KR100702013B1 - Robot control system of semiconductor diffusion equipment - Google Patents

Abstract

Provided is a robot control system for semiconductor diffusion equipment. In the robot control system of the semiconductor diffusion equipment, the robot control system of the semiconductor diffusion equipment to control the operation of the diffusion process of the process, and the robot is installed on a plurality of axes to load and unload the wafer into the diffusion path, A driving unit installed on a plurality of axes to drive the robots, and electrically connected to the driving unit, may be provided with a monitoring unit for checking the operating state of the robot in real time. In this case, the monitoring unit displays a first display unit for displaying the driving speed of the robot, a second display unit for displaying the driving position of the robot, a third display unit for displaying the current set value of the driving unit, and a current measurement value of the driving unit And a fourth display portion.

Description

Robot control system of semiconductor diffusion equipment

1 is a perspective view showing a robot control system of a semiconductor manufacturing facility of the present invention.

FIG. 2 is an enlarged perspective view showing the symbol A shown in FIG. 1.

Figure 3 is a block diagram showing the operation of the robot control system of the semiconductor manufacturing equipment of the present invention.

Figure 4 is a flow chart showing an embodiment of a robot control system according to the present invention.

5 is a flowchart showing another embodiment of the robot control system according to the present invention.

** Explanation of Signs of Major Parts of Drawings **

100: loading unit

210: robot arm

220: transfer

230: lift

211, 212, 231: 1,2,3 motors

212, 222, 232: 1,2,3 encoder

310: boat

500: monitoring unit

590 control unit

600: Alarm

700: image display

The present invention relates to a robot control system of a semiconductor diffusion device, and more particularly to a robot control system of a semiconductor diffusion device capable of monitoring the driving speed and the driving position of the robot.

Generally, wafers are fabricated through repetitive processes such as photography, diffusion, etching, chemical vapor deposition, and metal film wiring.

A semiconductor diffusion apparatus performing a double diffusion process includes a wafer transfer device for transferring one or more wafers to be processed, and robots for loading and unloading the wafers into a process chamber.

The robots are driven while moving along the respective axes installed in a predetermined direction according to the process conditions. The driving of these robots is driven by the driving force of the motors installed on the respective axes. The motors are further equipped with encoders for detecting the driving speed and the driving position of the robots.

In addition, the motors are connected to a power source and a power cable to which a predetermined current is applied as well as receiving driving force from the outside. The encoder is connected to the motor and the encoder cable to detect the operation of the motor.

Therefore, when the robots repeatedly move up and down or left and right along each axis, the encoder cable and the power cable are disconnected.

In addition, since there is no means for visually monitoring the driving speed and the driving position of the robots moving in this way, there is a problem that the operator can not immediately check the abnormal operation of the robots due to the failure of the motor. .

In such a case, if the process for the wafer is made as it is, there is a problem of raising the cost of airborne by causing product defects and process accidents of the bulk wafer.

Therefore, the present invention has been made to solve the above problems, the object of the present invention is to check the driving speed and the driving position of the robots in real time, and can be visually confirmed by measuring the current value of the motors driving the robots The present invention provides a robot control system for semiconductor diffusion equipment.

It is another object of the present invention to provide a robot control system of a semiconductor diffusion device which prevents mass product defects and process accidents by immediately stopping the process when the measured current value of the motors is different from the preset current value by comparing the measured current value with the preset current value. Is in.

The robot control system of a semiconductor diffusion apparatus according to an aspect of the present invention for solving the above problems is a diffusion path in which a process is performed, and the operation of robots installed on a plurality of axes to load and unload wafers into the diffusion path A robot control system of a semiconductor diffusion facility for controlling a power supply, comprising: a driver installed on the plurality of axes and electrically connected to the driver, and a monitoring unit configured to check an operation state of the robot in real time.

