KR100779083B1 - Plastic micro heating system, lap-on-a-chip using the same micro heating system, and method of fabricating the same micro heating system - Google Patents

Abstract

The present invention provides a micro heating system formed using a plastic structure having low heat mass and heat resistance and surface flatness that can use a semiconductor process, especially a photolithography process, a lab-on-a-chip using the micro heating system, and a micro heating system thereof. It provides a manufacturing method. The microheating system comprises a plastic structure having a plastic film and a chemical resistant and heat resistant thin film coated on the plastic film; And a heater unit having a fine electrode and a heater formed on the plastic structure. In the micro heating system of the present invention, by coating an inorganic and / or organic thin film on a plastic film, a micro electrode, a heater, a temperature sensor, and the like can be easily formed through a photolithography process.

Plastic film, plastic heating system, biochip, lab-on-a-chip

Description

Plastic micro heating system, lap-on-a-chip using the micro heating system, and manufacturing method of the micro heating system {Plastic micro heating system, lap-on-a-chip using the same micro heating system, and method of fabricating the same micro heating system}

1 is a cross-sectional view of a plastic structure used in the microheating system of the present invention.

2a to 2c are cross-sectional views of the micro heating system according to an embodiment of the present invention.

3a to 3d are photographs of how the micro heating system of the present invention is actually manufactured.

4A to 4F are cross-sectional views illustrating a method of manufacturing a micro heating system according to another embodiment of the present invention.

5A and 5B are cross-sectional views and perspective views of a microreaction system using a micro heating system according to a first embodiment of a lab-on-a-chip of the present invention.

6A and 6B are cross-sectional and perspective views of a microreaction system array according to a second embodiment of a lab-on-a-chip of the present invention.

7 is a cross-sectional view of a microreaction system using a micro heating system according to a third embodiment of a lab-on-a-chip of the present invention.

8 is a cross-sectional view of a microreaction system using a micro heating system according to a fourth embodiment of a lab-on-a-chip of the present invention.

9A and 9B are cross-sectional views and perspective views of a microreaction system using a micro heating system according to a fifth embodiment of a lab-on-a-chip of the present invention.

10 is a cross-sectional view of a microreaction system using a micro heating system according to a sixth embodiment of a lab-on-a-chip of the present invention.

11A and 11B are perspective views of a micro array using the plastic structure of the present invention.

<Description of main parts of drawing>

100: plastic structure 110: plastic film

120: inorganic thin film 130: organic thin film

200: heater 210, 220: fine electrode

230: Heater 240: Temperature sensor

250: electrical insulation film 255: contact groove

260: heat diffusion metal film 270: through hole

300: support substrate 320: adhesive material

400,400I, 400Ⅱ, 400III, 400a, 400b, 400c, 400d, 400e: Upper structure

410,410I: upper structure substrate 420,420I, 420II, 420III: reaction chamber

440, 440a, 440b: support substrate 460: top substrate

470: inlet valve 475: inlet

480: outlet valve 485: outlet

500: microarray seat 520: probe

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a micro electro-mechanical system (MEMS), and more particularly to a micro heating system capable of operating a photolithography process and having a low thermal mass and operating at low power during heating. The present invention relates to a lab-on-a-chip and a method of manufacturing the micro heating system.

In the field of microelectromechanical systems, in particular, medical disease diagnosis microdevices using biochips, also called Lap-On-a-Chip, have been greatly studied due to the advantages of miniaturization, low cost, and real-time diagnosis. It's going on.

To be used as a lab-on-a-chip, low power consumption and shorter analysis times for real-time diagnostics are required for portable batteries. To this end, it is necessary to design and fabricate a structure that is thermally isolated but has a low thermal mass.

For example, DNA lab-on-a-chip requires a lot of heating during DNA processing. Especially, DNA amplification and reaction control are mainly used in cell lysis and PCR (polymerase chain reaction). ), Or to heat the heat to about 40 ~ 100 ℃ in fluid transfer, etc. is required. Micro heating elements for this operation are mainly manufactured using silicon or glass. In particular, the micro heating devices are fabricated by applying a semiconductor process technology using silicon as a material, because the semiconductor process technology is realistically well established and a fine pattern can be formed.

