KR100689985B1 - Specular surface manufacturing method of LED chip housing and thereof - Google Patents

Abstract

The present invention relates to an LED chip housing and a reflective surface processing method of the LED chip housing.

The LED chip housing includes an opening of the LED chip housing including a rectangular frame body 10, a concave concave space 20 circularly concave inside the rectangular frame body 10, and openings 30 formed on both sides of the concave space. The reflective surface A is formed over the remaining bottom 22 and the circumferential wall 24 except for 30), and the reflective surface processing method of the LED chip housing manufactures an LED chip housing having a recessed space for fixing the LED chip. And rotating the polishing tip or the LED chip housing to the manufactured LED chip housing to form reflective surfaces on the inner wall and the bottom of the recessed space of the LED chip housing.

The present invention prevents deterioration of the LED chip by reflecting light and provides an LED chip housing with improved illumination.

LED chip, housing.

Description

LED chip housing and reflective surface processing method of the LED chip housing

1 is a perspective view showing the structure of the LED chip of the present invention,

Figure 2 is a cross-sectional view of the installation state of the LED chip of the present invention,

3 is a schematic cross-sectional view for explaining a processing method of the LED chip housing of the present invention.

※ Explanation of codes for main parts of drawing

1: housing, 2: drill tip, 3: drill chuck, 4: LED chip, 10: square frame, 20: recessed space,

22: floor, 24: circumference, 30: openings,

The present invention relates to an LED chip housing and a reflective surface processing method of the LED chip housing.

In general, in the case of arranging a plurality of LEDs to form an LCD liquid crystal panel, they are arranged using an LED chip housing.

Popular lighting fixtures, such as halogen lamps, have low energy consumption, long lifespan, and LED assemblies, which are advantageous for obtaining various lighting effects, are used as lighting lamps.

In this case, the problem of the arrangement of the LED is a method of treating the heat dissipated. For this purpose, a hole is formed to cool the air, and a housing material having high reflectance is adopted.

However, even in an LED chip housing having such a cooling structure and reflectance, heat treatment and improvement of illuminance at the time of light emission are required to achieve more effective application in a light fixture or a liquid crystal panel in which LEDs are integrated.

In view of the above necessity, the present invention effectively reflects the light emitted in the LED chip arrangement state, thereby increasing the light reflection effect and improving the illuminance, thereby simultaneously reflecting the heat emitted to prevent the degradation of the LED chip. The purpose is to provide an LED chip housing.

In addition, an object of the present invention is to provide a processing method in which the reflective surface is processed by mechanical polishing the bottom and sidewalls of the recessed space in providing the reflective surface to the LED chip housing.

Reflective surface processing method of the LED chip housing of the present invention for achieving the above object,

A method of manufacturing an LED chip housing having a concave space for fixing an LED chip; and forming a reflective surface on the inner wall and the bottom of the concave space by rotating / polishing a polishing tip on the manufactured LED chip housing.

The LED chip housing of the present invention for achieving the above object is preferably to form a reflective surface (A) over the bottom and the inner wall of the recessed space in which the LED chip is disposed.

The present invention LED chip housing for achieving the above object,

A reflective surface is formed on the bottom and the main wall of the remaining recessed space except for the opening of the LED chip housing, which is formed of a rectangular frame body, a recessed space circularly recessed inside the rectangular frame body, and a plurality of openings formed at both sides of the recessed space. .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing the structure of the LED chip of the present invention, Figure 2 is a cross-sectional view of the installation state of the LED chip of the present invention.

The LED chip housing 1 of the present invention according to the drawings,

A rectangular frame body 10, a concave concave space 20 is formed in the interior of the rectangular frame 10, and the opening 30 formed on both sides of the concave space, the opening 30 of the LED chip housing The reflective surface A may be formed over the remaining bottom 22 and the circumferential wall 24. At this time, the circumferential wall 24 preferably forms an inclined surface at a predetermined angle.

The opening 30 forms a drawing hole 12 at both sides of the bottom part to draw the power line of the LED chip, and the rectangular frame body 10 is modified in various ways by the design change of the housing 1. Is possible.

The assembly with the LED chip of the present invention is completed by placing the LED chip 4 at the center of the bottom 22 of the concave space 20.

3 is a schematic cross-sectional view for explaining the processing method of the LED chip of the present invention.

Referring to the processing method of the present invention according to the drawings as follows.

<1 step>

An LED chip housing 1 having an LED chip fixing recess 20 is manufactured.

The manufactured LED chip housing 1 includes a rectangular frame body 10, a concave concavity space 20 recessed in a circular shape inside the rectangular frame body 10, and openings 30 formed at both sides of the concave space.

The opening 30 forms a drawing hole 12 at both sides of the bottom thereof to draw the power line of the LED chip, and the rectangular frame body 10 is set in the housing 1.

<2 step>

In the state where the LED chip housing 1 is temporarily fixed on the pedestal, the rotary drill 3 equipped with the polishing tip 2 is rotated and polished in the concave space 10 of the LED chip housing 1 so that the concave space ( 20) The reflection surface A is formed in the inner wall 24 and the bottom 22. As shown in FIG.

Meanwhile, in the reflective surface polishing process of the LED chip housing 1 of the present invention, the reflective surface may be processed by rotating the LED chip housing 1 in a fixed state without rotating the polishing tip 2. At the same time as the polishing tip 2 rotates, the LED chip housing 1 can also be rotated to process the reflective surface.

In particular, the housing 1 having such a reflective surface has a polishing tip 2 in which the main wall 24 of the recessed space 20 to which the LED chip 4 is fixed is inclined at a predetermined angle and rotated / polished therein. Correspondingly, the inclined surface is formed.

This embodiment of the present invention will belong to all methods of polishing the reflective surface by mechanical polishing the concave space in the housing of the present invention.

Conventionally, although a certain degree of gloss was expected by using the LED chip housing as a part of LCD liquid crystal by plating in the state of manufacturing of the housing, the housing in which the reflective name is machined is plated as in the present invention. The reflectivity of the reflectance has a marked difference in the reflectance as in the mirror surface, and as a result, the amount of light of the liquid crystal panel or the lighting fixture, as well as illuminance and deterioration are greatly improved.

The LED chip housing of the present invention made as described above improves the problems of overheating and lack of light generated in the chip housing of the non-reflective structure of the LED chip installed in the LED chip housing. By reflecting, the amount of light through the LED chip includes reflected light in addition to the inherent amount of light, thereby increasing the amount of light, and also reflecting heat during light emission, thereby preventing deterioration of the LED chip.

Claims (6)

delete In the LED chip housing, A rectangular frame body 10 and a recessed space 20 having a reflective surface A formed on the bottom 22 and the entire inner wall 24 of the rectangular frame body 10 while being circularly recessed are formed. The LED chip housing, characterized in that the opening 30 is formed on both sides of the concave space (20). delete In the reflective surface processing method of the LED chip housing, Manufacturing an LED chip housing 1 having an LED chip fixing recess 20; And Half of the LED chip housing comprising the step of forming the reflective surface A on the inner wall 24 and the bottom 22 of the recessed space 20 by rotating / polishing the recessed space 20 of the LED chip housing 1 Slope processing method. The method of claim 4, wherein Reflecting surface processing method characterized in that to form a reflecting surface (A) by rotating the LED chip housing (1) in the fixed state of the polishing tip (2). The method of claim 4, wherein Reflective surface processing method, characterized in that to rotate the polishing tip (2) and at the same time to rotate the LED chip housing (1) to form a reflective surface (A).

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