KR100578391B1 - Crosslinkable polyolefin resin composition with high heat sealing properties - Google Patents
Crosslinkable polyolefin resin composition with high heat sealing properties Download PDFInfo
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- KR100578391B1 KR100578391B1 KR1019990003744A KR19990003744A KR100578391B1 KR 100578391 B1 KR100578391 B1 KR 100578391B1 KR 1019990003744 A KR1019990003744 A KR 1019990003744A KR 19990003744 A KR19990003744 A KR 19990003744A KR 100578391 B1 KR100578391 B1 KR 100578391B1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/66—Substances characterised by their function in the composition
- C08L2666/78—Stabilisers against oxidation, heat, light or ozone
Abstract
본 발명은 고내열성 가교 폴리올레핀 수지 조성물에 관한 것으로서, 좀더 상세하게는 선형 저밀도 폴리에틸렌, 저밀도 폴리에틸렌 또는 이들의 혼합 수지에 비닐-실란계 화합물, 퍼록사이드계 화합물, 산화방지제를 첨가한 수지 조성물(A)와, 저밀도 폴리에틸렌에 가교촉진제가 함유된 수지 조성물(B)을 공압출하므로써 얻어지는 고내열성 가교 폴리올레핀 수지 조성물에 관한 것이다.The present invention relates to a high heat-resistant crosslinked polyolefin resin composition, and more particularly, to a resin composition (A) in which a vinyl-silane compound, a peroxide compound, and an antioxidant are added to a linear low density polyethylene, a low density polyethylene, or a mixed resin thereof. And a high heat resistant crosslinked polyolefin resin composition obtained by coextrusion of a resin composition (B) containing a crosslinking accelerator in low density polyethylene.
Description
본 발명은 고내열성 가교 폴리올레핀 수지 조성물에 관한 것으로서, 좀더 상세하게는 선형 저밀도 폴리에틸렌, 저밀도 폴리에틸렌, 또는 이들의 혼합 수지에 비닐-실란계 화합물, 퍼록사이드계 화합물, 산화방지제를 첨가한 수지 조성물(A)과 저밀도 폴리에틸렌에 가교촉진제가 함유된 수지 조성물(B)을 공압출하므로써 얻어지는 고내열성 가교 폴리올레핀 수지 조성물에 관한 것이다.The present invention relates to a high heat-resistant crosslinked polyolefin resin composition, and more particularly, to a resin composition comprising a vinyl-silane compound, a peroxide compound, and an antioxidant added to a linear low density polyethylene, a low density polyethylene, or a mixed resin thereof (A ) And a high heat-resistant crosslinked polyolefin resin composition obtained by coextrusion of a resin composition (B) containing a crosslinking accelerator in a low density polyethylene.
폴리올레핀 가교기술은 전선 피복용 폴리에틸렌의 내열성과 물리적 성질의 향상을 위해 일찍부터 개발되었으며, 현재도 전선 분야에서 가장 많이 사용되고 있다. 그후 성형품, 스펀지 등의 성형에도 적용되어 왔으며 최근에는 필름에도 도입되기 시작하였으나 필름과 같은 얇은 제품에 적용 시에는 적절한 가공성, 균일한 필름외관(투명성), 만족할 만한 내열성 및 기계적 물성을 얻기 어려운 단점이 있어 실제 상업화 적용에 어려운 면이 많았다.Polyolefin crosslinking technology was developed early to improve the heat resistance and physical properties of polyethylene for wire coating, and is still most widely used in the electric wire field. Since then, it has been applied to molding of molded products, sponges, etc., and has recently been introduced into films, but when applied to thin products such as films, it is difficult to obtain adequate processability, uniform film appearance (transparency), satisfactory heat resistance, and mechanical properties. There were many difficulties in applying commercialization.
