KR100637139B1 - Plasma display device - Google Patents

Abstract

According to the present invention, a plasma display device is disclosed. The plasma display apparatus includes a plasma display panel in which an image is implemented and a chassis display disposed opposite to the plasma display panel, wherein the plasma display apparatus absorbs a heat conduction medium and vibrations to promote heat dissipation between the plasma display panel and the chassis base. Characterized in that the buffer medium is further provided. According to the disclosed plasma display apparatus, there is provided a plasma display apparatus in which image quality is improved, noise is reduced, and heat dissipation efficiency is improved.

Description

Plasma display device

1 is an exploded perspective view of a conventional plasma display device;

2 is an exploded perspective view of a plasma display device according to an embodiment of the present invention;

3 is an exploded perspective view of the plasma display panel shown in FIG. 2;

4 and 5 are cross-sectional views illustrating a plasma display device according to another embodiment of the present invention;

6 and 7 are views showing the arrangement of the heat conduction medium and the joining means,

8 is an exploded perspective view showing a plasma display device according to another embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10 ... first panel 11 ... first substrate

12 Discharge holding electrode 13 Bus electrode

14 first dielectric layer 15 protective layer

20 ... Second panel 21 ... Second substrate

22 ... address electrode 23 ... second dielectric layer

24 ... Bulk 25 ... Fluorescent layer

30 ... plasma display panel 40 ... heat transfer medium

45 buffer medium 50 bonding means

60 ... chassis base

The present invention relates to a plasma display device, and more particularly, to a plasma display device having an improved structure in which image quality is improved, noise is reduced, and heat dissipation efficiency is improved.

The plasma display device is a flat panel display device that displays an image by using a gas discharge phenomenon, and has excellent display capability such as display capacity, brightness, contrast, afterimage, and viewing angle, and is thin and large-screen display is possible to replace CRT. As a next-generation flat panel display that can be attracted attention.

1 shows a conventional plasma display device. Referring to the drawings, the plasma display apparatus includes a plasma display panel 130 and a chassis base 160 disposed to face the plasma display panel 130.

The plasma display panel 130 becomes an image display unit in which an image is realized by a discharge phenomenon. The plasma display panel 130 is provided by bonding the first panel 110 and the second panel 120 to each other.

Since the plasma display panel 130 uses a discharge phenomenon for displaying an image, a large amount of heat is generated therein. Therefore, the heat generated inside the panel 130 is conducted to the chassis base 160 via the heat dissipation sheet 140 between the panel 130 and the chassis base 160.

As shown in FIG. 1, the heat dissipation sheet 140 is provided to cover the panel 130 by combining several standardized sheets. The double-sided tape 150 is attached to the gap between the heat dissipation sheet 140.

The chassis base 160 serves as a heat sink for dissipating heat transferred to the chassis base 160 via the heat dissipation sheet 140 and as a support structure for supporting the plasma display panel 130 made of glass. To serve. Thus, the chassis base 160 is made of aluminum having excellent thermal conductivity.

Meanwhile, a double-sided tape 150 is used to bond the plasma display panel 130 and the chassis base 160 to each other. In more detail, as shown in FIG. 1, the double-sided tape 150 is attached along the edge of the chassis base 160, and the short side of the chassis base 160 also exists in the gap between the heat dissipation sheet 140. The double-sided tape 150 is attached in the direction.

Thus, by attaching the double-sided tape 150 to the chassis base 160, and pressure-bonded to the panel 130, the panel 130 and the chassis base 160 is coupled to each other.

However, the double-sided tape 150 has a relatively poor thermal conductivity compared to the heat-dissipating sheet 140, so that a large amount of heat is accumulated in the portion of the panel 130 in contact with the double-sided tape 150 due to the deterioration of the heat dissipation performance. .

Since the fluorescent layer and the like deteriorate in the cell in which a relatively large amount of heat is accumulated, the luminance characteristic is degraded. Thus, a luminance step or a color band phenomenon occurs between the cell in which the heat is accumulated and the cell that is not.

Therefore, according to the conventional plasma display apparatus, there is a problem that the image quality and durability of the plasma display panel are degraded.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and other problems, and an object thereof is to provide an improved plasma display apparatus in which image quality is improved.

Another object of the present invention is to provide a plasma display device having an improved structure in which noise is reduced.

