KR100708528B1 - Tape carrier package and plasma display panel with the same - Google Patents

Abstract

The present invention relates to a tape carrier package and a plasma display panel having the same, comprising: a metal wire for signal input and a metal wire for panel connection formed on a base film; And a semiconductor chip connected to the metal wire for signal input and the metal wire for panel connection, wherein the base film includes a first slit formed between an end of the metal wire for signal input and an end of the metal wire for panel connection. (Slit) part; And a second slit portion formed between the first slit portion and an end of the panel metal wiring line, wherein the length of the second slit portion is smaller than the length of the first slit portion.

With this feature, the present invention can prevent the desiccant applied to the connection portion between the panel of the display device and the tape carrier package from penetrating into the slit portion and damaging the exposed metal wiring.

Tape Carrier Package, Slit, Desiccant

Description

Tape Carrier Package And Plasma Display Panel With The Same}

1 is a plan view showing a schematic configuration of a tape carrier package according to the prior art;

2 is a plan view showing a first embodiment of a tape carrier package according to the present invention;

3 is a cross-sectional view showing a first embodiment of a tape carrier package according to the present invention;

4 is a plan view showing a second embodiment of a tape carrier package according to the present invention;

5 is a plan view showing a third embodiment of a tape carrier package according to the present invention;

6 is a plan view showing a base film used in the tape carrier package according to the present invention;

7A to 7E are cross-sectional views showing the manufacturing procedure of one embodiment of the tape carrier package according to the present invention.

*** Explanation of the Major Symbols in the Drawings ***

10: base film 11: metal wiring for panel connection

12 metal wiring for signal input 13 semiconductor chip

14 Bump 15 Solder Resist

16: insulation 17: first slit

18: second slit portion 40: device hole

41: transfer hole

The present invention relates to a tape carrier package and a plasma display panel having the same, and more particularly, to prevent the desiccant applied to the connection portion between the panel of the display device and the tape carrier package from penetrating into the slit formed to improve bending characteristics. The present invention relates to a tape carrier package and a plasma display panel having the same, which can prevent the metal wiring of the tape carrier package from being damaged.

Plasma display panels are intended for displaying images using a physical phenomenon called gas discharge, which is a display device with a wide range of sizes ranging from a single digit to a diagonal 1m graphic display with a large size of 2 million pixels. It is one of the successful display products.

Since the plasma display panel has a very strong non-linearity of discharge, it does not discharge below the ignition voltage, so there is no limitation on the number of lines, so that a large size can be manufactured and a multiplexing technique for reducing the number of driving circuits can be used. In addition, it has a number of advantages, such as long life, high brightness, high brightness efficiency, simple structure, and easy fabrication, compared to a conventional cathode ray tube. With these advantages, the demand for plasma display panels is increasing rapidly according to the rapid growth of the information society.

The plasma display panel is divided into an AC type and a DC type according to the type of driving voltage applied to the discharge cell. The AC type is widely used. When the AC type is described in more detail, each of the sustain electrodes is formed on the dielectric layer and the protective layer. As a result, the electrodes are separated from the discharge layer to form the wall charges without absorbing the charged particles generated during the discharge phenomenon, and the next discharge is formed by using the wall charges.

A typical plasma display panel includes a lower substrate, an address electrode formed on the lower substrate, a dielectric layer formed on the lower substrate on which the address electrode is formed, and a dielectric layer formed on the dielectric layer to maintain a discharge distance and to provide electro-optic cross talk between cells. And an upper substrate coupled to the lower plate on which the barrier ribs are formed, and the sustain electrode pair and the bus electrode pair of a predetermined pattern formed on a lower surface thereof so as to be orthogonal to the address electrode. In the sustain electrode pair, a transparent electrode is used to transmit light, and a bus electrode is generally bonded to compensate for the high resistance of the transparent electrode. A phosphor layer is formed on at least one side of the discharge space partitioned by the partition wall, and a dielectric layer and a protective film on which the electrodes are embedded are formed on the lower surface of the upper portion. The discharge space is injected with a discharge gas mixed with neon (Ne), xenon (Xe) and the like.

In such a plasma display panel, an electrode formed on the plasma display panel is electrically connected to a driving circuit through a flexible circuit board (FPC), and the signal is controlled by the driving circuit to selectively form a wall voltage on the pixels of the panel. As a result, a driver IC for applying an address voltage is formed.

