KR100656858B1 - Case of electronic products for electromagnetic shielding and manufacturing method of it - Google Patents

Abstract

An electronic products case for an electromagnetic shield and a method for manufacturing the same are provided to reduce a manufacturing process for forming an electronic products case having an electromagnetic wave shielding function by mixing a metal with an electronic products case when the electronic products case is formed. A method for manufacturing an electronic products case for an electromagnetic shield includes the steps of: mixing a metallic powder of 1-5 weight% with a thermosetting resin of 95-99 weight%; melting the mixed thermosetting resin with the metallic powder and forming the upper case(11) of electronic products and an inner case(12a) of a lower case(12) by inserting the melted thermosetting resin into a first mold; and separating the first mold from the inner case and covering a second mold; forming an outer case of the upper case and the lower case of electronic products so that the inner case is overlapped by inserting urethane or rubber of a liquid state into the second mold.

Description

Case of electronic products for electromagnetic shielding and manufacturing method of it

1 is a perspective view showing one side of a conventional electronic product (mobile phone) case.

2 is a partially cutaway perspective view of an electronics case manufactured according to the present invention.

3 is an exploded perspective view of an electronic case manufactured by the present invention.

4 is a cross-sectional view of an electronics case manufactured according to the present invention.

-Explanation of symbols for the main parts of the drawings

10 electronics case 11 upper case

11a, 12a: inner case 11b, 12b: outer case

12: lower case 13: electronic components

14: opening 15: PCB

16a, 16b: outer surface 17a, 17b: outer surface

18: inner side 19a, 19b: joining surface

The present invention relates to an electronic case for electromagnetic shielding and a method of manufacturing the same. In particular, the present invention by molding a case of a variety of electronic products such as mobile phones, PDAs, digital cameras, DMB phones, etc. by molding a mixture of metal powders such as gold, silver, copper, iron, etc. that can block the leakage of electromagnetic waves The present invention relates to an electromagnetic shielding electronics case and a method of manufacturing the same, which can block electromagnetic waves leaking from and also significantly reduce a process of manufacturing a case of various electronic products having an electromagnetic shielding function.

One of the things scientific science does to humans is electromagnetic waves. From power generation and transmission, radio and television, cell phones, PDAs, DMB phones, and other communications, microwaves and ovens, to space exploration on airplanes and ships, anything you can imagine is electromagnetic waves. As technology develops, electronics will pour and electromagnetic waves will increase.

Even now, electromagnetic waves are floating around us as colorless and odorless, like the air we breathe. However, these electromagnetic waves, which are indispensable to humans, are also known as EMI (Electro Magnetic Interference), which disturbs other electromagnetic waves, causing malfunction of various machines, causing industrial accidents, and directly or indirectly affecting the human body. .

In addition, efficiency and shortening of lifespan of internal electronic products caused by high voltage generators of automobiles, mutual disturbance between electronic equipments, glaucoma that can be caused by long-term exposure to microwaves of human body, and reduction of fertility are mentioned. . The space where modern people live is no longer a safe zone from the former, and as scientific civilization develops, its seriousness will increase.

The human body has a fine electronic signaling system that enables the regulation of emotions, mechanisms of memory and behavior. Pregnancy, childbirth, illness and stress in human history would be shocking if they were never related to electromagnetic waves, but that is true. In this situation, advanced countries such as the US, Japan, and Russia have established safe exposure standards for electromagnetic waves, which strongly regulates external exposure, and are continuously studying the harmfulness of electromagnetic waves.

In particular, in the advanced countries, 20 ~ 20 countries already have advanced measures to minimize the impact on human body and to counter the interference and the high quality of information, which are derived in proportion to the rapidly increasing information and communication in the 21st century. EMI has been regulated for over 30 years, and recently, it has been very active in protecting electromagnetic environment by forcing electromagnetic wave resistance to be maintained. This EMI is more serious in the case of electronic products that are often used in direct contact with the human body such as mobile phones, PDAs, DMB phones, digital cameras, MP3s, etc. .