It is still another object of the present invention to provide an improved plasma display device having improved heat dissipation efficiency.

In order to achieve the above object and other objects, the plasma display device of the present invention, in the plasma display device having a plasma display panel in which an image is implemented and a chassis base disposed opposite to the plasma display panel, Between the plasma display panel and the chassis base is further provided with a heat conducting medium for promoting heat dissipation and a buffer medium for absorbing vibration.

Here, the edge of the chassis base may be provided with bonding means for coupling the plasma display panel and the chassis base, the bonding means may be provided with a double-sided tape.

The buffer medium may be provided in a stripe shape, or may be formed over the entire area surrounded by the bonding means.

It is preferable that the gap between the bonding means and the heat conductive medium is limited to within 5 mm.

In addition, when the heat conductive medium is divided into at least two, it is preferable that the distance between the separated heat conductive medium is limited to within 5mm.

The buffer medium may be provided with a sponge. In this case, an adhesive layer may be provided on at least one surface of the buffer medium.

In addition, the buffer medium may be provided with a double-sided tape.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 shows a plasma display device according to an exemplary embodiment of the present invention.

Referring to the drawings, the plasma display apparatus includes a plasma display panel 30, which is a display unit of an image, and a chassis base 60 disposed to face the plasma display panel 30, and is interposed between the plasma display panel 30 and the chassis base 60. And a thermally conductive medium 40 and a buffer medium 45.

FIG. 3 is an exploded perspective view of the plasma display panel shown in FIG. 2. Referring to the drawing, the plasma display panel 30 is provided with the first panel 10 and the second panel 20 bonded to each other.

The first panel 10 serving as the display portion of the image includes a first substrate 11, a discharge sustaining electrode 12, a bus electrode 13, a first dielectric layer 14, and a protective layer 15.

A plurality of pairs of discharge sustaining electrodes 12 are provided on the first substrate 11 in a stripe pattern, and a plurality of bus electrodes 13 are provided. In addition, a first dielectric layer 14 filling the discharge sustaining electrode 12 and the bus electrode 13 and a protective layer 15 protecting the first dielectric layer 14 are sequentially formed on the first substrate 11. It is formed of a first panel 10 is provided.

The second panel 20 includes a second substrate 21, an address electrode 22, a second dielectric layer 23, a partition wall 24, and a fluorescent layer 25.

A plurality of address electrodes 22 are provided in a stripe pattern on the second substrate 21, and a second dielectric layer 23 covering the address electrodes 22 is formed on the second substrate 21. In addition, a partition wall 24 partitioning the discharge cells is formed on the second dielectric layer 23 in parallel with the address electrode 22, and a fluorescent layer 25 is formed on the side surfaces of the second dielectric layer 23 and the partition wall 24. ) Is formed to provide the second panel 20.

Referring to FIG. 2, the heat conducting medium 40 serves to diffuse heat generated from the plasma display panel 30 in the planar direction of the panel 30 and to conduct the heat to the chassis base 60.

The thermally conductive medium 40 is preferably provided with a thermal conductivity of about 0.5 W / mK or more in terms of heat dissipation. The thermally conductive medium 40 is silicon-based, acrylic-based, high oriented graphite, and carbon nano. Tube (CNT), it may be provided with a material of a metal series such as aluminum or copper.

For example, the highly oriented graphite has high thermal conductivity in the direction by arranging graphite crystals in a predetermined direction. When the thermally conductive medium 40 is provided with the highly oriented graphite, the inside of the panel 30 is generated. Heat may diffuse rapidly in the planar direction of panel 30.

When the thermally conductive medium 40 has a buffer property together with thermal conductivity, the vibration generated from the panel 30 may be absorbed. An adhesive layer (not shown) may be provided on a surface of the thermally conductive medium 40 that contacts the panel 30. When formed, vibration of the panel 30 can be suppressed, which is efficient for vibration blocking.

The chassis base 60 serves as a supporting structure of the plasma display panel 30 made of a glass material, and also serves as a heat sink of the panel 30 dissipating heat conducted via the thermal conductive medium 40. Do it. The chassis base 60 may be made of an aluminum material having excellent thermal conductivity.

Although not shown in the drawings, a circuit unit (not shown) for driving the plasma display panel 30 is provided on the opposite side of the panel 30 of the chassis base 60. The circuit unit includes various circuit elements, wirings, and the like for applying a controlled driving signal to the panel 30.

