KR100727048B1 - 공정 제어 시스템 - Google Patents

공정 제어 시스템 Download PDF

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Publication number
KR100727048B1
KR100727048B1 KR1020027008702A KR20027008702A KR100727048B1 KR 100727048 B1 KR100727048 B1 KR 100727048B1 KR 1020027008702 A KR1020027008702 A KR 1020027008702A KR 20027008702 A KR20027008702 A KR 20027008702A KR 100727048 B1 KR100727048 B1 KR 100727048B1
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South Korea
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state data
data
equipment state
wafer
semiconductor device
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English (en)
Korean (ko)
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KR20020063295A (ko
Inventor
밀러마이클엘.
손더맨토마스제이.
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어드밴스드 마이크로 디바이시즈, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • General Factory Administration (AREA)
KR1020027008702A 2000-01-04 2000-11-21 공정 제어 시스템 Expired - Fee Related KR100727048B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/477,465 2000-01-04
US09/477,465 US6449524B1 (en) 2000-01-04 2000-01-04 Method and apparatus for using equipment state data for run-to-run control of manufacturing tools

Publications (2)

Publication Number Publication Date
KR20020063295A KR20020063295A (ko) 2002-08-01
KR100727048B1 true KR100727048B1 (ko) 2007-06-12

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KR1020027008702A Expired - Fee Related KR100727048B1 (ko) 2000-01-04 2000-11-21 공정 제어 시스템

Country Status (5)

Country Link
US (1) US6449524B1 (enExample)
EP (1) EP1245043A1 (enExample)
JP (1) JP2003519921A (enExample)
KR (1) KR100727048B1 (enExample)
WO (1) WO2001050521A1 (enExample)

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US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
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US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7201936B2 (en) 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US7047099B2 (en) 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US6910947B2 (en) 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US7337019B2 (en) * 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6950716B2 (en) * 2001-08-13 2005-09-27 Applied Materials, Inc. Dynamic control of wafer processing paths in semiconductor manufacturing processes
US6984198B2 (en) * 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
US20030037090A1 (en) * 2001-08-14 2003-02-20 Koh Horne L. Tool services layer for providing tool service functions in conjunction with tool functions
US7225047B2 (en) 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US6922595B1 (en) * 2002-04-29 2005-07-26 Advanced Micro Devices, Inc. Selecting control algorithms based on business rules
US6799311B1 (en) * 2002-06-27 2004-09-28 Advanced Micro Devices, Inc. Batch/lot organization based on quality characteristics
US6999836B2 (en) 2002-08-01 2006-02-14 Applied Materials, Inc. Method, system, and medium for handling misrepresentative metrology data within an advanced process control system
AU2003290932A1 (en) 2002-11-15 2004-06-15 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US6917849B1 (en) * 2002-12-18 2005-07-12 Advanced Micro Devices, Inc. Method and apparatus for predicting electrical parameters using measured and predicted fabrication parameters
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US7684887B2 (en) * 2003-04-30 2010-03-23 Infineon Technologies Ag Advanced process control method and advanced process control system for acquiring production data in a chip production installation
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US20050010317A1 (en) * 2003-07-11 2005-01-13 Ron Hadar Method and apparatus for automated bi-directional integration of peripheral data sources for a production tool
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
JP4568216B2 (ja) * 2003-09-08 2010-10-27 株式会社東芝 半導体装置の製造システム
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US20050209818A1 (en) * 2004-03-17 2005-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for predicting a parameter for a lithography overlay first lot
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) * 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
KR100590603B1 (ko) * 2004-09-24 2006-06-19 에임시스템 주식회사 반도체 제조 설비의 비정형 데이터 수집 시스템 및 방법과그 방법을 실현시키기 위한 프로그램을 기록한 컴퓨터로읽을 수 있는 기록매체
US7535688B2 (en) * 2005-03-25 2009-05-19 Tokyo Electron Limited Method for electrically discharging substrate, substrate processing apparatus and program
US7117059B1 (en) * 2005-04-18 2006-10-03 Promos Technologies Inc. Run-to-run control system and operating method of the same
US7236848B2 (en) * 2005-09-12 2007-06-26 Advanced Micro Devices, Inc. Data representation relating to a non-sampled workpiece
US20080125883A1 (en) * 2006-09-11 2008-05-29 Christopher Gould Method and apparatus for consolidating process control
US8606379B2 (en) 2008-09-29 2013-12-10 Fisher-Rosemount Systems, Inc. Method of generating a product recipe for execution in batch processing
US9768082B2 (en) * 2009-02-13 2017-09-19 Hermes Microvision Inc. Method and machine for examining wafers
US20100211202A1 (en) * 2009-02-13 2010-08-19 Hermes Microvision, Inc. Method and machine for examining wafers
US8406911B2 (en) 2010-07-16 2013-03-26 HGST Netherlands B.V. Implementing sequential segmented interleaving algorithm for enhanced process control
US9523976B1 (en) * 2012-11-15 2016-12-20 Cypress Semiconductor Corporation Method and system for processing a semiconductor wafer using data associated with previously processed wafers
US11054815B2 (en) * 2016-03-11 2021-07-06 Applied Materials, Inc. Apparatus for cost-effective conversion of unsupervised fault detection (FD) system to supervised FD system
EP3938853A4 (en) * 2019-03-15 2022-12-28 3M Innovative Properties Company POLISHING SEMICONDUCTOR WAFER USING CAUSALITY MODELS

Citations (4)

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US5546312A (en) * 1993-09-20 1996-08-13 Texas Instruments Incorporated Use of spatial models for simultaneous control of various non-uniformity metrics
KR19980026111A (ko) * 1996-10-07 1998-07-15 김광호 반도체 제조를 위한 통계적 공정관리 방법
KR19980702034A (ko) * 1995-02-09 1998-07-15 마이클 엘. 린치 폴리우레탄 패드의 처리 특성을 예측하는 방법 및 장치
KR0174993B1 (ko) * 1996-02-23 1999-04-01 김광호 반도체 설비의 통계적 공정관리 시스템 및 그 방법

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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5546312A (en) * 1993-09-20 1996-08-13 Texas Instruments Incorporated Use of spatial models for simultaneous control of various non-uniformity metrics
KR19980702034A (ko) * 1995-02-09 1998-07-15 마이클 엘. 린치 폴리우레탄 패드의 처리 특성을 예측하는 방법 및 장치
KR0174993B1 (ko) * 1996-02-23 1999-04-01 김광호 반도체 설비의 통계적 공정관리 시스템 및 그 방법
KR19980026111A (ko) * 1996-10-07 1998-07-15 김광호 반도체 제조를 위한 통계적 공정관리 방법

Also Published As

Publication number Publication date
WO2001050521A1 (en) 2001-07-12
KR20020063295A (ko) 2002-08-01
JP2003519921A (ja) 2003-06-24
EP1245043A1 (en) 2002-10-02
US6449524B1 (en) 2002-09-10

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