KR100703093B1 - Plasma display panel having electrodes in partition wall and manufacturing method of partition wall of plasma display panel - Google Patents

Abstract

Provided are a plasma display panel including an electrode in a partition wall and a method of manufacturing the partition wall so as to increase luminous efficiency.

The plasma display panel includes a plasma display panel including the upper substrate and a lower substrate disposed to face the upper substrate, the plasma display panel being disposed between the upper substrate and the lower substrate and forming a tubular unit discharge space; An X electrode formed spirally on the partition wall; And a Y electrode formed spirally on the partition wall at a predetermined distance from the X electrode. It characterized in that the X electrode and the Y electrode to form a double helix structure.

According to the present invention, the light emitting efficiency and the transmittance of the upper substrate can be excellent, high contrast ratio can be realized, and the structure can be simple to obtain an effect of excellent design freedom and productivity.

Plasma Display Panel (PDP), Bulkhead, Electrode, Transmittance, Luminous Efficiency, Discharge

Description

Plasma display panel having electrodes inside the partition wall and a method of manufacturing the partition wall {Plasma Display Panel Having Electrodes in Partition Wall And Manufacturing Method of Partition Wall of Plasma Display Panel}

1 is a cross-sectional view of a typical AC surface discharge type plasma display panel.

2 is a manufacturing process flow chart on a conventional plasma display panel upper substrate.

3 is a sectional view of a plasma display panel according to the present invention;

4 is an exploded perspective view showing a partition wall of the plasma display panel according to the present invention;

5 is a cross-sectional view of a plasma display panel according to another embodiment of the present invention.

6 is a cross-sectional view of a plasma display panel according to another embodiment of the present invention.

7 (a) to 7 (d) are process diagrams of a barrier rib manufacturing method of a plasma display panel according to an embodiment of the present invention.

8 (a) to 8 (d) are process diagrams of a method for manufacturing partition walls of a plasma display panel according to another embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100 ... Bottom 110 ... Bottom Substrate

120 ... address electrode 130 ... lower dielectric layer

140 ... bottom bulkhead 150 ... phosphor layer

200 ... bulkhead 201 ... discharge space

211 ... X electrode 212 ... Y electrode

220 ... bulkhead 225 ... extended bulkhead

221 ... ceramic sheet 222 ... protective sheet

300 ... top 310 ... top substrate

The present invention relates to a plasma display panel (PDP), and more particularly to a plasma display panel having an electrode inside the partition wall.

A typical plasma display panel (PDP) is a phosphor caused by 147 nm ultraviolet rays generated during discharge of helium (He) and xenon (Xe) inert mixed gases or helium (He), neon (Ne) and xenon (Xe) inert mixed gases. An apparatus for displaying an image including a character or a graphic by emitting light, which is characterized by not only easy to enlarge, but also excellent display quality and fast response speed. In addition, since it can be thinned, it is also attracting attention as a wall-mounted display with a liquid crystal display (LCD).

PDPs are classified into a surface discharge type and an opposite type according to the arrangement of the electrodes, and are classified into an AC discharge type, an AC discharge type, a DC discharge type, or a hybrid type according to whether the electrode is exposed. The three-electrode AC surface discharge type PDP has advantages of low voltage driving and long life because wall charges are accumulated on the surface during discharge and protect the electrodes from sputtering caused by the discharge.

1 is a cross-sectional view of a typical AC surface discharge plasma display panel. As shown, the lower substrate 1, the address electrode 2 formed on the lower substrate 1, the lower dielectric layer 3 formed on the address electrode 2, and the lower dielectric layer 3 It is formed on the top to maintain the discharge distance and includes a partition wall (4) for receiving the phosphor layer (5).

In addition, a protective film 6 is formed on the upper dielectric layer 7. The protective film 6 increases the lifespan by preventing sputtering of the upper dielectric layer 7 by gas ions during discharge, and discharge start voltage by secondary electron emission. When the discharge start voltage is lowered, not only a stable discharge can be obtained but also the lifetime of the electrode is increased. The space between the protective film 7 and the phosphor layer 5 is filled with an inert gas such as Ne + Xe, Ne + Xe, He + Ne + Xe.

In addition, on the upper substrate 10 of the PDP, sustain electrode pairs 8 and 9 composed of two electrodes are formed.

