KR100631793B1 - Electroless Plating Equipment of Mold and Its Cooling Water Line - Google Patents

Abstract

The present invention relates to an electroless plating apparatus of a mold and its cooling water line, and more particularly, to stably maintain the operating temperature of the plating liquid according to the temperature of the mold to be plated during the plating process according to the appropriate operating temperature of the plating liquid. An electroless plating apparatus for a mold and its cooling water line.

The technical problem of the present invention is to stably maintain the temperature of the plating liquid, to uniformly plate the metal mold, to facilitate the storage of the metal mold, and to shorten the time of the plating process.

In order to solve the above problems, the present invention is a cooling water line electroless plating apparatus of a mold, the plating solution tank for storing the plating liquid of the mold; A washing liquid tank in which the washing liquid of the mold is stored; Pickling liquid tank for storing the pickling liquid of the mold; An inlet pipe for supplying the plating liquid of the plating solution tank to the cooling water line of the mold; An outlet pipe for refluxing the plating liquid in which the mold is distributed to the plating bath; The temperature of the mold to be plated is adjusted according to the proper operating temperature of the plating liquid, and the temperature control and washing, pickling, and plating of the cooling water line of the mold are performed, and a duct formed in the partition wall is provided with a heater. It is configured to include a constant temperature bath for maintaining a constant temperature of the plating liquid during plating by blowing air heated through.

This invention allows the plating film to be formed uniformly, significantly reducing the plating process time, and improves the durability of the mold.

Plating equipment, plating process, mold, electroless

Description

Electroless plating apparatus for the cooling line and metal mold}

1 is a process diagram of an electroless plating process of a mold according to the prior art

2 is a configuration diagram of an electroless plating apparatus of a mold according to the prior art.

3 is a cross-sectional view taken along the line AA ′ of FIG. 2.

Figure 4 is a process of the electroless plating process of the mold according to an embodiment of the present invention.

5 is a perspective view showing a cooling water electroless plating apparatus of a mold according to an embodiment of the present invention.

Figure 6a is a perspective view of a constant temperature bath according to an embodiment of the present invention.

Figure 6b is an internal structure of the thermostatic bath according to an embodiment of the present invention.

7 is an operation of the constant temperature bath top door according to an embodiment of the present invention.

8 is a process chart of the electroless plating process of the cooling water line of the mold according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

2. Chamber

21. Supply passage 22. Output passage

3. Feeding device

31. Plating solution tank 32. Pretreatment liquid tank 33. Washing liquid tank

35.valve 36.pipe

4. Heater

5. Mold

51. Cooling water line

110. Moving tube

111. Connector

113. Immigration Office 114. Immigration Customs

117. Customs Office 118. Customs Office

119.Flowmeter

120. Constant Temperature

121. Communication hole 122. Control box

123. Front door 125. Top door

126. Top door opening and closing motor 128. Fan

129. Heater

130. Plating solution tank 133. Pretreatment bath 135. Washing bath

132, 132 '. Plating bath valves 134, 134 '. Pretreatment Valve

136, 136 '. Water Tank Valve

140. Splitter

P. Mold

P '. Cooling water line

The present invention relates to an apparatus for electroless plating on the mold and the cooling water line of the mold, and more particularly, a mold for stably maintaining the operating temperature of the plating liquid by adjusting the temperature of the mold to be plated during the plating process according to the appropriate operating temperature of the plating liquid. And an electroless plating apparatus of the cooling water line.

As machines, mechanisms, and devices become larger, parts for producing them are also becoming larger, and the preferred production method for mass production of such large parts is processing by large presses. Dies are also becoming larger and more expensive.

Accordingly, in order to prevent corrosion of expensive large molds, it is important to improve the durability by surface treatment (plating) of the mold.

In particular, since large molds are operated under high pressure and high speed, and a lot of heat is generated due to work harding, installation of a coolant line in the mold is critical. Since such a coolant line is severely corroded by the coolant, Plating of lines has a more important meaning.

Therefore, in the prior art, electroless plating was performed by immersing a mold in a plating bath for surface plating. In particular, in order to plate the cooling water line of the mold, the entire surface of the mold is masked and then completely submerged in a large plating bath, thereby electroless plating the cooling water line, or the present applicant has invented and filed the application as a more advanced technology. As in the method described in Publication No. 10-2003-0075682 (Application No. 10-2002-0015036) described in the publication, there is a method of supplying a plating liquid only to the cooling water line by a pipe.

