KR100795511B1 - One-component epoxy resin type adhesive composition for printed circuit board - Google Patents
One-component epoxy resin type adhesive composition for printed circuit board Download PDFInfo
- Publication number
- KR100795511B1 KR100795511B1 KR1020050061256A KR20050061256A KR100795511B1 KR 100795511 B1 KR100795511 B1 KR 100795511B1 KR 1020050061256 A KR1020050061256 A KR 1020050061256A KR 20050061256 A KR20050061256 A KR 20050061256A KR 100795511 B1 KR100795511 B1 KR 100795511B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- adhesive
- printed circuit
- oxide
- circuit board
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
본 발명은 에폭시수지 65~95중량%와; 산화철, 실리카, 알루미늄 옥사이드, 마그네슘 옥사이드, 티타늄 옥사이드, 안티모니 옥사이드, 아연 옥사이드 및 몰리브데늄 옥사이드로 이루어진 군에서 선택된 어느 하나 이상으로 된 충진제 2~8중량%; 및 1차 아민, 2차 아민, 3차 아민, 무수물계, 아미드계 및 이미다졸계로 이루어진 군에서 선택된 어느 하나 이상으로 된 잠재성 촉진제 0.2~30%를 포함하는 인쇄회로기판용 일액형 에폭시수지 접착제를 개시한다.65 to 95% by weight of the epoxy resin; 2 to 8% by weight of a filler made of any one or more selected from the group consisting of iron oxide, silica, aluminum oxide, magnesium oxide, titanium oxide, antimony oxide, zinc oxide and molybdenum oxide; And 0.2 to 30% of a latent accelerator having at least one selected from the group consisting of primary amines, secondary amines, tertiary amines, anhydrides, amides, and imidazoles. Initiate an adhesive.
본 발명은 인쇄회로기판용 에폭시수지 접착제를 일액형으로 제조함으로써 상온에서는 경화가 잘 되지 않으므로 가사시간을 충분히 확보하여 접착제의 사용이 용이하고 손실을 줄일 수 있다. 또한, 주제와 보조제의 혼합 과정이 필요하지 않아 작업 시간과 공정이 단축되며, 혼합 과정에서 생기는 교반 불량 및 계량 불량으로 인한 접착제의 불균일화를 줄여 불량률을 감소시킬 수 있다.According to the present invention, since the epoxy resin adhesive for printed circuit board is manufactured in one-component type, curing is not performed well at room temperature, the pot life is sufficiently secured, and the use of the adhesive is easy and the loss can be reduced. In addition, the mixing process of the main agent and the auxiliary is not necessary, thereby reducing the work time and the process, and reducing the defect rate by reducing the non-uniformity of the adhesive due to the poor mixing and the poor measuring.
접착제, 일액형, 에폭시수지, 인쇄회로기판 Adhesive, one component, epoxy resin, printed circuit board
Description
본 발명은 인쇄회로기판(Printed circuit board;PCB)용 에폭시수지 접착제에 관한 것으로, 보다 구체적으로는 가사 시간의 제약이 없어 사용이 편리한 인쇄회로기판용 일액형 에폭시수지 접착제에 관한 것이다.The present invention relates to an epoxy resin adhesive for a printed circuit board (PCB), and more particularly to a one-component epoxy resin adhesive for a printed circuit board is easy to use because there is no limitation of pot life.
인쇄회로기판용 접착제는, 인쇄회로기판 시이트(sheet)에 연속 배열되는 다수의 회로 패턴 중 불량한 패턴을 제거하고, 대신 그 부분에 양호한 패턴을 접착시켜서 인쇄회로기판 시이트를 연속 공정의 장비에 계속 적용시킬 수 있도록 하기 위하여 사용된다.Adhesives for printed circuit boards continue to apply printed circuit board sheets to equipment in a continuous process by removing the poor ones from a number of circuit patterns continuously arranged on the printed circuit board sheets, and instead sticking the good patterns to the parts. It is used to make it possible.
일반적으로 인쇄회로기판용 에폭시수지 접착제는 주제와 보조제를 서로 혼합하여 사용하는 이액형이 주로 사용되고 있다.In general, a two-component type epoxy resin adhesive for printed circuit boards is used by mixing a main material and an auxiliary agent.
