KR100626422B1 - Printed circuit board - Google Patents

Printed circuit board Download PDF

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Publication number
KR100626422B1
KR100626422B1 KR1020040044978A KR20040044978A KR100626422B1 KR 100626422 B1 KR100626422 B1 KR 100626422B1 KR 1020040044978 A KR1020040044978 A KR 1020040044978A KR 20040044978 A KR20040044978 A KR 20040044978A KR 100626422 B1 KR100626422 B1 KR 100626422B1
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KR
South Korea
Prior art keywords
circuit board
printed circuit
lands
soldering
land
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KR1020040044978A
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Korean (ko)
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KR20050119850A (en
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하종헌
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삼성전자주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

본 발명은 인쇄회로기판에 관한 것으로, 특히 본 발명은 인쇄기판상에 실장되는 부품의 실장방향을 조절하여 인쇄회로기판의 설치공간부족, 부품배치곤란 등에 의해 인쇄회로기판의 솔더진행방향과 부품실장방향이 수평을 유지하지 못하더라도 부품의 솔더링불량을 최소화한다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board. In particular, the present invention relates to a solder progress direction and a component mounting direction of a printed circuit board by adjusting a mounting direction of a component mounted on a printed board due to lack of installation space of the printed circuit board, difficulty in placing components, and the like. Failure to maintain this level minimizes soldering defects in components.

이를 위해 본 발명은 복수의 리드가 형성된 부품이 실장되며, 이 복수의 리드에 대응하는 위치에 일렬로 형성되는 복수의 랜드를 구비한다. 이 복수의 랜드가 이루는 열은 부품의 실장방향과 상기 인쇄회로기판의 솔더링진행방향이 경사지도록 솔더링진행방향에 대하여 소정각도로 배치된다.To this end, in the present invention, a component having a plurality of leads is mounted and includes a plurality of lands formed in a line at a position corresponding to the plurality of leads. The rows of the plurality of lands are arranged at a predetermined angle with respect to the soldering progressing direction so that the mounting direction of the component and the soldering progressing direction of the printed circuit board are inclined.

Description

인쇄회로기판 {PRINTED CIRCUIT BOARD}Printed Circuit Board {PRINTED CIRCUIT BOARD}

도 1은 일반적인 인쇄회로기판의 부분평면도이다.1 is a partial plan view of a typical printed circuit board.

도 2는 종래의 인쇄회로기판의 부분평면도이다.2 is a partial plan view of a conventional printed circuit board.

도 3은 본 발명에 따른 인쇄회로기판의 부분평면도이다.3 is a partial plan view of a printed circuit board according to the present invention.

도 4는 본 발명에 따른 인쇄회로기판에 부품을 솔더링할 때의 부분측면도이다.4 is a partial side view when soldering a component to a printed circuit board according to the present invention.

*도면의 주요 기능에 대한 부호의 설명** Description of the symbols for the main functions of the drawings *

10 : 인쇄회로기판 11 : 랜드10: printed circuit board 11: land

11a : 말단랜드 12 : 홀11a: terminal land 12: hole

13 : 유도랜드 14 : 실크차단막13: judoland 14: silk barrier

15 : 연결부 16 : 리드15 connection 16 lead

본 발명은 인쇄회로기판에 관한 것으로, 더욱 상세하게는 인쇄회로기판(Printed Circuit Board ; PCB)에 실장되는 부품의 쇼트 및 브릿지를 방지할 수 있도록 한 인쇄회로기판에 관한 것이다.The present invention relates to a printed circuit board, and more particularly, to a printed circuit board capable of preventing shorts and bridges of components mounted on a printed circuit board (PCB).

일반적으로, 인쇄회로기판에는 표면실장부품(SMD)나 삽입부품(IMD)중 한 종류만이 실장되거나 표면실장부품과 삽입부품이 혼재 실장되며, 이 중 삽입부품은 리드가 인쇄회로기판을 관통하는 홀에 삽입된 후 솔더링에 의해 인쇄회로기판에 실장된다.In general, only one type of a surface mount component (SMD) or an insert component (IMD) is mounted on the printed circuit board, or a surface mount component and an insert component are mixed and mounted on the printed circuit board. After being inserted into the hole, it is mounted on the printed circuit board by soldering.

