KR100681497B1 - Apparatus for bonding multi-layer substrate temporarily - Google Patents

Abstract

An apparatus for bonding a multi-layer substrate temporarily is provided to reduce an error rate of the substrate without pressing the substrate by melting and bonding between the substrates through a high frequency. An apparatus for bonding a multi-layer substrate temporarily includes a jig plate(120), a main body, an upper high frequency induction heater(160), a lower high frequency induction heater(170), and a lift unit(180). The main body has a jig plate. The substrates having a conductive layer formed on an insulation material are stacked and installed on the jig plate(120). The upper and lower frequency induction heaters(160,170) are arrayed on the outermost upper and lower parts of substrates installed on the jig plate(120). The upper and lower frequency induction heaters(160,170) are supported by the main body to perform a relative movement to be close and away. The upper and lower frequency induction heaters(160,170) are melted between the substrates when the upper and lower frequency induction heaters(160,170) are contacted with the outermost upper and lower planes of the substrates. The lift unit(180) moves relatively between the upper and lower frequency induction heaters(160,170).

Description

Apparatus for bonding multi-layer substrate temporarily}

1 is a plan view of a multi-layer substrate temporary bonding apparatus according to an embodiment of the present invention.

Figure 2 is a front view of the multi-layer substrate temporary bonding apparatus shown in FIG.

Figure 3 is a side view of the multi-layer substrate temporary bonding apparatus shown in FIG.

FIG. 4 is a perspective view of the high frequency bonding head taken from FIG. 3; FIG.

5 is a side cross-sectional view of FIG. 4.

<Brief description of the major symbols in the drawings>

10. Substrate 11. Insulation

12..Conductor Floor 13..Guide Hole

110. Main body 120. Jig plate

150. High frequency bonding head 160. High frequency heater

161 .. Upper Derivative Core 162 .. Upper Coil

170..Lower high frequency heater 171..Lower derivative core

172. Lower coil 180. Lift means

The present invention relates to a multi-layer substrate temporary bonding apparatus, and more particularly, to a multi-layer substrate temporary bonding apparatus having an improved structure so as to be able to press-fit a plurality of substrates in a non-pressurized manner in manufacturing a multilayer substrate.

In general, a multilayer board has a structure in which an insulating layer and a conductive layer are alternately stacked to realize integrated circuits and high density of circuits. Such a multilayer board is integrated by stacking a plurality of substrates having a patterned conductive layer on an insulating material, followed by heat-compression bonding at high temperature and high pressure.

Since the alignment between the substrates may be disturbed in the process of heat-compressing and fusion bonding the substrates as described above, it may be necessary to prevent the defects. To this end, according to the related art, the alignment state is maintained by inserting a brass fixing member having one end opening into the alignment holes formed in the substrates, and then pre-assembling between the substrates by extending the open portion of the fixing member to the outside. Here is an example. However, in this case, since a separate fixing member is consumed to pre-assemble the substrates, it may cause a rise in manufacturing cost in mass production. In addition, fine brass powder is generated in the process of extending the fixing member to the outside to penetrate between the substrates, which may cause a short defect. When the gap between the alignment holes and the conductive layer is sufficiently secured, the substrate may be prevented. The size of Mg becomes excessively large, and thus manufacturing cost may increase. In addition, in the process of expanding the fixing member, the substrates located at the outermost sides may be lifted, which may cause adhesion failure. In addition, the plate on which the stacked substrates are placed may be damaged by the end of the fixing member protruding from the substrate in the process of being pressed for the fusion operation, thereby shortening the life.

In order to solve this problem, there is an invention disclosed in Korean Patent Publication No. 10-0276209 registered by the applicant. According to this configuration, the substrates may be partially fused and temporarily bonded by contacting the metal rods, which are the fusion heaters, with the substrates positioned at the outermost sides, respectively, and heat-pressing them from the upper and lower portions in the stacked state of the substrates. In this case, there is a possibility that misalignment may occur due to twisting between the substrates in the process of pressing the metal rod to the substrate, and there is a possibility that the problem of temporary bonding may be caused by deterioration of the fusion effect due to deformation of the metal rod due to repeated pressing. .

The present invention is to solve the above problems, by partially fusion bonding between the substrate constituting the multi-layer substrate using a high frequency, it is not necessary to pressurize the substrates to reduce the failure rate, maintenance can be advantageous In addition, it is an object of the present invention to provide a multi-layer substrate temporary bonding apparatus capable of temporarily bonding a larger number of substrates than the electrothermal method.