In one embodiment according to an aspect of the present disclosure, the driving unit may include motors driving the robots by receiving current from the outside, and encoders connected to the motors.

In one embodiment according to an aspect of the present disclosure, the monitoring unit may include a first display unit displaying driving speeds of the robots, a second display unit displaying driving positions of the robots, and a current setting value of the motors. And a third display unit and a fourth display unit for displaying current measurement values of the motors.

In another embodiment, the monitoring unit may be further provided with an input unit for selectively inputting the current set value of the motor.

In another embodiment, the monitoring unit may be further provided with a selection unit for selecting any one of the motors to selectively input the current set value through the input unit.

In another embodiment, the monitoring unit may further include a control unit for stopping the driving of the robot if the current measurement value of the motor is different from the current set value.

In another exemplary embodiment, the monitoring unit may further include an image display unit configured to compare the driving speed and the driving position of the robots with each other, compare the current measurement values of the motors with the current setting values, and display the images.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the robot control system of the semiconductor diffusion equipment of the present invention.

1 is a perspective view schematically showing a robot control system of a semiconductor diffusion apparatus of the present invention.

Referring to FIG. 1, the robot control system of the semiconductor diffusion apparatus of the present invention loads and spreads a wafer W into a diffusion path 400 which performs a diffusion process on the wafer W, and the diffusion path 400. It is mounted on a semiconductor diffusion facility having robots 210, 220, 230 installed on a plurality of axes X, Y, and R for unloading.

The robots 210, 220, and 230 are a transfer 210 for transferring the wafers W loaded on the carrier 110 from the loading unit 100 to the boat 310, and an upper portion of the transfer 210. It may include a robot arm 220 mounted on the pick-up wafers (W) and a lift (230) for loading a plurality of wafers (W) to raise and lower the boat 310 to be introduced into the diffusion path (400). have.

The plurality of axes (X, Y, R) of the robot arm 220 and the X-axis installed so that the transfer 210 can be moved, mounted on the transfer 210 to pick up the wafer (W) It may include an R axis that is a rotation axis and a Y axis that the lift 230 moves up and down.

Here, a driver 270 (see FIG. 3) for driving the robots 210, 220, and 230 may be further installed on the axes X, Y, and R.

The driving unit 270 is motors 211, 221, and 231 installed on the plurality of axes X, Y, and R to drive the robots 210, 220, and 230, and each motor 211. , 221 and 231 may be further equipped with encoders 212, 222, and 232 to detect driving speeds and driving positions of the robots 210, 220, and 230.

The motors 211, 221, and 231 are first, second, and third motors 211, 221, and 231 installed on the X, Y, and R axes, and the encoders 212, 222, and 232 are the first. And second and third encoders 212, 222 and 232 further mounted to the second and third motors 211, 221 and 231.

In addition, the monitoring unit 500 may be electrically connected to the driving unit 270 to check the driving state of the robots 211, 221, and 231 in real time.

Next, the configuration of the monitoring unit 500 will be described in detail with reference to FIGS. 1 and 2.

1 and 2, the monitoring unit 500 may include a first display unit 514 displaying driving speeds of the robots 210, 220, and 230, and the robots 210, 220, and 230. A second display unit 515 for indicating a driving position of the motor; a third display unit 531 for displaying current setting values of the motors 211, 221, and 231; and currents of the motors 211, 221, and 231. It may include a fourth display unit 532 for displaying the measurement value.

The first display unit 514 displays a first axis displaying the axes X, Y, and R of the robots 210, 220, and 230 such as the transfer 210, the robot arm 220, and the lift 230. The panel 510 and the second panel 511 displaying the driving speeds of the robots 210, 220, and 230 may be configured.

The second display unit 515 may include a third panel 512 including the first panel 510 to display driving positions of the robots 210, 220, and 230.

The third display unit 531 is a fourth panel 532 which displays a current set value to be applied to the first, second and third motors 211, 221, and 231 installed on the axes X, Y, and R. Can be configured.