하지만, 이액형의 인쇄회로기판용 에폭시수지 접착제는 주제와 보조제 혼합 이후 2~3시간의 짧은 가사시간을 갖는다. 게다가, 필요시 미리 주제와 보조제를 충분히 섞이도록 혼합하는 공정을 진행시켜야 하므로, 공정 시간과 에너지를 소모하게 된다. 또한, 매번 혼합 과정에서 발생하는 손실량이 다르거나, 균일한 혼합이 이루어지지 않아서 발생하는 물성의 차이로 불량률이 크다.However, two-component epoxy resin adhesives for printed circuit boards have a short pot life of 2 to 3 hours after mixing the main and auxiliary agents. In addition, the process of mixing the subject and the adjuvant sufficiently in advance, if necessary, consumes processing time and energy. In addition, the failure rate is large due to the difference in the physical properties caused by a different amount of loss generated during each mixing process or a uniform mixing is not made.
본 발명은 상술한 문제점을 해결하기 위하여 창안된 것으로, 가사시간을 충분히 늘림으로써 사용이 용이하고 경제적이며 불량률을 저감시키는 인쇄회로기판용 일액형 에폭시수지 접착제를 제공하는데 그 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object thereof is to provide a one-component epoxy resin adhesive for printed circuit boards which is easy to use, economical and reduces a defective rate by sufficiently increasing pot life.
본 발명의 다른 목적 및 장점들은 하기에 설명될 것이며, 본 발명의 실시예에 의해 알게 될 것이다. 또한, 본 발명의 목적 및 장점들은 특허 청구 범위에 나타낸 수단 및 조합에 의해 실현될 수 있다.Other objects and advantages of the invention will be described below and will be appreciated by the embodiments of the invention. In addition, the objects and advantages of the present invention can be realized by means and combinations indicated in the claims.
상기와 같은 목적을 달성하기 위한 본 발명의 인쇄회로기판용 일액형 에폭시수지 접착제는, 비스페놀 A 디글리시딜에테르, 비스페놀 B 디글리시딜에테르, 비스페놀 F 디글리시딜에테르, 페놀 노볼락 디글리시딜에테르 및 크레졸 노볼락 디글리시딜에테르로 이루어진 군에서 선택된 어느 하나 이상으로 된 에폭시수지 65~95중량%와; 산화철, 실리카, 알루미늄 옥사이드, 마그네슘 옥사이드, 티타늄 옥사이드, 안티모니 옥사이드, 아연 옥사이드 및 몰리브데늄 옥사이드로 이루어진 군에서 선택된 어느 하나 이상으로 된 충진제 2~8중량%와; 디에틸렌트리아민, 트리에틸렌테트라아민, 테트라에틸렌펜타아민, 아미노에틸피페라진, 디메틸아미노프로필아민, 디에틸아미노프로필아민 및 2,4,6-트리스(디메틸아미노메틸)페놀로 이루어진 군에서 선택된 어느 하나 이상으로 된 잠재성 촉진제 0.2~30%;를 포함한다.The one-component epoxy resin adhesive for printed circuit boards of the present invention for achieving the above object is bisphenol A diglycidyl ether, bisphenol B diglycidyl ether, bisphenol F diglycidyl ether, phenol novolac di 65 to 95% by weight of an epoxy resin composed of at least one selected from the group consisting of glycidyl ether and cresol novolac diglycidyl ether; 2 to 8% by weight of a filler composed of at least one selected from the group consisting of iron oxide, silica, aluminum oxide, magnesium oxide, titanium oxide, antimony oxide, zinc oxide, and molybdenum oxide; Any selected from the group consisting of diethylenetriamine, triethylenetetraamine, tetraethylenepentaamine, aminoethylpiperazine, dimethylaminopropylamine, diethylaminopropylamine and 2,4,6-tris (dimethylaminomethyl) phenol 0.2-30% of one or more latent promoters.
삭제delete
삭제delete
또한, 안료를 전체 중량을 기준으로 0.001 내지 0.01중량부로 포함할 수도 있다.In addition, the pigment may be included in 0.001 to 0.01 parts by weight based on the total weight.
이하 첨부된 도면을 참조로 본 발명의 바람직한 실시예를 상세히 설명하기로 한다. 이에 앞서, 본 명세서 및 청구 범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니 되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.