As such, the FPC and the driver IC have been widely used as a voltage application structure.The driver IC is mounted on a PCB (Chip On Board) mounted on a PCB (Printed Circuit Board) and a film forming the FPC. Directly mounted chip on film (COF).

The driver IC is connected to the signal input part and the panel connection part by metal wiring. In the COF structure, the minimum pitch for bonding the IC chip on the metal wiring is 60 μm, whereas in the tape carrier package structure, the minimum pitch is 40 μm or less. Therefore, not only is the tape carrier package advantageous in that the number of output pins can be increased in the same size IC chip, but also in the manufacturing process, the tape carrier package is advantageous. It's changing.

1 schematically illustrates a shape of a tape carrier package for a plasma display panel according to the related art. As shown in the drawing, the tape carrier package includes: a base film 200 on which a metal line 210 for panel connection connected to the plasma display panel 100 and a metal line 220 for signal input through which a driving signal is input; And a driver IC 230. In addition, since the tape carrier package is bent and connected to the panel and the driving circuit, the tape carrier package includes the bending slits 240 and 250 and the protrusion 260 to facilitate the connection with the driving circuit.

The metal wiring for connecting the electrodes of the plasma display panel and the panel of the tape carrier package is electrically bonded by an anisotropic conductive film, and the connection terminal of the driving circuit and the tape carrier package is electrically connected by a male and female connector. Connected. The tape carrier package is advantageous in terms of manufacturing cost while having a structure similar to a conventional COF.

The connection portion between the tape carrier package and the electrode of the plasma display panel is fixed by thermal compression. In order to prevent moisture from penetrating into the connection portion and damaging the electrode, it is common to apply a desiccant to the connection portion. to be.

The coating agent often invades the close banding slit 240, but when the desiccant is cured, it will have a considerably high strength. Therefore, stress acts on the metal wiring exposed to the slit part, which is one of the causes of damage to the metal wiring, such as the metal wiring is cut.

Therefore, by solving the above problems, it is necessary to develop a tape carrier package having a structure capable of preventing damage to the metal wiring by the desiccant.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and the metal wiring of the tape carrier package is prevented by preventing the moisture absorbent applied to the connection portion between the panel of the display device and the tape carrier package from penetrating into the slit formed to improve bending characteristics. An object of the present invention is to provide a tape carrier package capable of preventing damage and a plasma display panel having the same.

The present invention provides a metal wire for signal input and a metal wire for panel connection formed on a base film; And a semiconductor chip connected to the metal wire for signal input and the metal wire for panel connection, wherein the base film includes a first slit formed between an end of the metal wire for signal input and an end of the metal wire for panel connection. (Slit) part; And a second slit portion formed between the first slit portion and an end of the panel metal wiring line, wherein the length of the second slit portion is smaller than the length of the first slit portion.

Moreover, the soldering resist which covers a part of said each metal wiring; And an insulating part covering a portion of the semiconductor chip.

In addition, the base film is a tape carrier package, characterized in that made of a polyimide resin or an epoxy resin.

In addition, the metal wiring is a tape carrier package, characterized in that attached to the base film using an adhesive.

In addition, the semiconductor chip and each metal wiring is a tape carrier package, characterized in that connected to the bump.

In addition, the portion connected to the semiconductor chip of each metal wiring is a tape carrier package, characterized in that plated with gold or tin.

The semiconductor chip is a tape carrier package which is formed between the first slit portion and the second slit portion.

The semiconductor chip is a tape carrier package which is formed between a first slit portion and an end of a signal input metal wiring.

The slit portion is a tape carrier package, characterized in that it comprises a plurality of slits.

In addition, the length of the second slit portion is a tape carrier package, characterized in that 0.7 to 0.9 times the length of the first slit portion.

In addition, a lower structure including a lower substrate, an address electrode formed on the lower substrate, a lower dielectric layer, a partition wall, a phosphor layer; An upper structure including an upper substrate, a sustain electrode formed under the upper substrate, a bus electrode, an upper dielectric layer, and a passivation layer, the upper structure coupled to the lower structure such that the address electrode and the sustain electrode are orthogonal to each other; And the tape carrier package electrically connected to the sustain electrode or the address electrode.

In addition, the tape carrier package electrically connected to the sustain electrode or the address electrode is a plasma display panel, which is connected via an anisotropic conductive film.

In addition, the plasma display panel is characterized in that a desiccant is applied to a portion where the tape carrier package is connected to the sustain electrode or the address electrode.

The desiccant is a plasma display panel, which is an acrylic resin.

