KR100589416B1 - Plasma display panel and manufacturing method of the same - Google Patents

Abstract

The present invention relates to a method for manufacturing a plasma display panel which reduces the process time and production cost required to process the cut surface of the cut glass substrate.

In the method of manufacturing a plasma display panel according to the present invention, a first glass substrate manufacturing step of forming a film portion of a laminated structure such as a discharge sustaining electrode, a dielectric layer, and a protective film on a first glass substrate and cutting the first glass substrate is performed. ; A second glass substrate manufacturing step of forming a film portion having a stacked structure such as an address electrode, a dielectric layer, a partition wall, and a phosphor layer perpendicular to the discharge sustaining electrode on a second glass substrate, and cutting the second glass substrate; And a sealing step of aligning and sealing the first and second glass substrates, and the first and second glass substrate manufacturing steps include a cutting surface processing step of processing an entire region of the cut surface of the cut glass substrate by heat treatment. It further includes.

Plasma display, heat treatment, grazing surface, protective layer

Description

Plasma display panel and manufacturing method thereof {PLASMA DISPLAY PANEL AND MANUFACTURING METHOD OF THE SAME}

1 is a partially exploded perspective view schematically showing a part of a plasma display panel manufactured by the method of manufacturing a plasma display panel according to the present invention.

2 is a flowchart of a method of manufacturing a plasma display panel according to the present invention.

3 is a partial perspective view of a protective film applied to the cut surface of the glass substrate of the first embodiment according to the present invention.

4 is a longitudinal cross-sectional view of FIG. 3.

5 is a partial perspective view of the glass substrate cut surface of the second embodiment according to the present invention after heat treatment.

6 is a longitudinal cross-sectional view of FIG. 5.

The present invention relates to a plasma display panel and a method of manufacturing the same, and more particularly, a process time required for processing a cut surface of a glass substrate cut in a multi-faceted PDP (PDP) process. The present invention relates to a plasma display panel for reducing production costs and a method of manufacturing the same.

In general, the PDP is for displaying an image using a gas discharge phenomenon, and is excellent in various display capacities such as display capacity, brightness, contrast, afterimage, and viewing angle. The PDP generates a gas discharge between the electrodes by a direct current or an alternating voltage applied to the electrode, and excites the phosphor by the radiation of ultraviolet rays that accompanies the light, thereby emitting light.

The AC PDP, which is distinguished from the direct current type according to the driving method, forms an X electrode and a Y electrode corresponding to the discharge sustaining electrode on the inner surface of the front glass substrate, and forms an address electrode and a partition on the inner surface of the rear glass substrate. The X and Y electrodes are arranged in pairs in one discharge cell to generate sustain discharge therebetween during PDP operation. In general, the X electrode, the Y electrode and the address electrode are each formed in a stripe shape on the inner surface of the front and rear glass substrates, and cross each other at right angles when the front and rear glass substrates are assembled to each other.

A dielectric layer and a protective film are sequentially stacked on the inner surface of the front glass substrate to cover the X and Y electrodes. Dielectric layers and barrier ribs are sequentially stacked on the inner surface of the back glass substrate to form discharge cells. Phosphors are applied to the inner surface of the partition wall forming each discharge cell and the surface of the dielectric layer to form a phosphor layer. An inert gas such as neon (Ne) and xenon (Xe) is filled in the discharge cell in which the phosphor layer is formed.

When the operation of the PDP is schematically described, first, an address voltage and a scan voltage are applied to the address electrode and the Y electrode, respectively, and address charges are generated therebetween to form wall charges in the discharge cell. Next, when a discharge sustain voltage is applied between the Y electrode and the X electrode, a sustain discharge occurs in the discharge cell when the discharge start voltage is added to the wall voltage formed by the wall charge. In the sustain discharge state, the light in the ultraviolet region of the discharge light impinges on the phosphor to emit visible light, and accordingly, each pixel formed for each discharge cell implements an image.