The fourth display unit 533 may be configured as a fifth panel 534 that displays a current measurement value measured when the first, second and third motors 211, 221, and 231 operate.

In addition, the third and fourth display units 531 and 533 may include a sixth panel 535 that displays the motors 211, 221, and 231 so as to be distinguished from each other.

In addition, the monitoring unit 500 may be further provided with an input unit 550 for selectively inputting the current set value of the first, second, third motors 211, 221, 231. The input unit 550 may include a lifting button 551 for adjusting the current set value up and down, and a set button 552 for setting the current setting value to the controller 590 (see FIG. 3) when the current setting is completed.

In addition, the monitoring unit 500 selects any one of the first, second, third motors 211, 221, 231, the selection unit 570 to set the current set value through the input unit 550 The selector 570 may be a selection button to sequentially select the first, second and third motors 211, 221, and 231 through pressing operations.

The monitoring unit 500 may further include an interlock button 580 for forcibly stopping the driving and the process of the robots 210, 220, and 230.

Referring to FIG. 3, current monitoring values of the motors 211, 221, and 231 are transmitted to the monitoring unit 500, and current preset values may be preset, and the current measured values and the preset current set values may be different from each other. The control unit 590 may further include driving the robots 210, 220, and 230 and stopping the process when the current measurement value is different from the current setting value.

The controller 590 is electrically connected to the motor driver 290 for driving the motors 211, 221, and 231 to stop driving of the robots 210, 220, and 230. ) To send a stop signal.

The monitoring unit 500 may further include an image display 700 which displays an image to visually check the driving speeds and driving positions of the robots 210, 220, and 230. In addition, the image display unit 700 may receive a signal from the control unit 590 and display the current measurement value and the current setting value of the motors 211, 221, 231 as images.

Next, the driving of the robot control system configured as described above will be described with reference to the accompanying drawings.

1 and 2, the transfer 210 receives a driving force from the first motor 211 to which a current is applied and moves to the loading unit 100 along the X axis. At this time, the first encoder 212 detects the driving speed and the driving position of the transfer 210 and transmits it to the control unit 590 (see FIG. 3), and the control unit 590 transmits the received driving speed and driving position. It is transmitted to the monitoring unit 500 and the image display 700 to display digital values and images.

Subsequently, the second motor 221 rotates the robot arm 220 by providing a driving force to the R-axis to pick up one or more wafers W of the loading part 100. In this case, as described above, the second encoder 222 senses the driving speed and the driving position of the robot arm 220 and transmits the same to the controller 590, and the controller 590 is connected to the monitoring unit 500. The driving speed and the driving position are transmitted to the image display 700 so as to display the digital numerical value and the image.

Next, the transfer 210 moves along the X axis toward the boat 310, and at this time, the first encoder 212 installed in the first motor 211 performs the same function as described above. Subsequently, the robot arm 220 loads the wafer W into the boat 310.

The boat 310 loaded with the predetermined number of wafers W rises and enters the diffusion path 400. Here, the boat 310 is operated through the lift operation of the lift 230, the third motor 231 installed on the Y-axis provides a driving force to the lift (230).

In this case, the third encoder 232 detects the driving speed and the driving position of the lift 230 and transmits it to the control unit 590 as an electrical signal, and the control unit 590 is connected to the monitoring unit 500 and the image. The display 700 may display digital values and images.

Therefore, referring to FIGS. 2 to 4, the first panel 510 displays a recognition number (not shown) that can be recognized for each of the robots 210, 220, and 230, and the second and third panels 511. , 512, the driving speed and the driving position of the robots 210, 220, 230 may be displayed as digital values, and the image display 700 may be displayed as an image such as a graph so that an operator may check in real time. have.

In addition, the robot control system may further include first, second and third detectors 212, 222, and 232 to measure current values generated when the first, second, and third motors 211, 221, and 231 are driven. Can be.

