KR100787636B1 - Method of forming metal pattern and ??? filter and display device comprising metal pattern - Google Patents

Abstract

Provided is a method for efficiently forming a fine metal pattern of high conductivity. The method of forming a metal pattern includes forming a photoresist mold defining a metal pattern formation region on a photoreaction film layer formed on a substrate, and including a photoreactive compound exposed and selectively activated by the photoresist mold. Forming a metal pattern on the photoreaction film layer. Also provided is an electromagnetic wave shielding filter and display device comprising a metal pattern formed in this manner.

Metal pattern, electromagnetic shielding filter, display device, photoresist mold

Description

Electromagnetic shielding filter and display device comprising a metal pattern forming method and a metal pattern {Method of forming metal pattern and EMI filter and display device comprising metal pattern}

1 is a flow chart of a manufacturing process of a metal pattern according to an embodiment of the present invention.

2 to 5 are cross-sectional views of the intermediate step structure of each step in the manufacturing process of the metal pattern according to an embodiment of the present invention.

6 is an exploded perspective view showing a PDP apparatus according to an embodiment of the present invention.

7 is a perspective view illustrating a PDP device including an electromagnetic shielding filter according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

210: substrate 220: photoreaction film layer

230: photoresist layer 230 ': photoresist mold

240: electroless plating core pattern 250: metal pattern

310: mask 500: electromagnetic shielding filter

600: PDP device 610: case

620: drive circuit board 630: panel assembly

640: cover 711: front substrate

712: sustain electrode 713: bus electrode

714: dielectric layer 715: dielectric protective film

721: back substrate 722: address electrode

723: dielectric layer 724: partition wall

725: phosphor layer 725R: red phosphor layer

725G: green phosphor layer 725B: blue phosphor layer

726: discharge cell

The present invention relates to a method for forming a metal pattern and an electromagnetic wave shielding filter and a display device including the metal pattern formed by the above method, and more particularly, to a method for efficiently forming a fine metal pattern having high conductivity, and by the method An electromagnetic wave shielding filter and a display apparatus containing the obtained metal pattern.

As the modern society is highly informationized, photoelectronics-related components and devices are remarkably advanced and widely distributed. Among them, display apparatuses for displaying images are widely used for television apparatuses, monitor apparatuses of personal computers, and the like, and thinning is progressing at the same time as such display apparatuses are enlarged.

As an example of the display device, the PDP device is in the spotlight as the next generation display device because it can satisfy both the size and the thickness of the display device, compared to the CRT representing the existing display device. Such a PDP apparatus displays an image using a gas discharge phenomenon, and is excellent in various display capabilities such as display capacity, brightness, contrast, afterimage, viewing angle, and the like. In addition, the PDP device is easier to be enlarged than other display devices, and is considered to be a thin light emitting display device having the most suitable characteristics as a high quality digital television in the future.

The PDP device generates a discharge in the gas between the electrodes by a direct current or an alternating current voltage applied to the electrode, and excites the phosphor by the radiation of ultraviolet rays, which emits light.

However, due to its driving characteristics, the PDP device has a high emission amount of electromagnetic waves and near infrared rays, high surface reflection of the phosphor, and color purity of the PDP device due to the orange light emitted from the encapsulated helium (He) or xenon (Xe), which does not reach the cathode ray tube. There is this.

Therefore, electromagnetic waves and near-infrared rays generated in the PDP device may adversely affect the human body and cause malfunction of precision devices such as a wireless telephone or a remote controller. In order to use such a PDP apparatus, it is required to suppress the emission of electromagnetic waves and near-infrared rays emitted from the PDP apparatus below a predetermined value. To this end, an electromagnetic wave shielding filter having a function such as electromagnetic shielding, near-infrared shielding, and / or color correction is employed to shield electromagnetic waves and near infrared rays while reducing reflected light and improving color purity.

