on the printing roller on a substrate, wherein the printing plate is formed by patterning a pattern region of the base substrate while protecting an outer region of the base substrate with an etch stop pattern.

Other technical problems and features of the present invention in addition to the above technical problem will become apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

2 is a perspective view showing a printing device for forming a thin film pattern according to the present invention.

The printing apparatus shown in FIG. 2 includes an organic liquid supply part 146, a printing roller 144, and a printing plate 110.

The organic liquid supply unit 146 stores the organic liquid and supplies the stored organic liquid to the blanket 142 of the printing roller 144.

The printing roller 144 fills the blanket 142 attached to the outer circumferential surface of the printing roller 144 with the organic liquid from the organic liquid supply part 146. The printing roller 144 is rotated on them so as to sequentially contact with the printing plate 110 and the substrate 111 moving through the transfer unit 160. In addition, the printing roller 144 may move in contact with the printing plate 110 and the substrate 111 in sequence.

The printing plate 110 contacts the printing roller 144 such that the organic liquid filled in the blanket 142 of the printing roller 144 remains only in a desired area. To this end, the printing plate 110 includes a pattern region and an outer region formed to surround the pattern region, as shown in FIG. 3.

In the pattern region, a concave pattern 114 formed in a groove shape on the base substrate 131 and a convex pattern 112 having a first height h1 are formed.

The convex pattern 112 is an area in contact with the organic liquid applied to the printing roller 144 when the printing roller 144 rotates on the printing plate 110. Accordingly, when the printing roller 144 rotates on the printing plate 110 on the convex pattern 112, the organic liquid of the printing roller 144 is transferred.

The concave pattern 114 is an area that does not contact the organic liquid applied to the printing roller 144 when the printing roller 144 rotates on the printing plate 110. Accordingly, the organic liquid of the printing roller 144 corresponding to the concave pattern 114 remains in the printing roller 114 and is formed in the organic pattern.

The outer region of the printing plate 110 is formed at the same height as the convex pattern 112 of the pattern region at the second height h2. In this case, when the printing roller 144 rotates on the printing plate 110, the organic liquid of the printing roller 144 corresponding to the outer region of the printing plate 110 is transferred to the outer region, thereby preventing the printing failure of the display element. have.

4A to 4E are cross-sectional views illustrating a first embodiment of the method of manufacturing the printing plate illustrated in FIG. 3.

As shown in FIG. 4A, a mask layer 132 is formed on the base substrate 131. The mask layer 132 has a single layer such as Mo, Al, AlNd, Cr, CrOx, or a multilayer structure including the same, and is formed to a thickness of about 500 to 1500 Å. For example, in the case of a multilayer structure, the mask layer 132 is formed by stacking Mo / AlNd or Cr / CrOx.

After the photoresist is applied on the mask layer 132, the photoresist is patterned by a photolithography process including an exposure and development process, thereby forming a photoresist pattern 134 as illustrated in FIG. 4B.

The mask layer 132 is patterned through an etching process using the photoresist pattern 134 to form a mask pattern 136 as shown in FIG. 4C. Thereafter, the protection plate 120 is fixed to the rear surface of the base substrate 131, and an etch stop pattern 130 made of a sealant is formed in an outer region of the base substrate 131. As illustrated in FIG. 5A, the protection plate 120 has a larger area than the rear surface of the base substrate 131 and is fixed to the base substrate 131 by the etch stop pattern 130. As illustrated in FIG. 5B, the etch stop pattern 130 is formed by a screen printing method or a dispensing method so as to cover the outer area of the base substrate 131 so as not to invade the pattern area. Accordingly, the upper surface of the photoresist pattern 134 adjacent to the outer region of the base substrate 131 is not contacted. In addition, the etch stop pattern 130 is formed to cover the outer region of the base substrate 131 as shown in FIG. 4C, and the upper surface and part of the photoresist pattern 134 adjacent to the outer region of the base substrate 131. It is formed to be in contact.