However, if silicon is used, the performance can be excellent, but because the high-purity lab and the expensive equipment that can be used in the semiconductor process is used, the manufacturing cost is high, and it takes a lot of time, so there is a problem that it is used as a disposable medical diagnostic tool.

On the other hand, when using a glass substrate, since it is difficult to process a glass substrate, it is difficult to produce a heating thin film with a small thermal mass, and accordingly, power consumption is large and reaction rate is very slow, and a separate PID (proportional-integrate-) derivative) There is a problem to attach a controller.

Therefore, there is an urgent need for the development of other materials that have the same thermal properties as in silicon or glass, but are inexpensive in terms of cost and easy to process so that silicon and glass can be replaced.

Disposable is generally preferred for general-purpose medical diagnostics, and thus, recent research has been particularly focused on using plastics which are relatively inexpensive compared to materials such as silicon or glass.

Plastics are inexpensive, easy to process, and have very low thermal conductivity, resulting in low thermal interference between heating elements. However, plastics are poor at heat, and due to lack of compatibility with semiconductor process technology, difficulty in maintaining substrate flatness, and the lack of technology to fabricate structures with low thermal mass, microstructures using plastics are used as heaters or heating systems in medical lab-on-a-chips. Could not be used as

Due to the above limitations of plastics, plastics in lab-on-a-chip are currently being used mostly in the production of structures for fluid flow (microfluidics), that is, flow paths and chambers.

In order to use plastic as a heating system, heat resistance, surface flatness sufficient for photolithography, material selection capable of withstanding the demanding conditions of semiconductor processing, and microstructure processing technology with low thermal mass using the material are indispensable. Required.

Accordingly, a technical problem to be achieved by the present invention is a micro heating system formed using a plastic structure having low heat mass and heat resistance and surface flatness that can use a semiconductor process, especially a photolithography process, and a wrap-on using the micro heating system. The present invention provides a method for manufacturing a chip and its microheating system.

In order to achieve the above technical problem, the present invention provides a plastic structure comprising a plastic film and a thin film of chemical resistance and heat resistance coated on the plastic film; And a heater unit having a micro electrode and a heater formed on the plastic structure.

In the present invention, the plastic structure has a surface flatness of 0.1 ~ 50 nm, may have a thickness of 1 ~ 2000 ㎛. In addition, the heater unit may include a temperature sensor. The thin film may be at least one thin film of an inorganic thin film and an organic thin film, and preferably, an inorganic thin film may be coated on the upper surface of the plastic film and an organic thin film may be coated on the upper surface of the inorganic thin film and the lower surface of the plastic film.

Since the inorganic thin film and the organic thin film are resistant to the photolithography process, the photolithography process is possible at the top, and it is preferable to select an appropriate material as a lower layer of the thermal heating system because of high thermal insulation properties and low thermal mass.

The micro heating system may be used in a lap-on-a-chip, which may be any one of a micro reaction system, a microanalysis system, a drug delivery system, and a microfluidic control system. have.

The present invention also to achieve the above technical problem, the micro-heating system; It provides a wrap-on-a-chip using a micro-heating system comprising a; and an upper structure to form a lap-on-a-chip bonded to the micro-heating system.

In the present invention, the lab-on-a-chip may be any one of a micro reaction system, a microanalysis system, a drug delivery system, and a microfluidic control system. When the lab-on-a-chip is a microreaction system, the upper structure may be a reaction chamber and at least one substrate on which a micro channel connected to the reaction chamber is formed, and the microstructure that seals the reaction chamber over the upper structure. It may further comprise a heating system.

Furthermore, the present invention, in order to achieve the above technical problem, a plastic structure having a plastic film and a thin film of chemical and heat resistant coated on the plastic film; And a micro array (micro array) formed on the plastic structure provides a micro array comprising a.