Multi-layer substrate temporary bonding apparatus according to the present invention for achieving the above object,

A main body having a jig plate on which a plurality of substrates having a conductive layer patterned thereon are stacked and stacked on an insulating material;

The substrates are respectively disposed on the outermost upper and lower sides of the substrates seated on the jig plate and are respectively supported by the main body to allow relative movements closer to and farther from each other, and in contact with the outermost upper and lower surfaces of the substrates, respectively. A plurality of high frequency bonding heads each having an upper and a lower high frequency induction heater to allow at least some of the substrates to be fused; And

And lifting means for relatively moving between the upper and lower high frequency induction heaters.

Here, the upper and lower high frequency induction heater is preferably provided with a derivative core positioned opposite to the substrates, and a coil wound around the derivative core and supplied with a high frequency power.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view of a multi-layer substrate temporary bonding apparatus according to an embodiment of the present invention, Figures 2 and 3 are a front view and a side view of the multi-layer substrate temporary bonding apparatus shown in FIG.

1 to 3, a multi-layer substrate temporary bonding apparatus 100 according to an embodiment of the present invention may be formed between the substrates 10 before the plurality of substrates 10 are fused to each other and integrated into the multilayer substrate. For temporary bonding, a main body 110, a jig plate 120 and high frequency bonding heads 150 installed in the main body 110 are provided.

The jig plate 120 has a structure in which a plurality of substrates 10 are stacked and stacked on the upper surface, and along the horizontal guide rail 131 shown in FIG. 3 to easily raise and lower the substrate 10. The main body 110 is installed in the main body 110 to be pulled outward from the main body 110. The jig plate 120 may be transported by the rodless cylinder 132, as shown in FIGS. 2 and 3. That is, the rodless cylinder 132 is supported by the bracket 111 installed in the main body 110, and the connection block 133 fixed to one side of the jig plate 120 is fixed to the rodless cylinder 132. The jig plate 120 may be transferred by being coupled.

It is preferable that shock absorbers 135 and 136 are respectively installed on the bracket 111 and the connection block 133. The short absorbers 135 and 136 are applied to the substrates 10 placed on the jig plate 120 due to the inertial force generated when the jig plate 120 is transferred by the rodless cylinder 132. To be prevented. In addition, the sensors 137 and 138 capable of detecting the position of the jig plate 120 are provided on the transfer path of the jig plate 120, so that driving of the rodless cylinder 132 may be controlled. Alternatively, the jig plate 120 may be manually transported.

Referring to FIG. 4, the substrates 10 stacked on the jig plate 120 have a structure in which a conductive layer 12 is patterned on an insulating material 11, and a conductive layer 12 is formed. Guide holes 13 are formed at edges of the non-insulating material 11, respectively. Since the jig pins 121 protruding from the top surface of the jig plate 120 are sequentially inserted into the guide holes 13 formed in the substrates 10, the gaps between the substrates 10 may be assumed. A plurality of guide holes 13 are formed per substrate 10, and a plurality of jig pins 121 may be provided correspondingly. On the other hand, the jig plate as described above may be provided in plurality in order to increase the productivity. That is, in the jig plate located on one side of the plurality of jig plates, while the laminated substrates are temporarily bonded by the high frequency bonding heads, the jig plate located on the other side allows the substrates to be temporarily bonded to be laminated in advance to wait for productivity. Can be improved. Such jig plates may be transported in a conventional non-cyclic orbit manner, but are not limited thereto and may be transported by various methods.

Referring back to FIGS. 1 to 3, side plates 112 are provided on both sides of the jig plate 120 in a direction in which the jig plate 120 is transferred, and high frequency bonding heads 150 are arranged on the side plates 112, respectively. Is fixed. Here, the high frequency bonding heads 150 are positioned to correspond to the cutouts 122 formed in the jig plate 120, respectively. The spacing between the side plates 112 is preferably adjustable, because the spacing between the high frequency bonding heads 150 is also adjustable due to the spacing control between the side plates 112, the substrate 10. Even if the size of the variable is to properly adjust the spacing between the high-frequency bonding head 150 to allow the temporary bonding between the substrate (10).

Means for adjusting the spacing between the side plates 112, the lead screw is horizontally installed on the main body 110 orthogonal to the side plates 112 and the threads formed in the opposite direction relative to the middle portion (lead screw, 141 and horizontal movement parts 142 which are screwed to both sides of the lead screw 141 and fixed to the side plates 112, respectively, and move in opposite directions according to the rotation of the lead screw 141. Can be configured. The lead screw 141 may be manually rotated by the handle 143 fixed to one end, as in the present embodiment, because the range between the side plates 112 is not very large. It is also possible to rotate by.

The high frequency bonding head 150 is temporarily bonded between the substrates 10 by high frequency induction heating, and may be configured as shown in FIGS. 4 and 5.