JP-A-5-16281 and JP-A-10-72676 form a transparent resin layer on a transparent substrate, such as polycarbonate, and after electroless copper plating treatment thereon, by a microphotographic etching process. Disclosed is a method of manufacturing an electromagnetic shielding filter for forming a mesh pattern. In this case, the method may be advantageous in terms of processing a metal thin film, but may be etched after forming a plating layer of metal on the entire surface of the substrate. The metal layer is wasted. In particular, in the case of the electromagnetic wave shielding filter for a display device, since a relatively wide aperture must be maintained in consideration of the transmittance, many metal layers are etched. In addition, for high electromagnetic shielding efficiency, when a low sheet resistance is required, a thick metal film is required, so that the metal conductive layer dissolved and removed by etching is also thickened. In this case, there is a problem that a side etching phenomenon occurs on the side of the metal pattern. Therefore, there is a limit to the reduction of the line width and the space width of the metal pattern.

On the other hand, Japanese Patent Application Laid-Open No. 13-168574 discloses a method of forming a mesh pattern without an etching process. In this method, a transparent resin coating film containing reducing metal particles (electroless plating catalyst) is formed on a transparent substrate. After contacting the catalyst of the opening on the mesh pattern with the deactivation treatment or the dissolution removal treatment agent, the electromagnetic wave or the electron beam is irradiated, and only the catalyst portion is subjected to electroless plating to form an electromagnetic shielding film on the mesh. According to the above method, the plating film can be selectively grown only on a specific portion without growing the plating layer on the front surface, but an increase in line width occurs because the metal chemical plating layer on the catalyst layer does not prevent the growth in the transverse direction. There is a problem that the control of the line width is not easy.

Therefore, in the art, it is possible to form a high-conductivity metal pattern quickly and efficiently by a metal thin film process requiring a high vacuum or high temperature or a simple process in which a fine shape exposure process and a subsequent etching process are omitted. When the pattern is used as an electromagnetic shielding filter, there has been a need for a metal pattern forming method that can exhibit excellent performance.

The technical problem to be achieved by the present invention is to provide a method for forming an efficient high conductivity fine metal pattern by a simple process.

Another object of the present invention is to provide an electromagnetic shielding filter including a metal pattern formed by the above method.

Another object of the present invention is to provide a display device including a metal pattern formed by the above method.

The technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to another aspect of the present invention, there is provided a method of forming a metal pattern on a photoreaction film layer formed on a substrate and forming a photoresist mold defining a metal pattern formation region on the photoresist mold. And forming a metal pattern on the photoreaction film layer comprising the photoreaction compound exposed by and selectively activated.

Electron shielding filter according to an embodiment of the present invention for achieving the another technical problem comprises a substrate, a photoreaction film layer formed on the substrate, a photoreaction compound selectively activated in the photoreaction film layer It includes a photoresist mold exposing the photoreactive film layer and a metal pattern buried between the photoresist mold.

The display device according to an embodiment of the present invention for achieving another technical problem is continuous so as to partition a plurality of discharge cells between the transparent front substrate and the rear substrate and the front substrate and the rear substrate are coupled to face each other. A panel assembly including stripe-shaped electrodes formed on the front substrate and the rear substrate so as to be orthogonal to the partition wall interposed therebetween, the panel assembly disposed to face the front substrate of the panel assembly, the substrate, the photoreaction film layer formed on the substrate, And a photoresist mold exposing the photoreactive film layer selectively activated in the photoreaction film layer, and an electromagnetic wave shielding filter including a metal pattern to fill the space between the photoresist mold.

Specific details of other embodiments are included in the detailed description and the drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Hereinafter, a method of forming a metal pattern, an electromagnetic wave shielding filter and a display device including the metal pattern formed by the method will be described with reference to FIGS. 1 to 7.

1 is a flow chart illustrating a manufacturing process of a metal pattern, and FIGS. 2 to 5 are cross-sectional views of each step process intermediate step structure.

Referring to FIG. 1, first, a photoreactive film layer is formed on a substrate (S1). "Photoreactive film layer" of the present invention means a compound layer whose properties are significantly changed by light.

Specifically, referring to FIG. 2, the photoreaction film layer 220 is formed on the substrate 210.