In the present invention, the micro array site may be formed of a metal or formed by selectively modifying the surface of the microheating system. When the array site is formed by selective modification, a plasma surface treatment method may be used, and a probe may be selectively arranged on the modified array site.

On the other hand, the present invention, in order to achieve the above technical problem, a step of forming a plastic structure by coating a thin film of chemical and heat resistant organic or inorganic material on a plastic film; Securing the plastic structure to a support substrate; And forming a heater part including a fine electrode and a heater on the plastic structure.

In the present invention, the forming of the heater unit may include forming a conductive thin film on the plastic structure; And patterning the conductive thin film to form the fine electrode and the heater. The method may further include forming an electrical insulating film covering the microelectrode and the heater after the forming of the microelectrode and the heater, and after forming the electrical insulating layer, a part of the electrical insulating layer on the microelectrode is etched to form an electrode. It may also include forming a pad. Furthermore, after the electric insulating film forming step, the method may include forming a metal film for thermal diffusion on the insulating film above the heater, and may include forming a plurality of through holes outside the heater.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention; In the following description, when a component is described as being on top of another component, it may be directly on top of another component, and a third component may be interposed therebetween. In addition, in the drawings, the thickness or size of each component is exaggerated for convenience and clarity, and the same reference numerals in the drawings refer to the same element. On the other hand, the terms used are used only for the purpose of illustrating the present invention and are not used to limit the scope of the invention described in the meaning or claims.

1 is a cross-sectional view of a plastic structure used in the microheating system of the present invention.

Referring to FIG. 1, the plastic structure 100 is coated with an inorganic thin film 120 on a plastic substrate or an upper surface of the plastic film 110, and an organic thin film 130 on the lower surface of the plastic film 110 and the upper surface of the inorganic thin film 120. It is formed by coating.

Plastic film 110 is a cyclo olefin copolymer (COC), polymethylmethacrylate (PMMA), polycarbonate (PC), cyclo olefin polymer (COP), liquid crystalline polymers (LCP), polydimethylsiloxane (PDMS), polyamide (PA), PE (polyethylene) ), PI (polyimide), PP (polypropylene), PPE (polyphenylene ether), PS (polystyrene), POM (polyoxymethylene), PEEK (polyetheretherketone), PES (polyethylenephthalate), PET (polyethylenephthalate), PTFE (polytetrafluoroethylene), PVC ( It may be formed of various polymers including at least one of polyvinylchloride (PVDF), polyvinylidene fluoride (PVDF), polybutylene terephthalate (PBT), fluorinated ethylenepropylene (FEP), and perfluoralkoxyalkane (PFA).

In addition, the plastic film 110 may include injection molding, extrusion molding, hot embossing, casting, stereolithography, laser ablation, and rapid It can be produced using traditional machining methods such as Rapid Prototyping, Silkscreen, as well as Numerical Control (NC) machining.

The inorganic thin film 120 may be formed by spin or spray coating to a thickness of 1 to 100 μm using water glass, or the like, and may be formed of a plastic film through heat treatment between 50 and 300 ° C. The rough surface of 110 can be made very flat. The organic thin film 130 may also be formed by spin or spray coating to an thickness of 1 to 100 μm using an epoxy resin and the like, and may be chemically resistant to the plastic film 110 through heat treatment between 50 and 300 ° C. And heat resistance can be added.

As such, the plastic structure 100 coated with the inorganic and / or organic thin film may be formed to have a thickness of about 1 to 2000 μm as a whole, and may be formed to have a surface flatness of 0.1 to 50 nm to facilitate a photolithography process. can do.

The plastic structure 100 may be formed in a form in which the inorganic thin film 120 and the organic thin film 130 are coated together on the plastic film 110 as shown in FIG. 1, but sometimes only one inorganic thin film or the organic thin film is coated, Alternatively, the plastic film 110 may be formed in a form in which only one side of the plastic film 110 is coated. In addition, the plastic structure 100 may coat the inorganic thin film 120 and / or the organic thin film 130 after forming a thin conductive thin film on the plastic film 110. By forming such a thin conductive thin film, the uniformity of heating can be improved when the plastic structure 100 is used for a heating system.

