KR100624625B1 - Connector for electrical isolation in a condensed area - Google Patents

Abstract

The present invention relates to a connector system having a header connector and a receptacle connector. The header connector has an array of pins. The modular receptacle connector includes a ground receptacle contact in contact with adjacent mating surfaces of the pin and a signal receptacle contact for engaging the other pin.

Headers, Pins, Ground Receptacle Contacts, Signal Receptacle Contacts, Socket Connectors

Description

CONNECTOR FOR ELECTRICAL ISOLATION IN A CONDENSED AREA}

1A and 1B are perspective views, respectively, of an exemplary connector according to the present invention with parts separated and mated.

2 is a perspective view of an exemplary pin arrangement in a header housing, in accordance with the present invention.

3 is a perspective view of an exemplary ground pin in accordance with the present invention.

4 is a perspective view of an exemplary signal pin in accordance with the present invention.

5A is a perspective view of rows of contacts inserted into a housing, in accordance with the present invention;

FIG. 5B is a perspective view of the contact of FIG. 5A inserted into another housing, in accordance with the present invention; FIG.

6A and 6B are perspective views of exemplary signal receptacle contacts in accordance with the present invention.

7A, 7B and 7C are perspective views of exemplary ground receptacle contacts in accordance with the present invention.

8A is a perspective view of a pair of rows of exemplary signal receptacle contacts in accordance with the present invention.

FIG. 8B is a perspective view of the rows of contacts of FIG. 8A with an overmold and additional housing on the contacts in accordance with the present invention. FIG.

9A is a perspective view of the rows of contacts of FIG. 8B with a pair of rows of an exemplary ground receptacle contact in accordance with the present invention.

9B is a detail view of the rows of contacts of FIG. 9A.

9C is a perspective view of additional rows of contacts in FIG. 9A in accordance with the present invention.

9D is a perspective view of pairs of rows of exemplary ground contacts with coupled exemplary ground pins, in accordance with the present invention;

9E and 9F are perspective views of a pair of exemplary socket connectors each including a signal receptacle contact with a coupled pin and a ground receptacle contact, in accordance with the present invention;

10 is a force diagram of an arrangement of differential pairs in accordance with the present invention.

<Explanation of symbols for the main parts of the drawings>

10: header connector

12: header housing

15: signal pin

17: ground pin

18: registration beam

45, 47, 70, 72: contact point

50: Receptacle

52: Receptacle Housing

55: signal contact

57: ground contact

100: front housing

101: module

110: rear housing

150, 160: Socket Housing

204: matching part

The present invention relates generally to electrical connectors. More particularly, the present invention relates to an electrical connector having a densely packed contact member capable of passing a signal between adjacent contact members without crosstalk.

Electronic equipment requires electrical connectors that provide connections to the signal paths, and often the signal paths are quite closely spaced, which causes problems from interference between signals transmitted along adjacent paths.

To minimize this problem, it is known to provide such connectors with a ground connection that functions to filter out unwanted interference between signal paths.

However, simple grounding is not always sufficient and is not particularly sufficient for connectors that make up the signal path through the connector where the contacts extend at a sharp angle, because interference between adjacent signal paths is a particularly big problem for these connectors. Because.

In many situations where electrical signals are transmitted between separate subassembly parts of composite electrical and electronic devices, the reduced size makes a significant contribution to the usability or convenience of the devices or certain portions of these devices. To this end, cables comprising extremely small conductors are currently available and it is practical to manufacture terminal pads which are precisely positioned and fairly closely spaced, such as on a circuit board. Therefore, it is desirable to have connectors of reduced size, to interconnect such cables and circuit boards repeatedly, easily and reliably, and to minimize adverse effects on electrical signal transmission within the circuit comprising such connectors.

In the use of the high speed back side, it is desirable that there is little crosstalk between signal currents passing through the connector. In addition, it is also desirable to maximize signal density. Low crosstalk ensures high signal integrity. Higher density increases the number of circuits that can be routed through the connector.

Pin and socket connectors are used to create a detachable and electrically reliable interface. In addition, reliability is further increased by providing two dual cantilevered contact points. Conventional methods typically place two receptacle cantilever beams on opposite sides of protruding pins or blades. This 180 degree “optical beam” method requires a significant amount of coupling margin in the plane defined by the refractive motion of the cantilever beam during bonding. In addition, due to manufacturing tolerances, the ends of the beams are angled outward from the central longitudinal axis of the mating pins or blades to prevent stubbing during initial engagement. The clearance for the refraction and capture projections of such elastic beams leads to the need for contact clearance at the "refractive surface". This clearance must be accommodated in the connector's receptacle housing, which is an important limiting factor in improving the connector's density.