The substrate 210 usable in the present invention is not particularly limited, but a transparent plastic substrate or glass material is preferably used. As the transparent plastic substrate, acrylic, polyester, polycarbonate, polyethylene, polyethersulfone, olefin maleimide copolymer, norbornene-based resin, and the like may be used. If not, it is preferable to use a polyester film, an acrylic resin, or the like.

The photoreactive compound included in the photoreactive film layer 220 stacked on the substrate 210 may be activated before receiving light and a negative type for generating photoelectrons. There is a positive type which is then deactivated by light.

Negative-type photoreactive compounds include organometallic compounds including Ti that can form photoelectrons by light. Examples of organometallic compounds including Ti are tetraisopropyl titanate, tetra-n-butyl titinate, tetrakis (2-ethylhexyl) titanate (Tetrakis (2) -ethyl-hexyl) titanate), and polybutyltitanate.

The positive type photoreaction compound is an organometallic compound including Sn. Examples of organometallic compounds including Sn include SnCl (OH) and SnCl ₂ .

An example of the photoreactive compound used in the present invention may include a TiO ₂ precursor, which is preferably diluted in butanol or propanol within 20% of a range. Photoreactive compounds can be used commercially available products, a typical product is DuPont Tyzor ^® .

The photoreaction film layer 220 of the present invention may be applied onto the substrate 210 using spin coating, roll coating, dipping, or bar coating. As an example of a method of applying the photoreaction film layer 220, spin coating may be applied in a spin coater that rotates at 1000 to 3000 rpm.

The thickness of the photoreactive film layer 220 of the present invention may vary depending on UV irradiation time and light wavelength, and it is important to optimize in each condition.

In addition, the photoreaction film layer 220 may include a functional dye for color correction. As such a dye, a dye or a pigment can be used. Kinds of pigments include organic dyes such as anthraquinone, cyanine, azo, stryl, phthalocyanine and methine, but the present invention is not limited thereto. Since the type and concentration of the dye are determined by the absorption wavelength of the dye, the absorption coefficient, and the transmission characteristics required by the display device, the dye is not limited to a specific value.

Next, a photoresist mold is formed on the photoreaction film layer (S2).

Referring to FIG. 3A, a photoresist layer 230 for forming a photoresist mold is formed on the photoreaction film layer 220. The photoresist depends on the type of photoreactive compound included in the photoreactive film layer, i.e., the photoresist is positive when the photoreactive compound is negative, and the photoresist is negative when the photoreactive compound is positive. Should be chosen.

Positive type photoresists include, for example, photosensitive polyimide, noblock resin to which a photosensitive agent is added, polyvinyl cinnamic acid, polymethylisoprovinyl ketone, polyvinylphenol, polyvinyl alcohol, and the like. The negative type photoresist also includes a binder, a photosensitive monomer component, a photoinitiator, a solvent, a dispersant, and the like. Mainly, binders of methacrylic acid, acrylic acid, crotonic acid and maleic acid can be used.As the photosensitive monomer, polyacrylate is used. This may be achieved but vinyl may be used. Examples of the photoinitiator may include benzoin ether, acetophenone, acylphenine, acylphosphine, benzophenone, xanthone, quinone, and the like.

The photoresist layer 230 may include a functional dye for color correction. As such a dye, a dye or a pigment can be used. Kinds of pigments include organic dyes such as anthraquinone, cyanine, azo, stryl, phthalocyanine and methine, but the present invention is not limited thereto. Since the type and concentration of the dye are determined by the absorption wavelength of the dye, the absorption coefficient, and the transmission characteristics required by the display device, the dye is not limited to a specific value.

As described above, the photoresist layer 230 is formed on the photoreaction film layer 220, and then an exposure process is performed.

Referring to FIGS. 3B and 3C, the regions in which the metal patterns are to be formed are defined, and then the photoresist layer 230 and the photoreaction film layer 220 are formed by irradiation of ultraviolet rays through the mask 310 defining the metal patterns. The area is exposed.