따라서, 본 명세서에 기재된 실시예와 도면에 도시된 구성은 본 발명의 가장 바람직한 일 실시예에 불과할 뿐이고 본 발명의 기술적 사상을 모두 대변하는 것은 아니므로, 본 출원시점에 있어서 이들을 대체할 수 있는 다양한 균등물과 변형예들이 있을 수 있음을 이해하여야 한다.Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.
본 발명에 따른 인쇄회로기판용 일액형 에폭시수지 접착제는 65~95중량%의 에폭시수지, 2~8중량%의 충진제 및 0.2~30중량%의 잠재성 촉진제를 포함한다.The one-component epoxy resin adhesive for printed circuit boards according to the present invention includes 65 to 95 wt% epoxy resin, 2 to 8 wt% filler and 0.2 to 30 wt% latent accelerator.
이하 본 발명에 대하여 상세히 설명하기로 한다.Hereinafter, the present invention will be described in detail.
일단, 에폭시수지는 열변형온도가 높고, 유리전이온도가 높아서 변형이 없고, 강도 및 작업성이 우수하고 기판과 친화력이 좋은 수지를 사용한다. 이러한 에폭시수지는 잠재성 촉진제와 충진제를 혼합하여 사용하므로 내열성, 내충격성 및 접착력이 우수한 인쇄회로기판용 접착제가 제조될 수 있다.First, epoxy resins use a resin having high heat deformation temperature, high glass transition temperature, no deformation, excellent strength and workability, and good affinity with a substrate. Since the epoxy resin is used by mixing a latent accelerator and a filler, an adhesive for a printed circuit board having excellent heat resistance, impact resistance, and adhesion may be manufactured.
특히, 본 발명에 따른 일액형 접착제에 사용되는 에폭시수지는 지방족 에폭시수지, 지환족 에폭시수지, 방향족 에폭시수지, NBR, CTBN, ATBN 등의 고무변성 에폭시수지, 아크릴변성 에폭시수지, 우레탄변성 에폭시수지 및 다관능성 에폭시수지 등이 사용된다. 보다 구체적으로, 에폭시수지로는 비스페놀A 디글리시딜에테르, 비스페놀F 디글리시딜에테르, 비스페놀B 디글리시딜에테르, 페놀 노블락 디글리시딜에테르, 크레졸 노블락 디글리시딜에테르 및 페녹시 디글리시딜에테르로 이루어진 군에서 선택된 어느 하나 이상으로 된다.In particular, the epoxy resin used in the one-component adhesive according to the present invention is aliphatic epoxy resin, alicyclic epoxy resin, aromatic epoxy resin, NBR, CTBN, rubber modified epoxy resin such as ATBN, acrylic modified epoxy resin, urethane modified epoxy resin and Polyfunctional epoxy resin etc. are used. More specifically, epoxy resins include bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol B diglycidyl ether, phenol noblock diglycidyl ether, cresol noblock diglycidyl ether, and phenoxy. At least one selected from the group consisting of diglycidyl ether.
그리고, 충진제는 접착제에 내열성, 내충격성 및 내수축성을 부여하기 위하여 2~8중량%의 양으로 사용되며, 산화철, 실리카, 알루미늄 옥사이드, 마그네슘 옥사이드, 티타늄 옥사이드, 안티몬 옥사이드, 아연 옥사이드 및 몰리브덴 옥사이드 로 이루어진 군에서 선택된 어느 하나 이상으로 된다.In addition, the filler is used in an amount of 2 to 8% by weight in order to impart heat resistance, impact resistance and shrinkage resistance to the adhesive, iron oxide, silica, aluminum oxide, magnesium oxide, titanium oxide, antimony oxide, zinc oxide and molybdenum oxide At least one selected from the group consisting of.
마지막으로, 잠재성 촉진제는 100℃ 이상의 고온에서 경화속도를 조절하고 내열성을 증진시키기 위하여 0.2~30중량%의 양으로 사용되며, 디에틸렌트리아민, 트리에틸렌테트라아민, 테트라에틸렌펜타아민, 아미노에틸피페라진, 디메틸아미노프로필아민, 디에틸아미노프로필아민 및 2,4,6-트리스(디메틸아미노메틸)페놀로 이루어진 군에서 선택된 어느 하나 이상으로 된다.Finally, the latent accelerator is used in an amount of 0.2 to 30% by weight in order to control the curing rate and improve heat resistance at a high temperature of 100 ° C. or higher, and diethylenetriamine, triethylenetetraamine, tetraethylenepentaamine, aminoethyl At least one selected from the group consisting of piperazine, dimethylaminopropylamine, diethylaminopropylamine, and 2,4,6-tris (dimethylaminomethyl) phenol.