본 발명의 목적은 상기와 같은 문제점을 개선하기 위한 것으로서, 폴리올레 핀 수지 조성물의 가공시 가교촉진제가 포함된 수지 조성물(B)을 첨가하고, 적정의 가교제 시스템과 산화방지 시스템을 적용하므로써 고분자의 개질을 통해 가교특성이 잘 구현되도록 하여 내열성 및 우수한 기계적인 물성을 지니는 고내열성 가교 폴리올레핀 수지 조성물을 제공하는 것이다.An object of the present invention is to improve the above problems, by adding a resin composition (B) containing a crosslinking accelerator during processing of the polyolefin resin composition, by applying a suitable crosslinking agent system and antioxidant system It is to provide a high heat-resistant cross-linked polyolefin resin composition having a heat resistance and excellent mechanical properties by making the cross-linking properties well through the modification.
본 발명의 고내열성 가교 폴리올레핀 수지 조성물은 선형 저밀도 폴리에틸렌, 저밀도 폴리에틸렌, 또는 선형 저밀도 폴리에틸렌과 저밀도 폴리에틸렌이 5:95∼95:5의 비율로 혼합된 베이스 수지 100중량부에 대하여 비닐-실란계 화합물 0.001∼10중량부, 퍼록사이드계 화합물 0.001∼10중량부, 산화방지제 0.001∼10000ppm을 혼합하여 제조된 수지 조성물(A)와 저밀도 폴리에틸렌 100중량부에 가교촉진제 0.01∼2.5중량부를 첨가한 수지 조성물(B)를 혼합하여 제조되는 것을 특징으로 한다. The high heat resistant crosslinked polyolefin resin composition of the present invention is a vinyl-silane compound 0.001 based on 100 parts by weight of a linear low density polyethylene, a low density polyethylene, or 100 parts by weight of a base resin in which a linear low density polyethylene and a low density polyethylene are mixed in a ratio of 5:95 to 95: 5. A resin composition (A) prepared by mixing -10 parts by weight, 0.001-10 parts by weight of a peroxide-based compound, and 0.001-10000 ppm of an antioxidant, and 0.01-2.5 parts by weight of a crosslinking accelerator in 100 parts by weight of low density polyethylene (B ) Is prepared by mixing.
본 발명에서 사용되는 선형 저밀도 폴리에틸렌과 저밀도 폴리에틸렌으로는 밀도가 0.910∼0.925g/㎤인 폴리에틸렌 수지가 바람직하다.As the linear low density polyethylene and the low density polyethylene used in the present invention, a polyethylene resin having a density of 0.910 to 0.925 g / cm 3 is preferable.
폴리에틸렌 수지는 긴 사슬모양의 형태를 가지며 사슬과 사슬이 연결되어 길어질수록 기계적인 물성이 좋아진다. 압출가공기 내에서 수지는 열과 응력을 받게 되며 이때 첨가된 가교제인 비닐-실란계 화합물에 의해 원하는 만큼의 정교한 가교도를 가지게 된다. Polyethylene resin has a long chain shape, and the longer the chain is connected, the better the mechanical properties. In the extruder, the resin is subjected to heat and stress, and the resin has a precise degree of crosslinking as desired by the added vinyl-silane-based compound.
본 발명에서 가교제로서 사용되는 비닐-실란계 화합물은 (CH2=CH)SiXnR'3-n의 구조식을 갖는데, 여기서 R은 탄소수 1 내지 12까지의 알킬 라디칼이고, X는 할로겐 원자 또는 탄소수 1 내지 12까지의 알콕시 라디칼이며, n은 1 내지 3의 정수 또는 분수이다. 상기 비닐-실란계 화합물의 구체적인 예로는 비닐 트리메톡시 실란, 비닐 트리에톡시 실란 등의 화합물을 들 수 있으며, 베이스 수지 100중량부에 대하여 0.001∼10중량부, 더욱 좋게는 0.1∼10중량부를 사용하는 것이 바람직하다. 사용량이 0.001중량부 미만일 경우에는 내열성 향상 효과가 없고, 10중량부를 초과할 경우에는 수지 물성이 급격히 저하된다.The vinyl-silane-based compound used as the crosslinking agent in the present invention has a structural formula of (CH 2 = CH) SiX n R ' 3-n , wherein R is an alkyl radical having 1 to 12 carbon atoms, X is a halogen atom or carbon number An alkoxy radical from 1 to 12, n is an integer or fraction from 1 to 3. Specific examples of the vinyl-silane-based compound include compounds such as vinyl trimethoxy silane and vinyl triethoxy silane, and 0.001 to 10 parts by weight, and more preferably 0.1 to 10 parts by weight based on 100 parts by weight of the base resin. It is preferable to use. When the amount of use is less than 0.001 part by weight, there is no effect of improving heat resistance, and when the amount is more than 10 parts by weight, the resin physical properties rapidly decrease.