On the other hand, electroplating is performed by inserting an electrode into the plated body to be plated to conduct electricity. Since the mold cooling water line is bent in various ways, the electrode is not inserted into the electroplating. .

The prior art will be described in more detail with reference to the drawings. 1 is a process chart showing a plating process of a mold according to the prior art. According to this, the plating process of the mold includes the steps of accommodating the mold into a plating bath, a washing step for removing foreign substances adhering to the mold, a pickling step of immersing the mold in a pickling solution so that the plating is performed well, and a plating solution. It comprises a plating step to be immersed, in each step the movement of the mold is done by a conveyor system such as a crane or hoist.

In addition, in the case of electroless plating the cooling water line by immersing the mold, it is preferable to mask the entire surface of the mold before the plating. That is, the plating process of the coolant line of the mold may include masking the entire surface of the mold, washing with water to remove foreign substances adhering to the mold, and pickling to immerse the mold in a pickling solution so that plating is performed well, and the mold may be applied to the plating solution. It is configured to include a plating step to immerse.

On the other hand, Figures 2 and 3, which is a process and apparatus for connecting a pipe to a cooling water line of a mold and plating the cooling water line, are sectional views of the structure of the cooling water line electroless plating apparatus of the mold and the AA 'line, respectively. . According to this, the chamber 2 and the plating liquid tank 31 which have a supply passage 21 and a discharge passage 22 respectively connected to both ends of the cooling water line 51 of the mold 5 to be received and which are sealed to be opened and closed are provided. And a supply device in which a pump and a valve 35 are installed in a pipe 36 connecting the pretreatment liquid tank 32, the water washing tank 33, and the supply passage 21 and the discharge passage 22, respectively. It is composed of a heater (4) attached to the outside of the mold (5) accommodated in the chamber (2), the chamber (2) is opened to accommodate the mold (5), the inlet of the cooling water line (51) After the supply passage 21 and the discharge passage 22 installed in the chamber 2 are installed in the chamber, the pretreatment liquid tank 32 is opened while the pump is operated to pretreat (pickle) the cooling water line 51, and the pretreatment liquid Lock the tank 32, open the valve 35 of the flushing tank 33, wash the pretreatment liquid remaining in the cooling water line 51, close the flushing liquid tank 33, and close the valve 35 of the plating liquid tank 31. To It was made possible to perform electroless plating while refluxing the plating liquid in the cooling water line 51 for a predetermined time.

This conventional technique has the advantage of extending the life of the mold 5 by plating the mold 5 and the cooling water line of the mold, but when the large mold is immersed in the plating bath at a low temperature, There is a problem in that it is not possible to maintain a stable high temperature plating temperature that is most required in sea plating.

That is, in electroless plating, the plating solution is mainly operated at a high temperature, as shown in Table 1 (Table 1 is the same as that of an alkaline electroless nickel plating solution or a plating solution of a different property), which maintains a high temperature state. If this is not possible, the deposition rate of the plating solution is significantly reduced and the balance of the plating solution is broken. As experimental data for this, Table 2 shows the results of reaction and thickness measurement according to the temperature of the electroless plating solution.

According to this, when the temperature is high, the plating is performed in a short time and the thickness of the plating is good. However, the lower the temperature, the more time is required and the thickness of the plating is not good. It can be seen that it is very important to maintain a constant temperature at high temperatures in the plating.

Table 1

ingredient Ammonium hydroxide alkaline Caustic Alkaline One 2 3 4 5 Nickel chloride sodium hypophosphite sodium citrate ammonium chloride boric acid or borax pH temperature (℃) plating rate 30 10-50-8 ~ 10 90 8 44 11 100 50-8.5-9.5 90-100 15 30 10 (ammonium salt) 65 50-8-9 90 5 24 20 60-38 (borax) 8 ~ 9 90 10 ~ 13 24 20 60-(boric acid) 40 8 ~ 9 90-

TABLE 2

Reaction temperature (℃) Response time (minutes) C.M.I measurement thickness (μm) 45 5 0.02 50 5 0.07 55 5 0.13 60 5 0.26 65 5 0.24 70 5 0.34 75 5 0.54 80 5 0.82

In particular, the prior art of plating only the coolant line with a pipe for plating the coolant line of the mold is intended to solve the problem of maintaining a high temperature by installing in the mold (5) in which the linear heater (4) is accommodated, In order to maintain the temperature of the plating liquid above a certain temperature, the part contacted by the heater 4 must be locally heated to a high temperature, so that the temperature in the mold is not maintained uniformly, and the rubber packing attached to the mold is It causes the problem of being damaged by heat.