In order to achieve minimal crosstalk through the coaxial insulation of the signal current passing through the connector, it is desirable to insulate in a vertical and horizontal plane alongside the entire connector signal path (including coupling regions). The need for clearance at the refractive surface of the opposing cantilever beams conflicts with the need for vertical and horizontal insulation while maintaining or increasing the density of the connector at the same time.

A method of insulating using a "L-shaped" ground contact structure is disclosed in US Pat. No. 5,660,551 to Sakurai. The Sakurai patent creates an L-shape in the cross section of the ground contact along the length of the receptacle connector. In the area of contact coupling means, the transitions to the Sakurai patent flat conventional dual cantilever beam receptacle are relied upon by a flat protruding blade that is grounded to the contact and rotated 90 degrees, thus providing an L-shaped cross section when the blade and receptacle are engaged. Generate. The transition of this L-shaped structure in the contact joint limits the density due to the aforementioned refractive surface clearance relationship with both the signal and ground double beam contacts, and also creates an opportunity to create a gap where overall coaxial insulation cannot be maintained. Cause. In addition, in the Sakurai patent, the refractive surfaces of all four cantilever beams face in parallel, thus limiting the density.

One conventional method of transmitting data along a transmission line is the common mode method, which is also referred to as a single end. Common mode refers to a transmission mode that transmits a signal level based on a voltage level, preferably ground, which is common to a connector or other signal in the transmission line. The limitation of signal transmission in common mode is that noise on the transmission line will be transmitted with the signal. This common mode noise often results from the instability of the voltage level of the common reference plane, ie the ground elasticity.

Another conventional method of transmitting data along a transmission line is a differential mode method. Differential mode refers to a method based on a transmission line in which a signal on one transmission line of voltage V carries a complementary voltage (-V). A suitable circuit element subtracts the transmission lines, resulting in an output of V-(-V), ie 2V. Common mode noise is canceled in the differential receiver by subtraction of the signal.

The differential pairing method in high-speed right angled back connectors is usually heat based since the shield at ground potential is inserted between the columns of contacts in the connector. That is, conventional products typically use heat-based pair designs, such as those found in VHDM products manufactured by Teradyne, Inc., Boston, Massachusetts. In a column-based pairing, asymmetry is induced between the constant and complementary voltages of the differential pair. One signal in the signal pair will arrive faster than the other. This difference in arrival time degrades the efficiency of common mode noise rejection in the differential mode and slows the output rise time of the differential signal. Thus, since the bandwidth, which is the amount of data that can be transmitted through the transmission line structure, is inversely proportional to "bandwidth = 0.35 / rise time" with respect to the period of rise time, the amount of processed data is lowered by pairing based on columns. .

Although the technology of electrical connectors has been significantly developed, there are some inherent problems with this technology, in particular the problem of densely dense contact members while preventing crosstalk between adjacent contact members. Therefore, there is a need for an electrical connector having a small area while maintaining the integrity of the signal.

The present invention provides an electrical connector including a header having a plurality of pins, a socket connector having a ground receptacle contact in contact with an unopposed mating surface of at least one of the pins and a signal receptacle contact in contact with the other of the pins. It is about the system.

According to another aspect of the invention, the ground receptacle contact is L-shaped in cross section, each side of the L-shaped having a contact point for contacting the mated mating surface of one or more of the pins.

According to another aspect of the invention, the ground receptacle contact and the signal receptacle contact are dual beam contacts that are offset 90 degrees.

According to another aspect of the invention, the signal receptacle contact engages the non-opposite side of the signal pin on the header.

According to yet another aspect of the present invention, there is further provided a second ground receptacle contact, wherein the first and second ground receptacle contacts are partially disposed in an array of differential pairs within the module, and the second ground receptacle contact is also located within an adjacent module. Partially disposed, the second ground receptacle contact is disposed symmetrically to the first ground receptacle contact.

According to another aspect of the invention, the first ground receptacle contact engages a pin, such as a second ground receptacle contact of an adjacent module.

According to another aspect of the present invention, ground and signal receptacle contacts engage respective pins to generate an unbalanced force, the unbalanced force being applied to adjacent ground and signal receptacle contacts to provide a balanced connector system. Offset by one unbalanced force generated by the other.