The plastic structure 100 may be formed of a thin film of a liquid inorganic material or an organic material that is resistant to the chemicals used in the photolithography process while being heat resistant and / or chemically resistant to the plastic film 110 that is weak in a solvent. By coating and heat treatment, the photolithography process is possible, thermally insulated and low thermal mass can be used as the lower substrate of the microheating system.

The plastic structure 100 may be manufactured in the size of a wafer, and photolithography may be fixed to the top, so that a fine pattern having a line width of about 1 μm may be easily manufactured on a layer having a thickness of about 0.01 μm. In addition, by making the plastic structure 100 very thin as a whole, it is possible to significantly improve the thermal response characteristics due to the thermal mass while having thermal isolation. Accordingly, it can be easily used to produce a micro heating system with low power consumption and improved reaction speed.

2a to 2c are cross-sectional views of the micro heating system according to an embodiment of the present invention.

Referring to FIG. 2A, the micro heating system includes a heater unit 200 over the plastic structure 100 of FIG. 1, wherein the heater unit 200 includes micro electrodes 210 and 220 integrated onto the plastic structure 100. Each element, such as a heater 230 and a temperature sensor 240, and an electrical insulating layer 250 are disposed on each element. Meanwhile, a portion of the electrical insulating layer 250 on the electrodes 210 and 220 is etched to form contact grooves 255 for forming electrode pads. Each of the devices and the contact grooves 255 may be formed through a photolithography process due to the characteristics of the plastic structure 100.

The fine electrodes 210 and 220, the heater 230, and the temperature sensor 240 may be formed of a conductive material. For example, the fine electrodes 210 and 220, the heater 230, and the temperature sensor 240 may be formed of a metal, a conductive oxide film, or a conductive thick film including an adhesive enhancement layer. . The electrical insulating layer 250 may be formed of an insulating material, that is, an insulating metal oxide thin film, a plastic thin film, or an insulating thick film.

Referring to FIG. 2B, a heat spreading metal film 260 is formed on the heater 230 and the electrical insulating layer 250 on the temperature sensor 240. The heat spreading metal film 260 is a heating unit. That is, it may serve to prevent local heating that may occur in the heater 230 and the temperature sensor 240 and to improve thermal uniformity.

Referring to FIG. 2C, a plurality of through holes 270 may be formed in the micro heating system to thermally isolate the heater 230 and the temperature sensor 240, that is, the heater from the surroundings. The through hole 270 is preferably formed in an appropriate number in consideration of the material of the plastic structure 100 and the use of the micro heating system.

3a to 3d are photographs of how the micro heating system of the present invention is actually manufactured.

3A and 3B, it can be seen that a fine pattern, that is, a fine electrode, a heater, a temperature sensor, and the like are formed in the thin transparent plastic structure 100. These fine patterns are applied by the electric insulating film 250, so only the pattern of the electric insulating film 250 is shown in the photograph. The micro heating system in the photograph uses a plastic structure 100 coated with an inorganic thin film of about 30 μm and an organic thin film of about 2 μm on a plastic film having a thickness of about 50 μm.

3C shows a temperature sensor 240 having a gold micropattern having a 5 μm line width on the plastic structure 100 and a heater 230 having a line width of about 20 μm using a photolithography process. Giving. 3D is a photograph of a partial pattern different from that of FIG. 3C, and the heater 220 and the electrode 220 formed between the temperature sensor 240 and the heater 230 can be seen.

3C and 3D, it can be seen that a fine pattern of several μm may be sufficiently formed using a photolithography process even on a plastic substrate, that is, a plastic structure 100, not a silicon or glass substrate. Such a micro heating system can be formed in various thicknesses from 0.01 to 0.5 mm by adjusting the thickness of the plastic structure 100, and by forming a micro electrode array pattern, for the wrap-on-a-chip above one micro heating system. Many different superstructures can be formed.