In addition, as shown, one supply passage 21 and the discharge passage 22 is connected to the cooling water line 51 of the mold, in order to plate all the cooling water lines 51 formed in the mold (5) Plating must be performed repeatedly, thereby causing a problem in that the working time is long.

The present invention has been made to solve the above problems, an object of the present invention is to provide an electroless plating apparatus of a mold and its cooling water line to maintain the plating solution at a stable temperature to improve the uniformity of the plating film.

It is another object of the present invention to provide a cooling water line electroless plating apparatus of a mold that facilitates the storage of a large mold into a constant temperature bath.

Still another object of the present invention is to provide a cooling water line electroless plating apparatus of a mold in which a plating solution is maintained at a constant temperature in a cooling water line section.

Still another object of the present invention is to provide an electroless plating apparatus for a cooling water line of a mold, which shortens the working time of the plating process and improves efficiency.

The electroless plating process of the mold according to the present invention comprises the step of adjusting the temperature of the mold to be plated in accordance with the appropriate operating temperature of the plating liquid used.

At this time, the temperature of the mold to be plated is preferably adjusted to 70 ~ 100 ℃.

In addition, the electroless plating process of the cooling water line of the mold according to the present invention comprises a process of adjusting the temperature of the mold to be plated in accordance with the appropriate operating temperature of the plating liquid used.

At this time, the temperature of the mold to be plated is preferably adjusted to 70 ~ 100 ℃.

In addition, the electrolytic plating process of the cooling water line of the mold according to the present invention includes a step of adjusting the temperature of the mold to be plated in accordance with the appropriate operating temperature of the plating liquid used, the temperature control and washing, pickling, washing, etc. of the cooling water line of the mold The plating step is performed in the same bath, and is characterized in that the temperature of the plating liquid is kept constant during the plating process.

At this time, the temperature of the mold to be plated is preferably adjusted to 70 ~ 100 ℃ according to the type of plating solution.

In addition, the cooling water line electroless plating apparatus of the mold according to the present invention includes a plating solution tank in which the plating liquid of the mold is stored, and a washing solution tank in which the washing liquid of the mold is stored; A pickling tank for storing the pickling liquid of the mold, an inflow pipe for supplying the plating liquid of the plating solution to the cooling water line of the mold, an outlet pipe for refluxing the plating liquid for distributing the mold into the plating tank, and plating according to an appropriate operating temperature of the plating liquid. Adjusting the temperature of the mold to be, and the temperature control and washing, pickling, plating process of the cooling water line of the mold is performed, it is configured to include a constant temperature bath for maintaining a constant temperature of the plating liquid during the plating process.

At this time, the constant temperature bath is provided with a door into which the mold enters, a heater capable of heating the inside, a wall surface provided with a heat insulator, and a thermostat for maintaining the inside at a constant temperature. It can be configured to allow the plating to proceed in.

At this time, the constant temperature bath door may be configured to be installed on both the front and top, or both the side and top.

In addition, a portion of the wall surface of the constant temperature bath can be configured to form a communication hole for passing through the inlet and outlet pipes.

In addition, the heater of the constant temperature bath tank may be partitioned by a partition, the area in which the mold is accommodated, and may be configured to be provided with a fan for circulating the hot air generated from the heater.

In addition, the end portion connected to the cooling water line side of the mold of the inlet pipe and the outlet pipe may be configured to be branched into a plurality of inlet and outlet pipes, respectively.

In addition, the washing tank, pickling tank and the plating solution tank may be configured to share the inlet and outlet pipe.

Hereinafter, the present invention will be described in more detail with reference to the embodiments shown in the drawings. However, the present invention may be variously implemented without being limited to the following embodiments.