Each of the sustain electrode pairs 8 and 9 is an indium-tin oxide (ITO) electrode, which is a transparent electrode 8a and 9a, so as not to inhibit light transmission of the upper substrate 10, and the sustain electrode. In order to prevent the voltage drop of the pairs 8 and 9, the bus electrodes 8b and 9b have a narrower area and are metal electrodes for compensating for the resistive components of the transparent electrodes 8a and 9a.

The sustain electrode pairs 8 and 9 are composed of a sustain electrode (X electrode) 8 and a scan electrode (Y electrode) 9 in accordance with the applied pulse. Scan pulses for panel scanning and sustain pulses for sustaining discharge are mainly supplied to the scan electrodes 9, and sustain pulses are mainly supplied to the sustain electrodes 8.

An upper dielectric layer 7 is formed on the sustain electrode pairs 8 and 9, which limit the plasma discharge current and accumulate wall charges during discharge.

The operation principle of the PDP will be described with reference to FIG. 1.

First, a voltage corresponding to the discharge sustain voltage is applied between the sustain electrode 8 and the scan electrode 9 constituting the sustain electrode pairs 8 and 9 to accumulate charge in the upper dielectric layer 7.

Subsequently, when a voltage corresponding to the discharge start voltage is applied to the address electrode 2, an inert gas is separated into electrons and ions by a glow discharge, and the plasma is formed, and the phosphor is emitted by ultraviolet rays generated at the moment when the electrons and ions are recombined. The layer 5 develops.

The manufacturing process of such a PDP will be described with reference to the flowchart shown in FIG.

2 shows a manufacturing process of the upper substrate 10 of the conventional PDP. As shown, processing the glass, which is the upper substrate 10, forming the sustain electrode pairs 8 and 9 on the upper substrate 10, and forming the sustain electrode pairs 8 and 9 on the upper substrate 10; Forming an upper dielectric layer 7 on the substrate, sealing the upper dielectric layer 7, and forming a protective film 6.

The forming of the sustain electrode pairs 8 and 9 may include forming transparent electrodes 8a and 9a on the upper substrate 10 and a bus serving as an auxiliary electrode on a portion of the transparent electrodes 8a and 8b. Forming the electrodes 8b and 9b.

Referring to the manufacturing process of the upper substrate 10 composed of these steps, the transparent electrode (8a, 9a) is formed on the upper substrate 10 by using a method such as sputtering or vacuum deposition, the transparent electrode Bus electrodes 8b and 9b made of Cr / Cu / Cr are formed on the surfaces 8a and 9a by sputtering.

The upper dielectric layer 7 formed on the pair of sustain electrodes 8 and 9 formed of the transparent electrodes 8a and 9a and the bus electrodes 8b and 9b is applied by a screen printing method, and the upper dielectric layer 7 is formed on the upper dielectric layer 7. Seal it.

A protective film 6 is then formed on the upper dielectric layer 7 surface, which is usually made of magnesium oxide (MgO), which is about 500 nm using E-beam or liquid magnesium oxide. It deposits about (5000 Pa).

In addition, the manufacturing process of the lower substrate 1 of the conventional PDP panel is as follows.

First, an address electrode 2 is formed on the lower substrate 1 on the lower substrate 1 by using a photo method, a printing method, or the like.

Mixing a mixture of an oxide of fine powder in a PbO or non-PbO glass fine powder according to a certain composition ratio using a method such as screen printing on the lower substrate 1 on which the address electrode 2 is formed, is mixed with an organic solvent. The paste thus formed is applied to a thickness of about 10 to 20 μm.

Then, the lower dielectric 3 is formed on the lower substrate 1 on which the address electrode 2 is formed by firing the paste applied to the lower substrate 1 in an oxidation atmosphere of 500 to 600 ° C.

Thereafter, the barrier rib 4 having a height of 100 to 200 μm is formed on the lower substrate 1 on which the lower dielectric 3 is formed by using screen printing, sand blasting, or pressing.

Subsequently, the phosphor layer 5 is formed on the inner wall of the partition 4 and the surface of the lower dielectric 3 using screen printing, printing, or the like.

The lower plate of the PDP thus formed is bonded by the upper plate and the sealing fixing.