The chassis base 60 is provided with a joining means 50. The joining means 50 is formed along the edge of the chassis base 60 and may be provided with a double-sided tape.

The panel 30 and the chassis base 60 may be coupled by pressing the chassis base 60 with the joining means 50 to the panel 30.

The buffer base 45 is disposed in the chassis base 60 in a predetermined pattern, and as shown in FIG. 2, the buffer medium 45 may be provided in a stripe pattern extending in the short side direction of the chassis base 60.

The buffer medium 45 is provided with a material having a buffer to elasticity, for example, may be provided with a sponge. The buffer medium 45 has a buffer property to absorb vibration and noise generated from the panel 30, thereby preventing noise from being transmitted to the outside of the device. In more detail, in the plasma display apparatus in which initialization, writing, light emission maintenance, and erasing operations are repeated, vibration or noise may be generated in the display panel 60 and the circuit unit. When the vibration is transmitted to the outside, it becomes noise, and the buffer medium 45 absorbs such vibration or noise to remove or mitigate the noise.

In addition, the buffer medium 45 may serve to protect the panel 30 made of a glass material by absorbing vibration generated during distribution or movement of the display device.

In addition, the buffer medium 45 may serve to press the heat conducting medium 40 toward the panel 30 so that the panel 30 and the heat conducting medium 40 are in close contact with each other.

In more detail, the chassis base 60 and the display panel 30 may have distortion areas due to non-flat areas or heat generated during driving due to manufacturing limitations. However, when the buffer medium 45 is interposed, the thermally conductive medium 40 can be brought into close contact with the panel 30 in spite of the non-flat or distorted portion, so that the adhesion rate can be improved. 30 and the contact resistance of the thermal conductive medium 40 can be reduced.

When the buffer medium 45 is provided with a sponge, since the thermal conductivity is inferior to that of the heat conductive medium 40, the thickness is preferably limited in terms of heat dissipation of the panel. That is, the buffer medium 45 is preferably about 1mm in the pre-compression state before bonding the panel 30 and the chassis base 60, the thickness is maintained about 0.1 ~ 0.3mm when bonded and compressed .

 In addition, the buffer medium 45 may be provided with a rubber material. In this case, when the buffer medium 45 has the appropriate elastic strength, the vibration and noise generated by the panel 30 can be sufficiently absorbed. That is, when the buffer medium 45 having excessive elastic strength is provided, the vibration generated by the panel 30 may not be absorbed, so that the vibration or noise of the panel 30 is transmitted to the outside of the device to generate noise.

4 and 5 are cross-sectional views illustrating a plasma display device according to another embodiment of the present invention.

As described above, the buffer medium 45 is interposed between the thermal conductive medium 40 and the chassis base 60, the adhesive layer 46 may be formed on at least one surface of the buffer medium 45. As shown in FIG. 4, the adhesive layer 46 may be provided on a surface in contact with the chassis base 60. As illustrated in FIG. 5, the adhesive layer 46 may include the thermal conductive medium 40 and the chassis base ( 60 may be formed on all of the surfaces in contact with each other. As such, when the adhesive layer 46 is formed on the buffer medium 45, the buffer medium 45 may catch vibration of the panel 30 or the circuit part, thereby reducing the generation of noise due to vibration.

The buffer medium 45 may be provided with a double-sided tape having a buffer. In this case, the double-sided tape preferably has a thickness of about 0.1 to 0.3 mm. If the buffer medium 45 is provided with a double-sided tape, there is no need to form an adhesive layer separately.

In the experiment for measuring the noise reduction effect described above, when the double-sided tape was inserted into the buffer medium 45, the noise level decreased by about 3 to 5 dB.

As described above, the buffer medium 45 may be provided in a predetermined pattern. As shown in FIG. 2, when the buffer medium 45 is provided in a stripe pattern, air flows in an area where the buffer medium 45 is not interposed. This may be formed to facilitate heat dissipation by natural convection. In this case, by attaching the bonding means 50 attached to the edge of the chassis base 60 spaced apart at appropriate intervals, such air can be smoothly flowed.