4 is a process diagram of an electroless plating process of a mold according to an embodiment of the present invention. According to this, the plating process of the mold includes the steps of accommodating the mold, adjusting the temperature of the mold, washing with water to remove the foreign matter adhering to the mold, and pickling to immerse the mold in the pickling solution so that plating is well performed. And a plating step of immersing the mold in the plating liquid. In this case, the washing, degreasing and pickling processes may be carried out at appropriate stages in a conventional manner as necessary.

In addition, in the case of electroless plating the cooling water line by immersing the mold, the step of masking the entire surface of the mold should be preceded before the plating. That is, in the cooling water line plating process of the mold, masking the entire surface of the mold, adjusting the temperature of the mold, washing with water to remove foreign substances adhering to the mold, and pickling to immerse the mold in the pickling solution so that plating is performed well. And a plating step of immersing the mold in the plating liquid. In this case, the washing, degreasing and pickling processes may be carried out at appropriate stages in a conventional manner as necessary.

On the other hand, the process of plating the cooling water line by connecting a pipe to the cooling water line of the mold will be described after the description of the plating apparatus for the process.

Figure 5 shows an embodiment of a cooling water line electroless plating apparatus of a mold according to the present invention. According to the present invention, the electroless plating apparatus of the mold according to the present invention includes a constant temperature gold bath 120 in which the mold P is largely accommodated and plated, and a cooling water line of the mold stored in the constant temperature gold bath 120 ( An inlet pipe 113 for supplying the plating liquid to P ') and an outlet pipe 117 for discharging the plating liquid from the cooling water line P' of the mold, and a plating solution for circulating the inlet pipe 113 and the outlet pipe 117 The plating solution tank 130 is stored and heated.

Figure 6a is a perspective view of the thermostatic bath according to an embodiment of the present invention is shown in more detail the thermostatic bath.

The mold P is housed in the constant temperature bath 120, and the constant temperature bath 120 is provided with doors 123 and 125 to allow the mold P to enter and exit. The doors 123 and 125 are installed on both the front and the top or both the side and the top (hereinafter, the front door is used as a concept including the side door), the front door 123 is a small mold that can be transported by a forklift, etc. The upper door 125 is additionally used to enter and exit a large mold with a hoist or the like. The upper door 125 is provided with a top door opening and closing motor 126 for automatically opening and closing it.

One side wall of the constant temperature bath 120 is provided with a control box 140 for heater operation, internal temperature control, opening and closing the upper door, and also the plurality of inflow customs 114 and the outflow customs 118 pass through. The communication hole 121 is formed.

One embodiment of the internal structure of the constant temperature bath is shown in Fig. 6B. The inner rear of the constant temperature bath 120 is provided with a heater 129 for increasing the temperature of the constant temperature bath 120. The air heated by the heater 129 ascends through the partition wall 124 and blows forward through the duct 124 by the fan 128 to increase the temperature inside the constant temperature bath 120. This is to maintain the internal temperature more uniformly, but is not limited to this manner can be installed in a conventional deformable form.

And the wall surface of the constant temperature bath 120 is treated with a heat insulating material (not shown) to help keep the temperature inside is constant without being influenced by the outside.

In addition, in order to keep the temperature of the constant temperature bath 120 more constant, a thermostat (not shown) may be installed as a conventional technique. The thermostat (not shown) stops the operation of the heater 129 when the temperature in the constant temperature bath 120 rises above a predetermined level, and starts to operate when the temperature falls below a predetermined level so that it is always maintained at a constant temperature. In addition, the temperature control device may also serve as a dehumidifier.

The inlet pipe 113 to which the plating liquid is supplied is connected to the outlet pipe 117 for discharging the supplied plating liquid to the cooling water line P ′ of the mold accommodated in the constant temperature bath 120. The inflow pipe 113 and the outflow pipe 117 are branched into the plurality of inflow pipes 114 and the outflow pipes 118, respectively, which are connected to the coolant line P 'side of the mold to the coolant line P'. This is connected to the case in which the coolant line P 'formed in the mold P is not usually formed as a single line, but is prepared in a case where a plurality of coolant lines P' are formed. In this case the branch is made by the distributor 140. Unlike in the figure, the configuration may be branched in the constant temperature bath 120.

When the configuration as described above consists of one inlet pipe 113 and the outlet pipe 117, the inlet pipe 113 and the outlet pipe (for each cooling water line (P ') to plate a plurality of cooling water lines (P') ( 117) is connected repeatedly to prevent the hassle of working.

