KR100639006B1 - Organic light emitting display device - Google Patents

Abstract

An organic EL(Electro-Luminescence) display device is provided to prevent moisture from permeating into a pixel region by increasing a side length of an electrode line. An organic EL display device includes a first substrate, a second substrate, a frit(320), and at least one electrode line(400). The first substrate includes a pixel region and a non-pixel region. The second substrate is bonded with the first substrate at one region included the pixel region. The frit is positioned between the non-pixel region and the second substrate and bonds the first substrate with the second substrate. The electrode line is formed on the first substrate and partially overlapped with the frit. The electrode line includes at least one protrusion portion(404), which is elongated from an intersection between the frit and the electrode line.

Description

Organic Light Emitting Display Device

1 is a view illustrating a first substrate of an organic light emitting display device according to an exemplary embodiment of the present invention.

2A and 2B are diagrams illustrating a second substrate bonded to face the first substrate.

3 is a view schematically illustrating a bonded state of a first substrate and a second substrate.

4 illustrates an electrode line partially overlapping a frit.

5A and 5B are views showing an etching state of electrode lines.

FIG. 6 is a diagram illustrating an intersection region of a frit and an electrode line according to an exemplary embodiment of the present invention. FIG.

7A and 7B illustrate embodiments of the protrusion illustrated in FIG. 6.

<Explanation of symbols for the main parts of the drawings>

100: pixel 104b: scanning line

104c, 106d: Pad 106c: Data line

200,300: substrate 210: pixel area

220: non-pixel area 320: frit

400: electrode lines 401a, 401b, 401c: metal film

402: semi-circle hole 404: protrusion

405a: body portion 405b: end portion

405c: rotating part 410: scanning drive part

420: data driver

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescent display, and more particularly, to an organic electroluminescent display in which penetration of oxygen, moisture, and the like is prevented.

In general, an organic light emitting display device is disposed to face a first substrate for providing encapsulation and a first substrate that provides a pixel region and a non-pixel region, and is bonded to the first substrate by a sealant such as epoxy. Consisting of a second substrate.

In the pixel area of the first substrate, a plurality of organic light emitting diodes are formed in a matrix at intersections of scan lines and data lines. The organic light emitting diode includes an organic thin film layer including an anode electrode and a cathode electrode, and a hole transport layer, a light emitting layer, and an electron transport layer formed between the anode electrode and the cathode electrode.

Here, the organic light emitting diode is vulnerable to oxygen because it contains an organic material, and since the cathode electrode is formed of a metal material, the organic light emitting diode is oxidized by moisture in the air, thereby easily deteriorating electrical characteristics and light emitting characteristics. In order to prevent this, conventionally, a moisture absorbent is mounted in a powder form or adhered in the form of a film to a container made of a metal can or cup, or a second substrate such as organic or plastic. The water penetrating was allowed to be removed.

However, the method of mounting the moisture absorbent in the form of a powder has a problem that the process is complicated, the material and the process cost are increased, the thickness of the display device is increased, and it is difficult to apply to the front emission. In addition, the method of adhering the moisture absorbent in the form of a film has a limitation in removing moisture and is difficult to apply to mass production due to its low durability and reliability.

Thus, in order to solve such a problem, a method of sealing the organic light emitting display by forming sidewalls with frits has been proposed.

International Patent Application No. PCT / KR2002 / 000994 (May 24, 2002) describes an encapsulation container having a sidewall formed of glass frit and a manufacturing method thereof.

US patent application Ser. No. 10 / 414,794 (April 16, 2003) describes a glass package sealed by bonding the first and second glass plates with a frit and a manufacturing method thereof.

Korean Patent Laid-Open No. 2001-0084380 (2001.9.6) describes a frit frame sealing method using a laser.

Korean Patent Laid-Open Publication No. 2002-0051153 (2002.6.28) describes a packaging method of sealing an upper substrate and a lower substrate with a frit layer using a laser.

Accordingly, an object of the present invention is to provide an organic light emitting display device in which penetration of oxygen, moisture, and the like is prevented.

In order to achieve the above object, an organic light emitting display device according to an exemplary embodiment of the present invention includes a first substrate including a pixel region where a pixel is formed and a non-pixel region other than the pixel region; A second substrate bonded to face the first substrate in one region including the pixel region; A frit positioned between the non-pixel region and the second substrate to bond the first substrate and the second substrate to each other; At least one electrode line formed on said first substrate and partially overlapping said frit; The electrode line has at least one protrusion extending from the side at an intersection region overlapping the frit.