The conventional PDP having such a structure and a manufacturing method has a problem in that transmittance and luminous efficiency are low because a part of the visible light generated by the phosphor is blocked by the bus electrode formed on the upper substrate 10.

In addition, the conventional PDP has a problem in that the selection of the material of the transparent electrode is limited in order to prevent a decrease in transmittance during the manufacture of the top plate, the phosphor is deteriorated by ion collision generated by the top plate electric field, and it is difficult to secure the aperture ratio, thereby increasing the contrast ratio.

In addition, the conventional PDP has a problem in that the transparent electrode and the bus electrode is formed on the top plate, which makes the top plate manufacturing and assembly process complicated.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a plasma display panel including an electrode inside a partition wall having excellent luminous efficiency and transmittance of an upper substrate.

In addition, an object of the present invention is to provide a plasma display panel including an electrode inside a partition wall capable of preventing deterioration of phosphors and high contrast ratio.

An object of the present invention is to provide a method for manufacturing a partition wall of a plasma display panel having a simple structure and excellent design and productivity.

In order to achieve the above object, the present invention provides a plasma display panel having an upper substrate and a lower substrate provided to face the upper substrate, which is provided between the upper substrate and the lower substrate, and a tube. A partition wall forming a unit discharge space having a shape; An X electrode formed spirally on the partition wall; And a Y electrode formed spirally on the partition wall at a predetermined distance from the X electrode. It provides a plasma display panel having an electrode in the partition wall including a.

Preferably, the X electrode and the Y electrode may be formed in the partition wall at a predetermined distance from the inner peripheral surface of the partition wall.

Also preferably, the partition wall may be formed by stacking a plurality of ceramic sheets having discharge holes corresponding to a unit discharge space.

More preferably, the X electrode and the Y electrode may be formed spaced apart from one side and the other side around the discharge hole provided in the ceramic sheet.

In this case, the X electrode forms a spiral structure by being electrically connected to the X electrode formed on the other side of the discharge hole provided in the neighboring ceramic sheet through the via hole, and the Y electrode is formed around the discharge hole provided in the neighboring ceramic sheet. The spiral structure may be achieved by electrically connecting the Y electrode and the via hole formed at one side thereof.

Also preferably, the X electrode and the Y electrode are electrically connected to each other through a via hole and a plurality of X electrodes and Y electrodes formed on the same side of the discharge hole provided in the predetermined number of ceramic sheets. And a Y electrode assembly, wherein the X electrode assembly and the Y electrode assembly are electrically connected to each other through a via hole and an X electrode assembly and a Y electrode assembly formed on different sides of a discharge hole provided in neighboring ceramic sheets. Can be achieved.

Preferably, the X electrode and the Y electrode may be formed at a predetermined interval from the discharge hole.

Also preferably, the partition wall may include an extension partition wall extending to the lower substrate without forming the X electrode and the Y electrode.

As another aspect of the present invention, (a) forming an X electrode and a Y electrode and a via hole connected to the X electrode or the Y electrode are spaced apart from each other on the surface of the ceramic sheet around the discharge space portion corresponding to each unit discharge space; step; (b) forming a ceramic sheet stack by stacking a plurality of ceramic sheets such that the X electrode and the Y electrode are electrically connected through the via hole and the X electrode and the Y electrode formed in a neighboring ceramic sheet to form a spiral structure, respectively. ; And (c) forming a barrier rib through the discharge holes forming a unit discharge space in the ceramic sheet stack. It provides a partition wall manufacturing method of the plasma display panel comprising a.

Preferably, the step (a) comprises (a1) forming a via hole around each discharge space portion in the ceramic sheet, (a2) filling the via hole, and (a3) And forming an X electrode and a Y electrode spaced apart from each other on the surface of the ceramic sheet. The via hole may be formed to be connected to the X electrode or the Y electrode.

More preferably, the forming of the via hole of (a1) may be performed after the forming of the X electrode and the Y electrode of (a3).

Also preferably, the forming of the X electrode and the Y electrode of (a3) may be performed after the forming of the via hole of (a1).

Preferably, the X electrode and the Y electrode of the step (a3) may be formed spaced apart from the discharge space portion by a predetermined interval.