On the other hand, in order for the plating to be uniform, a plating liquid having a predetermined concentration or more must be in contact with the cooling water line P 'for a predetermined time, so that a flow meter is provided in the inflow pipe 113 or the outflow pipe 117 to measure the reflux rate of the plating liquid. 119 may be installed. In addition, in the case of the mold P having a plurality of coolant lines P 'formed in a short length, the coolant lines P' having a plating solution of two or more by using a connection pipe 111 connecting the coolant lines P 'to each other. Can flow.

The other end of the inflow pipe 113 and the outflow pipe 117 connected to the cooling water line P 'of the mold is connected to the plating solution tank 130. At this time, if the inlet pipe 113 is connected to the upper side, the outlet pipe 117 is preferable to the lower circulation is advantageous. The plating solution tank 130 is a storage solution is stored, stored, and heated from the plating solution tank 130 to the place where the stored plating solution is pumped to the inlet pipe 113, the plating liquid discharged after plating flows out It is refluxed to the plating solution tank 130 through the pipe 117.

On the other hand, in addition to the plating solution tank 130, a washing liquid tank 135 and a pretreatment liquid (pickling liquid) tank 133 is further provided for washing and pretreatment necessary for the plating process. The flushing liquid tank 135 and the pretreatment liquid tank 133 may be configured to have separate inlet pipe 113 and outlet pipe 117, but the inlet pipe 113 and outlet pipe 117 of the plating solution tank 130 ), It is desirable to extend as necessary to control with the valve. That is, it is distributed to the inflow pipe 113 and the outflow pipe 117 which share each liquid, and when water washing is needed, the pretreatment liquid tank and plating liquid tank valve 134, 134 ', 132, 132' are locked, and the water washing liquid tank By opening only the valves 136 and 136 'so that only the washing liquid is circulated, the various liquids remaining in the inlet and outlet pipes 113 and 117 are washed, and each liquid tank is separated into the inlet and outlet pipes 113 and 117. It is also possible not to configure.

Next, an embodiment of the action and plating process of the cooling water line plating apparatus of the mold according to the embodiment of the present invention will be described.

First, as a step before plating is performed, the mold P is accommodated in the constant temperature bath 120. In the case of the small to medium mold (P), the front door 123 of the constant temperature bath tank 120 is pulled open to the front by using a forklift and stored therein, and in the case of a large mold, the front door 123 is opened. The upper door 125 is also opened to be housed in the constant temperature bath 120 using a suitable conveying means such as a hoist or a crane. The upper door 125 may be controlled by the control box 122 having the upper door opening and closing motor 126. 5 shows the operation of the upper door.

Next is the step of connecting the inlet pipe 113 and the outlet pipe 117 to the stored mold (P). The connecting end of the inflow pipe 113 and the outflow pipe 117 is easily connected to the nipple (nipple) is fitted in accordance with the cooling water line (P ').

When the cooling water line P 'of the mold is connected to the inlet pipe 113 and the outlet pipe 117, the washing liquid is refluxed in the washing liquid tank 135 to remove foreign substances and grease in the mold P. And a degreasing step. When refluxing the washing liquid, the valves 134, 134 ', 132, and 132' of the pretreatment liquid tank and the plating liquid tank are closed, and only the valves 136 and 136 'of the washing liquid tank are opened to reflux the water to remove dust or foreign matter. . Next, as a pickling step for passing the pickling (pretreatment) liquid in order to facilitate the plating, if oil to be deposited on the plated body, it is ionized and the plating is not performed properly, so removing it. In this case, only the valves 134, 134 'of the pretreatment liquid tank are opened, and the valves 136, 136', 132, 132 'of the water washing tank and the plating liquid tank are closed.

Next, a step of controlling the temperature of the constant temperature bath 120 by operating the heater 129 before passing the plating liquid. At this time, the temperature is increased to 70 ℃ to 100 ℃ depending on the nature of the plating solution. When the heater 129 is operated, the heated air rises on the partition wall 124 by the fan 128 and is evenly spread through the duct 124 'throughout the constant temperature bath 120. If the mold is large, the heating time is about 10 hours.