In another embodiment within the scope of the present invention, a contact is provided that engages a mating contact, the contact being at the first end of the contact for mating contact, a terminal portion opposite the mating portion, and the mating contact. An intermediate portion extending between the portion and the terminal portion, wherein the mating portion is L-shaped in cross section, and each side of the L-shaped has a contact point for contacting the mated mating surface of the mating contact portion.

According to one aspect of the invention, one or more of the contact points are disposed on the smaller surface of the sides. The contact point of the other of the contact points is disposed on the cantilevered portion from the other side. More preferably, the cantilevered portion extends below the rest of the side.

In another embodiment within the scope of the present invention, an electrical interconnect is provided, the electrical interconnect comprising a header connector having a first rectangular array of signal pins and a second rectangular array of ground pins, and a first array of signal pins. A receptacle connector having a third rectangular array of signal receptacle contacts arranged to mate with and a second rectangular array of ground receptacle contacts arranged to mate with the first array and the second array; Offset in a diagonal direction with respect to each other, and the third array and the fourth array are offset in a diagonal relationship with respect to each other. Preferably, each signal receptacle contact is L-shaped in cross section, each ground receptacle contact is L-shaped in cross-section, and each side of the L-shaped is two of the mating mating faces of the bonded ground pin. A contact point for contacting the above adjacent mating surfaces is provided and one side of the sides is flat.

The present invention relates to an electrical connector module having a compact contour that provides coaxial insulation of the signal connection. The present invention provides insulation preservation of the signal in the contact coupling region with minimal sized contours by insulating the contacts in horizontal and vertical planes.

The foregoing and other aspects of the invention will become apparent from the following detailed description of the invention when considered in conjunction with the accompanying drawings.

1A is a perspective view of a first embodiment of a high speed transmission connector according to the present invention with the header and receptacle components separated. FIG. 1B is a perspective view of the connector of FIG. 1A with the header and receptacle assembled; FIG. The straight header connector 10 includes a header housing 12, pins for male signal transmission lines (male contacts 15) and pins for ground lines (male contacts 17). These pins 15, 17 described below with reference to FIGS. 3 and 4 are arranged on the header housing 12 of the connector 10 coupled to correspond to the arrangement of the ground and receptacle contacts on the receptacle 50. . Receptacle 50 preferably includes socket housings 150, 160 that make up receptacle housing 52. Each housing is preferably molded using a plastic material, such as a hot thermoplastic. The fins 15 and 17 are preferably stamped together with the desired material, such as phosphor bronze or beryllium copper. Header 10 may include a suitable shield. The header connector 10 may be mounted or connected to a first circuit board such as a motherboard.

2 is a perspective view of an exemplary pin arrangement in header housing 12, in accordance with the present invention. Terminal portions 202 of the signal pin and the ground pin extend from the receptacle connector to engage a circuit board, such as a midplane or a backplane. The matching portion 204 of the signal pin and the ground pin extends from the housing 12 to the receptacle connector 50. A more detailed description of the header assembly is not necessary to understand the present invention.

3 is a perspective view of a portion of an exemplary ground pin in accordance with the present invention. The ground pin 17 preferably includes a mating beam 18 with cast mating surfaces 18a, 18b. Adjacent faces 18a, 18b (18a are bottom faces) of mating beam 18 contact the ground receptacle contact (at contact points 70, 72 as shown in FIG. 7A). The mating beam 18 extends from the base of the header connector (element 10 in FIG. 1). The ground pin 17 also has a tail section (see FIG. 1B) extending from the header housing opposite the receptacle housing, for example to a printed circuit board.

4 is a perspective view of an exemplary signal pin in accordance with the present invention. Signal pin 15 is also provided on the base of the header connector. Like the pin 17, the pin 15 has adjacent mating surfaces 22, 24.

Header 10 mates with receptacle connector 50. The connector 50 may be mounted on a second circuit board such as a daughter board. The header 10 and receptacle 50 interconnect with the motherboard and daughter board.

The receptacle 50 is a modular connector formed by a series of modules 101 arranged side by side. The introduction housing 150 and the second housing 160 are coupled to the module 101 and form a receptacle 50 with each other.

5A is a perspective view of rows of modules inserted into receptacle housing 150 by engagement of corresponding features (such as protrusions and slots). 5B is a perspective view of two receptacles 50 installed side by side. Each receptacle 50 may have a front housing 150 and a rear housing 160. The socket receptacle housings 150 and 160 are preferably made of plastic.