Preferably, in the step (b), the X electrode and the Y electrode formed on one side and the other side of the discharge space of the ceramic sheet are spaced apart from each other, and the X electrode, the Y electrode, and the via hole formed on the other side and the side of the discharge space of the adjacent ceramic sheet. The ceramic sheets may be laminated so as to be connected to each other to form a spiral structure.

Also preferably, in the step (b), the X electrode and the Y electrode may be electrically connected to each other through a via hole and a plurality of X electrodes and Y electrodes formed on the same side around the discharge space of the predetermined number of ceramic sheets. Stacking ceramic sheets to form an X electrode assembly and a Y electrode assembly, wherein the X electrode assembly and the Y electrode assembly are connected to a neighboring X electrode assembly and a Y electrode assembly through via holes, respectively, to form a spiral structure. And laminating ceramic sheets having the electrode assembly and the Y electrode assembly.

Preferably, the step (b) may further include laminating a protective sheet on the ceramic sheet exposed to the outside of the X electrode and the Y electrode to protect the X electrode and the Y electrode and to connect to an external power source. have.

Also preferably, the step (b) may further include stacking a plurality of sheets on which the X electrode and the Y electrode are not formed so as to extend to the lower substrate.

Preferably, the discharge hole of step (c) may be made of a polygonal or circular tube shape.

As another aspect, the present invention provides a plasma display panel provided in a partition including a partition manufactured by the aforementioned partition wall manufacturing method.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

3 is a cross-sectional view of a plasma display panel according to the present invention, FIG. 4 is an exploded perspective view showing a partition wall of the plasma display panel according to the present invention, and FIG. 5 is a cross-sectional view of a plasma display panel according to another embodiment of the present invention. 6 is a cross-sectional view of a plasma display panel according to another embodiment of the present invention.

As shown in FIG. 3, according to the present invention, the plasma display panel including an electrode in the partition wall is characterized in that the X electrode and the Y electrode constituting the sustain electrode pair are formed in a double spiral in the partition wall. This not only generates vertical discharges in the vertical direction between the X and Y electrodes adjacent to the upper and lower sides of the spiral, but also faces opposite discharges between the X electrodes and the Y electrodes positioned with the discharge space therebetween. It is characterized by minimizing damage and maximizing luminous efficiency.

As shown in FIG. 3, the plasma display panel according to the present invention includes an upper plate 300 having an upper substrate 310 and a lower plate having a lower substrate 110 provided to face the upper substrate 310. 100 and a partition 200 provided between the upper substrate 310 and the lower substrate 110.

Like the general AC surface discharge type plasma display panel illustrated in FIG. 1, the lower plate 100 includes a lower substrate 110, an address electrode 120 formed on the lower substrate 110, and the address electrode 120. A lower dielectric layer 130 formed on the upper portion and a lower partition wall 140 formed on the lower dielectric layer 130 to accommodate the phosphor layer 150 is included.

The upper plate 300 will be described with reference to FIG. 3. In the plasma display panel according to the present invention, unlike the conventional plasma display panel, no electrode is formed on the upper substrate 310. Therefore, the upper plate 300 according to the present invention consists of an upper substrate 310 having no electrode.

As described above, since the bus electrode is not formed on the upper plate 300, the plasma display panel having the electrode formed according to the present invention can prevent a decrease in transmittance caused by the bus electrode or the like. The problem of limiting the selection of electrode materials can be solved. In addition, since the opening ratio is easily secured, a high contrast ratio can be realized, and since the entire upper substrate except the partition wall is used as a black portion, an advantageous quality of high quality color can be achieved.

3 and 4 will be described with respect to the partition wall 200 according to an embodiment of the present invention.

As shown in FIG. 3, the partition wall part 200 includes a partition wall 220 and an X electrode 211 and a Y electrode 212 provided in the partition wall 220.

The partition wall 220 is installed between the upper substrate 310 and the lower substrate 110 to form a tube-shaped unit discharge space 201. In this case, the unit discharge space 201 may be formed in a polygonal or circular tube shape, the partition wall 220 may have a known structure, such as rectangular lattice, honeycomb.

As shown in FIGS. 3 and 4, the X electrode 211 is formed in a spiral shape on the partition wall 220, and the Y electrode 212 is spaced apart from the X electrode 211 on the partition wall 220 by a predetermined distance. It is formed spirally.