Hereinafter, with reference to the accompanying drawings will be described in detail the technical features of the present invention.

FIG. 2 is a plan view showing a first embodiment of the tape carrier package according to the present invention, wherein the signal input metal wiring 12 and the panel connection metal wiring 11 formed on the base film 10; And a semiconductor chip 13 connected to the metal wire for signal input and the metal wire for panel connection, wherein the base film 10 is disposed between an end of the metal wire for signal input and an end of the metal wire for panel connection. A first slit portion 17 formed in the first slit portion 17; And a second slit portion 18 formed between the first slit portion and the end of the metal wire for panel connection, wherein the length of the second slit portion is smaller than the length of the first slit portion.

3 is a cross-sectional view of the tape carrier package, and as shown, the metal wire 12 for signal input and the metal wire 11 for panel connection are electrically connected to the semiconductor chip 13 by a bump 14. Insulated portion 16 is formed to protect and fix the semiconductor chip. The metal wirings of the remaining portions except the end portions are wrapped with the solder resist 15.

An end of the panel connection metal line 11 is electrically connected to an electrode of the plasma display panel to drive the electrode. Since the metal wiring for panel connection has more wirings than the metal wiring for signal input, the metal wiring for panel connection is narrower than the metal wiring for signal input. The metal wiring for panel connection of the tape carrier package is connected to the connection portion of the display device panel, and a method of connecting through an anisotropic conductive film or a conductive adhesive is mainly used. More specifically, an anisotropic conductive film or a conductive adhesive is applied to the metal wire for panel connection, and then bonded and aligned with the connection part of the plasma display panel, and the connection part is heated and pressed to bond.

An end of the signal input metal line 12 is connected to a driving circuit designed on a circuit printed board. The metal wire for signal input is connected to the drive circuit in the form of a male and female connector, unlike the metal wire for panel connection.

In addition, the metal wiring of the signal input unit and the panel connection unit is preferably made of copper in consideration of electrical conductivity and economy.

The base film 10 is made of synthetic resin, and particularly preferably made of polyimide resin or epoxy resin having high heat resistance.

The tape carrier package is connected to the panel of the display device and the printed circuit board in a bent form for the efficiency of the space layout. The base film is formed with a slit portion for improving the bending characteristics of the tape carrier package. Since two bends are required for holding, the first slits and the second slits are provided.

As described above, a desiccant is applied to the connection portion between the tape carrier package and the panel of the display device, and the desiccant may penetrate into the slit close to the connection portion to damage the metal wiring. A tape carrier package according to the present invention includes a first slit portion formed between an end of a signal input metal wiring and an end of a panel wiring metal wiring, and a second slit formed at the end of the first slit portion and an electrode wiring for panel connection. By providing a slit part and forming the length W2 of a 2nd slit part smaller than the length W1 of a 1st slit part, the possibility of penetration of a desiccant can be reduced. In particular, considering that the part where the desiccant is largely penetrated and the possibility of penetration is both ends of the start and end of the application, the effect can be sufficiently obtained by shortening the length of the second slit part as in the present invention.

The length W2 of the second slit portion is preferably about 0.9 to 0.7 times the length W1 of the first slit portion. When the length of the second slit portion becomes shorter than that, a decrease in the bending characteristic is remarkable.

The signal input metal wire 12 and the panel connection metal wire 11 are electrically connected to the semiconductor chip through bumps! 4. Connecting the semiconductor chip and each electrode through the bumps simplifies the manufacturing process of the tape carrier package and helps to reduce the spacing of the electrodes to achieve miniaturization of the tape carrier package.

4 is a plan view showing a second embodiment of the tape carrier package according to the present invention, wherein the signal input metal wiring 12 and the panel connection metal wiring 11 formed on the base film 10; And a semiconductor chip (13) connected to the signal input metal wiring and the panel connection metal wiring; The base film 10 may include a first slit portion 17 formed between an end of the signal wire and an end of the panel wire; And a second slit portion 18 formed between the first slit portion and an end of the metal wire for panel connection, wherein the length of the second slit portion is smaller than the length of the first slit portion, and each slit portion is side by side. It consists of arranged slit pairs.

In the case of the above embodiment, by further reducing the area that the desiccant can penetrate, it is possible to further reduce the likelihood of penetration of the desiccant.