The housing 150 has a front face 151 and a side wall 153 extending from an edge of the front face 151. Front surface 151 and sidewall 153 define an open interior with a front portion of module 101. The surface of one sidewall 153 facing the open interior may include a groove (not shown) that receives the protrusion 111 on the module 101 for alignment.

The front face 151 has an array of introduction holes 155, 157 corresponding to the arrangement of the pins 15, 17 of the header 10 and the arrangement of the contacts 55, 57 in the module 101. Housing 150 may have protrusions 158 on sidewalls 153 that enter into alignment grooves (see FIG. 2) in header 10 during insertion. The housing 150 may have a block 159 on the sidewall 153 to engage with a latching structure (see FIG. 1A) on the housing 160.

Housing 160 is generally U-shaped with top wall 161 and sidewall 163. The bottom of the top wall 161 may include a groove (not shown) to accommodate the protrusion 111 of the module 101. Sidewall 163 has a pillar 165 for mounting on daughter board and a latch 167 for securing to housing 150. Once secured to the housing 150, the housing 160 holds the module 101 between the housings 150, 160 to form the receptacle 50.

The module 101 will be described below. Each module 101 includes a front housing 100, a rear housing 110, a signal contact 55, and a ground contact 57.

6A and 6B are perspective views of exemplary signal receptacle contacts in accordance with the present invention. Most preferably, the contact 55 has an L-shaped structure 48 that engages non-facing surfaces, in particular the adjacent surfaces 22, 24 of the pin 15. Arm 51 has flared ends 45 and 47, thus providing a surface to mate with the mating pins of the header connector. Most of the surface of the arm 51 engages with the pin 15. The middle portion 54 of the contact portion 55 has a square cross-sectional shape. The fixed or rear end of the contact portion 55 is provided with the terminal 53, respectively, for each angular terminal for mounting on its PCB.

7A, 7B and 7C are perspective views of exemplary ground receptacle contacts in accordance with the present invention. Ground receptacle contact 57 engages two non-facing surfaces of ground pin 17. Preferably, contact 57 is L to receive a pin (eg, ground pin 17) on two adjacent (or non-opposite) mating surfaces 18a, 18b of mating beam 18. It has a shape of a child. Each portion of the "L" shape has shielding tabs 80a and 80b to provide electromagnetic shielding. Tab 80a has a contact point 70 that engages pin 17. Preferably, the contact point 70 is located on the small surface of the tab 80a. The tab 80b has a contact point 72 on the cantilevered portion 81 from the rest of the tab 80. Like the tab 80a, the contact point 72 is on the small surface of the tab 80b. The middle portion of the contact portion 57 has an angular portion 82. The fixed or rear end of the contact portion 57 has a terminal 83 for mounting on a substrate.

As shown in FIGS. 7B and 7C, the portion 81 extends below the rest of the tab 80b. The portion 81 is curved downward from the rest of the tab 80b to align the contact point 72 with the pin 17. Upon insertion of the pin 17, the portion 81 can be deflected laterally towards the rest of the tab 80b. 7b clearly shows that the contact 57 engages the non-opposite side of the pin 17.

The assembly of the module 101 will be described below. 8A is a perspective view of a pair of rows of exemplary signal receptacle contacts in accordance with the present invention. In this differential pair arrangement, adjacent columns are generally symmetrical with respect to each other. Each signal receptacle contact is substantially similar to the contact 55 described with reference to FIG. 6A. The terminal 53 and the right angled portion 54 vary in size to fit properly in the housing as described below.

FIG. 8B is a perspective view of the rows of contacts of FIG. 7A after the housing 110 is overmolded relative to the portion of the terminal portion 53 of the contact portion 55 and the intermediate portion 54. The housing 110 is preferably molded using a plastic material, such as a high temperature thermoplastic. Housing 110 includes a slot 120 in which ground receptacle 57 is later located, as shown in FIG. 9A. The overmolding process also produces protrusions 11 and alignment pillars 113.

The front housing 100 has an opening 103 for receiving the signal terminal 55 from the rear and the pin 15 from the front. The front housing 100 may also have a protrusion 105 that engages with a corresponding groove in the housing 150. The front housing 100 is preferably molded separately (ie not overmolded around the terminal 55) and the signal contacts 55 and the pins 15 are separated from each other and the ground contacts 57 and the pins 17. Used to insulate from The front housing 100 helps to align the module for insertion into the receptacle housing 150 and protects the contacts during transport. The housing 100 is preferably molded using a plastic material, such as a high temperature thermoplastic. The housing may be located on the terminal 55 before or after the overmolding step or during the overmolding step.