도 1에 도시된 바와 같이, 삽입부품 중 IC나 커넥터 등의 부품이 실장되는 인쇄회로기판(1)에는, 부품에 형성된 다수의 리드에 대응하는 랜드(2)가 화살표로 표시된 솔더링진행방향을 따라 일렬로 배치되어 있다. 즉, 솔더링진행방향과 부품의 실장방향이 수평한 상태를 이룬다.As shown in FIG. 1, a printed circuit board 1 in which components such as an IC and a connector are mounted among the inserted parts includes a land 2 corresponding to a plurality of leads formed in the component along a soldering progress direction indicated by an arrow. It is arranged in a line. That is, the soldering progress direction and the mounting direction of the parts to form a horizontal state.

인쇄회로기판(1)에 삽입부품을 실장하는 경우, 인쇄회로기판(1)의 홀(3)에 삽입부품의 리드를 삽입한 후 인쇄회로기판(1)을 납조를 따라 이동시킨다. 이에 따라, 솔더가 각 리드의 둘레에 형성된 랜드(2)에 부착됨으로서 솔더링이 이루어진다. 이때, 솔더의 흐름이 말단랜드(2a)에 도달하면, 솔더는 말단랜드(2a)에 부착된 다음, 폭이 좁은 연결부(5)를 통과하면서 솔더의 양이 급격히 줄어들고, 잉여의 솔더는 유도랜드(4)에 수령되게 된다. 이 때, 유도랜드(4)의 말단부가 급격히 폭이 좁아지기 때문에 연결부(5)에서와 마찬가지로 솔더링이 급격히 줄어들어 자연스럽게 인쇄회로기판(1)로부터 분리되게 되므로, 랜드(2) 간의 쇼트나 브릿지를 방지하게 된다.When inserting an insert into the printed circuit board 1, the lead of the insert is inserted into the hole 3 of the printed circuit board 1, and then the printed circuit board 1 is moved along the lead bath. Thereby, soldering is performed by attaching the solder to the land 2 formed around each lead. At this time, when the flow of solder reaches the end land (2a), the solder is attached to the end land (2a), and then the amount of solder is drastically reduced while passing through the narrow connection portion 5, the excess solder is induction land Will be received at (4). At this time, since the distal end portion of the guide land 4 is rapidly narrowed, as in the connecting portion 5, the soldering is abruptly reduced and naturally separated from the printed circuit board 1, thereby preventing shorts or bridges between the lands 2. Done.

그러나, 인쇄회로기판(1)의 설치공간부족 또는 부품의 배치곤란 등에 의해 도 2에 도시된 바와 같이, 다수의 리드에 대응하는 랜드(2)가 화살표로 표시된 솔더링진행방향에 대하여 수직으로 일렬 배치되는 경우가 있다. 이로 인해, 인쇄회로 기판(1)의 솔더링진행방향과 부품의 실장방향이 수평하게 배치되지 못하기 때문에 솔더링시, 유도랜드(2a')가 설치되어 있다 하더라도 이웃하는 랜드(2)간에 솔더의 뭉침을 초래함으로서 각 랜드(2)간에 쇼트나 브릿지가 발생하는 문제점이 있다.However, as shown in FIG. 2 due to lack of installation space of the printed circuit board 1 or difficulty in arranging parts, the lands 2 corresponding to the plurality of leads are arranged in a line perpendicular to the soldering progress direction indicated by the arrows. It may become. As a result, the soldering progress direction of the printed circuit board 1 and the mounting direction of the components are not arranged horizontally, so that the solder agglomerates between neighboring lands 2 even when the induction lands 2a 'are provided at the time of soldering. This causes a short or bridge between the lands 2.

이러한 현상은 특히 무연 솔더와 같은 젖음성이 적은 솔더의 경우에는 더욱 심하게 나타나게 된다.This is especially true for solders with low wettability, such as lead-free solders.

본 발명은 전술한 문제점을 해결하기 위한 것으로, 본 발명의 목적은 인쇄회로기판의 솔더링진행방향과 부품의 실장방향이 수평하지 않더라도 부품의 솔더링불량을 최소화할 수 있는 인쇄회로기판을 제공하는 것이다.SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a printed circuit board capable of minimizing soldering defects of components even when the soldering progress direction of the printed circuit board and the mounting direction of the components are not horizontal.

전술한 목적을 달성하기 위한 본 발명의 인쇄회로기판은 복수의 리드가 형성된 부품이 실장되며, 상기 복수의 리드에 대응하는 위치에 일렬로 형성되는 복수의 랜드를 구비하는 인쇄회로기판에 있어서, 상기 부품의 실장방향과 상기 인쇄회로기판의 솔더링진행방향이 경사지도록 상기 복수의 랜드가 이루는 열을 상기 솔더링진행방향에 대하여 소정각도로 배치시키는 것을 특징으로 한다.In the printed circuit board of the present invention for achieving the above object is a printed circuit board having a plurality of lands are mounted, the plurality of lands are formed in a line corresponding to the plurality of leads in the printed circuit board, The arrangement of the plurality of lands may be arranged at a predetermined angle with respect to the soldering progressing direction such that the mounting direction of the component and the soldering progressing direction of the printed circuit board are inclined.