Preferably, the electrode line is composed of at least three layers containing different metals.

The protrusions are formed at both sides of the electrode line.

The protrusion has a body portion extending from the electrode line.

The protrusion has an end portion formed in a wider width than the body portion at the end portion of the body portion.

The protruding portion further includes a rotating portion extending from both ends of the end portion to be bent into the body portion.

According to an embodiment of the present invention, an organic light emitting display device includes: a first substrate including a pixel area where a pixel is formed and a non-pixel area other than the pixel area; A second substrate bonded to face the first substrate in one region including the pixel region; A sealant positioned between the non-pixel region and the second substrate to bond the first substrate and the second substrate to each other; At least one electrode line formed on the first substrate and partially overlapping the frit and formed of at least three layers containing different metals; The electrode line has at least one protrusion extending from both sides at an intersection region overlapping the frit.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 1 to 7B which can be easily implemented by those skilled in the art.

1 is a diagram illustrating an organic light emitting display device according to an exemplary embodiment of the present invention.

Referring to FIG. 1, the first substrate 200 includes a pixel region 210 and a non-pixel region 220 surrounding the pixel region 210. Scan lines 104b and data lines 106c are formed in the pixel region 210, and pixels 100 are formed to be connected to the scan lines 104b and the data lines 106c. In the non-pixel region 220, a scan driver 410 connected to the scan lines 104b and a data driver 420 connected to the data lines 106c are formed. In the non-pixel region 220, pads 104c and 106d are formed to be connected to a power supply line (not shown) and an external driving circuit (not shown) for supplying power to the pixels 100. .

Each of the pixels 100 includes an organic light emitting diode (not shown) and at least one thin film transistor for driving the organic light emitting diode. The organic light emitting diode includes an organic thin film layer including an anode electrode and a cathode electrode, and a hole transport layer, a light emitting layer, and an electron transport layer formed between the anode electrode and the cathode electrode. The thin film transistor is formed to include a gate electrode, a source electrode, and a drain electrode, and controls the amount of current supplied to the organic light emitting diode. In fact, the pixels 100 are selected when a scan signal is supplied to the scan line 104b to receive a data signal from the data line 106c and generate light having a predetermined luminance in response to the supplied data signal.

The scan driver 410 sequentially supplies the scan signals to the scan lines 104b in response to the control signal supplied from the first pad 104c. Then, the pixels 100 connected to the scan lines 104b are sequentially selected.

The data driver 420 receives data and control signals from the second pads 106d. The data driver 420 receiving the data and the control signal supplies the data signal to the data lines 106c. The data signals supplied to the data lines 106c are supplied to the pixels 100 selected by the scan signals.

The pads 104c and 106d are electrically connected to an external drive circuit. Here, the first pad 104c is connected to the scan driver 410 to supply the control signal to the scan driver 410 so that the scan driver 410 is driven. The second pads 106d are electrically connected to the data driver 420 to supply the control signal and data to the data driver 420 so that the data driver 420 is driven.

2A and 2B are plan and cross-sectional views illustrating a second substrate bonded to a first substrate. Here, the second substrate (encapsulation substrate: 300) is bonded to the first substrate 200 to prevent penetration of moisture and the like into the interior.

2A and 2B, the second substrate 300 is provided with a frit 320 for bonding to the first substrate 200.

The process of generating the frit 320 is briefly described as follows. In general, frits in the form of glass powder are produced when the glass material is heated to a high temperature and then the temperature is drastically reduced. Oxide powder is included in the frit in the form of a powder, and the organic material is added thereto to form a gel paste. When the paste is applied to the edge of the second substrate 300 and then fired at a predetermined temperature, the organic material is extinguished in the air, and the paste in the gel state is cured to the second substrate 300 by the frit 320 in the solid state. Attached. Here, the temperature for firing the frit 320 is approximately 300 ℃ to 500 ℃ range. The frit 320 is formed to have a height of about 14 to 15 μm and a width of about 0.6 to 0.7 mm so that the second substrate 300 and the first substrate 200 can be stably bonded.