As a conventional technology for blocking electromagnetic waves harmful to the human body as described above, the Republic of Korea Utility Model No. 20-0227958 disclosed for the 'electromagnetic wave shielding case of electronic products' and the 'shield can for electromagnetic shielding' Patent Publication No. 2005-0029389, "Electromagnetic Shielding Device for Terminals and Method for Manufacturing the Same," Disclosed for "EMI and ESD Shielding of Components in Boards of Electronic Products and Its Manufacturing Method" Published Patent Publication No. 2004-0097574 and Published Patent Publication No. 2004-00511326 for "Conductive Coating and Painting Method for Electromagnetic EMI Shielding of Wireless Communication Products".

The electromagnetic shielding case of the electronic products of the prior art Republic of Korea Utility Model Registration No. 20-0227958 manufactures and assembles a case having a certain shape in which electronic or home appliances, such as a TV or computer monitor, can be stored. By inserting an electromagnetic wave blocking member that can block electromagnetic waves inside the case, it is possible to block and absorb harmful electromagnetic waves generated when using electronic or home appliances.

However, the electromagnetic shielding case of the prior art has the advantage that it can block and absorb electromagnetic waves harmful to the human body, but after fabricating the case it is necessary to install a separate electromagnetic shielding member fixed therein, the fabrication and assembly process is long. In the case of a bulky product such as a TV or a computer monitor, the volume does not increase significantly even if a separate electromagnetic wave shielding member is fixedly installed, but in the case of small electronic products such as mobile phones, PDAs, digital cameras, DMB phones, etc. It will have a big impact on my weight.

In addition, the 'shield can for electromagnetic wave shield' of the prior art Republic of Korea Patent Publication No. 2006-0003804, when the shield can is manufactured by weaving a metal wire between 40 mesh ~ 200 mesh to press into a predetermined shape and size to fine 0.5 mm or less The ventilation hole is formed to completely prevent the emission of electromagnetic waves through the ventilation hole as well as to minimize the time required for manufacturing.

However, the above-described shield cans of the prior art need to be installed on each electronic product or electronic components mounted thereon, so that it takes time or space for installation and excessive manpower or cost to install on all electronic products or electronic parts. There is a problem to enter.

In addition, the prior art Republic of Korea Patent Publication No. 2005-0029389 "EMI and ESD shielding device and manufacturing method of the components in the board of the electronic product" and the metal thin film for blocking ESD and EMI on the outer surface and the inner surface of the plastic can By forming a metal thin film to block the RF and forming an insulator film on the inner surface, the shielding efficiency is improved and the risk of shorting with other parts is small even during the attachment process or use.

In the case of the EMI and ESD shielding device, as in the conventional shield can, each electronic component of each electronic product must be installed one by one, so it takes time or space for installation and excessive manpower or cost to install on all electronic components. It takes In particular, EMI and ESD shielding device can prevent errors due to electromagnetic waves between electronic components in electronic products, but there is a limit to blocking electromagnetic waves leaking to the outside.

In addition, the prior art Korea Patent Publication No. 2004-0097574, 'electromagnetic shielding device of the terminal and its manufacturing method' as shown in Figure 1 can block the opening 110 in the injection molding cover 100 of the portable terminal as a whole. By attaching the thin film sheet-like tape 200 having a larger width than the opening 110 so that the electromagnetic wave shielding paint is applied to the wider area than the tape 200, the shield is better overall without a gap around the tape. .

In addition, Korean Patent Application Publication No. 2004-00511326, 'Conductive Coating and Painting Method for Electromagnetic EMI Shielding of Wireless Communication Products,' uses a surface treatment solution in which a fine powder of a conductive plated conductor or a non-conductor is mixed with a volatile liquid. Application to the interior of the housing and cover allows the same coating layer as the silver plating to be formed only on the inner surface of the product.