The current measurement values measured by the first, second, third detectors 212, 222, and 232 are transmitted to the control unit 590, and the control unit 590 receiving the received currents is compared with the preset current setting values.

At this time, if the current measurement value measured in any one of the first, second, third motors 211, 221, 231 is different from the current set value, the control unit 590 transmits an electrical signal to the motor driving unit 290 The driving of the motors 211, 221, and 231 may be stopped, and at the same time, the process may be stopped.

Therefore, when the driving motors 211, 221, 231 operate abnormally, for example, when an applied current value is higher or lower than a current setting value, the process may be immediately stopped to prevent a process accident.

In addition, as described above, the current measurement value and the preset current setting value transmitted to the control unit 590 may be displayed as digital values and images through the monitoring unit 500 and the image display unit 700. In this case, the current measurement value and the current setting value may be displayed as digital values on the fourth and fifth panels 532 and 534 displayed for each of the motors 211, 221, and 231.

Here, the sixth panel 535 may be divided and displayed by the first, second, and third motors 211, 221, and 231.

Meanwhile, when the driving of the motors 211, 221, 231 is stopped or the process is stopped as described above, the controller 590 may generate an alarm for notifying the process stop through the alarm 600 electrically connected. Can be.

Referring to FIG. 5, the controller 590 may further input driving speed set values of the robots 211, 221, and 231, and the driving speeds measured by the encoders 212, 222, and 232. In comparison with each other, if the driving speed measurement value is out of the range of the driving speed setting value, the driving of the motors 211, 221, 231 may be stopped and the process may be stopped.

The driving speed set value range is preferably set to a standard speed range in which the robots 210, 220, and 230 do not operate abnormally. Although not shown in the drawing, an additional panel for displaying the driving speed set value may be further installed in the monitoring unit 500, and the driving speed set value may be further displayed as an image through the image display unit 700. have.

Therefore, according to the robot control system of the semiconductor manufacturing equipment of the present invention, the operator can confirm in real time by displaying the driving speed and the driving position of the robots to drive the process in digital values and images, and accordingly Process accidents caused by abnormal operation can be prevented in advance.

In addition, the current measurement value of the motors providing the driving force to the robots in real time, and compared to a preset current set value, if the abnormal current, that is, outside the range of the current set value by stopping the motor driving and process process process and accordingly There is an effect to reduce the manufacturing cost and labor costs.

Claims (7)

In the robot control system of the semiconductor diffusion equipment to control the operation of the diffusion process in the process, and the robot is installed on a plurality of axes to load and unload the wafer into the diffusion path, A driving unit installed on the plurality of axes to drive the robots; Is electrically connected to the drive unit, including a monitoring unit for checking the operating state of the robot in real time, The monitoring unit may include: a first display unit displaying driving speeds of the robots; a second display unit displaying driving positions of the robots; a third display unit displaying current setting values of the driving unit; and a current measurement value of the driving unit; A robot control system for semiconductor diffusion equipment comprising a fourth display portion. The method of claim 1, The driving unit includes a motor for driving the robot by receiving a current from the outside, and the robot control system of the semiconductor diffusion equipment, characterized in that the encoder connected to the motor. delete The method of claim 2, The monitoring unit further comprises an input unit for selectively inputting the current set value of the motor, the robot control system of the semiconductor diffusion equipment. The method of claim 2, The monitoring unit further comprises a selection unit for selecting any one of the motors to selectively input the current set value through the input unit, the robot control system of the semiconductor diffusion equipment. The method of claim 2, The monitoring unit further comprises a control unit for stopping the driving of the robot if the current measurement value of the motor is different from the current setting value robot control system of the semiconductor diffusion equipment. The method of claim 2, The monitoring unit may further include an image display unit which compares the driving speed and the driving position of the robots with each other, compares the current measurement value of the motors with the current setting value, and displays an image. .

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