KR100584121B1 - Apparatus for providing gas having 3-dimension flow path and etching chamber containing the same - Google Patents

Abstract

The gas supply device of the present invention relates to a gas supply device disposed above the etching chamber for supplying gas into the etching chamber. The gas supply device includes a chamber part disposed along an upper circumference of the etching chamber, the chamber part including at least one gas supply port and having a flow path connected to the gas supply port disposed therein along the circumference, and inserted into the center of the chamber part. And a gas distribution plate having a jet port for supplying gas into the etching chamber, and a dome disposed on the gas distribution plate to collect gas supplied through the flow path toward the center and supply the gas to the jet port of the gas distribution plate.

Description

Apparatus for providing gas having 3-dimension flow path and etching chamber containing the same}

1 is a cross-sectional view schematically showing an etching chamber employing a conventional gas supply device.

Figure 2a is a rear view showing a gas supply device according to the present invention.

2B and 2C are perspective views partially showing the gas supply device of FIG. 2A.

3 is an exploded view illustrating the gas supply device of FIG. 2A.

4A and 4B are views illustrating chamber parts of the gas supply device of FIG. 2A.

4C is a view illustrating the flow path in the chamber parts of FIGS. 4A and 4B.

FIG. 5A is a view illustrating a combination of a gas distribution plate and a jet port of the gas supply device of FIG. 2A.

5B is a cross-sectional view illustrating a state in which the gas distribution plate and the jet port of FIG. 5A are coupled.

6A and 6B are views for explaining a dome constituting the gas supply device of FIG. 2A.

7A and 7B are plan views illustrating various examples of the jet port of FIG. 2A.

8A to 8C are plan views illustrating various other examples of the jet port of FIG. 2A.

The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a gas supply apparatus having a three-dimensional gas flow path and an etching chamber including the same.

In general, an etching process for a semiconductor wafer is a process of selectively removing metals, oxides, and polys designed on a wafer by a plasma generated by dissociation of gases supplied into the etching chamber into ions, radicals, and electrons. In order to properly perform such an etching process, it is necessary to uniformly distribute the plasma formed in the etching chamber. One of the major influences on obtaining a uniform plasma distribution in the chamber is the gas supply into the chamber.

Conventionally, a side feeding method of supplying gas through the side of the chamber is mainly used. The method supplies gas into the chamber through an injector located at the side of the chamber. However, this method has no problem when the pump and the chamber for discharging the gas in the chamber are arranged vertically, but it is difficult to obtain a uniform gas distribution when arranged side by side. Recently, in order to solve such a problem, a top feeding method is mainly used, and this method is a method of supplying gas through a gas distribution plate disposed on the upper part of the chamber.

1 is a cross-sectional view schematically showing an etching chamber employing a conventional gas supply device.

Referring to FIG. 1, in the conventional etching chamber 100, a constant inner space 120 is defined by the chamber outer wall 110. A support 130 for supporting the semiconductor wafer 140 is disposed at the bottom of the etching chamber 100. The gas distribution plate 150 is disposed above the etching chamber 100, and the gas supply unit 151 is disposed at the center portion of the gas distribution plate 150. Although not shown in the figure, a plurality of holes (not shown) serving as a passage through which the gas passes are disposed in the gas supply unit 151.

In such an etching chamber 100, the gas supplied through the gas supply line (not shown) connected to the gas supply unit 151 is the internal space of the etching chamber 100 through a plurality of holes of the gas supply unit 151. Supplied to 120. The supplied gas is dissociated by the RF power applied to the upper and lower portions of the etching chamber and the coils on the upper portion of the etching chamber, and the plasma 160 is formed in the internal space 120 of the etching chamber 100.

However, in the etching chamber 100 employing the conventional gas supply device, a gas supply deviation occurs between holes adjacent to the gas supply line and holes not adjacent to each other among the plurality of holes in the gas supply unit 151. Therefore, there is a problem that the gas supply into the etching chamber 100 is not made uniform.

An object of the present invention is to provide a gas supply device having a three-dimensional gas flow path that can be uniformly supplied to the inside of the etching chamber to the plasma distribution in the etching chamber and an etching chamber comprising the same will be.

