KR100719699B1 - Plasma display apparatus - Google Patents

Abstract

In the plasma display device of the present invention, a conductive thin film is formed on the front surface of the chassis base, one end of the conductive boss coupled to the chassis base is electrically connected to the thin film, and the other end of the boss is electrically connected to the circuit part. The thin film and the circuit portion is characterized in that it is electrically connected.

Therefore, firstly, by using the plastic chassis base, the material cost and molding cost are reduced, the process is simple, the weight and noise of the module can be reduced, and second, the front surface of the plastic chassis base, etc. By placing the conductive thin film and electrically connecting the thin film and the circuit part using the boss and the fastening member, it is possible to improve the stability of the PDP module by securing the ground of the circuit part. Third, the chassis base dissipates heat emitted from the panel and the circuit part. Heat can be radiated through a conductive thin film located in the front of the film.

Description

Plasma display device {PLASMA DISPLAY APPARATUS}

1 is a schematic exploded perspective view of a PDP according to an embodiment of the present invention;

2 is a schematic view showing an electrical connection between the conductive thin film formed on the front surface of the chassis base and the circuit unit according to an embodiment of the present invention;

3 is a schematic view showing a state in which a thin film is formed by spraying a front surface of a chassis base according to an embodiment of the present invention;

4 is a schematic diagram illustrating an electrical connection method between a conductive thin film formed on a rear surface of a chassis base and a circuit unit according to another exemplary embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100: PDP 103: panel

106: heat conductive sheet 108: adhesive member

109: chassis base 109b: reinforcement

110: circuit portion 120: protective plate

140: conductive thin film 150: boss

160: first fastening member 162: head

164: screw 170: second fastening member

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device. More particularly, the present invention relates to a plasma display device in which a conductive thin film for securing grounding of a circuit part is formed on a front surface of a chassis base made of plastic, and an electrical connection between the thin film and the circuit part is formed. It is about.

Recently, many flat display devices (CRTs) have been developed to replace Cathode Ray Tubes (CRTs). Representative examples of such flat panel display devices include liquid crystal display devices (LCDs), electro-luminescence display devices (ELDs), field emission display devices (FEDs), and plasmas. And a display panel (PDP; Plasma Display Panel).

Among such flat panel display apparatuses, the PDP displays an image by plasma discharge, which has the advantages of enabling complete digital implementation and relatively large screen implementation compared to other flat panel display apparatuses.

Such a PDP is composed of a filter assembly, a panel, a heat conductive sheet, a chassis base, a circuit part, a connection member, a protective plate, and various additional devices housed inside the front / rear case.

The chassis base serves to support a panel displaying an image located on the front surface thereof and to fix a circuit portion for driving the panel on the back surface thereof. Such a chassis base serves as the above-mentioned support material, and at the same time, heat dissipates heat generated from the panel and the circuit portion to the outside, and is made of aluminum, which is usually a metal material, for grounding of the circuit portion. Recently, as the PDP becomes thinner, the thickness of the chassis base is required to be thinner. However, when the thickness of the chassis base becomes thinner, the function of supporting the panel becomes weaker. Therefore, in order to prevent the twisting or bending of the chassis base, which may occur as the thickness of the chassis base becomes thin, a reinforcement is installed on the rear surface of the chassis base to reinforce the strength of the chassis base.

On the other hand, recently, due to the development of circuit and panel design, the power consumption of the PDP module is reduced and the amount of electro magnetic interference (EMI) and heat generation are decreasing. Efforts to replace the chassis base are ongoing. In addition to the material cost advantages, the plastic chassis base has the advantage of low cost, simple process, and reduced weight and noise of the module by injection molding.

However, in order to completely replace the chassis base made of aluminum that the plastic chassis base that solves the problem of support and heat dissipation to some extent, a method for securing the ground of the circuit part should also be considered.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to form a conductive thin film for securing a ground of a circuit portion on a front surface of a chassis base made of plastic material, and to configure an electrical connection between the thin film and the circuit portion. .

Plasma display device according to the present invention to achieve this object,

A plasma display device comprising a panel for displaying an image, a chassis base made of a plastic material supporting the panel on the back side of the panel, and a circuit portion fixed to the back side of the chassis base to drive the panel. A conductive thin film is formed on the front surface, one end of the conductive boss coupled to the chassis base is electrically connected to the thin film, and the other end of the boss is electrically connected to the circuit portion, and the thin film and the circuit portion are electrically connected. .