FIG. 5 is a plan view showing a second embodiment of the tape carrier package according to the present invention, wherein the signal input metal wiring 12 and the panel connection metal wiring 11 formed on the base film 10; And a semiconductor chip 13 connected to the metal wire for signal input and the metal wire for panel connection, wherein the base film 10 is disposed between an end of the metal wire for signal input and an end of the metal wire for panel connection. A first slit portion 17 formed in the first slit portion 17; And a second slit portion 18 formed between the first slit portion and an end of the metal wire for panel connection, wherein the length of the second slit portion is smaller than the length of the first slit portion, and each slit portion is side by side. The semiconductor chip 13 is positioned between the first slit portion 17 and the second slit portion 18.

In the tape carrier package, the semiconductor chip may be located between the first slit portion and the terminal of the signal input metal wiring, but the configuration thereof is deformable, and as in this embodiment, the first slit portion and the second slit It may be located between the parts.

Hereinafter, a method of manufacturing a tape carrier package according to the present invention will be described with reference to the accompanying drawings.

7A to 7E are cross-sectional views showing an embodiment of a method of manufacturing a tape carrier package for a plasma display panel according to the present invention, which includes a device hole, a first slit portion and a second slit portion, wherein the length of the second slit portion is Forming a metal film on the base film formed smaller than the length of the first slit portion; Etching the metal film to form a metal wire for panel connection and a metal wire for signal input; Forming a solder resist on a portion of each of the metal wires; Mounting a semiconductor chip in a device hole such that each metal wiring and the semiconductor chip are electrically connected through bumps, and forming an insulating part to surround a connection portion of the semiconductor chip and the metal wiring and a part of each metal wiring; The electrode of the signal input metal wiring is formed so that the width of the terminal is larger than the rest.

First, a device hole 40, a first slit portion (not shown) and a second slit portion (not shown) are provided, and the length of the second slit portion is formed on the base film 10 smaller than the length of the first slit portion. The metal film 20 is formed (FIG. 7A). The base film is generally wound on a roll so as to be convenient for use.

As shown in FIG. 6, in the present embodiment, the device hole 40 is formed outside the first slit portion 17, but between the first slit portion 17 and the second slit portion 18. It may be formed in. Since the method for forming the device holes and slits is well known, a detailed description thereof will be omitted. In addition to this, both sides of the base film are formed with a transport hole 41 to assist the transport of the film.

As a material of the metal film 20, in consideration of electrical conductivity and economic efficiency, it is preferable to use a copper film. The metal film may be formed at a place other than the base film, and then attached to the base film using an adhesive, or the like, and may be sputtered onto the base film.

Next, the metal film is etched to form a metal wire for panel connection and a metal wire for signal input. More specifically, the forming of the panel connection metal line and the signal input metal line may include forming a photoresist on the metal layer and forming an etch resist under the metal layer corresponding to the device hole; Exposing and developing the photoresist to form a photoresist pattern; And forming an electrode by etching the metal film on which the photoresist pattern is not formed, and removing the photoresist pattern and the etching resist.

First, the photoresist 30 is formed on the metal film 20, and the etching resist 35 is disposed under the metal film corresponding to the device hole so that the etching material does not damage other portions through the device hole 40. To form (FIG. 7B).

Next, the photoresist is exposed and developed to form a photoresist pattern (not shown). Exposure of the photoresist is performed by irradiating ultraviolet rays through a mask, and the photoresist of the exposed portion remains cross-linked to form a photoresist pattern without being removed by the alkaline developer.

Next, an electrode is formed by etching the metal film on which the photoresist pattern is not formed, and the photoresist pattern 30 and the etching resist 35 are removed, thereby forming the panel wiring metal wiring 11 and the signal input metal wiring. (12) is formed (FIG. 7C).

Next, a solder resist 15 is formed on a part of each of the metal wires (FIG. 7D), and the metal wires 11 and 12 and the semiconductor chip 13 form bumps 14 of high electrical conductivity. The semiconductor chip is mounted in the device hole 40 so as to be electrically connected therethrough, and then, in order to protect the semiconductor chip 13 and the metal wirings 11 and 12 and to stably fix the position, the semiconductor chip and the metal wiring. An insulating portion 16 is formed to surround the connecting portion and a part of each metal wiring of (Fig. 7E). Since the insulation is not formed, the metal wiring exposed to the outside becomes a part for connecting with the panel and the circuit printed board.