상기 소정각도는 대략 60도 내지 80도인 것을 특징으로 한다.The predetermined angle is characterized in that about 60 to 80 degrees.

상기 소정각도는 대략 75도인 것을 특징으로 한다.The predetermined angle is characterized in that approximately 75 degrees.

상기 복수의 랜드 중 솔더링진행방향의 최후방에 배치된 말단랜드에는, 이격되게 배치되어 솔더를 수령하는 유도랜드와, 상기 말단랜드와 상기 유도랜드를 연결하는 연결부가 마련되는 것을 특징으로 한다.End lands arranged in the rearmost of the plurality of lands in the soldering progress direction may be provided with induction lands spaced apart from each other to receive solder, and connecting portions connecting the end lands to the induction lands.

상기 유도랜드는 상기 솔더링진행방향을 따라 폭이 좁아지는 물방울형상 또는 하트형상인 것을 특징으로 한다.The induction land is characterized in that the water droplets or the heart shape narrowing in the soldering progress direction.

상기 각 랜드와 이웃하는 랜드 사이에는 솔더의 흐름을 차단하는 실크차단막이 인쇄되어 있는 것을 특징으로 한다.A silk barrier layer is printed between the lands and the neighboring lands to block the flow of solder.

이하에서는 본 발명의 바람직한 실시예를 본 도면을 참조하여 상세하게 설명하도록 한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

도 3은 본 발명에 따른 인쇄회로기판의 부분평면도이다. 도 4는 본 발명에 따른 인쇄회로기판에 부품을 솔더링할 때의 부분측면도이다.3 is a partial plan view of a printed circuit board according to the present invention. 4 is a partial side view when soldering a component to a printed circuit board according to the present invention.

도 3과 도 4에 도시된 바와 같이, 본 발명에 따른 인쇄회로기판(10)에는 각 랜드가 순차적으로 솔더링될 수 있기 하기 위해 부품의 실장방향과 솔더링진행방향이 서로 경사지도록 삽입되는 부품 중 IC 나 커넥터 등의 부품에 형성된 다수의 리드에 대응하는 랜드(11)가 화살표로 표시된 솔더링진행방향에 대하여 소정각도로 일렬로 배치되어 있다. 이때, 소정각도는 일예로, 대략 75도이며, 대략 60도에서 80도의 범위도 가능하다.As shown in FIGS. 3 and 4, in the printed circuit board 10 according to the present invention, in order to allow each land to be soldered sequentially, the mounting direction of the component and the soldering progress direction are inserted into the IC. The lands 11 corresponding to the plurality of leads formed on the components such as the connector are arranged in a line at a predetermined angle with respect to the soldering progress direction indicated by the arrows. In this case, the predetermined angle is, for example, about 75 degrees, and a range of about 60 to 80 degrees is possible.

각 랜드(11)는 리드가 삽입되는 홀을 중심으로 한 원형으로 형성되어 있으며, 솔더링진행방향을 따라 최후방에 위치하는 말단랜드(11a)에는 솔더링진행방향에 수평하게 형성되고, 소정 이격된 위치에 형성되어 말단랜드(11a)로부터의 솔더링을 유도하는 유도랜드(13)가 형성되어 있다.Each land 11 is formed in a circular shape centering the hole into which the lead is inserted, and is formed horizontally in the soldering progress direction in the end land 11a positioned at the rearmost side along the soldering progress direction, and spaced a predetermined distance from each other. An induction land 13 is formed which is formed at the side to induce soldering from the end land 11a.

이 유도랜드(13)는, 말단으로 갈수록 그 폭이 급격히 좁아지는 물방울 형상(또는 하트 형상)으로 형성되며, 연결부(15)에 의해 말단랜드(11a)와 일체로 연결된 다. 연결부(15)는 유도랜드(13)와 말단랜드(11a)의 솔더링진행방향의 가로폭의 1/3정도로 형성되어 솔더가 유도랜드(13)로 유도되는 것을 돕게 된다.The guide land 13 is formed in a drop shape (or heart shape) whose width narrows rapidly toward the end, and is integrally connected to the end land 11a by the connecting portion 15. The connecting portion 15 is formed in about 1/3 of the width of the induction land 13 and the end land 11a in the soldering progress direction to help guide the solder to the induction land 13.

