KR100759106B1 - 초미세 전기기계 시스템 미러에서 미러 판을 정전 구동부와 결합하는 방법 - Google Patents
초미세 전기기계 시스템 미러에서 미러 판을 정전 구동부와 결합하는 방법 Download PDFInfo
- Publication number
- KR100759106B1 KR100759106B1 KR1020070015157A KR20070015157A KR100759106B1 KR 100759106 B1 KR100759106 B1 KR 100759106B1 KR 1020070015157 A KR1020070015157 A KR 1020070015157A KR 20070015157 A KR20070015157 A KR 20070015157A KR 100759106 B1 KR100759106 B1 KR 100759106B1
- Authority
- KR
- South Korea
- Prior art keywords
- mirror
- mirror plate
- area
- driving unit
- bonding
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
- B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
- G02B6/3568—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
- G02B6/357—Electrostatic force
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
Abstract
Description
Claims (2)
- 미러 판(mirror plate), 상기 미러 판을 정전력(electrostatic force)으로 구동하는 구동부, 및 기판을 차례대로 포함하는 초미세 전기기계 시스템(Micro-Electro-Mechanical Systems; MEMS) 미러에서, 상기 미러 판을 상기 구동부와 결합(bonding)하는 방법으로서,상기 구동부의 에칭 과정에서, 상기 구동부가 상기 기판과 닿을 수 있도록, 상기 미러의 중심부에 제1 면적의 지지 포스트(supporting post)를 남겨두는 단계;상기 미러 판의 바닥 면에 상기 제1 면적보다 더 넓은 제2 면적의 받침대(pedestal)를 패터닝하는 단계;상기 받침대를 이용하여 상기 미러 판을 상기 구동부에 결합하는 단계; 및상기 지지 포스트를 제거할 수 있도록, 상기 제1 면적보다는 넓고, 상기 제2 면적보다는 좁은 제3 면적으로 에칭하는 단계를 포함하는 방법.
- 제1항에 있어서,상기 결합 단계에서 사용될 수 있는 결합 방법에, 양극 결합(anodic bonding), 실리콘 대 실리콘 직접 퓨전 결합(silicon to silicon direct fusion bonding), 공융 결합(eutectic bonding), 폴리머 부착 결합(polymer adhesive bonding)이 포함되는 방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070015157A KR100759106B1 (ko) | 2007-02-14 | 2007-02-14 | 초미세 전기기계 시스템 미러에서 미러 판을 정전 구동부와 결합하는 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020070015157A KR100759106B1 (ko) | 2007-02-14 | 2007-02-14 | 초미세 전기기계 시스템 미러에서 미러 판을 정전 구동부와 결합하는 방법 |
Publications (1)
Publication Number | Publication Date |
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KR100759106B1 true KR100759106B1 (ko) | 2007-09-19 |
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Family Applications (1)
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KR1020070015157A KR100759106B1 (ko) | 2007-02-14 | 2007-02-14 | 초미세 전기기계 시스템 미러에서 미러 판을 정전 구동부와 결합하는 방법 |
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KR (1) | KR100759106B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101955151A (zh) * | 2010-09-26 | 2011-01-26 | 中国科学院上海微系统与信息技术研究所 | 基于硅塑性变形原理的二维梳齿静电驱动器及制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000072121A (ko) * | 2000-08-01 | 2000-12-05 | 김홍년 | 도메인네임서버 구축체계 및 그 운영방법 |
KR20000072123A (ko) * | 2000-08-01 | 2000-12-05 | 최두 | 웹 브라우저의 도메인 네임 주소란에 이-메일 주소 적어링크시키기 |
KR20050085010A (ko) * | 2002-11-15 | 2005-08-29 | 글락소 그룹 리미티드 | 백신 |
-
2007
- 2007-02-14 KR KR1020070015157A patent/KR100759106B1/ko not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000072121A (ko) * | 2000-08-01 | 2000-12-05 | 김홍년 | 도메인네임서버 구축체계 및 그 운영방법 |
KR20000072123A (ko) * | 2000-08-01 | 2000-12-05 | 최두 | 웹 브라우저의 도메인 네임 주소란에 이-메일 주소 적어링크시키기 |
KR20050085010A (ko) * | 2002-11-15 | 2005-08-29 | 글락소 그룹 리미티드 | 백신 |
Non-Patent Citations (5)
Title |
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1020000072121 |
1020000072123 |
1020007007743 |
1020037010996 |
1020050085010 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101955151A (zh) * | 2010-09-26 | 2011-01-26 | 中国科学院上海微系统与信息技术研究所 | 基于硅塑性变形原理的二维梳齿静电驱动器及制作方法 |
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