When the first substrate 200 and the second substrate 300 are bonded to each other, the frit 320 seals the pixel region 210 to prevent penetration of oxygen and moisture. To this end, the second substrate 300 and the first substrate 200 are positioned in the non-pixel region 220 of the frit 320. In addition, the frit 320 is melted when the laser, infrared light, or the like is irradiated from the outside to bond the first substrate 200 and the second substrate 300 together.

3 is a view briefly illustrating a state in which a first substrate and a second substrate are bonded together.

Referring to FIG. 3, the frit 320 is positioned in the non-pixel region 220 to bond the first substrate 200 and the second substrate 300 to each other. In fact, after the frit 320 is disposed in the non-pixel region 220, the frit 320 is melt-bonded to the first substrate 200 by irradiating a laser or infrared rays, and thus, the first substrate 200 and the second substrate. The substrate 300 is bonded. As such, when the first substrate 200 and the second substrate 300 are bonded together by the frit 320, oxygen and moisture may be prevented from penetrating into the pixel region 210.

Meanwhile, when the first substrate 200 and the second substrate 300 are bonded to each other, the frit 320 overlaps with at least one electrode line. For example, the frit 320 overlaps electrode lines such as the scan line 104b, the data line 106c, and the power supply line. Here, the electrode lines are formed when the thin film transistor and / or the organic light emitting diode included in the pixel 100 are formed. In other words, the electrode lines may be formed of at least one of a gate metal, a source / drain metal, and an anode metal when the thin film transistor is formed. For example, the scan line 104b may be formed of a gate metal, and the data line 106c and the power supply line may be formed of a source / drain metal. In addition, the electrode lines may be formed of the same material as the semiconductor layer when the thin film transistor is formed.

On the other hand, the position of the frit 320 in the present invention can be variously changed. For example, the frit 320 may be positioned outside the scan driver 410 such that the second substrate 300 overlaps the scan driver 410.

4 is a diagram illustrating a structure of a general electrode line.

Referring to FIG. 4, the electrode line 400 is manufactured in a three layer form including heterogeneous metal materials. In other words, the electrode line 400 includes a first metal film 401a, a second metal film 401b, and a third metal film 401c. Here, the first metal film 401a and the third metal film 401c are formed of the same material, and the second metal film 401b is made of a different material from the first metal film 401a and the third metal film 401c. Is formed.

For example, the first metal film 401a and the third metal film 401c are formed of titanium (Ti) or molybdenum (Mo), and the second metal film 401b is formed of aluminum (Al) having high conductivity. do. As described above, when the electrode line 400 is manufactured in a three-layer form, electrical properties such as conductivity may be improved and chemical reactions with adjacent layers may be minimized.

Meanwhile, when manufacturing an organic light emitting display device, the electrode line 400 undergoes at least one etching process. In this etching process, the first metal film 401a and the second metal film 401b formed of different metals are etched at different speeds. In fact, as shown in FIGS. 5A and 5B, the second metal film 401b formed of aluminum (Al) is etched more, thereby creating a semicircular hole 402 on the side of the electrode line 400. In particular, the semicircle-shaped hole 402 is formed larger through a cleaning process or the like. On the other hand, the semi-circular hole 402 is shown in the form of through holes by the adjacent layer as shown in FIG.

When the semicircular hole 402 is formed in the electrode line 400, oxygen and moisture from the outside may be supplied to the pixel region 210 via the semicircle hole 402. For example, oxygen, moisture, and the like may be caused by the semicircle hole 402 of the electrode line 400 electrically connecting the driving units 410 and 420 included in the pixel area 210 and the non-pixel area 220. May penetrate into region 210. Meanwhile, the semicircle hole 402 formed in the electrode line 400 may be partially recessed during the process. However, since the semicircle hole 402 is not likely to be recessed, it is difficult to secure reliability.

FIG. 6 is a diagram illustrating an intersection region of a frit and an electrode line according to an exemplary embodiment of the present invention. FIG.

Referring to FIG. 6, at least one protruding portion 404 is formed on at least one side of the electrode line 400 at an intersection portion of the frit 320 and the electrode line 400. In fact, the protrusion 404 is formed to extend in a plurality of sides of the electrode line 400.