4A to 4F are cross-sectional views illustrating a method of manufacturing a micro heating system according to a second embodiment of the present invention.

Referring to FIG. 4A, first, the inorganic and organic thin films 120 and 130 are coated on the plastic film 110 to form the plastic structure 100, as described with reference to FIG. 1. The plastic film 110 may be manufactured using various mechanical methods such as extrusion molding as described above, and the inorganic and organic thin films 120 and 130 may be selected through a spin coating method and a material having heat and chemical resistance characteristics. Form to an appropriate thickness.

Referring to FIG. 4B, since the plastic structure 100 is formed of a highly flexible plastic material, the plastic structure 100 is adhered to a rigid support substrate 300 such as a silicon or glass wafer for the subsequent photolithography process. (320) and the like to fix. The adhesive material 320 is preferably selected an adhesive material that is easy to control the detachment.

Referring to FIG. 4C, a conductive thin film is deposited on the plastic structure 100, and a heating unit 200 having a conductive thin film pattern is formed through a pattern and an etching through a photolithography process. The conductive thin film patterns formed here may be the fine electrodes 210 and 220, the heater 230, and the temperature sensor 240, respectively. The conductive thin film may be formed of a conductive thick film including a metal, a conductive oxide film, and an adhesive layer.

Referring to FIG. 4D, an electrical insulating layer 250 is deposited on the conductive thin film pattern. The electrical insulating layer 250 is formed to block the external air layer of the conductive thin film pattern or to electrically insulate between adjacent patterns. The electrical insulating layer 250 may be formed of an insulating metal oxide thin film, a plastic thin film, an insulating thick film, or the like.

Referring to FIG. 4E, a portion of the electrical insulating layer 250 on the fine electrodes 210 and 220 of the conductive thin film pattern is etched to form a contact groove 255 for forming an electrode pad. An electrode pad may be formed through the contact groove 255 to form a contact wiring to the outside.

Referring to FIG. 4F, a plurality of through holes 270 are formed around the heater 230 and the temperature sensor 240 forming the heating part of the conductive thin film pattern. The through hole 270 is formed to thermally block the heating unit from the surroundings. Therefore, if the thermal shield can be easily spherical, it can of course be omitted. As described above, the through holes are preferably formed in an appropriate number in consideration of the material of the plastic structure 100 and the use of the micro heating system.

 5A and 5B are cross-sectional views and perspective views of a microreaction system using a micro heating system according to a first embodiment of a lab-on-a-chip of the present invention.

Referring to FIG. 5A, the microreaction system includes an upper structure 400 for the microreaction system on top of a micro heating system (hereinafter referred to as a 'lower structure') formed of the plastic structure 100 and the heater portion 200. . The upper structure 400 is formed by bonding the upper structure substrate 410 on which the reaction chamber 420 is formed to the lower structure.

The upper structure 400 is bonded to the top of the microheating system through the adhesive material 320. The adhesive material may be not only a liquid adhesive material but also a thin plate-like adhesive material such as powder or paper. In particular, in order to prevent denaturation of biochemicals during bonding, a pressure-sensitive adhesive is used in which bonding is performed only by pressure. In addition, for bonding, an ultrasonic bonding method for locally melting and bonding a substrate using ultrasonic energy or a thermal bonding method for locally melting and bonding a substrate using heat may be used.

One of the considerations for joining the lower and upper structures 400 is that the injected solution flows out through the tiny gaps or voids without exiting or through the already formed microchannel. It is important to ensure that the seal is completely sealed around the flow path and the reaction chamber.

In addition to the above, the joining method may be performed by forcibly fastening the lower and upper structures by using an additional structure in the form of a clip, or by making an embossed groove in one of the lower and upper structures and making a recess in the other. The two substrates can be joined by the method. As described above, in the case of bonding using a clip or a groove, an elastic polymer layer may be padded on the contact surface so that a minute gap does not occur.