In this case, the thin film may be formed using a metal plating method, a coating method or a deposition method.

When the boss penetrates the chassis base, the thin film may be formed to contact the one end of the boss. Alternatively, the thin film may be electrically connected to the one end of the boss by the conductive first fastening member.

In addition, the circuit portion may be electrically connected to the other end of the boss by a conductive second fastening member.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic exploded perspective view of a PDP according to an embodiment of the present invention.

Referring to the drawings, the plasma display apparatus 100 includes a panel 103, a thermal conductive sheet 106, an adhesive member 108, a conductive thin film 140, a chassis base 109, a circuit unit 110, and a protective plate 120. ), And a connecting member 130.

The panel 103 displays an image by the discharge generated by the drive signal provided from the circuit formed in the circuit section 110. To this end, the panel 103 forms partitions, electrodes, phosphors, dielectrics, and protective films between the two substrates 103a and 103b to form a space in which discharge occurs, that is, a discharge cell. The discharge cell is also filled with an inert gas that emits ultraviolet rays in the wavelength band that excite the phosphor during discharge. The panel 103 is connected to the circuit unit 110 by a flexible printed circuit (FPC) or a chip carrier film (TCP) in which some driving chips are mounted. In addition, accessory members such as an adhesive member 108 and a thermally conductive sheet 106 may be attached to the rear surface of the panel 103.

The thermally conductive sheet 106 is inserted between the panel 103 and the chassis base 109 to transfer heat generated from the panel 103 when the PDP is driven to the chassis base 109 or to dissipate heat to heat the panel 103. To prevent it from rising sharply. In addition, the thermally conductive sheet 106 evens the temperature distribution of the non-uniform panel 103, thereby preventing the panel 103 from being broken or malfunctioned due to local temperature differences. The heat conducting sheet 106 is preferably different from the attachment method and the role depending on the material of the chassis base 109 for the normal operation of the PDP. As in the present invention, when the material of the chassis base 109 is a plastic material and the heat conduction characteristics and the heat dissipation characteristics are not good, the heat conduction sheet 106 and the chassis base 109 are provided at a predetermined interval.

The adhesive member 108 fixes the panel 103 to the chassis base 109. To this end, the adhesive member 108 is formed in the form of a strip or frame in the edge portion of the thermal conductive sheet 106, as shown in Figure 1, thereby fixing the panel 103 to the chassis base (109). As the adhesive member 108, it is possible to use an adhesive, an adhesive sheet and an adhesive tape. The adhesive member 108 may vary the thickness and shape of the attachment method and the adhesive member 108 according to the characteristics of the chassis base 109. As in the present invention, when using the chassis base of the plastic material is not good thermal conductivity and heat dissipation characteristics, it is preferable to leave a gap between the adhesive member (108). The reason why the adhesive members 108 are spaced apart at predetermined intervals is to facilitate heat dissipation of the heat conductive sheet 106 by allowing air to flow through the space between the adhesive members 108. In addition, it is preferable that the thickness of the adhesive member 108 is thickened to form a gap through which air can be distributed for heat dissipation of the thermal conductive sheet 106.

The chassis base 109 fixes the panel 103 by the adhesive member 108, and also supports and fixes the circuit unit 110 by a fastening member 170 such as a boss 150 and a screw. In the present invention, the chassis base 109 of a plastic material is used, and thus the ground securing means of the circuit unit 110 is problematic, which will be described later.

The circuit unit 110 is divided into several pieces of substrates for driving the PDP. That is, the circuit unit 110 includes a power supply unit, a logic circuit unit, an address circuit unit, a scan circuit unit, a sustain circuit unit, and driving buffer boards. The power supply unit supplies power to the driving circuit and the panel and is equipped with an AC / DC converter that converts an external AC voltage into a DC voltage. The logic circuit unit receives the image signal, separates and controls the signal to be sent to the address circuit unit, the scan circuit unit, and the sustain circuit unit, and automatically adjusts the power. Each circuit unit receives a signal from a logic circuit and transmits the signal to each driving chip, and each driving chip distributes a logic circuit command to each electrode. The driving buffer boards are provided between each driving board and the panel 103, and a driving signal from each circuit portion is provided to the panel 103 via this driving buffer board. In addition, the driving buffer boards are connected to the panel 103 by a connecting member such as TCP or FPC.