Korean Patent Laid-Open Publication Nos. 2004-0097574 and 2004-00511326 have the advantage of minimizing the thickness of the layer for shielding electromagnetic waves by applying or coating the electromagnetic shielding paint or surface treatment solution on the surface of the product. It is difficult to apply and coat the shielding paint or the surface treatment solution only to the necessary parts, and the process is lengthened because the electromagnetic shielding paint or the surface treatment solution must be applied and coated in a separate process after molding the product case.

An object of the present invention for solving the conventional problems as described above is a metal, such as gold, silver, copper and iron that can block the electromagnetic wave in the case of various electronic products such as mobile phones, PDAs, digital cameras, DMB phones, etc. It is to be able to block the electromagnetic waves generated from various electronic products by including.

In addition, another object of the present invention is to provide an electromagnetic shielding function by forming a metal, such as gold, silver, copper, iron for shielding the electromagnetic wave when molding an electronic case such as a mobile phone, PDA, digital camera, DMB phone, etc. It is to reduce the process of molding the electronics case.

Another object of the present invention is to form the outer case of the upper case and the lower case by rubber or urethane material, when the upper case and the lower case are integrally combined, the outer case of the upper case and the lower case is in close contact with each other and various electronic components When they are exposed to the outside of the upper case and the lower case, the outer case and the various electronic components of the upper case and the lower case is in close contact to achieve a waterproof.

Electromagnetic shielding electronics case manufacturing method according to the present invention for achieving the above object, the first step of mixing 95 to 99% by weight of the thermosetting resin and 1 to 5% by weight of the metal powder; A second step of melting the thermosetting resin mixed with the metal powder and injecting the thermosetting resin into a primary mold mold to form an inner case of an electronic product; And a third step of separating the primary mold mold from the inner case, covering the secondary mold mold, and then injecting a liquid urethane or rubber thereto to mold the outer case of the electronic case so as to overlap the inner case. It is characterized by including.

Moreover, in this invention, it is preferable that the said metal powder consists of one metal of iron, gold, silver, and copper.

In addition, in the present invention, the inner case of the upper case and the lower case is preferably composed of a thermosetting resin PC (polycarbonate, Polycarbonate) or ABS (copolymer of acrylonitrile-butadiene-styrene).

In addition, in the present invention, when the outer case is formed to be overlapped with the inner case by forming a molding temperature of the inner case higher than the molding temperature of the outer case, the outer case is thermally fused to the inner case is molded integrally and At the same time, it is desirable not to deform the inner case.

In addition, the electromagnetic shielding electronics case according to the present invention, a pair of detachable couplings and a mobile phone or PDA, a digital camera, a DMB phone, etc. In the electronic case for shielding electromagnetic waves for shielding the electromagnetic waves leaked from the same electronic product, the electronic case is composed of a pair of upper case and the lower case of the inner case and the outer case double overlapping, the upper case The inner case of the lower case with 95 to 99% by weight of the thermosetting resin and 1 to 5% by weight of the metal powder, the outer case of the upper case and the lower case is made of urethane or rubber, the inner case and the outer The case forms the inner case first, and then the outer case is formed on the outer surface of the inner case. And it is characterized in that that overlap in duplicate.

Moreover, in this invention, it is preferable that the said metal powder consists of one metal of iron, gold, silver, and copper.

In addition, in the present invention, the inner case of the upper case and the lower case is preferably composed of a thermosetting resin PC (polycarbonate, Polycarbonate) or ABS (copolymer of acrylonitrile-butadiene-styrene).

In the present invention, when the upper case and the lower case are integrally combined, it is preferable that the inner case and the outer case of the upper case and the lower case are closely coupled to each other.

Hereinafter, the present invention will be described in detail.