한편, 각 랜드(11)와 그 이웃하는 랜드(11)사이에는 실크차단막(14)이 인쇄되어 랜드(14) 간의 솔더링을 차단해주는 역할을 하며, 일반적으로 실크인쇄는 부품의 명칭이나, 장착방향 등을 표시하기 위해 인쇄회로기판(10)에 인쇄되고, 솔더의 흐름을 방해하는 성질을 가지고 있다.On the other hand, between each land 11 and the neighboring land 11, a silk barrier film 14 is printed to block soldering between the lands 14, in general silk printing is the name of the part, the mounting direction It is printed on the printed circuit board 10 to display the back, and has the property of hindering the flow of solder.

인쇄회로기판(10)에 삽입부품의 실장은, 먼저, 삽입부품의 리드(16)를 인쇄회로기판(10)의 홀(12)에 삽입하고, 삽입부품이 삽입된 인쇄회로기판(10)을 약 5 정도 기울어진 상태로 납조를 따라 이동시킨다. 그러면, 도 4와 같이, 솔더가 인쇄회로기판(10)을 향해 분사되어 각 리드(16)의 둘레에 형성된 랜드(11)에 부착되고, 각 랜드(11) 사이의 실크차단막(14)으로 인해 각 랜드(11)간의 솔더링이 차단되어 랜드(11)간의 쇼트나 브릿지를 방지하게 된다.Mounting of an insertion part on the printed circuit board 10 first inserts the lead 16 of the insertion part into the hole 12 of the printed circuit board 10, and then inserts the printed circuit board 10 into which the insertion part is inserted. Move along the tub with the incline about 5 degrees. Then, as shown in FIG. 4, the solder is sprayed toward the printed circuit board 10 and attached to the lands 11 formed around each of the leads 16, and due to the silk barrier film 14 between the lands 11. Soldering between the lands 11 is blocked to prevent shorts or bridges between the lands 11.

한편, 솔더의 흐름이 첫 번째 랜드(11)에서 순차적으로 말단랜드(11a)에 도달하면, 솔더는 말단랜드(11a)에 부착된 다음, 폭이 좁은 연결부(15)를 통과하면서 솔더의 양이 급격히 줄어들고, 잉여의 솔더는 유도랜드(13)에 수령되게 된다. 이때, 유도랜드(13)의 말단부가 급격히 폭이 좁아지기 때문에 연결부(15)에서와 마찬가지로 솔더가 급격히 줄어들어 자연스럽게 인쇄회로기판(10)로부터 분리되게 되며, 연결부(15)에 의해 솔더가 유도랜드(13)로부터 말단랜드(11a)로 역류되는 것을 방지할 수 있게 된다.On the other hand, when the flow of solder reaches the end land 11a sequentially in the first land 11, the solder is attached to the end land 11a, and then the amount of solder is passed through the narrow connecting portion 15. The drastic decreases, and excess solder is received in the induction land (13). At this time, since the end portion of the induction land 13 is rapidly narrowed, as in the connection part 15, the solder is abruptly reduced and naturally separated from the printed circuit board 10, and the solder is connected to the induction land ( It is possible to prevent the backflow from the end land 11a to the end 13).

이러한 솔더링작업이 완료되면, 각 랜드(11)에 골고루 솔더가 부착되고, 말 단랜드(11a)로부터의 잔여분의 솔더는 유도랜드(13)로 흡입되어 유도랜드(13)는 상향 볼록한 단면을 가지게 된다.When the soldering operation is completed, solder is evenly attached to each land 11, and the remaining solder from the end land 11a is sucked into the induction land 13 so that the induction land 13 has an upwardly convex cross section. do.

이와 같이, 본 발명에서는 부품의 실장방향과 인쇄회로기판의 솔더링진행방향이 경사지도록 각 랜드(11)를 솔더링진행방향에 대하여 기울어지게 형성한 후, 말단랜드(11a)에 유도랜드(13)를 형성함으로써, 인쇄회로기판(10)의 솔더링 작업시, 불가피하게 인쇄회로기판(10)에서 단품과 연결되는 커넥터가 많아 솔더링진행방향으로 부품실장의 수평 기본원칙을 지키지 못하고, 수직 배치하는 경우 많이 발생하는 솔더링불량을 기존 인쇄회로기판의 부품배치의 큰 변경 없이 부품삽입의 각도만을 변경하는 것만으로 최소화할 수 있게 된다.As described above, in the present invention, each land 11 is formed to be inclined with respect to the soldering progression direction so that the mounting direction of the component and the soldering progression direction of the printed circuit board are inclined, and then the guide lands 13 are formed on the end lands 11a. When forming, the soldering work of the printed circuit board 10 inevitably causes a large number of connectors to be connected to a single component in the printed circuit board 10, which does not comply with the horizontal basic principle of component mounting in the soldering progress direction, and is often caused by vertical arrangement. Soldering defects can be minimized only by changing the angle of component insertion without a large change in the arrangement of components of the existing printed circuit board.