비닐-실란계 화합물은 자체적으로 이중결합을 가지고 있어 라디칼을 형성시킬 수 있고 일반적으로 가교제로 쓰이는 퍼록사이드계 화합물에 비해 안정하여 균일한 가교도를 얻을 수 있으며, 비교적 고온에서도 매우 안정하여 보관에도 용이하다.Vinyl-silane-based compound has its own double bonds, which can form radicals, and is more stable than peroxide-based compounds generally used as crosslinking agents, so that a uniform crosslinking degree can be obtained. .
본 발명에서 가교조제로 사용되는 퍼록사이드계 화합물로는 디알킬퍼록사이드, 디아실퍼록사이드, 퍼록시에스테르, 케톤퍼록사이드 등이 사용가능하며, 구체적인 예로서는 디큐밀 퍼록사이드, 2,5-디메틸-2,5-디(t-부틸 퍼록사이드)헥산 등이 있다. 상기 퍼록사이드계 화합물의 함량은 베이스 수지 100중량부에 대하여 0.001∼10중량부, 더욱 좋게는 0.01∼10중량부 사용하는 것이 바람직하다. 사용량이 0.001중량부 미만일 경우에는 내열성 향상 효과가 없고, 10중량부를 초과할 경우에는 수지 물성이 급격히 저하된다.Dialkyl peroxide, diacyl peroxide, peroxy ester, ketone peroxide and the like may be used as the peroxide compound used as the crosslinking aid in the present invention, and specific examples include dicumyl peroxide, 2,5-dimethyl- 2,5-di (t-butyl peroxide) hexane and the like. The content of the peroxide-based compound is preferably 0.001 to 10 parts by weight, more preferably 0.01 to 10 parts by weight based on 100 parts by weight of the base resin. When the amount of use is less than 0.001 part by weight, there is no effect of improving heat resistance, and when the amount is more than 10 parts by weight, the resin physical properties rapidly decrease.
퍼록사이드계 화합물은 반응개시제의 역할을 하여 가공시에 가교결합 특성이 잘 발현되도록 한다.The peroxide-based compound acts as a reaction initiator so that crosslinking properties are well expressed during processing.
본 발명의 수지 조성물(A)에는 수지가 가열과 응력을 받을 경우 가교현상 이외에 발생하는 사슬이 끓어지는 분해현상을 방지하기 위해서 산화방지제를 0.001∼10000ppm 처방하는데, 산화방지제의 농도가 10000ppm보다 높으면 가교특성이 저하되고, 산화방지제의 농도가 0.001ppm보다 낮으면 수지의 저하에 따른 물성저하 현상이 발생한다. 본 발명에서 산화방지제로는 부자유 페놀(hindered phenol), 페놀 설파이드(phenolic sulphide), 폴리퀴논(polyquinone), 유기 인(organo phosphorus), 니트로소 아민(nitroso amine) 계열의 화합물을 사용할 수 있으나, 특히 시바 가이기사의 IRGANOX-1010과 IRGAFOS-168의 복합시스템을 사용하는 것이 좋다.In the resin composition (A) of the present invention, in order to prevent the decomposition phenomenon in which the chains boil in addition to the crosslinking phenomenon when the resin is heated and stressed, an antioxidant is prescribed in 0.001 to 10,000 ppm, and when the concentration of the antioxidant is higher than 10000 ppm, the crosslinking is performed. When the properties are lowered and the concentration of the antioxidant is lower than 0.001 ppm, the property degradation phenomenon occurs due to the decrease of the resin. In the present invention, as an antioxidant, hindered phenol, phenolic sulphide, polyquinone, organic phosphorus, and nitrosoamine may be used. It is recommended to use a combination system of Ciba Geiger's IRGANOX-1010 and IRGAFOS-168.