Electromagnetic shielding electronics case 10 according to the present invention is composed of a pair of upper case 11 and the lower case 12 that can be separated and coupled as shown in Figure 2 electronic products, in particular, mobile phones or PDAs, It refers to a case of a portable and compact electronic product such as a digital camera, a DMB phone and an MP3. Of course, this includes a computer monitor, a TV, a microwave oven, and the like.

That is, the electromagnetic shielding electronics case 10 for shielding the electromagnetic waves harmful to the human body is a PCB (15) having an electronic circuit for generating electromagnetic waves or a mobile phone, PDA, digital camera, DMB phone with a variety of electronic components , Electronics such as MP3, computer monitor, TV, etc.

The electronic case 10 is composed of a pair of upper case 11 and lower case 12, the upper case 11 and the lower case 12 is an inner case (11a) (12a) of different materials ) And the outer case (11b, 12b) has a double overlapping structure. In addition, the upper case 11 is formed with an opening 14 for exposing the electronic component 13 such as an LCD or various buttons to the outside.

In particular, the electromagnetic shielding electronics case 10 according to the present invention is the inner case (11a) (12a) of the upper case 11 and the lower case 12, which is double overlapping as shown in Figure 3 and 4 95 to 99% by weight of the thermosetting resin and 1 to 5% by weight of the metal powder, the outer case (11b, 12b) of the upper case 11 and the lower case 12 is made of urethane or rubber, The inner cases 11a, 12a and the outer cases 11b, 12 are formed on the outer surfaces 16a, 16b of the inner cases 11a, 12a after first forming the inner cases 11a, 12a. The secondary casings 11b and 12b are secondary molded to have a double overlapping structure.

In this case, a conductive metal powder, a conductive polymer, or the like may be used as a material mixed with a synthetic resin, that is, a thermosetting resin to shield electromagnetic waves. In particular, a metal such as iron, gold, silver, copper, etc. may be used as the metal powder.

In addition, the inner cases 11a and 11b of the upper case 11 and the lower case 12 are made of a thermosetting resin such as PC (polycarbonate, polycarbonate) or ABS (copolymer of acrylonitrile-butadiene-styrene). Can be.

Soft outer cases 11b and 12b surrounding the outer surfaces 16a and 16b of the inner cases 11a and 12a of the upper case 11 and the lower case 12 are inner cases 11a and 12a. The outer surface 17a, 17b and the inner surface of the opening 14, i.e., the inner surface 18, are covered, so that when the upper case 11 and the lower case 12 are integrally combined, the upper case 11 and The inner cases 11a and 12a and the outer cases 11b and 12b of the lower case 12 are tightly coupled to each other.

In particular, the soft outer case 11b, 12b is molded at the same height as the inner case 11a, 12a to form the engaging surfaces 19a, 19b of the upper case 11 and the lower case 12. When the upper case 11 and the lower case 12 are integrally combined with each other, the outer cases 11b and 12b may be in close contact with each other to provide life waterproofing. In addition, by absorbing the impact from the outside of the soft outer case (11b, 12b) constituting the case 10 of the various electronic products, it is possible to reduce the damage of the electronic product due to the impact and to print various patterns It is easy.

In addition, the outer surface of the electronic component 13 such as an LCD or a selection button exposed to the outside through the opening 14 of the upper case 11 and the inner surface 18 of the upper case 11, that is, the soft outer case Since 11b is in close contact, life waterproofing is possible.

In the embodiment of the present invention as described above, the inner case (11a) 12a and the outer case (11b) (12b) of the upper case 11 and the lower case 12 has been described as an example, The present invention is not limited thereto, and the upper case 11 and the lower case 12 may be in close contact with each other, and the inner case 11a, 12a and the outer case 11b of the upper case 11 and the lower case 12 ( 12b) may be modified in various forms such as giving a step to have a height difference.

A process of manufacturing the electromagnetic shielding electronics case 10 having the above structure will be described.