The high frequency bonding head 150 illustrated in FIGS. 4 and 5 includes an upper high frequency induction heater 160 disposed separately on an outermost upper side and an outermost lower side of the substrates 10 stacked and mounted on the jig plate 120. And a lower high frequency induction heater 170.

The upper high frequency induction heater 160 is provided with an upper inductor core 161 and an upper coil 162 wound around an upper portion of the upper inductor core 161 and supplied with a high frequency power. The lower high frequency induction heater 170 includes a lower inductor core 171 and a lower coil 172 wound around a lower portion of the lower inductor core 171 and supplied with a high frequency power. Here, the upper and lower derivative cores 161 and 171 are shown in a rod shape, but are not limited thereto. In addition, although the high frequency current may be applied to the upper and lower coils 162 and 172 by independent high frequency power sources, the high frequency AC power 152 may be applied to the upper and lower coils 162 and 172. It is preferable that a high frequency current is applied. High frequency current flows through the upper and lower coils 162 and 172. The upper and lower derivative cores 161 and 171 are preferably formed of ferrite materials, respectively, so that high frequency noise can be minimized. It is not limited to this.

The portion in which the upper coil 162 of the upper inductor core 161 is wound is received in the upper housing 163, and the portion in which the lower coil 172 of the lower inductor core 171 is wound is the lower housing 173. Is accommodated in. In addition, a portion drawn out from the upper housing 163 of the upper derivative core 161 and a portion drawn out from the lower housing 173 of the lower derivative core 171 are supported by the side plate 112. Are inserted and supported respectively. Here, a predetermined space 151a is formed in the support block 151 so that the substrates 10 stacked on the jig plate 120 can be inserted between the upper inductor core 161 and the lower inductor core 171. An end portion of the upper derivative core 161 disposed in the space 151a of the support block 151 is opposite to the upper surface of the substrate 10 positioned on the outermost side, and the space 151a of the support block 151 is provided. An end portion of the lower derivative core 171 disposed therein is opposed to the lower surface of the substrate 10 exposed through the cutout 122 formed in the jig plate 120 at the outermost lower side. The upper and lower derivative cores 161 and 171 are separated from each other so that the substrates 10 seated on the jig plate 120 can be inserted without interference, so as to partially fuse the inserted substrates 10. When the outermost upper and lower surfaces of the substrates 10 are respectively in contact with each other, they are moved by the lifting means 180 so as to be close to each other.

The elevating means 180 is supported by elevating along upper and lower guide rails 181 and 185 fixed to upper and lower support brackets 115 and 116 provided on the main body 110, respectively, and the upper and lower high frequencies. At least one driving unit 190 for elevating the upper elevating member 182 and the lower elevating member 186 fixed to the induction heaters 160 and 170 and the upper and lower elevating members 182 and 186. It may be configured to include. Here, the fixing between the upper elevating member 182 and the upper high frequency induction heater 160 may be made by a fixed coupling between the upper elevating member 182 and the upper housing 163 through the upper connecting bracket 183. Likewise, fixing between the lower elevating member 186 and the lower high frequency induction heater 170 may be performed by fixing the lower elevating member 186 and the lower housing 173 through the lower connecting bracket 187. The upper lifting member 182 and the upper connecting bracket 183 may be integrally formed, and the lower lifting member 186 and the lower connecting bracket 187 may be integrally formed, but is not limited thereto.

The driving unit 190 for elevating the upper and lower elevating members 182 and 186 appropriately applies strokes of the upper and lower derivative cores 161 and 171 according to the thickness of the substrate 10 or the number of stacked sheets. It can be variously configured to be adjustable, for example, the upper and lower elevating member 182, 186 is screwed and the upper and lower lead screw 191 (one end is fixed to the support block 151, respectively) 195, and upper and lower motors 192 and 196 axially coupled to the other ends of the upper and lower lead screws 191 and 195. The upper and lower motors 192 and 196 are fixed to and supported by the upper and lower support brackets 115 and 116. On the other hand, the driving unit 190 may be configured separately so as to independently lift the upper and lower lifting members 182, 186 as described above, the upper and lower lifting members 182, 186 is linked It is also possible to be configured as one to be able to go up and down. In addition, a cylinder may be used as the driving unit 190.

The upper and lower high frequency induction heaters 160 and 170 are respectively contacted by the elevating means 180 so that the upper and lower inductor cores 161 and 171 contact the outermost upper and lower surfaces of the substrates 10, respectively. In the moved state, when the high frequency power is supplied to the upper and lower coils 162 and 172 to flow the high frequency current, the upper and lower parts are caused by the heat loss of eddy current and some hysteresis by the electromagnetic induction action. The surface of the lower derivative cores 161 and 171 is heated rapidly. The heated upper and lower inductor cores 161 and 171 cause the conductive layers 12 of the substrates 10 to generate heat, thereby melting the insulating materials 11 adjacent to the conductive layers 12. At least a portion between the substrates 10 may be fused. As a result, the aligned state between the substrates 10 can be temporarily bonded without being disturbed.