As such, when the protrusion 404 is formed at the side surface of the electrode line 400 at the intersection of the frit 320 and the electrode line 400, oxygen, moisture, and the like may be prevented from penetrating into the pixel region 210 from the outside. Can be. In detail, the semicircular hole 402 is formed in the side surface of the electrode line 400 during the process as shown in FIG. 5A. At this time, the length of the side portion of the electrode line 400 having the protrusion 404 is increased, so that the likelihood of penetration of moisture is reduced. In addition, when the protrusion 404 is formed on the side of the electrode line 400, the possibility that the semicircle hole 402 is recessed during the process increases. In other words, since the side surface of the electrode line 400 is not formed in a straight shape, but is formed while being bent at various angles, the possibility of the semicircular hole 402 is increased, thereby ensuring reliability.

And, in the present invention, the stone head 404 may be formed in various forms so that the length of the side of the electrode line 400 can be long.

For example, in the present invention, the protrusion 404 has a wider width than the body portion 405a at the end of the body portion 405a and the end of the body portion 405a as shown in FIG. 7A. It may be composed of the end portion 405b is formed. In this case, as shown in FIG. 6, the lateral length of the electrode line 400 is longer than that of the protrusion 404 including only the body 405a.

In addition, the present invention may further include a rotating portion 405c which is formed to be bent to the body portion 405a is extended from both ends of the end portion 405b as shown in Figure 7b. Indeed, in the present invention, the structure of the protrusion 404 may be set in various forms. In addition, in the exemplary embodiment of the present invention, the structure of the protrusion 404 of the electrode line 400 is not limited to the organic light emitting display device in which the frit 302 is used. For example, the electrode line 400 including the protrusion 404 may be applied to an organic light emitting display device in which a sealant such as epoxy is used instead of the frit 302.

The above detailed description and drawings are merely exemplary of the present invention, but are used only for the purpose of illustrating the present invention and are not intended to limit the scope of the present invention as defined in the meaning or claims. Accordingly, those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical protection scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

As described above, according to the organic light emitting diode display according to the exemplary embodiment of the present invention, protrusions are formed on the side of the electrode line at the intersection region of the frit and the electrode line. As such, the protrusion formed on the side of the electrode line increases the side length of the electrode line, thereby preventing moisture or the like from penetrating into the pixel region. In addition, the protrusion formed in a predetermined shape may improve reliability by increasing the possibility of recession of the semicircle hole on the side of the electrode line.

Claims (13)

A first substrate including a pixel region where a pixel is formed and a non-pixel region other than the pixel region; A second substrate bonded to face the first substrate in one region including the pixel region; A frit positioned between the non-pixel region and the second substrate to bond the first substrate and the second substrate to each other; At least one electrode line formed on the first substrate and partially overlapping the frit; And the electrode line has at least one protrusion extending from a side surface at an intersection region overlapping the frit. The method of claim 1, And the electrode line comprises at least three layers containing dissimilar metals. The method of claim 2, And the protrusions are formed at both sides of the electrode line. The method of claim 2, And the protrusion portion includes a body portion extending from the electrode line. The method of claim 4, wherein And the protrusion has an end portion formed at a wider width than the body portion at an end portion of the body portion. The method of claim 5, And the protruding portion further includes a rotating portion extending from both ends of the end portion to be bent into the body portion. The method of claim 2, The electrode line is formed of titanium (Ti) / aluminum (Al) / titanium (Ti). The method of claim 2, The electrode line is formed of molybdenum (Mo) / aluminum (Al) / molybdenum (Mo). The method of claim 2, And the electrode line comprises at least one of a scan line, a data line, and a power supply line. The method of claim 2, And wherein the frit is melted when irradiated with laser or infrared light to bond the first substrate and the second substrate together. The method of claim 2, The pixel includes at least one thin film transistor and an organic light emitting diode. The method of claim 11, And the electrode line is formed when the thin film transistor or the organic light emitting diode is formed, and is formed of the same material as at least one of a gate metal, a source / drain metal, an anode metal, and a semiconductor layer. A first substrate including a pixel region where a pixel is formed and a non-pixel region other than the pixel region; A second substrate bonded to face the first substrate in one region including the pixel region; A sealant positioned between the non-pixel region and the second substrate to bond the first substrate and the second substrate to each other; At least one electrode line formed on the first substrate and partially overlapping the frit and formed of at least three layers containing different metals; And the electrode line has at least one protrusion extending from both sides in an intersection region overlapping the frit.

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