First, the worker prepares a mold mold for molding the electronics case 10. In this case, the two mold molds can be divided into a primary mold mold and a secondary mold mold, and the primary mold mold is a mold mold capable of forming the inner cases 11a and 12a of the electronic case 10. The secondary mold mold refers to a mold mold capable of molding the outer cases 11b and 12b on the outer surface of the inner cases 11a and 12a.

Here, the primary mold mold is a pair of the mold for forming the inner surface of the electronic case 10 and the mold for forming the outer surface of the inner case (11a) (12a). In addition, the secondary mold mold forms a pair of molds for molding the inner surface of the electronic case 10 and a mold for forming the outer surfaces of the outer casings 11b and 12b.

In particular, the mold case for forming the inner surface of the electronic case 10 commonly used as the primary mold frame and the secondary mold frame for the continuous production of the electronic case 10 is fixed while the inner case (11a) The mold frame for forming the outer surface of the (12a) and the outer case (11b) (12b) is arranged at a predetermined interval on the rotating shaft, forming the inner case (11a) 12a and the outer case (11b) (12b) When the mold is fixed, and the remaining primary and secondary mold molds form a pair.

After preparing the mold mold, the operator mixes 95 to 99 wt% of the thermosetting resin with 1 to 5 wt% of the conductive metal powder or the conductive polymer.

In this case, a conductive metal powder, a conductive polymer, or the like may be used as a material mixed with a synthetic resin, that is, a thermosetting resin to shield electromagnetic waves. In particular, a metal such as iron, gold, silver, copper, etc. having a diameter of 100 ~ 400 ㎛ may be used as the metal powder.

In addition, the inner cases 11a and 11b of the upper case 11 and the lower case 12 are made of a thermosetting resin such as PC (polycarbonate, polycarbonate) or ABS (copolymer of acrylonitrile-butadiene-styrene). Can be.

Subsequently, the worker or the mold machine melts the thermosetting resin mixed with the metal powder and injects the same into the primary mold mold to form the inner cases 11a and 12a of the electronic product.

After the inner cases 11a and 12a are molded, the primary mold frame surrounding the outer surfaces of the inner cases 11a and 12a is separated and the outer cases 11b and 12b are formed by rotation and reciprocation of the rotating shaft. When the secondary mold frame to be coupled to the fixed mold frame surrounding the inner case (11a) (12a), the operator or mold machine injects the liquid urethane or rubber into the secondary mold to the inner case (11a) (12a) The outer case 11b and 12b of the electronic case 10 are formed to overlap with each other.

Here, the molding temperature of the inner cases 11a and 12a is higher than the molding temperature of the outer cases 11b and 12b so as to overlap the inner cases 11a and 12a so as to overlap the outer cases 11b and 12b. When molding the outer case (11b) (12b) is heat-sealed to the inner case (11a) (12a) can be molded integrally and at the same time can prevent deformation of the inner case (11a) (12a).

-Example

First, the operator mixes 98 wt% PC and 2 wt% iron powder.

Subsequently, the worker or the mold machine melts the PC mixed with the iron powder with heat of 290 to 330 ° C., and injects the PC into the primary mold mold to form the inner cases 11a and 12a of the electronic product.

After molding the inner cases 11a and 12a and then removing the primary mold form from the inner cases 11a and 12a and covering the secondary mold form, the worker or the mold machine is a liquid melted by heat of 170 to 200 ° C. Urethane is injected into the secondary mold to form the outer cases 11b and 12b of the electronics case 10 so as to overlap with the inner cases 11a and 12a.

Electromagnetic waves harmful to human body generated when electronic circuits or various parts of electronic products are embedded in electronic case manufactured according to shape or shape of electronic products such as mobile phone, PDA, digital camera, DMB phone, MP3, etc. Does not leak outside. Of course, the electronic circuits or various components embedded in the electronics case do not malfunction or generate errors due to electromagnetic waves applied from the outside.