In this case, the X electrode 211 and the Y electrode 212 are spaced apart from the inner circumferential surface of the partition wall 220, that is, at a predetermined distance from the unit discharge space 201 formed by the partition wall 220. 220 may be formed inside. This is to allow the gap formed to be spaced apart from the inner circumferential surface of the partition wall 220 to serve as a dielectric layer.

As such, in order to form the X electrode 211 and the Y electrode 212 spirally inside the partition wall 220, the partition wall 220 corresponds to the unit discharge space 201 as shown in FIG. 4. A plurality of ceramic sheets 221 having discharge holes 215 may be stacked and formed. In this case, the discharge hole 215 may be formed after lamination of the ceramic sheet 221 as described below.

As shown in FIG. 4, the X electrode 211 and the Y electrode 212 are spaced apart to prevent a short between the electrodes on one side and the other side of the discharge hole 215 provided in the ceramic sheet 221. It is formed, and has a shape that surrounds the discharge hole 215 as a whole. In addition, as described above, the X electrode 211 and the Y electrode 212 may be formed at a predetermined interval from the discharge hole 215 to allow the spaced portions to serve as dielectric layers.

In addition, the X electrode 211 formed at one side of the discharge hole 215 provided in the ceramic sheet 221 is the X electrode 211 formed at the other side around the discharge hole 215 provided in the neighboring ceramic sheet 221. ) And the via hole 213 is electrically connected to form a spiral structure. In addition, the Y electrode 212 formed at the other side of the discharge hole 215 provided in the ceramic sheet 221 is a Y electrode 212 formed around one side of the discharge hole 215 provided in the neighboring ceramic sheet 221. ) And the via hole 214 is electrically connected to form a spiral structure.

In FIG. 4, two via holes 213 and 214 connected to the X electrode 211 and the Y electrode 212 are provided, respectively. However, the ceramic sheets 221 having the electrodes 211 and 212 and the via holes 213 and 214 are formed. In order to be used in common by rotating, in order to form a spiral structure of the X electrode 211 and the Y electrode 212, respectively, one of the via holes 213 and 214 may be filled (filling). However, alternatively, only one via hole 213 and 214 connected to the X electrode 211 and the Y electrode 212 may be provided to form a spiral structure. 4 illustrates only a part of the ceramic sheet 221, and in fact, each ceramic sheet 221 may be expanded two-dimensionally to form a plurality of unit discharge spaces.

The plasma display panel according to the present invention having the above-described structure not only generates vertical discharge between the vertically adjacent X electrodes 211 and Y electrodes 212, but also opposes the X electrodes 211 facing each other with a discharge space therebetween. Opposite discharges occur simultaneously between the Y electrodes 212 and have the advantage of maximizing discharge efficiency.

Meanwhile, as shown in FIG. 5, the X electrode 211 and the Y electrode 212 may be configured as an aggregate. That is, the X electrode 211 is formed around a plurality of X electrodes and via holes 213 formed on the same side as the X electrode 211 around the discharge holes 215 provided in the predetermined number of ceramic sheets 221. It can be electrically connected through to configure the X electrode assembly 211a. In the same manner, the Y electrode assembly 212a can be configured.

The X electrode assembly 211a and the Y electrode assembly 212a are formed of the X electrode assembly 211a and the Y electrode assembly 212a formed on the other side of the discharge hole 215 provided in the neighboring ceramic sheets 221. And a spiral structure may be configured to be electrically connected to each other through the via holes 213 and 214.

As described above, the X-electrode assembly 211a and the Y-electrode assembly 212a form a spiral structure, so that vertical discharge is formed longer, thereby improving the luminous efficiency.

As illustrated in FIG. 6, the partition wall 220 includes an extension partition wall 225 extending to the lower substrate 110 without forming the X electrode 211 and the Y electrode 212. It can be provided.

As such, the partition wall 200 according to the present invention may be manufactured independently of the upper plate 300 and the lower plate 100, and in particular, the formation of the transparent electrode and the bus electrode on the upper plate 300 is unnecessary, and thus, in the partition wall manufacturing process. The formation of the electrode has the advantage that the assembly and manufacturing process becomes very simple.