Referring to FIG. 5B, the reaction chamber 420 is opened by cutting a portion of the upper structure of the microreaction system, and the micro electrodes 210 and 220, the heater 230, and the temperature are disposed on the plastic structure 100. The heater unit in which the sensor 240 is formed is formed, and the upper structure substrate 410 in which a predetermined space, that is, the reaction chamber 420 is formed, is bonded to the upper portion of the heater unit through the adhesive material 320. In fact, the heater 230, the temperature sensor 240, and the like of the heater portion are in a state of being coated by the electric insulating film 250. The fine electrodes 210 and 220 are also coated with the electrical insulating layer 250, but are represented in an exposed form in consideration of contact grooves in FIG. 5A.

A flow path 430 is formed in the upper structure substrate 410 to connect with the reaction chamber 420, and the inlet 432 of the flow path is seen above the upper structure substrate 410. The shape of the flow path 430 is just one example, and of course, it can be appropriately formed according to various shapes of the lab-on-a-chip. The material to be heated or analyzed is injected into the reaction chamber 420 through the flow path 430, and an experiment such as heating is performed using a micro heating system.

6A and 6B are cross-sectional and perspective views of a microreaction system array according to a second embodiment of a lab-on-a-chip of the present invention.

Referring to FIG. 6A, it can be seen that the microreaction system of FIG. 5A may be formed in one microheating system. That is, the micro heating system may form an array of conductive thin film patterns having the same pattern through a photolithography process, and then join each of the upper structures required thereon to form a microreaction system array. In the case of Figure 6b, a perspective view for showing the inside of the reaction chamber of the microheating system of Figure 6a in more detail, a portion of the reaction chamber is represented in an open form.

In the present embodiment, three upper structures 400I, 400II, and 400III are formed, but of course, it can be formed above or below. In addition, although each of the upper structures 400I, 400II, and 400III is formed in the same upper structure substrates 410I, 410II, and 410III having respective reaction chambers 420I, 420II, and 420III, other types of upper structures may be formed. Of course it can.

7 is a cross-sectional view of a microreaction system using a micro heating system according to a third embodiment of a lab-on-a-chip of the present invention.

Referring to FIG. 7, two microreaction systems of FIG. 5A face each other through the upper structure 400b and are bonded to each other through the adhesive material 320. The upper structure 400b is formed of a support substrate 440 which is joined to the microreaction system up and down to seal the reaction chamber 420 and to support the microreaction system as a whole. A flow path (not shown) may be formed in the support substrate 440.

The microreaction system of the same type as this embodiment may also be manufactured in the form of a microreaction system array by forming a conductive pattern array in a single micro heating system.

8 is a cross-sectional view of a microreaction system using a micro heating system according to a fourth embodiment of a lab-on-a-chip of the present invention.

Referring to FIG. 8, a microreaction system is shown in which a microheating system is used as a platform and a superstructure 400c or a reaction vessel for reaction may be placed thereon. Thus, unlike the other embodiment, the upper structure 400c is formed in a form that is detachable rather than bonded to a micro heating system.

The microreaction system of this embodiment may also be manufactured in an array form to manufacture a microreaction system array.

9A and 9B are cross-sectional views and perspective views of a microreaction system using a micro heating system according to a fifth embodiment of a lab-on-a-chip of the present invention.

Referring to FIG. 9A, an upper or lower structure 400d is formed below the microheating system. The upper structure 400d separates the reaction chamber of the upper structure 400b of FIG. 7 from another microheating system, rather than sealing the reaction chamber. It is formed of a structure that is sealed through the upper substrate 460. This type of microreaction system can be used primarily as a micro biochemical reactor. In the case of Figure 9b, a perspective view for showing the inside of the reaction chamber of the microheating system of Figure 9a in more detail, a portion of the reaction chamber is shown in an open form.

The microreaction system of this embodiment can also be manufactured in an array form.

10 is a cross-sectional view of a microreaction system using a micro heating system according to a sixth embodiment of a lab-on-a-chip of the present invention.