In order to achieve the above technical problem, the gas supply device according to the present invention, in the gas supply device disposed in the upper portion of the etching chamber for supplying gas into the etching chamber, it is disposed along the upper circumference of the etching chamber A chamber part including at least one gas supply port and having a flow passage connected to the gas supply port disposed therein along a circumference; A gas distribution plate inserted into a center of the chamber part and having a jet port for supplying gas into the etching chamber; And a dome disposed on the gas distribution plate and collecting gas supplied through the flow path toward the center of the gas distribution plate.

The flow path formed in the chamber part is branched from the gas supply port is disposed along the edge of the chamber part, it is preferable to be arranged so as to branch in both directions through at least one or more branch points.

It is preferable that the jet port of the said gas distribution board is a plug-type which can be attached or detached in the center of the said gas distribution board.

The ejection hole formed in the ejection opening may be formed in a square shape.

The jet hole formed in the jet port may be formed in a circular shape.

The jet port may have a structure in which a first region in which the jet holes are not disposed and a second region in which the jet holes are disposed are alternately arranged.

In this case, when there are a plurality of second regions, the ejection holes included in each of the second regions may have different shapes. In addition, when there are a plurality of second regions, the ejection holes included in each of the second regions may have different densities.

The ejection opening may include a first region in which the ejection hole is not disposed, and a second region in which the ejection hole is disposed along the circumference of the first region.

The dome may be a ceramic dome.

The dome includes a plurality of grooves disposed to extend from the side of the edge toward the center, and has an inner space connected to the plurality of grooves so that the gas supplied through the flow path passes through the side and the grooves of the dome. It is desirable to be supplied to the space.

In this case, the inner space is preferably connected to the outlet of the gas distribution plate.

And it is preferable that the groove has a depth of at most 1.5mm.

In order to achieve the above technical problem, the etching chamber according to the present invention, in the etching chamber including a gas supply device disposed above the etching chamber for supplying gas into the etching chamber, the upper periphery of the etching chamber A chamber part including at least one gas supply hole and having a flow passage connected to the gas supply hole, the chamber part being disposed inside the circumference; A gas distribution plate inserted into a center of the chamber part and having a jet port for supplying gas into the etching chamber; And a gas supply device disposed on the gas distribution plate and configured to collect a gas supplied through the flow path in the center and supply the gas to the jet port of the gas distribution plate.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below.

Figure 2a is a rear view showing a gas supply device according to the present invention. 2B and 2C are perspective views partially illustrating the gas supply device of FIG. 2A. 3 is an exploded view illustrating the gas supply device of FIG. 2A.

2A, 2B, 2C, and 3, the gas supply apparatus according to the present invention is disposed above the etching chamber for supplying gas into the etching chamber. The gas supply device includes a chamber part 210 disposed along an upper circumference of the etching chamber, and a gas distribution plate 230 and a dome 240 sequentially inserted into the central hole of the chamber part 210. And a cover 250 for fixing the gas distribution plate 230 and the dome 240 to the chamber part 210.

The chamber part 210 is composed of a ring-shaped main body 211 and includes at least one gas supply port 212 at a peripheral edge thereof. The gas supply port 212 is provided with a flow path 213 inside the main body 211 along the main body 211. A plurality of grooves 215 are formed in the inner wall of the main body 211, which are connected to the flow path 213. Therefore, the gas supplied through the gas supply port 212 is supplied toward the inner wall through the flow path 213 and the groove 215.

The gas distribution plate (GDP) 230 and the dome 240 are sequentially inserted into the central hole of the chamber part 210. The gas distribution plate 230 is disposed to contact the inside of the chamber, and the dome 240 is disposed to contact the outside of the chamber. The gas distribution plate 230 includes a hole having a predetermined size formed at the center thereof, and the injection hole 220 is fitted into the hole. The blower outlet 220 has a plug-in shape in which the gas distribution plate 230 is detachably attached to the hole. The jet port 220 has a semi-elliptic shape that protrudes convexly toward the inside of the chamber, and a plurality of jet holes 221 are formed on a surface thereof.