8 is a cross-sectional view showing an embodiment of a plasma display panel according to the present invention, comprising: a lower structure 60 including a lower substrate, an address electrode formed on the lower substrate, a lower dielectric layer, a partition wall, and a phosphor layer; An upper structure 50 including an upper substrate, a sustain electrode formed under the upper substrate, a bus electrode, an upper dielectric layer, and a passivation layer, the upper structure 50 coupled to the lower structure such that the address electrode and the sustain electrode are perpendicular to each other; And a tape carrier package (90) electrically connected to the sustain electrode or the address electrode, wherein the tape carrier package comprises: a metal wire for signal input and a metal wire for panel connection formed on a base film; A semiconductor chip 13 connected to the metal line for signal input and the metal line for panel connection; A first slit portion 17 formed on the base film; And a second slit portion 18 formed between the first slit portion and an end of the metal wire for panel connection, wherein the length of the second slit portion is smaller than the length of the first slit portion. A support 75 is formed below the lower structure of the plasma display panel, and the tape carrier package 90 is attached to the bottom of the support 75 through an adhesive layer 70. The support portion may be formed of a metal having high thermal conductivity such as aluminum.

As shown in FIG. 9, the upper structure 50 of the plasma display panel includes an upper substrate 51, a storage electrode 52 formed under the upper substrate, a bus electrode 53, an upper dielectric layer 54, and a protective film ( 55. The lower structure 60 of the plasma display panel includes a lower substrate 61, an address electrode 62 formed on the lower substrate, a lower dielectric layer 63, a partition 64, and a phosphor layer 65. It is composed.

As shown in FIG. 10, a desiccant 81 is applied to a portion where the tape carrier package and the sustain electrode or the address electrode (not shown) are connected, and an acrylic resin is used as the desiccant. The plasma display panel according to the present invention includes a slit portion 18 having a small length, thereby reducing the likelihood of penetration of the desiccant into the slit, thereby improving the reliability of the plasma display panel. As the tape carrier package, various types of tape carrier packages described above may be used.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, in the tape carrier package according to the present invention, in forming a slit for improving the bending characteristics of the tape carrier package, by shortening the length of the slit portion located near the connection portion with the panel, the desiccant penetrates into the slit portion. This can prevent damage to the exposed metal wiring.

In addition, since each slit portion of the present invention is composed of a plurality of slits arranged side by side, there is an advantageous effect that a sufficient bending characteristic can be obtained while reducing the area that the desiccant can penetrate.

Claims (14)

A metal wire for signal input and a metal wire for panel connection formed on the base film; And It comprises a semiconductor chip connected to the metal wire for signal input and the metal wire for panel connection, The base film may include a first slit portion formed between an end of the metal wire for signal input and an end of the metal wire for panel connection; And And a second slit portion formed between the first slit portion and an end of the metal wire for panel connection, wherein the length of the second slit portion is smaller than the length of the first slit portion. The method of claim 1, A solder resist covering a portion of each of the metal wires; And And an insulating part covering a portion of the semiconductor chip. The method of claim 1, The base film is a tape carrier package, characterized in that made of polyimide resin or epoxy resin. The method of claim 1, Each said metal wiring is attached to a base film using an adhesive. The method of claim 1, Tape carrier package, characterized in that the semiconductor chip and each metal wiring is connected by a bump. The method of claim 1, Tape carrier package, characterized in that the portion connected to the semiconductor chip of each metal wiring is plated with gold or tin. The method of claim 1, The semiconductor chip is a tape carrier package, characterized in that formed between the first slit portion and the second slit portion. The method of claim 1, The semiconductor chip is a tape carrier package, characterized in that formed between the first slit portion and the end of the metal wiring for signal input. The method of claim 1, And each of the slits comprises a plurality of slits. The method of claim 1, The length of the second slit portion is a tape carrier package, characterized in that 0.7 to 0.9 times the length of the first slit portion. A lower structure including a lower substrate, an address electrode formed on the lower substrate, a lower dielectric layer, a partition wall, and a phosphor layer; An upper structure including an upper substrate, a sustain electrode formed below the upper substrate, an upper dielectric layer, and a passivation layer, the upper structure coupled to the lower structure such that the address electrode and the sustain electrode are perpendicular to each other; And 11. The plasma display panel of claim 1, further comprising a tape carrier package of any one of claims 1 to 10 electrically connected to the sustain electrode or the address electrode. The method of claim 11, The tape carrier package electrically connected to the sustain electrode or the address electrode, Plasma display panel, characterized in that connected via an anisotropic conductive film. The method of claim 11, And a desiccant is applied to a portion where the tape carrier package is connected to the sustain electrode or the address electrode. The method of claim 13, The desiccant is a plasma display panel, characterized in that the acrylic resin.

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