The protective plate 120 protects the connection member 130 together with the front case and the rear case from external shocks, and transfers heat generated from the connection member 130 to a heat dissipation member (not shown), and also directly radiates some heat. By preventing the damage and malfunction of the connecting member 130.

Since the circuit unit 110 requires a high voltage in order to apply a voltage to a plurality of electrodes mounted inside the panel 103, it is necessary to stably ground it. By using the chassis base 109 made of plastic material In more detail with respect to the ground securing means in question as follows.

FIG. 2 is a schematic view illustrating an electrical connection between a conductive thin film formed on a front surface of a chassis base and a circuit unit according to an embodiment of the present invention, and FIG. 3 is a front view of a chassis base according to an embodiment of the present invention. Is a schematic diagram showing a state of forming a thin film by spray coating.

Referring to the drawings, in the plasma display device according to the exemplary embodiment, the conductive thin film 140 is formed on the front surface of the chassis base 109, and the conductive boss 150 is coupled to the chassis base 109. One end of is electrically connected to the thin film 140 and the other end of the boss 150 is electrically connected to the circuit portion 110, the thin film 140 and the circuit portion 110 is electrically connected.

As shown in FIG. 3, the conductive thin film 140 may be formed using a spray coating method. However, the present invention is not limited thereto, and the present invention is not limited thereto, and may use a metal plating method such as nickel plating or a physical, chemical, or thermal vapor deposition method. It may be formed using. The thickness is about 0.1 mm.

The plastic that is the material of the chassis base 109 may be a polyester resin, an epoxy resin, or a polycarbonate resin. Among these, polyester resins are generally referred to as fiber reinforced plastics (FRP) because they are generally reinforced with glass fibers. Recent advances in molding can produce FRP with the same strength as steel. In addition, polycarbonate resin is an engineering plastic that is transparent, has excellent mechanical properties and heat resistance, and is nontoxic and self-extinguishing. However, the type of plastic is not limited here.

2, a conductive first fastening member 160 electrically connected to the thin film 140 is coupled to the one end of the conductive boss 150. However, the present disclosure is not limited thereto, and the boss 150 may pass through the chassis base 109, and the thin film 140 may be in contact with the one end of the boss 150.

Here, the first fastening member 160 is conductive and includes a head portion 162 and a screw portion 164. The size of the cross section parallel to the chassis base of the cross section of the screw portion 164 is smaller than the size of the cross section of one end of the boss 150, and the size of the cross section of the head portion 162 is a hole of the thin film 140 through which the screw portion passes. It is formed to be larger. Accordingly, the thin film 140 is fixed to the front surface of the chassis base 109 by the first fastening member 160, and is transmitted from the threaded portion 164 and the conductive boss 150 of the first fastening member 160. Electrical flow is led to the thin film 140 directly or in contact with it through the head 162 of the first fastening member.

In addition, the second fastening member 170 may also include a head and a screw, and is coupled to the other end of the boss 150 while being in contact with the circuit unit 110 as a conductive material.

Here, the circuit portion 110 is formed with a ground end, the ground end is in contact with the second fastening member 170, the second fastening member 170, the boss 150, at the ground end of the circuit portion 110, The flow of electricity continues in order of the first fastening member 160 and the conductive thin film 140.

On the other hand, the inside of the boss 150 may be penetrated. The inside of the boss 150 may have a female threaded groove, and the two fastening members 160 and 170 may each have an external shape of a male thread corresponding to the female threaded groove.

In addition, the boss 150 includes protrusions (not shown) formed along the outer circumference of the boss 150 as another measure for avoiding leaving through the chassis base 109, and the protrusions are included in the chassis base 109. It is preferable that the locking jaw portion (not shown) corresponding to the external shape of is formed. At this time, the shape of the protruding portion may be a ring shape, preferably a polygonal nut shape. This is to prevent the boss 150 from being rotated together with the screw when the fastening members 160 and 170 such as screws are rotated to the boss 150. However, protrusions of various shapes may be formed in addition to the polygonal nut shape or the ring shape, and the shape of the protrusions is not limited thereto.

In addition, the chassis base 109 includes a reinforcement portion 109b formed at a portion where the boss 150 is positioned to be relatively thicker than other portions. This is because the load is concentrated on the boss 150 as the support member, and therefore, the portion where the boss 150 is located in the chassis base 109 needs to be formed thicker than the other portions.