6 shows an arrangement of the joining means and the heat conducting medium. As can be seen in the figure, the bonding means 50 and the heat conducting medium 40 are spaced apart by a distance d1. Here, when the bonding means 50 and the heat conducting medium 40 are spaced apart by an appropriate interval or more, heat dissipation is not performed smoothly in the part of the panel 30 which does not come into contact with the heat conducting medium 40, and thus the temperature in the plane direction. Deviation is formed, resulting in luminance step to color band phenomenon. Therefore, the spacing is preferably limited to within about 5mm.

As shown in FIG. 2, the thermal conductive medium 40 may be integrally formed to cover the front surface of the panel 30, or as illustrated in FIG. 7, several standardized sheets may be combined to form a panel. It may be provided to cover 30.

As described above, when the thermally conductive medium 40 includes a plurality of sheets in combination, the spacing d2 between the sheets is preferably densely arranged to be limited to about 5 mm or less. When each sheet is excessively spaced apart, due to the local temperature rise in the display panel 30, the luminance step or color band phenomenon occurs as described above, thereby degrading the image quality.

8 shows another embodiment of the present invention. Referring to the drawing, the chassis base 60 is bonded to the plasma display panel 30 via the heat conductive medium 40 and the buffer medium 45. Here, the bonding means 50 is provided along the rim of the chassis base 60, and the buffer medium 45 is formed over the entire surface of the chassis base 60 surrounded by the bonding means 50.

The bonding means 50 may be provided with a double-sided tape, and the buffer medium 45 may be provided with a material having a cushioning property such as a sponge or a rubber material.

According to the plasma display panel of the present invention, the following effects can be obtained.

First, the image quality of the plasma display panel is improved. According to the present invention, by providing the bonding means at the edge of the chassis base, heat dissipation in the panel internal region where a large amount of heat is accumulated is promoted, as compared with the conventional plasma display apparatus in which the double-sided tape is also disposed in the center of the chassis base. Therefore, according to the present invention, color stripe phenomenon and luminance step can be eliminated, so that image quality is improved.

Further, according to the present invention, by arranging the heat conducting medium and the joining means in close proximity and by arranging the heat conducting medium densely, the heat dissipation of the panel is promoted and thus the image quality is improved.

Second, it is possible to reduce noise of the plasma display device. According to the present invention, a buffer medium is interposed between the heat conducting medium and the chassis base to absorb vibrations and noise generated from the plasma display panel and the circuit unit. Therefore, the noise transmitted to the outside of the apparatus can be reduced, and the quality of the apparatus can be improved.

Third, the heat radiation performance of the plasma display device is improved. According to the present invention, a buffer medium having elasticity is interposed to improve adhesion between the thermal conductive medium and the panel. Therefore, the heat radiation performance is improved due to the decrease in the contact resistance.

Although the present invention has been described with reference to the embodiments illustrated in the accompanying drawings, it is merely exemplary, and various modifications and equivalent other embodiments are possible from those skilled in the art to which the present invention pertains. You will understand the point. Therefore, the true scope of protection of the present invention should be defined by the appended claims.

Claims (10)

A plasma display device comprising a plasma display panel on which an image is implemented and a chassis base disposed to face the plasma display panel. In the central region between the plasma display panel and the chassis base, a heat conductive medium for promoting heat dissipation and a buffer medium for absorbing vibrations are disposed to overlap each other. Bonding means for coupling the plasma display panel and the chassis base is provided along the periphery of the central area. And the spacing between the bonding means and the heat conducting medium is limited to within 5 mm. delete The plasma display apparatus of claim 1, wherein the bonding means is provided with a double-sided tape. The plasma display apparatus of claim 1, wherein the buffer medium is formed over an entire region formed by the bonding means. delete The plasma display apparatus of claim 1, wherein the buffer medium has a stripe shape. A plasma display device comprising a plasma display panel on which an image is implemented and a chassis base disposed to face the plasma display panel. In the central region between the plasma display panel and the chassis base, at least two thermally conductive media closely contacted to different positions of the panel surface and a buffer medium for absorbing vibration are overlapped with each other. And a spacing between the thermally conductive media is limited to within 5 mm. The plasma display apparatus of claim 1, wherein the buffer medium is formed of a sponge. The plasma display apparatus of claim 8, wherein an adhesive layer is provided on at least one surface of the buffer medium. 8. The plasma display apparatus of claim 1 or 7, wherein the buffer medium is provided with a double-sided tape.

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