Thereafter, the plating solution is refluxed to the inlet pipe 113 and the outlet pipe 117 while the plating is performed by the thermostat 127 and the heater while maintaining the temperature of the constant temperature bath 120 constantly. . At this time, the reflux rate is measured by the flow meter 119 and maintained at a temperature at which plating is most appropriate. During plating, the normal pH of the plating solution is maintained at 4.5 to 4.7. When raising the pH, 10% sodium hydroxide or 10% sulfuric acid solution is used to lower the pH. In addition, the concentrations of Ni and P, which are the plating liquid components, are also kept constant, and the constant temperature bath 120 is also kept constant at 80 ° C. As a finishing step, the mold P is washed again with water to remove foreign matters after plating, and all steps are completed.

Figure 6 is a process diagram for one embodiment of a cooling water line electroless plating process of the mold, the present invention is not limited to this embodiment can be variously modified. In particular, the washing, degreasing, and pickling steps may be carried out at appropriate stages in a conventional manner as necessary, and in addition, it is also contemplated to use them repeatedly, since complete removal of foreign matter is desirable to optimize plating. It is natural that the technical scope of the invention should not be exceeded.

 Effects on the cooling water line electroless plating process and apparatus of the mold according to the present invention made as described above are as follows.

First, since the electroless solution is maintained at a high temperature so that the reaction is normally performed, according to the present invention, plating can be stably performed by adjusting the temperature of the mold in advance, thereby forming a uniform coating film.

Second, in the plating process and apparatus for connecting the pipe to the cooling water line of the mold to plate the cooling water line,

① The mold is heated in the constant temperature bath, so that a constant temperature is maintained in all the coolant line sections of the mold, so that the entire mold is immersed in the plating bath, and water washing, pickling and plating are performed in one tank. As a result, the work efficiency is significantly increased.

② A large number of inflow and outflow customs are provided to plate the entire cooling water line of the mold at the same time, significantly reducing the plating time, thereby increasing the efficiency of plating.

③ Even in the case of large molds, it can be easily stored in constant temperature molds.

Furthermore, as a useful effect of the present invention, it is possible to improve the durability of the mold to reduce the loss of cost due to frequent replacement of the mold, which is expensive equipment.

Claims (11)

delete delete delete delete In the cooling water line electroless plating apparatus of the mold, A plating solution tank in which a plating solution of a mold is stored; A washing liquid tank in which the washing liquid of the mold is stored; Pickling liquid tank for storing the pickling liquid of the mold; An inlet pipe for supplying the plating liquid of the plating solution tank to the cooling water line of the mold; An outlet pipe for refluxing the plating liquid in which the mold is distributed to the plating bath; The temperature of the mold to be plated is adjusted according to the proper operating temperature of the plating liquid, and the temperature control and washing, pickling, and plating of the cooling water line of the mold are performed, and a duct formed in the partition wall is provided with a heater. Cooling line electroless plating apparatus of a mold comprising a constant temperature bath for maintaining a constant temperature of the plating liquid during plating by blowing air heated through. The thermostatic bath according to claim 5, wherein the constant temperature bath is provided with a door into which the mold is entered, a heater capable of heating the inside, a wall surface provided with a heat insulating material, and a thermostat for maintaining the inside at a constant temperature. Cooling line electroless plating apparatus of a mold, characterized in that the plating proceeds in the plating bath. 7. The electroless plating apparatus of claim 6, wherein the constant temperature bath door is installed at a front surface and a top surface, or at a side surface and a top surface thereof. 8. The electroless plating apparatus according to claim 7, wherein a communication hole for passing the inflow pipe and the outflow pipe is formed in one portion of the wall surface of the thermostatic gold bath. The heater of any one of claims 5 to 8, wherein the heater of the constant temperature bath is partitioned from an area in which the mold is accommodated by the partition wall, and a fan is provided to circulate the hot air generated from the heater. Electroless plating device for cooling water line of mold. The cooling water line electroless of the mold according to any one of claims 5 to 8, wherein ends of the inflow pipe and the outflow pipe connected to the cooling water line side of the mold are branched into a plurality of inflow and outflow custom pipes, respectively. Plating equipment. The mold cooling water line electroless plating apparatus according to any one of claims 5 to 8, wherein the washing liquid tank, the pickling liquid tank, and the plating liquid tank share the inflow pipe and the outflow pipe.

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