The dome 240 disposed on the gas distribution plate 230 is made of a ceramic material, and collects the gas supplied through the flow path 213 inside the main body 211 of the chamber part 210 to the center to distribute the gas distribution plate 230. It is supplied to the outlet 220 of the). To this end, the dome 240 includes a plurality of grooves 241 which are arranged to extend from the side of the edge toward the center, and are connected to the plurality of grooves 241 and at the same time the outlet 220 of the gas distribution plate 230 It also has an inner space 242 connected to. The groove 241 preferably has a depth of up to 1.5 mm, because if it has a depth above that unwanted plasma can be formed here. Accordingly, the gas supplied through the flow path 213 is supplied to the inner space 242 through the side surface of the dome 240 and the grooves 241, and is eventually supplied into the chamber through the outlet 220.

In the gas supply device having such a structure, the gas supplied from the outside through the gas supply port 212 of the chamber part 210 is connected to the flow path 213 inserted into the main body 211 of the chamber part 210. Therefore, after spreading evenly over the edge of the chamber part 210 is supplied to the groove 241 of the dome 240 through the flow path 215 connected to the side groove 260 of the dome 240. At this time, an O-ring is disposed between the side of the dome 240 and the edge of the chamber part 210 to prevent gas leakage from the outside. The air supplied to the groove 241 of the dome 240 is supplied to the internal space 242 of the dome 240 through the groove 241, and the air is discharged to the outlet 220 inserted into the gas distribution plate 230. Supplied. The gas supplied to the jet port 220 is injected into the chamber through the jet holes 221 of the jet port 220.

4A and 4B are views illustrating shapes of the chamber parts of the gas supply device of FIG. 2A viewed from different angles. Specifically, FIG. 4A is a shape viewed from above, and FIG. 4B is a shape viewed from below.

4A and 4B, the chamber part 210 includes a gas supply port 212 and a flow path 213 including a plurality of lines connected to the gas supply part 213. Is inserted into the main body 211. The flow path 213 is injected through the plurality of grooves 215 disposed on the inner surface of the body 211.

4C is a view illustrating the flow path in the chamber parts of FIGS. 4A and 4B.

Referring to FIG. 4C, the flow path 213 connected to the gas supply port 212 is branched in both directions at the first branch point 214a. Each branched flow path 213 is branched again at the second branch points 214b, and each branched flow path 213 is branched again at the third branch points 214c. The number of such branch points 214a, 214b, 214c may be three, more than, or in some cases less than three, as in the present embodiment. Also, the arrangement of the branched flow paths 213 is mutually symmetrical.

FIG. 5A is a view illustrating a combination of a gas distribution plate and a jet port of the gas supply device of FIG. 2A. 5B is a cross-sectional view illustrating a state in which the gas distribution plate and the jet port of FIG. 5A are coupled.

5A and 5B, a jet port 220 is attached to a hole 231 formed in the center of the gas distribution plate 230. A plurality of ejection holes 221 are disposed in the ejection opening 220 to inject gas into the chamber through the ejection holes 221. The blower outlet 220 may be freely attached and detached from the gas distribution plate 230 as a plug-in type.

6A and 6B are views for explaining a dome constituting the gas supply device of FIG. 2A. Specifically, FIG. 6A illustrates a shape viewed from above, and FIG. 6B illustrates a shape viewed from below.

Referring to FIG. 6A, the upper portion of the dome 240 has a flat shape, but the lower portion of the dome 240 has a plurality of grooves 241 formed in a radial shape, and the grooves 241 are disposed at the center thereof. It is connected to the inner space 242 of. As mentioned above, the inner space 242 is connected to the jet port 220 attached to the gas injection plate 230. The path of the gas flows from the side groove of the dome to the grooves 241 and the inner space 242 under the dome 240.

7A and 7B are plan views illustrating various examples of the jet port of FIG. 2A.

First, as illustrated in FIG. 7A, the ejection opening 220a alternates between the first region 220a-1 where the ejection hole 221 is not disposed and the second region 220a-2 where the ejection hole 221 is located. It has a structure that is arranged. That is, the second region 220a-2 having the ejection hole 221 is disposed at the center of the circular ejection opening 220a, and the second region 220a-2 is formed around the second region 220a-2. The surrounding first region 220a-1 is disposed in a ring shape. The blowing hole 221 does not exist in the first region 220a-1. Again, a second region 220a-2 is disposed around the first region 220a-1, and a first region 220a-2 is disposed around the second region 220a-2. The second region 220a-2 is disposed around the first region 220a-1. Next, as shown in FIG. 7B, the ejection opening 220b has a first region 220b-1 having no ejection hole 221 in the center thereof, and an edge surrounding the first region 220b-1. The second region 220b-2 in which the ejection hole 221 exists is disposed.