As described above, the X, Y electrodes, the dielectric layer, and the protective film are formed on the inner surface of the front glass substrate, and the address electrode, the dielectric layer, the phosphor layer, and the partition wall are formed on the inner surface of the rear glass substrate, and then the two glass substrates are mutually sealed. Then, the air in the space formed between the two glass substrates thus sealed is removed, and then the PDP is completed by injecting an inert gas into the space.

The front and back glass substrates are subjected to a process of being cut by a glass substrate cutting machine before being sealed to each other in a multi-layered PDP production process, in the state of forming multilayer films on the inner surface as described above. do.

Since the front and back glass substrates cut in this process have sharp edges on the cut surface, they are subjected to a grinding process before being sealed to each other for the safe progress of the subsequent process.

This polishing process polishes, ie chamfers, the sharp edge portions of the front and back glass substrates by separate equipment. Therefore, this polishing process requires additional equipment to chamfer the cut surfaces of the front and back glass substrates, thus increasing the cost in the production of PDP, and mechanically polishing the edges, which is required to chamfer the edges. Lengthen the process time.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a plasma display panel and a method of manufacturing the same, which reduce the processing time and production cost for processing the cut surface of the cut glass substrate. .

Plasma display panel manufacturing method according to the present invention in order to achieve the above object,

A first glass substrate manufacturing step of forming a film portion having a laminated structure such as a discharge sustaining electrode, a dielectric layer, and a protective film on the first glass substrate, and cutting the first glass substrate;

A second glass substrate manufacturing step of forming a film portion having a stacked structure such as an address electrode, a dielectric layer, a partition wall, and a phosphor layer perpendicular to the discharge sustaining electrode on a second glass substrate, and cutting the second glass substrate; And

And a sealing step of aligning and sealing the first and second glass substrates.

The preparing of the first and second glass substrates may further include a cutting surface processing step of processing an entire region of the cut surface of the cut glass substrate by heat treatment.

In the cutting surface processing step, a liquid coating agent is applied to the cutting surface of the glass substrate, and the coating agent is dried by heat treatment to form a protective film.

The cutting surface processing step is applied to the cut surface of the glass substrate to melt the sharp portion to form a thermal grazing (Grazing) surface.

The thermal grazing surface forms a chamfer at the edge portion.

In addition, the plasma display panel according to the present invention,

A first glass substrate formed by cutting a film portion having a laminated structure such as a discharge sustaining electrode, a dielectric layer, and a protective film; A second glass substrate formed by cutting and sealing a film portion having a stacked structure such as an address electrode, a dielectric layer, a partition wall, and a phosphor layer perpendicular to the discharge sustaining electrode and encapsulating the first substrate,

The said 1st, 2nd glass substrate forms the process surface heat-treated in the whole area | region of the cut surface of the said cut 1st, 2nd glass substrate.

The said process surface is equipped with the protective film formed by apply | coating a liquid coating agent to the cut surface of the said 1st, 2nd glass substrate, and drying by heat processing.

The cut surface is formed of a thermal grazing surface formed by applying heat to the cut surfaces of the first and second glass substrates and melting them into sharp portions.

The thermal grazing surface forms a chamfer at the edge portion.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a partially exploded perspective view schematically showing a part of a plasma display panel manufactured by the method of manufacturing a plasma display panel according to the present invention.

Referring to the drawings, the PDP forms an X electrode 3 and a Y electrode 5 on the inner surface of the front glass substrate 1 (hereinafter referred to as a 'first glass substrate') and serve as discharge sustaining electrodes. An address electrode 9 and a partition 11 are formed on the inner surface of the glass substrate 7 (hereinafter referred to as a second glass substrate). The X and Y electrodes 3 and 5 are composed of a plurality of pairs, and a sustain discharge occurs during the operation of the PDP between the X electrode 3 and the Y electrode 5. The X electrode 3, the Y electrode 5, and the address electrode 9 are formed in a stripe shape on the inner surfaces of the first glass substrate 1 and the second glass substrate 7, respectively, to form the first glass substrate 1. ) And the second glass substrate 7 cross each other at right angles to each other.