That is, when the barrier rib portion 200 is independently manufactured and the barrier rib portion 200 is installed on the upper plate 300 and the lower plate 100 by sealing, the manufacturing of the plasma display panel is completed. In particular, when the extension partition 225 is provided as shown in FIG. 6, the process of the lower plate 100 for manufacturing the lower partition wall 140 of FIG. 3 may be reduced.

Hereinafter, a method of manufacturing the partition wall 220 of the plasma display panel according to the present invention will be described with reference to FIGS. 7 and 8.

7 is a flowchart illustrating a method of manufacturing a partition wall of a plasma display panel according to an embodiment of the present invention, and FIG. 8 is a flowchart of a method of manufacturing a partition wall 220 of a plasma display panel according to another embodiment.

In the method of manufacturing a partition wall of the plasma display panel according to the present invention, as shown in FIGS. 3 to 6, the X electrode 211 and the Y electrode 212 constituting the sustaining electrode pair are double-held in the partition at regular intervals. It is formed to form. That is, the X electrode 211 and the Y electrode 212 are provided at regular intervals to prevent short between the electrodes.

Specifically, forming the electrodes 211 and 212 in the partition wall 220 shown in FIGS. 3 to 6, as shown in FIGS. 7 and 8, (a) the X electrode 211 and the Y electrode 212. ) And via holes 213 and 214, (b) laminating a plurality of ceramic sheets 221 to form a ceramic sheet stack 230, and (c) through-discharging the discharge holes 215. Forming a partition wall 220.

Hereinafter, each step will be described in detail.

(a) the X electrode 211, the Y electrode 212, and Via Holes (213,214)  Forming;

The X electrode 211 and the Y electrode 212 are formed on the surface of the ceramic sheet 221 around the unit discharge space 201 and the corresponding discharge space 217 shown in FIG. Also, via holes 213 and 214 connected to the X electrode 211 or the Y electrode 212 are formed ((a), (b1) and (b2) of FIG. 7).

Preferably, this step (a) may comprise the following steps (a1) to (a3).

( a1 ) On ceramic sheet 211 Via Holes (213,214)  Forming steps

As shown in FIG. 7A, the via hole 213 connected to the X electrode 211 and the via hole connected to the Y electrode 212 are disposed around the unit discharge space 201 and the corresponding discharge space 217. And form 214. The via holes 213 and 214 may be formed in portions extending by extending the X electrode 211 or the Y electrode 212 to the outside to connect the electrodes 211 and 212 formed in each ceramic sheet 221 to the same electrode. have.

Meanwhile, as described above, one via hole 214 may be provided for each electrode 211 and 212, but two via holes 214 may be formed to simplify the manufacturing process. As such, the forming of the via holes 213 and 214 may be performed before or after the step of forming the X electrode 211 and the Y electrode 212 on the surface of the ceramic sheet 221.

( a2 ) remind Via Holes (213,214) Peeling  step

After the via holes 213 and 214 are formed, the via holes 213 and 214 are filled to electrically connect the electrodes 211 and 212. This peeling operation may be performed before or after the step of forming the X electrode 211 and the Y electrode 212 on the surface of the ceramic sheet 221.

( a3 ) Forming an X electrode and a Y electrode

As shown in FIG. 7 (b1), the X electrode 211 and the Y electrode 212 are formed on the surface of the ceramic sheet 221 around the discharge space 217 and spaced apart from each other.

In this case, as described above, the X electrode 211 and the Y electrode 212 may be formed to be spaced apart from the discharge space 217 by a predetermined interval to serve as a dielectric layer. In this case, there is an advantage that a dielectric layer does not need to be separately formed on the surfaces of the electrodes 211 and 212.

Meanwhile, as shown in FIG. 7B so that the X electrode 211 and the Y electrode 212 have a spiral structure, the X electrode 211 and the Y electrode 212 are located on different sides of the discharge space 217. ) Is formed a ceramic sheet 211.

(b) a plurality of ceramic sheets 221 Stacked  Ceramic sheet The laminate 230  Forming;

As shown in FIG. 4, the X electrode 211 and the Y electrode 212 are electrically connected through the X electrode 211 and the Y electrode 212 and the via holes 213 and 214 formed in the neighboring ceramic sheet 221. The ceramic sheet stack 230 is formed by stacking a plurality of ceramic sheets 221 to form spiral structures, respectively.