Once housing 110 is overmolded relative to terminal 55 and housing 100 is located on terminal 55, ground terminal 57 is located on housings 100 and 110. The corresponding portion of the ground terminal 55 is inserted into the groove 120 in the housing 110. The front portion of the ground terminal 57 has a complementary edge and thus surrounds a corresponding portion of the housing 100. Housings 100 and 110 and contacts 55 and 57 are combined to form a completed module as shown in FIG. 9A. Modules installed side by side and inserted into the housing 150 form a receptacle connector.

9B shows a detailed view of the completed module 101. Multiple rows and columns of contacts of the connector module may be regularly arranged in closely spaced arrays. The preferred pitch is 2 mm and the rows of signal contacts are sandwiched between two adjacently located rows of ground contacts. Each signal pin 15 is shielded by the ground receptacle contact 57 of the connector module as well as the ground receptacle contact 57 of the adjacent module. It will be appreciated that any number of connector modules may be arranged. As described with reference to FIG. 9A, a plurality of pairs of rows of contacts are located adjacent to each other as shown in FIG. 9C.

9D is a perspective view of pairs of rows of exemplary ground contacts 57 of adjacent module 101 with example ground pins coupled. The pin is similar to the ground pin 17 described with reference to FIG. Matching beams 18 are inserted into the receptacle between two adjacent ground receptacles 57 of each adjacent module. The mating beam 18 contacts the receptacle at four positions, each contact point 70, 72 of the adjacent receptacle. The registration beam 18 contacts each contact at a location 72 on the opposite side of the registration beam 18 and contacts each contact at a location 70 on the bottom of the registration beam 18.

9E and 9F illustrate a pair of exemplary socket connector elements (the housings 100 and 110 are omitted for clarity), each including a pin coupled signal receptacle contact and a ground receptacle contact, according to the present invention. A perspective view of the arrangement. 9E and 9F couple the pair of signal receptacle contacts 55 of FIGS. 6A and 6B with the pair of ground receptacle contacts 57 of FIGS. 7A-7C. Pins 17 and 15 of Figs. 3 and 4 are also shown respectively.

For the signal receptacle contact 55, the contact points 45, 47 are mated on adjacent (ie non-opposite) sides 22, 24 of the signal pin 15, preferably rectangular in cross section, and the signal pin ( Mismatch on opposite sides of 15). For ground receptacle contact 57, contact points 70, 72 are mated on adjacent (ie non-opposite) sides 18a, 18b of ground pin 17. The matching design provides more space to surround the signal with ground. This provides insulation in tight areas.

U.S. Patent Application No. 08 / 942,084 filed October 1, 1997 (Agent Document No. EL-4491 / BERG-2422) and U.S. Patent Application No. 09 / 045,660 filed March 20, 1998 ( As described in Representative Document No. EL-4491A / BERG-2433, the connector provides a balanced reaction force. As shown in the force diagram of the arrangement of differential pairs in FIG. 10, each differential pair (e.g., differential pair 305) has a pair of ground receptacle contacts (e.g., contacts 57 ₁ , 57 _2). ) And a pair of signal receptacle contacts (eg, contacts 55 ₁ , 55 ₂ ). For the differential pair 305, each ground contact 57 is in contact with the ground pin as described above, so represented by the horizontal vectors FH ₁ , FH ₂ and the vertical vectors FV ₁ , FV ₂ . Generates a series of forces Neighboring differential pair, for example, in the differential pair 300, the ground contact (57 ₃₎ is in contact with the ground pin which is also engaged by the adjacent contact (57 ₁₎ in the adjacent module 101. The contact portion (57 ₃₎ generates a set of forces indicated respectively as vector ₍₃ FH, FV ₃₎ in the horizontal and vertical directions. Similarly, in neighboring differential pair 310, the ground contact (57 ₂₎ is in contact with the ground pin which is also engaged by the adjacent contact (57 ₂₎ in adjacent modules (101). The contact portion (57 ₄₎ generates a set of forces indicated respectively as vector ₍₄ FH, FV ₄₎ in horizontal and vertical directions. This force acts on the connector module to generate composite forces, represented by the vectors FD ₁ , FD ₂ , FD ₃ , FD ₄ , in the composite direction, preferably diagonally relative to the bonded ground contact.