8A to 8C are plan views illustrating various other examples of the jet port of FIG. 2A.

First, referring to FIG. 8A, as described with reference to FIG. 7A, the ejection opening 220a may alternately include a first region in which the ejection hole 221a does not exist and a second region in which the ejection hole 221a exists. It has a rectangular blower hole 221a in the structure. Naturally, the rectangular blower hole 221a may be applied to the shape as described with reference to FIG. 7B. Next, referring to FIG. 8B, the jet hole 221b formed in the jet port 220a is formed in a circular shape. Next, referring to FIG. 7C, the center of the jet port 220a has a high-density jet hole 221c, the outermost part has a circular jet hole 221b, and a rectangular jet hole 221a therebetween. ) As such, the density of the blow holes may vary depending on the area.

As described above, according to the gas supply apparatus and the etching chamber including the same according to the present invention, there are the following effects. Firstly, it is possible to select various combinations of spouts and spouts to suit the needs of the process. Secondly, the gas is efficiently distributed in the three-dimensional structure, and the gas can be uniformly collected in the gas distribution plate through the symmetrical flow path.

Although the present invention has been described in detail with reference to preferred embodiments, the present invention is not limited to the above embodiments, and various modifications may be made by those skilled in the art within the technical spirit of the present invention. Do.

Claims (14)

In the gas supply device disposed in the upper portion of the etching chamber for supplying gas into the etching chamber, A chamber part disposed along an upper circumference of the etching chamber, the chamber part including at least one gas supply port and having a passage connected to the gas supply hole therein; A gas distribution plate inserted into a center of the chamber part and having a jet port for supplying gas into the etching chamber; And And a dome disposed on the gas distribution plate and collecting the gas supplied through the flow path toward the center of the gas distribution plate. The method of claim 1, The flow path formed in the chamber part is branched from the gas supply port is disposed along the edge of the chamber part, the gas supply device characterized in that arranged to be bi-directionally through at least one or more branch points. The method of claim 1, The gas outlet of the gas distribution plate is a gas supply device, characterized in that the plug type detachable to the center of the gas distribution plate. The method of claim 1, The gas supply device characterized in that the ejection hole formed in the ejection opening made of a square shape. The method of claim 1, The gas supply device, characterized in that the blowing hole formed in the outlet is made in a circular shape. The method of claim 1, The gas ejection device has a structure in which the first region where the ejection holes are not arranged and the second region where the ejection holes are alternately arranged. The method of claim 6, When there are a plurality of the second areas, the gas supply device, characterized in that the blow holes included in each of the second area has a different shape. The method of claim 6, When there are a plurality of second areas, the gas supply apparatus, characterized in that the blow holes included in each of the second area has a different density. The method of claim 1, The gas supply device is a gas supply device, characterized in that the first region is not disposed in the ejection hole is disposed, the second region is arranged along the circumference of the first region. The method of claim 1, The dome is a gas supply device, characterized in that the ceramic dome. The method of claim 1, The dome includes a plurality of grooves disposed to extend from the side of the edge toward the center, and has an inner space connected to the plurality of grooves so that the gas supplied through the flow path passes through the side and the grooves of the dome. Gas supply device characterized in that to be supplied to the space. The method of claim 11, The internal space is a gas supply device, characterized in that connected to the outlet of the gas distribution plate. The method of claim 11, Gas groove, characterized in that the groove has a maximum depth of 1.5mm. An etch chamber comprising a gas supply device disposed above the etch chamber for supplying gas into an etch chamber. A chamber part disposed along an upper circumference of the etching chamber, the chamber part including at least one gas supply port and having a passage connected to the gas supply hole therein; A gas distribution plate inserted into a center of the chamber part and having a jet port for supplying gas into the etching chamber; And And a gas supply device disposed on the gas distribution plate and having a dome for collecting the gas supplied through the flow path in the center and supplying the gas to the outlet of the gas distribution plate.

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