As shown in FIG. 3B, when the negative type is used as the photoreactive compound and the positive type is used as the photoresist, when the area to be formed with the photoresist mold is exposed (ER), the photoreaction of the exposed area is performed. The photoreactive compound included in the film layer 220 is activated, and the exposed region of the photoresist layer 230 is decomposed and removed by a subsequent developing process.

As shown in FIG. 3C, in the case where the positive type is used as the photoreactive compound and the photoresist is used as the negative type, the non-exposed area is exposed when ER is exposed to an area other than the photoresist mold. The activity of the photoreactive compound contained in the photoreaction film layer 220 is maintained, and the non-exposed areas of the photoresist layer 230 are decomposed and removed by a subsequent development process.

In the photoreaction film layer including the activated photoreaction compound, photoelectrons are formed and become a potential pattern for the electroless plating nuclei to be described later. The optoelectronics transition from the ground state to the active state, where they can be easily combined with other positive charges. In order to increase the efficiency of photoelectron generation and increase the life time, it is preferable to add an appropriate amount of additives such as triethanolamine, isopropyl alcohol, citric acid, etc. to the photoreaction film layer 220 or photoresist layer 230. .

The selectively exposed photoresist layer 230 is removed through a development process. 3D and 3E illustrate that a portion of the photoresist layer is removed by a developing process to form a photoresist mold. As the developing method, for example, there may be a shower developing method, a method of immersing and shaking in a developing solution. Moreover, it is also preferable to heat up a developing solution, when it is necessary to perform a developing process using the developing solution at normal temperature, or to heat in consideration of developing speed.

Hereinafter, only the case where the negative type is used as the photoreactive compound and the photoresist is performed using the positive type will be described.

Next, an electroless plating nucleus pattern is formed in the region exposed by the photoresist mold (S3).

Referring to FIG. 4, the substrate 210 including the photoreactive film layer 220 and the photoresist mold 230 ′ exposed to the catalyst aqueous solution for electroless plating is deposited. When deposited on an aqueous metal solution capable of generating positive charges, the photoelectrons formed by exposure are combined with the positive charges in the aqueous catalyst solution to cause a reduction reaction, which causes the positively charged metal to be adsorbed only to the region where the photoelectrons are formed. 240 is formed. The adsorbed metal particles serve as a catalyst for promoting metal crystal growth in a subsequent plating process. When plating copper, nickel, or gold, it is desirable to make an electroless plating nucleus through such metal salt treatment. In addition, a silver salt solution or a palladium salt solution or a mixed solution thereof is used as the metal salt solution. The electroless plating core pattern 240 having reduced palladium or silver metal particles or the like has sufficient activity as a catalyst in a subsequent electroless plating process to promote metal crystal growth by plating, thereby obtaining a more compact metal pattern. It is preferable because there are advantages that can be obtained.

Subsequently, a metal pattern is formed on the electroless plating core pattern (S4).

Referring to FIG. 5, the formation of the metal pattern 250 may be sufficiently performed by electrolytic plating or electroless plating. If the metal pattern 250 is formed by the vacuum film forming method, the adhesion strength and durability will be excellent. However, in order to simplify the process, the electroless plating method is most suitable. Hereinafter, the electroless plating method will be described.

As shown in FIG. 5, since the metal crystal is surrounded by the photoresist mold 230 ′ upon growth on the electroless plating core pattern 240, growth in the transverse direction is restricted. Therefore, the metal pattern 250 having a uniform line width can be formed, so that the fine line width can be controlled without expanding the line width.

The process of forming the metal pattern 250 on the electroless plating core pattern 240 may be of various combinations depending on the conditions such as the thickness of the metal pattern 250 to ultimately obtain. For example, when the thickness of the metal pattern 250 to be obtained is thick, it is also preferable to initially grow to an appropriate thickness with an electroless plating layer, and then grow a part of the electroless plating layer as an electrode to grow an electrolytic plating layer.