At this time, as shown in FIG. 4, the X electrode 211 and the Y electrode 212 formed to be spaced apart from one side and the other side of the discharge space portion 217 of the ceramic sheet 221 are adjacent to the ceramic sheet 221. The ceramic sheet is laminated to form a spiral structure by being connected to the X electrode 211, the Y electrode 212, and the via holes 213 and 214 formed on the other side and one side of the discharge space 217.

Alternatively, as shown in FIG. 5, the X electrode assembly 211a and the Y electrode assembly 212a may be stacked to form a spiral electrode structure.

That is, the X electrode 211 is formed around the discharge hole 215 provided in the predetermined number of ceramic sheets 221 and the plurality of X electrodes and via holes 213 formed on the same side as the X electrode 211. It may be to be electrically connected through to configure the X electrode assembly (211a). In the same manner, the Y electrode assembly 212a can be configured.

The X electrode assembly 211a and the Y electrode assembly 212a are formed of the X electrode assembly 211a and the Y electrode assembly 212a formed on the other side of the discharge hole 215 provided in the neighboring ceramic sheets 221. And via the via holes 213 and 214 to be electrically connected to form a spiral structure.

On the other hand, as shown in Figure 8 (c2), to protect the X electrode 211 and the Y electrode 212, the ceramic sheet exposed to the X electrode 211 and the Y electrode 212 to the outside ( The protective sheet 222 may be further stacked on the 221. An external electrode pattern (not shown) connected to an external power source may be formed on the protective sheet 222.

In addition, as shown in FIG. 6, an extended barrier rib 225 may be formed by further stacking a plurality of sheets on which the X electrode 211 and the Y electrode 212 are not formed to extend to the lower substrate 110. have.

(c) the ceramic sheet On stack 230 Discharge hole 215  Forming a barrier rib 220 by penetrating through it;

In the step (b), the lamination is completed, and the ceramic sheet laminate 230 in which the spiral electrodes 211 and 212 are formed is compressed to form a discharge hole 215 constituting a unit discharge space.

As such, when the discharge hole 215 is formed, the partition wall 220 is formed in the periphery thereof.

At this time, the discharge hole 215 may be made of a polygonal or circular tube shape.

In addition, as shown in FIG. 3, after the barrier ribs 200 including the electrodes 211 and 212 formed on the barrier ribs 220 are independently manufactured, the barrier rib portions (such as the upper plate 300 and the lower plate 100) may be sealed. When the 200 is installed, the manufacturing of the plasma display panel is completed.

As described above, according to the present invention, unlike the conventional PDP, by installing the electrode on the partition wall to eliminate the electrode on the upper substrate to obtain an electrode structure of the plasma display panel excellent in luminous efficiency and transmittance of the upper substrate and can realize a high contrast ratio Can achieve the effect.

In addition, it is possible to maximize the discharge efficiency and prevent the deterioration of the phosphor by generating a vertical discharge between the electrodes formed on the opposite surface with the discharge space in between and the electrodes formed above and below the partition wall. have.

In addition, according to the present invention, an electrode structure of a plasma display panel having a simple structure and excellent design freedom and productivity can be obtained.

While the invention has been shown and described with respect to specific embodiments thereof, those skilled in the art can variously modify the invention without departing from the spirit and scope of the invention as set forth in the claims below. And that it can be changed. Nevertheless, it will be clearly understood that all such modifications and variations are included within the scope of the present invention.

Claims (19)