According to the upper and lower high frequency induction heaters 160 and 170 as described above, it is possible to temporarily bond between the substrates 10 in a simple contact state without pressurizing the substrates 10. Compared with the method of mechanically fastening and pre-assembled between them or the method of temporarily bonding by pressurizing and heating the substrates, the defective rate can be reduced and maintenance can be advantageous. In addition, the number of substrates can be temporarily bonded rather than the electrothermal method, thereby maximizing efficiency.

Referring to the operation of the multi-layer substrate temporary bonding apparatus 100 having the above configuration as follows.

First, after driving the rodless cylinder 132 to draw the jig plate 120 to the outside of the main body 110, the jig pins 121 of the jig plate 120 are guide holes 13 of the substrate 10. The substrates 10 are sequentially stacked so as to be fitted in the fields. When the stacking of the plurality of substrates 10 is completed, the rodless cylinder 132 is driven again to return the jig plate 120 to its original state. After returning the jig plate 120, check that the high frequency bonding heads 150 are correctly positioned at the temporary bonding positions between the substrates 10, and if inaccurate, rotate the handle 143 to rotate the high frequency bonding heads 150. Adjust the gap between them to position them correctly. Then, the elevating means 180 is driven so that the upper and lower derivative cores 161 and 171 of the upper and lower high frequency induction heaters 160 and 170 are in contact with the outermost upper and lower surfaces of the substrates 10, respectively. After positioning, high frequency power is supplied to the upper and lower coils 162 and 172 to allow high frequency current to flow so that the upper and lower derivative cores 161 and 171 are heated. When the upper and lower inductor cores 161 and 171 are heated in this manner, the conductive layers 12 of the substrates 10 generate heat, and accordingly, the insulating materials 11 adjacent to the conductive layers 12 are melted to thereby melt the substrate 10. It is possible to make a temporary joint between them. After the operation of temporarily bonding between the substrates 10 is completed, the upper and lower derivative cores 161 and 171 are spaced apart from the outermost upper and lower surfaces of the substrates 10 by the lifting means 180. The jig plate 120 is drawn out of the main body 110. The substrates 10 temporarily bonded through the above process are integrated into a multi-layer substrate by heat squeezing and fusion bonding at high temperature and high pressure.

According to the present invention as described above, according to the non-pressurized pressure bonding between the substrates by using a high frequency, a method of mechanically fastening and temporarily assembling between the substrates as in the prior art or pressurized heating between the substrates Compared to the joining method, the temporary splice failure rate can be reduced and maintenance can be advantageous. In addition, a separate fixing member for temporarily assembling the substrates is not consumed as in the related art, and a space for installing the fixing member is not required, so that the size of the substrate can be minimized. The effect can be obtained so that the efficiency can be maximized.

Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Could be. Accordingly, the true scope of protection of the invention should be defined only by the appended claims.

Claims (5)

A main body having a jig plate on which a plurality of substrates having a conductive layer patterned thereon are stacked and stacked on an insulating material; The substrates are respectively disposed on the outermost upper and lower sides of the substrates seated on the jig plate and are respectively supported by the main body to allow relative movements closer to and farther from each other, and in contact with the outermost upper and lower surfaces of the substrates, respectively. A plurality of high frequency bonding heads each having an upper and a lower high frequency induction heater to allow at least some of the substrates to be fused; And Multi-layer substrate temporary bonding apparatus having a lifting means for relatively moving between the upper and lower high frequency induction heater. The method of claim 1, The upper and lower high frequency induction heaters are: And a derivative core positioned opposite to the substrates, and a coil wound around the derivative core and supplied with a high frequency power. The method of claim 1, And the upper and lower high frequency induction heaters heat the conductive layers formed on the substrates to melt the insulating material, thereby enabling at least a portion of the substrates to be fused. The method of claim 1, The lifting means is: The upper and lower high frequency induction heater is fixed to each of the upper and lower elevating member and the lifting and lowering along the vertical guide rail provided in the main body, and at least one driving unit for elevating the upper and lower elevating member Multi-layer substrate temporary bonding apparatus characterized in. The method of claim 1, The jig plate is provided in plural numbers, while in the jig plate located at one side, the substrates are temporarily bonded by the high frequency bonding heads, while in the jig plate located at the other side, the substrates to be temporarily bonded are stacked in advance so as to be productive. Multilayer substrate temporary bonding apparatus, characterized in that to increase the.

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