Then, the base substrate 131 is etched as shown in FIG. 4D through an etching process using an etchant using the mask pattern 136 and the photoresist pattern 134, for example, an etchant of hydrofluoric acid (HF). The printing plate 110 including the convex pattern 112 and the concave pattern 114 is formed.

In this case, since the outer region of the base substrate 131 is protected by the etch stop pattern 130, etching of the outer region of the base substrate 131 is prevented to have the same height as the convex pattern 112. The back surface of the base substrate 131 may be protected by the protection plate 120 to prevent the back surface of the base substrate 131 from being unevenly etched.

In the etching process, the mask pattern 136 has good adhesion with the base substrate 131 as compared with the photoresist pattern 134. Accordingly, when the photoresist pattern 134 is positioned on the base substrate 131, the etching liquid may penetrate therebetween, but the mask pattern 136 is positioned on the base substrate 131. ) And the etching solution does not penetrate between the base substrate 131 and the base substrate 131, the convex pattern 112 may be formed in a desired shape. In addition, the photoresist pattern 134 may etch the base substrate 131 using the photoresist pattern 134 when a defect occurs in the mask pattern 136 during the etching process. Thus, the convex pattern 112 and the concave pattern may be etched. 114 can be formed in a desired shape.

Thereafter, as shown in FIG. 4E, the photoresist pattern 134, the mask pattern 136, the etch stop pattern 130, and the protection plate 120 remaining on the printing plate 110 are removed.

6A through 6C are cross-sectional views for describing a second exemplary embodiment of the manufacturing method of the printing plate illustrated in FIG. 3.

First, a mask layer 132 is formed on the base substrate 131. The photoresist pattern 134 is formed in the pattern region on the mask layer 132, as shown in FIG. 6A, and the etch stop pattern of the same material as the photoresist pattern 134 is formed in the outer region of the mask layer 132. 130) is formed. The photoresist pattern 134 and the etch stop pattern 130 are formed by applying a photoresist on the mask layer 132 and patterning the photoresist process including an exposure and development process.

The mask layer 132 is patterned through an etching process using the photoresist pattern 134 and the etch stop pattern 130, thereby forming the mask pattern 136 as illustrated in FIG. 6B. Thereafter, a protective plate 120 having an area greater than or equal to the rear surface of the base substrate is fixed to the rear surface of the base substrate 131.

Then, the base substrate 131 is etched as shown in FIG. 6C through an etching process using the mask pattern 136 and the photoresist pattern 134 to include the convex pattern 112 and the concave pattern 114. The printing plate 110 is formed. In this case, since the outer region of the base substrate 131 is protected by the etch stop pattern 130, etching of the outer region of the base substrate 131 is prevented to have the same height as the convex pattern 112. The back surface of the base substrate 131 may be protected by the protection plate 120 to prevent the back surface of the base substrate 131 from being unevenly etched.

Thereafter, the photoresist pattern 134, the mask pattern 136, the etch stop pattern 130, and the protection plate 120 remaining on the printing plate 110 are removed.

7A to 7C are views for explaining a thin film patterning method using a printing apparatus having a printing plate according to the present invention.

As shown in FIG. 7A, a printing roller 144 to which a blanket 142 is attached is provided. In the blanket 142, the organic liquid 148 is filled through the organic liquid supply part 146.

Then, as shown in FIG. 7B, when the printing roller 144 coated with the organic liquid 148 is rotated on the printing plate 110 having the concave pattern 114 and the convex pattern 112, the convex pattern 112 is formed. The organic liquid 148 in the region in contact with the first layer is transferred onto the convex pattern 112, and the organic liquid 148 in the region not in contact with the concave pattern 114 remains on the surface of the blanket 142. Is formed.

The printing roller 144 on which the organic pattern 140 is formed is rotated on the substrate 111 as shown in FIG. 7C. Accordingly, the organic pattern 140 is transferred onto the substrate 111, dried, and cured to form a thin film.