After the metal crystals are grown to form the metal pattern 250, the photoresist mold 230 ′ may be peeled off or removed, but when the functionalities such as dye addition are added to the photoresist mold 230 ′, peeling is performed. Or not removed. Of course, when the photoresist mold 230 'is not peeled or removed, the photoresist mold may also be peeled or removed, and there is no need to perform a transparent treatment in which the metal pattern is filled with a separate transparent resin or the like.

Hereinafter, an electromagnetic shielding filter including a metal pattern formed by a method according to an embodiment of the present invention will be described.

Electromagnetic shielding filter 500 according to an embodiment of the present invention includes a substrate, a photoreactive film layer, a photoresist mold, an electroless plating nucleus pattern and a metal pattern as shown in FIG.

Referring to FIG. 5, the photoreaction film layer 220 is positioned on the substrate 210 of the electromagnetic wave shielding filter 500 according to an embodiment of the present invention.

The photoreactive film layer 220 is a layer containing a photoreactive compound and plays a role in contributing to the formation of an electroless plating nucleus pattern 240 to be described later by selectively forming a photoelectron by exposure to the photoreaction compound.

The photoreactive compound included in the photoreactive film layer 220 includes a negative type that receives light and is activated to generate photoelectrons, and a positive type that is activated before receiving light and deactivated by light. Negative-type photoreactive compounds include organometallic compounds including Ti that can form photoelectrons by light. Examples of organometallic compounds containing Ti include tetraisopropyl titanate, tetra-n-butyl titinate, tetrakis (2-ethylhexyl) titanate (Tetrakis (2) -ethyl-hexyl) titanate), and polybutyltitanate. The positive type photoreaction compound is an organometallic compound including Sn. Examples of organometallic compounds including Sn include SnCl (OH) and SnCl ₂ .

In addition, the photoreaction film layer 220 may include a functional dye, and in this case, the electromagnetic shielding filter 500 may perform a function of color correction even without including an additional color correction film.

A dye or a pigment may be used as a dye included in the photoreaction film layer 220. Kinds of pigments include organic dyes such as anthraquinone, cyanine, azo, stryl, phthalocyanine and methine, but the present invention is not limited thereto. The type and concentration of the dye is determined by the absorption wavelength of the dye, the absorption coefficient, and the transmission characteristics required by the display device, and is therefore not limited to a specific value.

The photoresist mold 230 ′ is positioned on the photoreaction film layer 220. The photoresist mold 230 ′ exposes the photoreaction film layer including the photoreaction compound selectively activated in the photoreaction film layer. Also, the line width of the photoresist mold 230 'has the same line width as the line width of the metal wiring ultimately to be obtained. That is, the photoresist mold 230 ′ regulates the growth of the metal pattern 250 in the lateral direction.

The photoresist mold may include a functional dye, and in this case, the electromagnetic shielding filter 500 may perform a function of color correction even without including an additional color correction film.

A dye or a pigment may be used as a dye included in the photoresist mold 230 ′. Kinds of pigments include organic dyes such as anthraquinone, cyanine, azo, stryl, phthalocyanine and methine, but the present invention is not limited thereto. Since the type and concentration of the dye are determined by the absorption wavelength of the dye, the absorption coefficient, and the transmission characteristics required by the display device, the dye is not limited to a specific value.

An electroless plating core pattern 240 may be disposed on the photoreaction film layer 220 exposed by the photoresist mold 230 ′. The electroless plating core pattern 240 serves as a catalyst when the metal pattern 250 to be described later is formed.

The electroless plating core pattern 240 is made of Cu, Ni, Pd, Au, Ag, or a combination thereof.

The metal pattern 250 is positioned on the electroless plating core pattern 240 in a form surrounded by the photoresist mold 230 ′. That is, the growth of the metal pattern 250 in the transverse direction is controlled by the photoresist mold 230 ′.

Hereinafter, a display apparatus including an electromagnetic shielding filter according to an exemplary embodiment of the present invention will be described.