The other forces are developed by signal receptacle contacts on the signal pins (eg, contacts 55 ₁ , 55 ₂ in differential pair 305), so that FH ₅ and FH ₆ and Generates a series of forces labeled FV ₅ and FV ₆ in the vertical direction. These forces act on the connector module to generate composite forces, represented by vectors FD ₅ , FD ₆ , in the composite direction, preferably diagonally relative to the coupled signal contacts.

Preferably, for the differential pair 305, the vectors FD ₁ , FD ₅ are opposite diagonal and have the same size, and the vectors FD ₂ , FD ₆ are also preferred, and thus are offset from each other. Eventually balance the connector. Thus, the present invention uses the ground and signal contacts with ground and signal pins in differential pairs to balance the forces. Balancing the vector occurs in the other differential pairs of connectors as well.

The present invention allows a method of total insulation in a more dense manner within the contact bonding region. Moreover, the present invention maintains overall insulation in the diagonal direction.

Although the ground and signal pins of the illustrated embodiment are provided in approximately square cross sections, it should be noted that the invention is not so limited. The use of other shapes such as rectangles and circles is also contemplated.

It should be noted that although a right angle portion is provided in the socket connector of the illustrated embodiment, the present invention is not limited thereto. For example, the present invention can be applied to a socket connector (not shown) having a straight ground contact and a straight signal contact without a right angle portion.

Although illustrated and described with respect to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in detail within the scope and scope of the claims and without departing from the invention.

As described above, according to the present invention, the contact members can be densely concentrated while preventing crosstalk between adjacent contact members, thus providing an electrical connector having a small area while maintaining signal integrity.

Claims (12)

In the electrical connector system, A header having a plurality of pins, And a socket connector having a first ground receptacle contact in contact with an opposing mating face of at least one of the pins and a signal receptacle contact in contact with the remaining pins of the pins. The method of claim 1, wherein the first ground receptacle contact is L-shaped in cross section, and each side of the L-shaped has a contact point in contact with an associated mating surface of the at least one of the pins. Connector system. 2. The connector system of claim 1, wherein the first ground receptacle contact and the signal receptacle contact are dual beam contacts that are offset 90 degrees. The connector system of claim 1, wherein the signal receptacle contact engages a non-opposite side of the pin. 2. The method of claim 1, further comprising a second ground receptacle contact, wherein the first and second ground receptacle contacts are partially disposed in an array of differential pairs within the module, and the second ground receptacle contact is also partially within the adjacent module. And the second ground receptacle contact is symmetrically disposed in the first ground receptacle contact. 2. The connector system of claim 1, wherein the first ground receptacle contact engages a pin, such as a second ground receptacle contact of an adjacent module. 2. The method of claim 1, wherein the first ground receptacle contact and the signal receptacle contact engage with respective pins to produce an unbalanced force, the unbalanced force being adjacent to the first ground to provide a balanced connector system. Wherein the connector system is offset by another unbalanced force generated by the receptacle contact and the signal receptacle contact. In the contact portion to engage the mating contact, A mating portion at the first end of the contact portion for mating contact, A terminal portion opposed to the matching portion; An intermediate portion extending between the matching portion and the terminal portion; And the mating portion is L-shaped in cross section, and each side of the L-shaped has a contact point for contacting with an associated mating surface of the mating contact portion. The contact as claimed in claim 8, wherein at least one of the contact points is disposed on a smaller surface of the sides. 10. The contact as claimed in claim 9, wherein the remaining one of the contact points is disposed on a cantilevered portion from the other of the side faces. 11. The contact as claimed in claim 10 wherein the cantilevered portion extends below the rest of the side surface. In the electrical interconnects, A header connector having a first rectangular array of signal pins and a second rectangular array of ground pins; A receptacle connector having a third rectangular array of signal receptacle contacts arranged to mate with a first array of signal pins and a fourth rectangular array of ground receptacle contacts arranged to mate with a second array of ground pins; Each signal receptacle contact is L-shaped in cross section, Each ground receptacle contact is L-shaped in cross section, and each side of the L-shaped has a contact point for contacting two or more adjacent mating surfaces of the associated mating surface of the associated ground pin and the one of the side surfaces. The sides are flat, The first array and the second array are offset along a diagonal direction with respect to each other, The third array and the fourth array are offset in a diagonal relationship with respect to each other.

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