The dielectric layer 13 and the protective film 15 are sequentially stacked on the inner surface of the first glass substrate 1. Meanwhile, the barrier ribs 11 are formed on the second glass substrate 7 on the upper surface of the dielectric layer 17, and the discharge cells 19 are formed by the barrier ribs 11. Inside the partition 11 forming each discharge cell 19, a phosphor 21 emitting light of any one of three primary colors red (R), green (G), and blue (B) is coated. The discharge cell 19 is filled with an inert gas such as neon (Ne) and xenon (Xe).

In the PDP, the X and Y electrodes 3 and 5 are formed in a stripe shape, but are not limited thereto, and may be variously formed, such as a protrusion structure toward the discharge cell 19. The partition 11 to be formed is also formed in an open form of a stripe shape, but is not limited thereto, and may be formed in various ways such as being formed in a closed form such as a lattice form. The characteristic configuration of the first and second glass substrates 1 and 7 in this PDP will be described in detail through the following PDP manufacturing method.

2 is a flowchart of a method of manufacturing a plasma display panel according to the present invention.

Referring to the drawings, this PDP manufacturing method produces a first glass substrate (1), and separately a second glass substrate (7) to seal the first and second glass substrates (1, 7) to each other After the gas in the space in the sealed first and second glass substrates 1 and 7 is exhausted, an inert gas is injected into the space to complete the PDP.

In the preparing of the first glass substrate 1, the X and Y electrodes 3 and 5 are arranged in parallel on the inner surface of the first glass substrate 1 to form a pair, and the X and Y electrodes 3, 5) A plurality of pairs are formed, and the X and Y electrodes 3 and 5 pairs thus formed are filled with the dielectric layer 13 and the protective film 15.

In the manufacturing step of the second glass substrate 7, the address electrode 9 is formed on the inner surface of the second glass substrate 7 and then embedded in the dielectric layer 17, and the partition 11 is formed on the dielectric layer 17. After forming the film, the phosphor layer 21 is formed on one side of the partition wall 11. Of course, a plurality of address electrodes 9 are provided to correspond to the respective discharge cells 19.

In the production of the multi-faceted PDP, the first and second glass substrates 1 and 7 which have undergone the manufacturing steps separately are subjected to the first and second glass substrate cutting and cutting surface processing steps before they are sealed to each other. In order to collectively explain the first and second glass substrate cutting steps and the cut surface processing steps, the first and second glass substrates 1 and 7 will be collectively referred to as glass substrates 1 and 7 for convenience.

Although the first glass substrate 1 has the X, Y electrodes 3 and 5, the dielectric layer 13, and the protective film layer 15 formed on the inner surface thereof in a multilayer structure, the second glass substrate 7 ) Forms an address electrode 9, a dielectric layer 17, a partition 11, a phosphor layer 21 and a discharge cell 19 in a multi-layered structure on the inner surface thereof. In the cutting step and the cutting surface processing step, there is no need to distinguish these multilayer structures in particular, so that the multilayer structure portions formed on the inner surface thereof are collectively referred to as the membrane portions 1a and 7a.

3 is a partial perspective view showing a protective film applied to a cut surface of the glass substrate of the first embodiment according to the present invention, and FIG. 4 is a longitudinal sectional view of FIG.

This glass substrate cutting step is to form the film portions 1a and 7a on the inner surface of the glass substrates 1 and 7 independently of each PDP as described above, and then to adjoin the film portions 1a and 7a. The film is cut between the portions 1a and 7a.

The glass substrates 1 and 7 thus cut are subjected to the cutting surface processing step following the glass cutting step as described above. This cut surface processing step heat-processes the whole area | region in the cut surface of the glass substrate 1 and 7 cut | disconnected in the glass cutting step.

Referring to the drawings, this cutting surface processing step is applied to the cut surface (1b, 7b) of the glass substrate 1, 7, the liquid coating agent, and the protective film (1c, 7c).

The dried protective films 1c and 7c are preferably formed of a material having a slight elasticity, such as silicone and polyurethane, to conceal the cut surfaces of the glass substrates 1 and 7 to ensure safety in subsequent processes.