본 발명에 따른 인쇄회로기판용 일액형 접착제는 40℃ 이하의 온도에서 잠재성 촉진제와 에폭시수지를 혼합하는데, 이는 잠재성 촉진제가 상온에서는 활성이 저하되지만 80℃ 이상에서는 활성이 시작되므로 80℃ 이상에서 혼합시 Gel화 현상이 일어날 수 있기 때문이다.The one-component adhesive for printed circuit boards according to the present invention mixes the latent accelerator and the epoxy resin at a temperature of 40 ° C. or lower. This is because the latent accelerator is deactivated at room temperature but starts to be active at 80 ° C. or higher. This is because the gelation phenomenon may occur when mixing at.
나아가, 본 발명에 따른 인쇄회로기판용 일액형 에폭시수지 접착제에는 안료를 첨가제로서 적용할 수 있다. Furthermore, the pigment may be applied as an additive to the one-component epoxy resin adhesive for printed circuit board according to the present invention.
안료는 기판의 색상과 유사한 녹색을 사용할 수 있으며, 전체 접착제에 대해 0.001~0.01중량부로 사용될 수 있다.Pigment may use green similar to the color of the substrate, and may be used in 0.001 to 0.01 parts by weight of the total adhesive.
이와 같은 조성의 일액형 접착제를 사용함으로써 기판시이트 상에 회로 패턴 중 일부가 불량일 경우 폐기할 필요없이 일부 불량 부분을 제거하고 양호한 기판과 접착제로 연결하여 전체를 양호한 기판으로 사용할 수 있게 된다. By using the one-component adhesive of such a composition, when some of the circuit patterns on the substrate sheet are defective, some defective portions can be removed without being discarded and connected with a good substrate and an adhesive to be used as a good substrate.
본 발명의 일액형 에폭시 접착제는 내충격성, 내강도성, 접착력 뿐만 아니라, 내열성이 우수하여 기판에 납땜시 등에 의한 고온이 가해지더라도 접착력과 치수가 변형되지 않아 기판의 형태가 양호하게 유지된다.The one-component epoxy adhesive of the present invention has excellent heat resistance as well as impact resistance, strength resistance, and adhesive strength, so that even if high temperature is applied to the substrate by soldering, the adhesive strength and dimensions are not deformed, and thus the shape of the substrate is maintained well.
이하, 실시예를 통하여 본 발명에 대하여 상세히 설명하기로 한다.Hereinafter, the present invention will be described in detail with reference to Examples.
<실시예><Example>
본 실시예에서는 에폭시수지, 충진제, 잠재성 촉진제 및 안료를 표 1에 나타낸 바와 같이 후술한 방법으로 혼합하여 발명예1 과 비교예1, 2의 에폭시수지 접착제를 제조하였다.In this embodiment, epoxy resins, fillers, latent accelerators and pigments were mixed in the following manner as shown in Table 1 to prepare epoxy resin adhesives of Inventive Example 1 and Comparative Examples 1 and 2.
서스(SUS)재질의 제조통에 40℃ 이하로 예열된 에폭시수지, 충진제인 실리카, 잠재성 촉진제 및 녹색안료인 시아닌 그린을 각각 첨가한 후, 800rpm 이하의 속도로 5~10분 교반하여 롤이 3개인 3단 롤밀에 2회 밀링한다. 1회는 롤과 롤 사이의 간격을 2~5mm로 하고, 2회는 1mm이하의 간격으로 하여 밀링하였다Epoxy resin preheated to 40 ° C. or lower, silica as a filler, latent accelerator and cyanine green as green pigments were respectively added to a manufacturing vessel of sus material, followed by stirring for 5 to 10 minutes at a speed of 800 rpm or lower. Mill twice in three roll mills of three. One time, the gap between rolls was 2 to 5 mm, and the second time was milled with an interval of 1 mm or less.