Referring to FIG. 10, the microreaction system includes an upper structure 400e above the micro heating system, wherein the upper structure 400e includes a lower support substrate 440a on which the reaction chamber 420 is formed and a support substrate for controlling the flow path. 440b. Inlet and outlet valves 470 and 480 are formed in the lower support substrate 440a to control the flow path. The inlet and outlet valves 470 and 480 are the inlet and outlet 475 and the outlet 485 of the flow path formed in the support substrate 440b. It is formed into a structure connected to each.

The microreaction system of this embodiment is mainly used as a low-cost and portable micropump controlling microfluidics. This type of structure may also be manufactured in an array form.

Although various embodiments of the microreaction system have been described so far, the microheating system may be used in a lab-on-a-chip in various fields such as a microreaction system, a microanalysis system, a drug delivery system, and a microfluidic control system. In addition, each system may be formed in a system array structure instead of a single structure.

11A and 11B are perspective views of a micro array using the plastic structure of the present invention.

Referring to FIG. 11A, the microarray is formed on the surface of the plastic structure 100 of FIG. 1 in a micro patterned surface or microarray site 500 so as to know the interaction between thousands of genes or proteins at the same time. The array site 500 is formed through hydrophilicity control through surface modification or additionally by coating a metal electrode.

Microarray has been applied to gene expression, disease diagnosis, new drug development, toxic substance reaction, etc. Previously, glass substrates and silicon substrates were mainly used to form micro patterns, but had a disadvantage of being expensive. However, the micro array of the present embodiment has an advantage that the array site 500 can be easily manufactured even at low cost by using the plastic structure 100 capable of the photolithography process.

The array site 500 may be manufactured in a form having micro electrodes on the order of several micrometers using a photolithography process, and a material such as gold or platinum may be used as the material of the array site 500. Meanwhile, instead of the metal, the surface modified array site 500 may be formed by selectively performing surface treatment on the plastic structure only by photolithography and plasma surface treatment to control hydrophilicity and hydrophobicity. Surface modified array sites 500 have the advantage of selectively arranging probes.

Referring to FIG. 11B, the microelectrode array site 500 fabricated in FIG. 11A shows probes 520 formed of biomolecules such as DNA or protein. Although the illustrated probes 520 are exaggeratedly expressed for easy understanding, they are formed of a finer and more sophisticated structure.

The invention can also be embodied as computer readable code on a computer readable recording medium. The computer-readable recording medium includes all kinds of recording devices in which data that can be read by a computer system is stored. Examples of computer-readable recording media include ROM, RAM, CD_ROM, magnetic tape, floppy disks, and optical data storage, and may also include those implemented in the form of carrier waves (e.g., transmission over the Internet). . The computer readable recording medium can also be distributed over network coupled computer systems so that the computer readable code is stored and executed in a distributed fashion.

So far, the present invention has been described with reference to the embodiments shown in the drawings, which are merely exemplary, and those skilled in the art may understand that various modifications and equivalent other embodiments are possible. will be. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

As described in detail above, in the micro heating system of the present invention, by coating an inorganic and / or organic thin film on a plastic film, a micro electrode, a heater, a temperature sensor, etc. may be easily formed through a photolithography process.

In addition, by appropriately selecting the material of the inorganic and / or organic thin film of the plastic structure to increase the thermal insulation and lower the thermal mass, PCR chip, protein chip, DNA chip, drug delivery system (Drug Delivery System), microbiological / chemical reactor ( It can be easily used for low power consumption and accurate temperature control of various Lab-on-a-chip bio devices such as Micro Biological / Chemical Reactor and micro array.