In addition, the protective films 1c and 7c provided on the cutting surfaces 1b and 7b of the glass substrates 1 and 7 may further include mechanical processing of sharp edges provided on the cutting surfaces 1b and 7b cut in the glass cutting step. In other words, it is possible to reduce the process time and production cost required for the cutting surface (1b, 7b) processing by making the polishing step and the equipment required for the polishing process unnecessary.

FIG. 5 is a partial perspective view of a glass substrate cut surface of a second embodiment according to the present invention after heat treatment, and FIG. 6 is a longitudinal cross-sectional view of FIG. 5.

The first embodiment has a structure in which the protective films 1c and 7c are further provided on the cut surfaces 1b and 7b of the glass substrates 1 and 7, while the second embodiment is a cut surface of the glass substrates 1 and 7. There is a difference in the configuration in which the sharp surfaces are melted and removed by heat-treating the 1b and 7b to form the grazing surfaces 1d and 7b. In other words, strictly speaking, the glass substrates 1 and 7 of the second embodiment remove the cut surfaces 1b and 7b to form separate grazing surfaces 1d and 7d.

Further, in this second embodiment, the edge portions of the cut surfaces 1b and 7b are concentrated with heat to form chamfers 1e and 7e therein.

As a result, the glass substrates 1 and 7 remove the cut surfaces 1b and 7b and have the processed grazing surfaces 1d and 7d and the chamfers 1e and 7e, which are the protective layers 1c, As shown in 7c), the process time and production cost required for the cutting of the cutting surfaces 1b and 7b are reduced.

The first and second glass substrates 1 and 7 manufactured by the process of the first and second embodiments as described above are sealed to each other in the following process to discharge the air therein, and then injected with an inert gas to seal the PDP. You are done.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, in the present invention, a glass substrate having a film portion formed on its inner surface is cut between the film portions, and the cut surface is heat treated to form a protective film or a thermal grazing surface, thereby cutting for the safety of subsequent processes. There is an effect of reducing the process time and production cost required to process the cut surface of the glass substrate and its edge portion.

Claims (8)

A first glass substrate manufacturing step of forming a film portion having a laminated structure such as a discharge sustaining electrode, a dielectric layer, and a protective film on the first glass substrate, and cutting the first glass substrate; A second glass substrate manufacturing step of forming a film portion having a stacked structure such as an address electrode, a dielectric layer, a partition wall, and a phosphor layer perpendicular to the discharge sustaining electrode on a second glass substrate, and cutting the second glass substrate; And And a sealing step of aligning and sealing the first and second glass substrates. The first and second glass substrate manufacturing steps include a cutting surface processing step of processing by heat treating the entire area of the cut surface of the cut glass substrate, The cutting surface processing step is a plasma display panel manufacturing method of applying a liquid coating agent on the cut surface of the glass substrate, and drying the coating agent by heat treatment to form a protective film. delete The method of claim 1, The cutting surface processing step is a plasma display panel manufacturing method of forming a thermal grazing (Grazing) surface by melting a sharp portion by applying heat to the cut surface of the glass substrate. The method of claim 3, wherein And forming a chamfer at an edge portion of the thermal grazing surface. A first glass substrate formed by cutting a film portion having a laminated structure such as a discharge sustaining electrode, a dielectric layer, and a protective film; A second glass substrate formed by cutting and sealing a film portion having a stacked structure such as an address electrode, a dielectric layer, a partition wall, and a phosphor layer perpendicular to the discharge sustaining electrode and encapsulating the first substrate, The said 1st, 2nd glass substrate is provided with the process surface heat-processed in the whole area | region of the cut surface of the said cut 1st, 2nd glass substrate, And said processed surface is provided with a protective film formed by applying a liquid coating agent to the cut surfaces of said first and second glass substrates and drying them by heat treatment. delete The method of claim 5, wherein And the cut surface is a thermal grazing surface formed by applying heat to the cut surfaces of the first and second glass substrates and melting them into sharp portions. The method of claim 7, wherein And the thermal grazing surface forms a chamfer at an edge portion thereof.

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