6 is an exploded perspective view showing a PDP device 600 as an example of a display device according to an embodiment of the present invention. As shown in FIG. 6, the structure of the PDP device 600 according to an exemplary embodiment of the present invention includes a case 610, a cover 640 covering an upper portion of the case 610, and a housing within the case 610. The driving circuit board 620, a panel assembly 630 including a discharge cell in which gas discharge occurs, and an electromagnetic shielding filter 500 according to an exemplary embodiment of the present invention.

The electromagnetic shielding filter 500 includes a metal pattern formed of a material having excellent conductivity on a substrate, and the metal pattern is grounded to the case 610 through the cover 640. That is, before the electromagnetic waves generated from the panel assembly 630 reach the user, the electromagnetic waves generated by the panel assembly 630 are grounded to the cover 640 and the case 610 through the conductive layer of the electromagnetic shielding filter 500.

In this case, FIG. 7 is a perspective view illustrating a PDP apparatus 600 as an example of a display apparatus according to an exemplary embodiment.

As shown in FIG. 6 and FIG. 7, the PDP device 600 according to an embodiment of the present invention includes an electromagnetic shielding filter 500 and a panel assembly 630. As described above, the electromagnetic wave shielding filter 500 includes a photoreaction film layer 220 on the substrate 210, a photoresist mold 230 ′, and a photoresist mold 230 ′. The electroless plating core pattern 240 is positioned on the exposed photoreaction film layer, and the metal pattern 250 is buried between the photoresist mold 230 ′. Hereinafter, the panel assembly 630 will be described in detail.

As illustrated in FIG. 7, a plurality of sustain electrodes 712 are disposed on the surface of the front substrate 711 in a stripe shape. Bus electrodes 713 are formed on each sustain electrode 712 to reduce signal delay. The dielectric layer 714 is formed on the surface where the sustain electrode 712 is disposed to cover the whole. A dielectric protective film 715 is formed on the surface of the dielectric layer 714. For example, the dielectric protective film 715 can be formed by covering the surface of the dielectric layer 714 with a thin film of MgO using a sputtering method or the like.

On the other hand, a plurality of address electrodes 722 are arranged in a stripe shape on a surface of the rear substrate 721 that faces the front substrate 711. The disposition direction of the address electrode 722 is a direction intersecting with the sustain electrode 712 when the front substrate 711 and the rear substrate 721 are disposed to face each other. The dielectric layer 723 is formed on the surface where the address electrode 722 is disposed so as to cover the whole. On the surface of the dielectric layer 723, a plurality of partition walls 724 protruding toward the front substrate 711 while being parallel to the address electrode 722 are provided. The partition wall 724 is disposed in an area between the neighboring address electrode 722 and the address electrode 722.

The phosphor layer 725 is disposed on the side surface of the groove portion formed of the neighboring partition wall 724, the partition wall 724, and the dielectric layer 723. In the phosphor layer 725, a red phosphor layer 725R, a green phosphor layer 725G, and a blue phosphor layer 725B are disposed in each of the groove portions partitioned by the partition wall 724. These phosphor layers 725 are layers made of a phosphor particle group formed by using a thick film forming method such as a screen printing method, an inkjet method, or a photoresist film method. As the material of the phosphor layer 725, for example, (Y, Gd) BO ₃ : Eu may be used as the red phosphor, Zn ₂ SiO ₄ : Mn as the green phosphor, and BaMgAl ₁₀ O ₁₇ : Eu as the blue phosphor. .

When the front substrate 711 and the rear substrate 721 having such a structure are disposed to face each other, the discharge gas is filled in the discharge cell 726 formed of the groove portion and the dielectric protective film 715. That is, in the panel assembly 630, the discharge cells 726 are formed at respective portions where the sustain electrode 712 and the address electrode 722 cross between the front substrate 711 and the rear substrate 721. As the discharge gas, for example, a Ne-Xe-based gas, a He-Xe-based gas, or the like can be used.

The panel assembly 630 having the above structure basically has a light emitting principle such as a fluorescent lamp, and ultraviolet rays emitted from the discharge gas according to the discharge inside the discharge cell 726 excite the phosphor layer 725 to emit visible light. Is converted.