A plasma display panel comprising an upper substrate and a lower substrate provided to face the upper substrate. A partition wall disposed between the upper substrate and the lower substrate to form a unit discharge space having a tube shape; An X electrode formed spirally on the partition wall; And A Y electrode formed spirally on the partition at a predetermined distance from the X electrode; Plasma display panel having an electrode in the partition including a. The method of claim 1, And the X electrode and the Y electrode are formed in the partition wall at a predetermined distance from the inner circumferential surface of the partition wall. The method of claim 1, The partition wall includes a plurality of ceramic sheets having discharge holes corresponding to the unit discharge space is formed in the plasma display panel having an electrode inside the partition wall. The method of claim 3, And the X electrode and the Y electrode are spaced apart from one side and the other side around the discharge hole provided in the ceramic sheet. The method of claim 4, wherein The X electrode forms a spiral structure by being electrically connected to the X electrode formed on the other side of the discharge hole provided in the neighboring ceramic sheet through the via hole. And the Y electrode has a spiral structure by electrically connecting the Y electrode formed on one side of the discharge hole of the neighboring ceramic sheet through a via hole to form a spiral structure. The method of claim 4, wherein The X electrode and the Y electrode are electrically connected to a plurality of X electrodes and Y electrodes formed on the same side of each of the discharge holes provided in the predetermined number of ceramic sheets through via holes to form the X electrode assembly and the Y electrode assembly. Made up, The X electrode assembly and the Y electrode assembly are partitioned to form a spiral structure by being electrically connected to each other through a via hole and an X electrode assembly and a Y electrode assembly formed on different sides of a discharge hole provided in neighboring ceramic sheets. A plasma display panel having an electrode therein. The method according to any one of claims 4 to 6, And the X electrode and the Y electrode are formed at predetermined intervals from the discharge hole. The method of claim 1, The partition wall has an electrode inside the partition wall, characterized in that the bottom electrode and the X electrode and the Y electrode is not formed and extending to the lower substrate extending. (A) forming an X electrode and a Y electrode and a via hole connected to the X electrode or the Y electrode to be spaced apart from each other on the surface of the ceramic sheet around the discharge space portion corresponding to each unit discharge space; (b) forming a ceramic sheet stack by stacking a plurality of ceramic sheets such that the X electrode and the Y electrode are electrically connected through the via hole and the X electrode and the Y electrode formed in a neighboring ceramic sheet to form a spiral structure, respectively. ; And (c) forming a barrier rib through the discharge holes forming a unit discharge space in the ceramic sheet stack; Partition wall manufacturing method of the plasma display panel comprising a. The method of claim 9, The step (a) comprises the steps of (a1) forming a via hole around each discharge space portion in the ceramic sheet, (a2) filling the via hole, and (a3) a surface of the ceramic sheet around the discharge space portion. Forming an X electrode and a Y electrode spaced apart from each other, And the via hole is connected to the X electrode or the Y electrode. The method of claim 10, The forming of the via hole of (a1) is performed after the forming of the X electrode and the Y electrode of (a3). The method of claim 10, The forming of the X electrode and the Y electrode of (a3) is performed after the forming of the via hole of (a1). The method of claim 10, And the X electrode and the Y electrode of step (a3) are spaced apart from the discharge space portion by a predetermined interval. The method of claim 9, In the step (b), the X electrode and the Y electrode formed to be spaced apart from one side and the other side of the discharge space portion of the ceramic sheet are connected through the X electrode, the Y electrode, and the via hole formed on the other side and the side of the discharge space portion of the neighboring ceramic sheet, respectively. And stacking ceramic sheets so as to form a spiral structure. The method of claim 9, In the step (b), the X electrode assembly and the Y electrode are electrically connected to each other through a via hole and a plurality of X electrodes and Y electrodes formed on the same side of the discharge space of the predetermined number of ceramic sheets, respectively. Stacking ceramic sheets to form a Y electrode assembly; Laminating ceramic sheets including the X electrode assembly and the Y electrode assembly so that the X electrode assembly and the Y electrode assembly are connected to the neighboring X electrode assembly and the Y electrode assembly respectively via via holes to form a spiral structure, respectively. A barrier rib manufacturing method of a plasma display panel. The method of claim 9, The step (b) further comprises the step of laminating a protective sheet on the ceramic sheet exposed to the X electrode and the Y electrode to the outside to protect the X electrode and the Y electrode and to connect to an external power source. Method for manufacturing partition walls of display panels. The method of claim 9, The step (b) further comprises the step of stacking a plurality of sheets on which the X electrode and the Y electrode is not formed so as to extend to the lower substrate. The method of claim 10, The discharge hole of step (c) is a manufacturing method of the partition wall of the plasma display panel, characterized in that the polygonal or circular tube shape. A plasma display panel including an electrode in a partition including a partition manufactured by the method of manufacturing the partition of claim 9.

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