Claims (32)

A plastic structure having a plastic film and a chemical resistant and heat resistant thin film coated on the plastic film; And And a heater having a heater and a micro electrode formed on the plastic structure. According to claim 1, The plastic structure has a surface flatness of 0.1 ~ 50 nm, plastic micro heating system, characterized in that having a thickness of 1 ~ 2000 ㎛. According to claim 1, The heater micro plastic heating system, characterized in that it comprises a temperature sensor. According to claim 1, The thin film is a plastic micro heating system, characterized in that at least one thin film of the inorganic thin film and the organic thin film. According to claim 1, A plastic micro heating system further comprising a conductive thin film between the plastic film and the thin film. According to claim 1, Wherein the thin film is an inorganic thin film coated with the upper surface of the plastic film and an organic thin film coated with the upper surface of the inorganic thin film and the lower surface of the plastic film. The method of claim 6, The organic thin film is formed in a thickness of 1 ~ 100 ㎛, the inorganic thin film is a plastic micro heating system, characterized in that formed in a thickness of 1 ~ 100 ㎛. The method of claim 6, The organic thin film is formed of epoxy, The inorganic thin film is a plastic micro heating system, characterized in that formed of water glass (water glass). The method of claim 6, The organic thin film and the inorganic thin film are resistant to a photolithography process, Plastic microheating system, characterized in that it has thermal insulation properties. The method of claim 6, The organic thin film and the inorganic thin film is a plastic microheating system, characterized in that formed by spin (spray) coating or spray (spray) coating method. The method of claim 10, And the organic thin film and the inorganic thin film are heat treated so that the plastic structure has a flattened surface. According to claim 1, And said heater portion comprises an electrical insulating film covering said microelectrode and said heater. The method of claim 12, The electrical insulating film is a plastic micro heating system, characterized in that any one of an insulating metal oxide thin film, a plastic thin film and an insulating thick film. The method of claim 12, And a part of the insulating film on the microelectrode is etched to form an electrode pad connected to the microelectrode. The method of claim 12, And a metal film for thermal diffusion is formed on the insulating film above the heater. According to claim 1, The plastic structure is a plastic micro heating system, characterized in that a plurality of holes are formed outside the heater. According to claim 1, The micro heating system is a plastic micro heating system, characterized in that used in the lap-on-a-chip (lap-on-a-chip). The micro heating system of claim 1; And And a superstructure forming a lap-on-a-chip bonded to the micro heating system. The method of claim 18, The lab-on-a-chip is a microreaction system, The upper structure is a wrap-on-a-chip using a micro heating system, characterized in that the reaction chamber and at least one substrate formed with a microchannel connected to the reaction chamber. The method of claim 19, Lap-on-a-chip using the micro-heating system is characterized in that the micro-heating system is further bonded to the upper structure to seal the reaction chamber. A plastic structure having a plastic film and a chemical resistant and heat resistant thin film coated on the plastic film; And And micro array formed on the plastic structure. The method of claim 21, Wherein said microarray site is formed of a metal or formed by selectively modifying the surface of said microheating system. The method of claim 22, The selective modification is made through a plasma surface treatment method, And a probe may be selectively arranged in place of the modified array. The method of claim 23, wherein The probe is a micro array, characterized in that the biomolecule of DNA or protein. Coating a thin film of chemical and heat resistant organic or inorganic material on a plastic film to form a plastic structure; Securing the plastic structure to a support substrate; And Forming a heater unit comprising a micro electrode, a heater on the plastic structure; manufacturing method of a plastic micro heating system comprising a. The method of claim 25, The heater unit is a manufacturing method of a plastic micro heating system, characterized in that formed through a photolithography (photolithography) process. The method of claim 25, The forming of the heater unit may include forming a conductive thin film on the plastic structure; And And patterning the conductive thin film to form the microelectrode and the heater. The method of claim 27, The conductive thin film is a method of manufacturing a plastic micro heating system, characterized in that any one of a conductive thick film comprising a metal, a conductive oxide film and an adhesive layer (glue layer). The method of claim 27, The forming of the heater part may include forming an electrical insulating film covering the micro electrode and the heater after the forming of the micro electrode and the heater. The method of claim 29, The forming of the heater unit may include forming an electrode pad by etching a portion of the electrical insulating layer on the microelectrode. The method of claim 29, The forming of the heater unit may include forming a metal film for thermal diffusion on the insulating film above the heater. The method of claim 29, The forming of the heater unit may include forming a plurality of through holes outside the heater.

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