In the plasma display device according to another exemplary embodiment, the conductive thin film 140 is formed on the front surface of the chassis base 109, and the conductive first fastening member 160 is electrically connected to the thin film 140. Is coupled to one end of the boss 150 fixed to the chassis base 109, and a second conductive fastening member 170 electrically connected to the circuit unit 110 is coupled to the other end of the boss 150. An electrical connection is made between the members 160 and 170, and the thin film 140 and the circuit unit 110 are electrically connected to each other. Hereinafter, only differences from the above-described embodiment will be described.

Looking at the electrical connection between the first fastening member 160 and the second fastening member 170, may be configured to make a direct contact between the two fastening members (160, 170), two fastening members (160) , 170 may be integrally formed. In this case, the boss 150 does not necessarily need to be a conductive material. Accordingly, the boss 150 and the chassis base 109 may be integrally formed by plastic injection molding.

Alternatively, if the boss 150 is a conductive material, no direct contact between the two fastening members 160, 170 is necessary. However, although the entire boss 150 may be a conductive material, at least one contact portion contacting at least each of the fastening members 160 and 170 of the boss 150 and a connection portion of each of the contact parts may be formed of a conductive material. There is no problem with the electrical connection. Therefore, even in this case, the boss 150 and the chassis base 109 are integrally formed by plastic injection molding, and the boss 150 is formed of a conductive material or the two fastening members 160 inside the boss 150. , 170 may be interposed in contact with a conductive material.

4 is a schematic diagram illustrating an electrical connection method between a conductive thin film formed on a rear surface of a chassis base and a circuit unit according to another exemplary embodiment of the present invention.

Referring to the drawings, the plasma display device according to another embodiment of the present invention, the conductive thin film 140 is formed on the rear surface of the chassis base 109, the conductive fastening member 170 is electrically connected to the circuit unit 110 Is coupled to the conductive boss 150 in contact with the thin film 140 while being fixed to the chassis base 109, so that the thin film 140 and the circuit unit 110 are electrically connected to each other.

In the present embodiment, unlike the embodiment shown in FIG. 3, the conductive thin film 140 is formed on the rear surface of the chassis base 109 instead of the front surface, and the thin film 140 is in contact with the conductive boss 150. Therefore, a separate fastening member for electrically connecting the boss 150 and the thin film 140 is unnecessary. In addition, the contents described with reference to FIG. 3 may be equally applied to the exemplary embodiment of FIG. 4.

In addition, various embodiments of the present invention exist.

In the plasma display device according to the fourth embodiment, a first conductive thin film is formed on a front surface of a chassis base, a second conductive thin film is formed on a rear surface of a panel, and the two thin films are connected to each other by a conductive material. One end of the conductive boss fixed to the chassis base is electrically connected to the first thin film, and the other end of the boss is electrically connected to the circuit portion by the conductive fastening member, so that the two thin films and the circuit portion are electrically connected.

In the plasma display device according to the fifth embodiment, a conductive thin film is formed on the front surface of the chassis base, a conductive thin plate is attached to the rear surface of the panel, and the thin film and the thin plate are connected to each other by a conductive material, and the chassis base is One end of the conductive boss fixed to is electrically connected to the thin film, and the other end of the boss is electrically connected to the circuit portion by a conductive fastening member, and the thin film and the thin plate and the circuit portion are electrically connected to each other.

In the fourth and fifth embodiments described above, by attaching a conductive thin film or a conductive thin plate to the rear surface of the panel and connecting each of them with a conductive thin film formed on the front surface of the chassis base, the thermal conductivity and the grounding effect can be doubled. . In this case, the thermal conductive sheet may be omitted. 3 may also be applied to the fourth and fifth embodiments.

Although the present invention has been described using PDP as an example, the contents of the present invention can be applied to other flat panel display devices.

Plasma display device according to the present invention, first, by using the chassis base made of plastic material material and molding cost is low, the process is simple, the weight and noise of the module can be reduced.

Second, by placing a conductive thin film on the front surface of the chassis base made of plastic material and electrically connecting the thin film and the circuit part using a boss and a fastening member, it is possible to improve the stability of the PDP module by securing the ground of the circuit part. .

Third, heat emitted from the panel and the circuit unit may be radiated through the conductive thin film located on the front surface of the chassis base.