However, phosphor materials having different conversion efficiencies to different visible light are used for the phosphor layers 725R, 725G, and 725B of the respective colors used for the panel assembly 630. Therefore, when displaying an image in the panel assembly 630, color balance is generally adjusted by adjusting the brightness of each phosphor layer 725R, 725G, 725B. Specifically, on the basis of the phosphor layer of the color having the lowest luminance, the luminance of the other phosphor layer is reduced at a ratio designated for each color.

The driving of the panel assembly 630 is largely divided into driving for address discharge and driving for sustain discharge. The address discharge occurs between the address electrode 722 and one sustain electrode 712, at which time a wall charge is formed. The sustain discharge is caused by the potential difference between the two sustain electrodes 712 positioned in the discharge cell 726 in which the wall charges are formed. During the sustain discharge, the phosphor layer 725 of the corresponding discharge cell 726 is excited by the ultraviolet rays generated from the discharge gas, and the visible light is emitted, and the visible light is emitted through the front substrate 711 to be recognized by the user. To form an image.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

According to the metal pattern forming method of the present invention, the electromagnetic shielding filter including the metal pattern and the display device including the electromagnetic shielding filter as described above has one or more of the following effects.

First, in the method of forming a metal pattern according to the present invention, it is possible to form a selective metal pattern through selective exposure of the photoreactive film layer, so that a subsequent etching process is unnecessary and a metal pattern can be formed by a simple process.

Secondly, in the method of forming the metal pattern according to the present invention, by controlling the lateral growth by the photoresist mold, it is possible to control the fine line width without expanding the line width of the metal pattern.

Third, the metal pattern forming method according to the present invention includes a functional dye for color correction on the photoreaction film layer and / or photoresist mold, to add an additional color correction film to the electromagnetic shielding filter comprising the metal pattern It does not need to be included, which reduces costs and simplifies the process.

Fourth, in the method of forming a metal pattern according to the present invention, when the photoresist mold including a functional dye is included, the photoresist mold must be peeled or removed and a transparent process must be performed between the metal patterns with a separate transparent resin or the like. This has the effect of simplifying the process.

Fifth, the electromagnetic shielding and display device including the metal pattern according to the present invention can be produced at a simpler process and lower cost while showing the same performance as the conventional electromagnetic shielding filter and display device.

Claims (11)

Providing a substrate having a photoreaction film layer formed thereon; Forming a photoresist mold for selectively exposing a metal pattern region on the photoreaction film layer; Selectively activating a photoreactive compound of the photoreactive film layer using the photoresist mold; And Forming a metal pattern on the activated photoreaction film layer; Metal pattern forming method comprising a. The method of claim 1, And a photoresist forming the photoresist mold when the photoreaction compound included in the photoreaction film layer is a negative type. The method of claim 1, And a photoresist forming the photoresist mold when the photoreaction compound included in the photoreaction film layer is a positive type. The method of claim 1, At least one of the photoreaction film layer and the photoresist mold includes a dye capable of color correction. The method of claim 1, Forming the metal pattern is a metal pattern forming method, characterized in that consisting of at least one method of electroless plating and electrolytic plating. The method of claim 5, When the forming of the metal pattern comprises an electroless plating method, forming an electroless plating nucleus pattern on the photoreaction film layer including a photoreaction compound exposed by the photoresist mold and selectively activated. Method of forming a metal pattern, characterized in that. The method of claim 1, After the forming of the metal pattern, the method of forming a metal pattern further comprising the step of peeling or removing the photoresist mold. Board; A photoreactive film layer formed on the substrate; A photoresist mold exposing the photoreaction film layer including the photoreaction compound selectively activated in the photoreaction film layer; And Electromagnetic shielding filter including a metal pattern to fill between the photoresist mold. The method of claim 8, Electromagnetic shielding filter, characterized in that it further comprises an electroless plating core pattern on the lower portion of the metal pattern. The method of claim 1, After the forming of the metal pattern, the method of forming a metal pattern further comprising the step of peeling or removing the photoresist mold. delete

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