In particular, due to the close coupling between the upper case and the lower case of the electronic case, electronic components and the case, electronic products such as mobile phones, PDAs, digital cameras, DMB phones, MP3, etc. employing the electronic case according to the present invention is waterproof Is possible.

Therefore, the present invention is formed by embedding metal powders such as gold, silver, copper and iron, which can block electromagnetic waves, in a case of various electronic products such as mobile phones, PDAs, digital cameras, DMB phones, etc. There is an effect that can block.

In addition, the present invention when forming an electronics case, such as a mobile phone, PDA, digital camera, DMB phone, etc., including a metal, such as gold, silver, copper, iron for electromagnetic shielding by molding the electronics case having an electromagnetic shielding function There is an effect that can reduce the molding process. In particular, it can be used as it is without spraying or post-processing (UV) on the exterior of the electronics case.

According to the present invention, when the upper case and the lower case are integrally combined by molding the outer case of the upper case and the lower case with a rubber or urethane material, the outer cases of the upper case and the lower case are in close contact with each other and various electronic components are attached to the upper case. When exposed to the outside of the lower case and the outer case of the upper case and the lower case and a variety of electronic components are in close contact with each other to enable waterproof.

Although the present invention has been described in detail only with respect to the specific embodiments described, it will be apparent to those skilled in the art that various changes and modifications are possible within the technical scope of the present invention, and such modifications and modifications belong to the appended claims. .

Claims (8)

A first step of mixing 95 to 99 wt% of the thermosetting resin and 1 to 5 wt% of the metal powder; A second step of melting the thermosetting resin mixed with the metal powder and injecting the thermosetting resin into a primary mold mold to form an inner case of an upper case and a lower case of an electronic product; And The first mold mold is separated from the inner case, the second mold mold is covered, and then urethane or rubber is injected into the mold to form the outer case of the upper case and the lower case of the electronic product so as to overlap the inner case. Step 3; Electromagnetic shielding electronics case manufacturing method comprising a. The method of claim 1, The metal powder is made of a metal of iron, gold, silver, copper, electromagnetic shielding electronics case manufacturing method. The method of claim 1, The inner case of the upper case and the lower case is a thermosetting resin PC (polycarbonate, Polycarbonate) or ABS (copolymer of acrylonitrile-butadiene-styrene) manufacturing method of the electromagnetic shield for the electromagnetic wave, characterized in that. The method of claim 1, By forming a molding temperature of the inner case higher than the molding temperature of the outer case, when the outer case is formed to overlap with the inner case double, the outer case is thermally fused to the inner case to be molded integrally and at the same time not to deform the inner case. Electromagnetic shielding electronics case manufacturing method characterized in that. Electromagnetic shielding for shielding electromagnetic waves leaking from electronic products such as mobile phones, PDAs, digital cameras, DMB phones, etc. In the electronics case, The electronics case may include a pair of upper and lower cases in which an inner case and an outer case overlap each other, and an inner case of the upper case and the lower case is 95 to 99 wt% of a thermosetting resin and 1 to 5 weight. It is made of% of the metal powder, the outer case of the upper case and the lower case is made of urethane or rubber, the inner case and the outer case is formed by forming the inner case first and the outer case on the outer surface of the inner case secondary Electromagnetic shielding electronics case, characterized in that to form a double overlap by forming. The method of claim 5, The metal powder is an electromagnetic shielding electronics case, characterized in that consisting of one metal of iron, gold, silver, copper. The method of claim 5, The inner case of the upper case and the lower case is electromagnetic shielding electromagnetic case, characterized in that composed of a thermosetting resin PC (polycarbonate, Polycarbonate) or ABS (copolymer of acrylonitrile-butadiene-styrene). The method of claim 5, When the upper case and the lower case are integrally combined, the inner case and the outer case of the upper case and the lower case is in close contact with each other, characterized in that the electronic product case.

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