이상에서 상세히 설명한 바와 같이, 본 발명은 인쇄기판상에 실장되는 부품의 실장방향을 조절하여 인쇄회로기판의 설치공간부족, 부품배치곤란 등에 의해 인쇄회로기판의 솔더진행방향과 부품실장방향이 수평을 유지하지 못하더라도 부품의 솔더링불량을 최소화할 수 있는 효과가 있다.As described in detail above, the present invention adjusts the mounting direction of the components mounted on the printed circuit board to maintain the solder progress direction and the component mounting direction of the printed circuit board due to lack of installation space of the printed circuit board, component placement difficulties, etc. If not, there is an effect to minimize the soldering defects of the part.

또한, 본 발명은 인쇄회로기판의 기존 틀을 유지하여 부품배치와 인쇄회로기판의 크기에 영향을 주지 않으면서도 부품의 솔더링불량을 줄일 수 있는 효과가 있다.In addition, the present invention has the effect of reducing the soldering defects of the components without affecting the arrangement of the components and the size of the printed circuit board by maintaining the existing framework of the printed circuit board.

Claims (6)

복수의 리드가 형성된 부품이 실장되며, 상기 복수의 리드에 대응하는 위치에 일렬로 형성되는 복수의 랜드를 구비하는 인쇄회로기판에 있어서,A printed circuit board having a plurality of leads formed thereon and mounted with a plurality of lands formed in a line at a position corresponding to the plurality of leads, 상기 부품의 실장방향과 상기 인쇄회로기판의 솔더링진행방향이 경사지도록 상기 복수의 랜드가 이루는 열을 상기 인쇄회로기판의 솔더링진행방향에 대하여 60도 내지 80도로 배치시키되,The heat formed by the plurality of lands is disposed at 60 degrees to 80 degrees with respect to the soldering progress direction of the printed circuit board such that the mounting direction of the component and the soldering progress direction of the printed circuit board are inclined. 상기 복수의 랜드 중 상기 인쇄회로기판의 솔더링진행방향의 최후방에 배치된 말단랜드에는, 이격되게 배치되어 솔더를 수령하는 유도랜드와, 상기 말단랜드와 상기 유도랜드를 연결하는 연결부가 마련되고,An end land disposed at the rearmost end of the printed circuit board in the soldering progress direction of the printed circuit board may include induction lands spaced apart from each other to receive solder, and connecting portions connecting the end lands to the induction lands. 상기 유도랜드는 상기 인쇄회로기판의 솔더링진행방향을 따라 폭이 좁아지는 물방울형상 또는 하트형상인 것을 특징으로 하는 인쇄회로기판.The induction land is a printed circuit board, characterized in that the water droplets or the heart shape narrowing in the soldering progress direction of the printed circuit board. 삭제delete 제1항에 있어서, 상기 소정각도는 대략 75도인 것을 특징으로 하는 인쇄회로기판.The printed circuit board of claim 1, wherein the predetermined angle is about 75 degrees. 삭제delete 삭제delete 제1항에 있어서, 상기 각 랜드와 이웃하는 랜드 사이에는 솔더의 흐름을 차단하는 실크차단막이 인쇄되어 있는 것을 특징으로 하는 인쇄회로기판.The printed circuit board of claim 1, wherein a silk barrier layer is printed between the lands and the neighboring lands to block the flow of solder.
KR1020040044978A 2004-06-17 2004-06-17 Printed circuit board KR100626422B1 (en)

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Publication number Priority date Publication date Assignee Title
JPH0648077A (en) * 1992-07-29 1994-02-22 Rohm Co Ltd Ic memory card
JP2002280717A (en) * 2001-03-19 2002-09-27 Matsushita Graphic Communication Systems Inc Printed board
KR20020094598A (en) * 2001-06-12 2002-12-18 주식회사 하이닉스반도체 semiconductor device and method for fabricating the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0648077A (en) * 1992-07-29 1994-02-22 Rohm Co Ltd Ic memory card
JP2002280717A (en) * 2001-03-19 2002-09-27 Matsushita Graphic Communication Systems Inc Printed board
KR20020094598A (en) * 2001-06-12 2002-12-18 주식회사 하이닉스반도체 semiconductor device and method for fabricating the same

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