PCB 2연 배열된 기판을 배열하고 상기 준비된 접착제를 적용하여 기판을 부착시킨 후 120℃의 건조용 오븐에서 1시간 동안 경화시켰다. 그리고 나서, 접착제의 접착성, 꺾임성, 내열성 및 치수안정성에 대하여 평가하였다.PCB double-arranged substrates were arranged and the substrates were applied by applying the prepared adhesive, followed by curing in a drying oven at 120 ° C. for 1 hour. Then, the adhesiveness, the bending property, the heat resistance, and the dimensional stability of the adhesive were evaluated.
접착성은 무게를 알 수 있는 분동을 올려놓고 접착제가 견딜 수 있는 한계 하중으로 측정하였다.Adhesion was measured by placing the weight on which weight is known and the limit load that the adhesive can withstand.
꺾임성은 동일 무게의 분동을 올려놓고 PCB 휨의 높이를 측정하였다.Flexibility was measured on the height of the PCB deflection with the weight of the same weight.
내열성은 시차주사열량계(Differential Scanning Calorimeter; DSC)를 사용하여 유리전이온도(Tg) 및 선팽창계수 등을 측정하여 접착제의 열화 정도, 수축성, 균열 및 비틀림에 대하여 평가하였다.The heat resistance was evaluated for the degree of deterioration, shrinkage, cracking and torsion of the adhesive by measuring the glass transition temperature (Tg) and the coefficient of linear expansion using a differential scanning calorimeter (DSC).
치수안정성은 접착제를 도포하기 전과 접착제 도포 및 경화 후의 거리 차이로 측정하였다.Dimensional stability was measured by the distance difference before applying the adhesive and after applying and curing the adhesive.
비교예1Comparative Example 1
비교예1의 조성으로 된 접착제를 기판에 시험한 결과 실리카 과량으로 치수안정성은 우수하나, 점도가 높아져 작업자의 작업성이 저하되었고 고점도로 인한 흐름성 저하 및 기포 발생으로 접착력이 감소하였다.As a result of testing the adhesive with the composition of Comparative Example 1 on the substrate, the dimensional stability was excellent due to the excess silica, but the viscosity was high, the workability of the worker was lowered, and the adhesive force was decreased due to the decrease in flowability and bubble generation due to the high viscosity.
발명예1Inventive Example 1
발명예1의 조성으로 된 접착제를 기판에 적용하여 시험한 결과 경화 전과 경화 후 5미크롬 이하로 수축되는 것으로 치수안정성이 우수한 것으로 판단되었으며, 꺾임성이나 내열성도 우수하여 PCB 부착 상태가 균열되지 않는 특성이 나타났다As a result of applying and testing the adhesive with the composition of Inventive Example 1 on the substrate, it was judged to be excellent in dimensional stability by shrinking to less than 5 microns before curing and after curing. Characteristics appeared
비교예2Comparative Example 2
비교예2의 조성으로 된 접착제를 기판에 시험한 결과 실리카 소량으로 인해 치수안정성이 떨어지고 내열성이 부족하여 PCB판 사이가 분리되었다.As a result of testing the adhesive with the composition of Comparative Example 2 on the substrate, the dimensional stability was lowered due to the small amount of silica and the heat resistance was insufficient to separate the PCB plates.
이상과 같이, 본 발명은 비록 한정된 실시예와 도면에 의해 설명되었으나, 본 발명은 이것에 의해 한정되지 않으며 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에 의해 본 발명의 기술 사상과 아래에 기재될 특허청구범위의 균등 범위 내에서 다양한 수정 및 변형이 가능함은 물론이다.As mentioned above, although this invention was demonstrated by the limited embodiment and drawing, this invention is not limited by this, The person of ordinary skill in the art to which this invention belongs, Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.
본 발명의 인쇄회로기판용 일액형 에폭시수지 접착제에 따르면, 인쇄회로기판용 에폭시수지 접착제를 일액형으로 제조함으로써 상온에서는 경화가 잘 되지 않으므로 가사시간을 충분히 확보하여 접착제의 사용이 용이하고 손실을 줄일 수 있다.According to the one-component epoxy resin adhesive for printed circuit board of the present invention, since the epoxy resin adhesive for printed circuit board is manufactured in one component, it is hard to be hardened at room temperature, so the pot life is sufficiently secured, and the use of the adhesive is easy and the loss is reduced. Can be.