Meanwhile, the printing apparatus according to the present invention may form a thin film formed of an organic material such as a color filter and a black matrix of an LCD and an organic thin film layer including an emission layer of an organic EL device.

As described above, the printing plate, the manufacturing method thereof, and the thin film patterning method using the same according to the present invention are formed such that the convex pattern of the pattern region and the outer region have the same height. Accordingly, since the organic liquid of the printing roller corresponding to the outer region of the printing plate is transferred to the outer region, printing failure of the display element can be prevented. In addition, the printing plate according to the present invention, a manufacturing method thereof, and a thin film patterning method using the same may prevent the base substrate back surface from being unevenly etched because the back surface of the base substrate is protected by a protective plate during the etching of the base board of the printing plate.

In the detailed description of the present invention described above with reference to the preferred embodiment of the present invention, those skilled in the art or those skilled in the art having ordinary knowledge of the present invention described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the spirit and scope of the art.

Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (13)

Providing a base substrate having a pattern region and an outer region surrounding the pattern region; The pattern region of the base substrate has a convex pattern and a concave pattern in the pattern region of the base substrate, and protects the outer region of the base substrate with an etch preventing pattern so that the height of the outer region of the base substrate is the same as the height of the convex pattern. Method of manufacturing a printing plate comprising the step of forming a printing plate by patterning. The method of claim 1, Forming the printing plate Forming a photoresist pattern on the pattern region of the base substrate; Forming the etch stop pattern on an outer area surrounding the pattern area of the base substrate; Etching the base substrate through an etching process using the photoresist pattern; And removing the photoresist pattern and the etch stop pattern. The method of claim 2, The etching prevention pattern is a printing plate manufacturing method, characterized in that formed with a sealant. The method of claim 1, Forming the printing plate Forming a photoresist pattern on the pattern region of the base substrate and forming the etch stop pattern of the same material as the photoresist pattern on an outer region surrounding the pattern region of the base substrate; Etching the base substrate through an etching process using the photoresist pattern and the etch stop pattern; And removing the photoresist pattern and the etch stop pattern. The method according to any one of claims 2 and 4, And fixing the protective plate to the rear surface of the base substrate before etching the base substrate. The method according to any one of claims 2 and 4, And forming a mask pattern having the same pattern as that of the photoresist pattern under the photoresist pattern. The method of claim 6, The mask pattern has a single layer, such as Mo, Al, AlNd, Cr, CrOx, or a multi-layer structure containing them, the printing plate manufacturing method, characterized in that formed in a thickness of about 500 ~ 1500Å. In the printing plate in contact with the printing roller to which the organic liquid is applied, A pattern region in which a convex pattern in contact with the printing roller and a concave pattern in contact with the printing roller are formed; It is formed to surround the pattern region, and has an outer region formed at the same height as the convex pattern, The printing plate is formed by patterning the pattern area while protecting the outer area with an etch stop pattern. Applying an organic liquid to a printing roller; The convex pattern and the convex pattern pattern area on the base substrate, and the outer surface is formed on the base substrate to surround the pattern area, the printing roller is rotated on the printing plate comprising a convex pattern having the same height as the convex pattern is convex Transferring the organic liquid to the pattern to form an organic pattern on the printing roller; Printing an organic pattern formed on the printing roller on a substrate; The printing plate is formed by patterning a pattern region of the base substrate while protecting the outer region of the base substrate with an etch stop pattern. The method of claim 9, The organic pattern is a thin film patterning method, characterized in that the black matrix or color filter of the liquid crystal display device. The method of claim 9, The organic pattern is a thin film patterning method, characterized in that the organic thin film layer of the light emitting device. The method of claim 8, The etching prevention pattern is a printed plate, characterized in that formed of the same material as the sealant or photoresist pattern used when patterning the pattern area. The method of claim 9, The etching prevention pattern is a thin film patterning method, characterized in that formed of the same material as the sealant or photoresist pattern used when patterning the pattern region.

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