Although the present invention has been described with reference to the illustrated embodiments, it is merely exemplary, and the present invention may encompass various modifications and equivalent other embodiments that can be made by those skilled in the art. Will understand.

Claims (17)

A plasma display device comprising a panel for displaying an image, a chassis base made of plastic material supporting the panel on the back side of the panel, and a circuit portion fixed to the back side of the chassis base to drive the panel. A conductive thin film is formed on the front surface of the chassis base, one end of the conductive boss fixed to the chassis base is electrically connected to the thin film, and the other end of the boss is electrically connected to the circuit part. Plasma display device, characterized in that the circuit portion is electrically connected. The method of claim 1, And the thin film is formed by a metal plating method, a coating method or a deposition method. The method of claim 1, And the boss penetrates through the chassis base and the thin film is in contact with the one end of the boss. The method of claim 1, And a conductive first fastening member electrically connected to the thin film to the one end of the boss. The method of claim 4, wherein The first fastening member includes a head and a screw, wherein the size of the cross section parallel to the chassis base of the screw portion is smaller than the size of the cross section of the one end of the boss, and the size of the cross section of the head portion is And a larger hole than the hole of the thin film passing through the screw portion. The method of claim 1, And a second conductive fastening member electrically connected to the circuit unit at the other end of the boss. The method of claim 1, The boss may include a protrusion formed along an outer circumference of the boss so as not to penetrate through the chassis base, and the chassis base includes a locking jaw formed to correspond to an outer shape of the protrusion. Device. The method of claim 7, wherein The protrusion may have a polygonal nut shape or a ring shape. The method according to claim 1 or 7, And the chassis base includes a reinforcement part formed thicker than another part in a portion where the boss is located. The method of claim 1, The plastic is a plasma display device, characterized in that the polyester resin, epoxy resin or polycarbonate resin. A plasma display device comprising a panel for displaying an image, a chassis base made of plastic material supporting the panel on the back side of the panel, and a circuit portion fixed to the back side of the chassis base to drive the panel. A conductive thin film is formed on the front surface of the chassis base, and a conductive first fastening member electrically connected to the thin film is coupled to one end of a boss fixed to the chassis base and electrically connected to the circuit portion. 2, the fastening member is coupled to the other end of the boss, and the electrical connection is made between the two fastening members, wherein the thin film and the circuit portion is electrically connected. The method of claim 11, And the first coupling member and the second coupling member are in direct contact with each other so that an electrical connection is made between the two coupling members. The method of claim 11, And at least one contact portion of the boss contacting each of the fastening members and a connection portion of the contact portions are made of a conductive material, thereby making an electrical connection between the two fastening members. The method according to claim 12 or 13, And the boss and the chassis base are integrally formed by injection molding. A plasma display device comprising a panel for displaying an image, a chassis base made of plastic material supporting the panel on the back side of the panel, and a circuit portion fixed to the back side of the chassis base to drive the panel. A conductive thin film is formed on the rear surface of the chassis base, and a conductive fastening member electrically connected to the circuit portion is coupled to a conductive boss contacting the thin film while being fixed to the chassis base, thereby electrically connecting the thin film and the circuit portion. Plasma display device characterized in that. A plasma display device comprising a panel for displaying an image, a chassis base made of plastic material supporting the panel on a rear surface of the panel, and a circuit portion fixed to a rear surface of the chassis base to drive the panel. A conductive first thin film is formed on a front surface of the chassis base, and a conductive second thin film is formed on a rear surface of the panel, and the two thin films are connected to each other by a conductive material and are fixed to the chassis base. One end of the plasma display device is electrically connected to the first thin film and the other end of the boss is electrically connected to the circuit portion by a conductive fastening member, wherein the two thin film and the circuit portion is electrically connected. A plasma display device comprising a panel for displaying an image, a chassis base made of plastic material supporting the panel on the back side of the panel, and a circuit portion fixed to the back side of the chassis base to drive the panel. A conductive thin film is formed on the front surface of the chassis base, and a conductive thin plate is attached to the rear surface of the panel, and the thin film and the thin plate are connected to each other by a conductive material, and one end of the conductive boss fixed to the chassis base. Is electrically connected to the thin film, and the other end of the boss is electrically connected to the circuit part by a conductive fastening member, and the thin film and the thin plate and the circuit part are electrically connected to each other.

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