또한, 주제와 보조제의 혼합 과정이 필요하지 않아 작업 시간과 공정이 단축되며, 혼합 과정에서 생기는 교반 불량 및 계량 불량으로 인한 접착제의 불균일화를 줄여 불량률을 감소시킬 수 있다.In addition, the mixing process of the main agent and the auxiliary is not necessary, thereby reducing the work time and the process, and reducing the defect rate by reducing the non-uniformity of the adhesive due to the poor mixing and the poor measuring.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050061256A KR100795511B1 (en) | 2005-07-07 | 2005-07-07 | One-component epoxy resin type adhesive composition for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050061256A KR100795511B1 (en) | 2005-07-07 | 2005-07-07 | One-component epoxy resin type adhesive composition for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20070006164A KR20070006164A (en) | 2007-01-11 |
| KR100795511B1 true KR100795511B1 (en) | 2008-01-16 |
Family
ID=37871460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050061256A KR100795511B1 (en) | 2005-07-07 | 2005-07-07 | One-component epoxy resin type adhesive composition for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100795511B1 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040029939A (en) * | 2000-03-31 | 2004-04-08 | 히다치 가세고교 가부시끼가이샤 | Adhesive Composition, Method for Preparing the Same, Adhesive Film Using the Same, Substrate for Carrying Semiconductor and Semiconductor Device |
| JP2007009420A (en) * | 2005-06-28 | 2007-01-18 | Takashi Matsumoto | Segment for shield tunnel |
-
2005
- 2005-07-07 KR KR1020050061256A patent/KR100795511B1/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040029939A (en) * | 2000-03-31 | 2004-04-08 | 히다치 가세고교 가부시끼가이샤 | Adhesive Composition, Method for Preparing the Same, Adhesive Film Using the Same, Substrate for Carrying Semiconductor and Semiconductor Device |
| JP2007009420A (en) * | 2005-06-28 | 2007-01-18 | Takashi Matsumoto | Segment for shield tunnel |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070006164A (en) | 2007-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7511097B2 (en) | Two-component adhesive of epoxy resins and amine compound | |
| KR101212389B1 (en) | Thermosetting Resin Composition and Multilayer Printed Circuit Board Using the Same | |
| KR102006678B1 (en) | Epoxy resin composition for marine maintenace and repair coatings with improved overcoat ability | |
| KR100647072B1 (en) | Liquid thermosetting insulating resin composition and method of permanent hole-filling for printed wiring board using the same | |
| CN111019580B (en) | Epoxy resin adhesive and preparation method and application thereof | |
| TWI784366B (en) | Adhesive composition | |
| EP0384896A1 (en) | Toughened epoxy casting resins | |
| KR100795511B1 (en) | One-component epoxy resin type adhesive composition for printed circuit board | |
| JP2017188667A (en) | Insulating material and electronic component | |
| JP2013100525A (en) | Liquid epoxy resin composition and adhesive using the same | |
| JP2016512859A (en) | Thermosetting resin composition and printed wiring board filled with the resin composition | |
| WO2018008742A1 (en) | Structure adhesive composition which changes color when heat-cured | |
| KR100773641B1 (en) | Composition of die-attaching paste | |
| KR20130141482A (en) | Resin composition | |
| CN111040387A (en) | Halogen-free resin composition and flexible copper clad laminate comprising same | |
| KR100340438B1 (en) | Epoxy adhesive for binding printed circuit board | |
| JP2021175803A (en) | Epoxy resin composition | |
| CN117603640B (en) | Single-component epoxy shading adhesive, preparation method thereof and liquid crystal display | |
| US7294660B2 (en) | Epoxy resin composition | |
| KR100773638B1 (en) | Composition of die-attaching paste | |
| JPH04173858A (en) | Electrically conductive resin composition | |
| KR20240111482A (en) | An epoxy resin composition containing a highly flexible curing agent prepared using dicarboxylic acid and a cured product thereof | |
| KR20160069345A (en) | Adhesive composition for flexible print circuit board and adhesive tape for flexible print circuit board using the same | |
| JPH08164532A (en) | Curing of thermosetting composition | |
| CN118043405A (en) | Thermosetting resin composition, cured product, and printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E90F | Notification of reason for final refusal | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| G170 | Publication of correction | ||
| LAPS | Lapse due to unpaid annual fee |