본 발명의 수지 조성물(B)에 포함되는 가교촉진제로는 디말레이드계 화합물, 디메타아크릴계 화합물, 디아크릴계 화합물, 주석(TIN)계 화합물을 사용할 수 있으며, 특히 주석계 화합물을 사용하는 것이 더욱 바람직하다. 구체적인 예로서는 디라우틸 틴 디아우메이트(DILAUTYL TIN DIAUMATE(DLTDL)), 말레이미드, 페닐말레이미드, 라우릴메타아크릴레이트 등이 있다.As the crosslinking accelerator included in the resin composition (B) of the present invention, a dimalide compound, a dimethacrylic compound, a diacryl compound, a tin (TIN) compound can be used, and in particular, a tin compound is more preferable. Do. Specific examples include DILAUTYL TIN DIAUMATE (DLTDL), maleimide, phenylmaleimide, lauryl methacrylate and the like.
본 발명에서 수지 조성물(A)는 상온 및 고온에서 비교적 안정하기 때문에 보관시 변형에 의한 문제점은 상대적으로 개선이 되지만 가공시에 효과적인 가교특성을 나타내기 위해 수지 조성물(B)와 혼합하여 가공한다. 이때 혼합비는 수지 조성물(B)중에 첨가된 가교촉진제의 함량에 따라 조절이 가능한데, 고내열성을 부여하기 위하여 바람직하게는 수지 조성물(A) 100중량부에 대하여 수지 조성물(B) 0.0001∼40중량부의 비율로 혼합한다.In the present invention, since the resin composition (A) is relatively stable at room temperature and high temperature, the problem caused by deformation during storage is relatively improved, but mixed and processed with the resin composition (B) to exhibit effective crosslinking properties during processing. At this time, the mixing ratio can be adjusted according to the content of the crosslinking accelerator added in the resin composition (B), in order to impart high heat resistance, preferably 0.0001 to 40 parts by weight of the resin composition (B) based on 100 parts by weight of the resin composition (A). Mix in proportions.
본 발명은 하기 실시예에 의하여 보다 구체적으로 이해될 수 있고, 하기의The present invention can be understood in more detail by the following examples,
실시예는 본 발명을 예시하기 위한 것에 지나지 않으며 본 발명의 보호범위를 제한하고자 하는 것은 아니다.The examples are only intended to illustrate the invention and are not intended to limit the protection scope of the invention.
실시예 1Example 1
< A > 수지 조성물(A)의 제조<A> Preparation of Resin Composition (A)
2축 압출기(TWIN EXTRUDER)를 이용하여 질소 분위기하에서 가교반응이 일어나지 않도록 하면서 다이(DIE) 온도를 220℃로 세팅하여 표 1과 같은 조성으로 그래프트머를 압출가공하여 펠렛화하였다. 압출가공시 다이 온도는 220℃를 넘지 않도록 유의하며 일정온도가 유지되도록 하였다. 여기서 사용한 선형 저밀도 폴리에틸렌(LLDPE)은 삼성종합화학 4220S(용융지수 : 0.9g/10min, 밀도 : 0.922g/㎤)이며, 저밀도 폴리에틸렌(LDPE)은 삼성종합화학 530G(용융지수 : 2.8g/10min, 밀도 : 0.925g/㎤)를 사용하였고, LLDPE/LDPE의 혼합비는 50:50으로 하였다. 비닐-실란계 화합물로서는 비닐 트리메톡시 실란(VTMOS)을, 퍼록사이드 화합물로서는 일본유지의 디큐밀 퍼록사이드(DCP)를 사용하였다. 그리고 산화방지제는 시바 가이기사(CIBA GEIGY)의 IRGANOX-1010(Ⅰ-1010), IRGAFOS-168(Ⅰ-168) 복합 시스템을 사용하였다.Using a twin-screw extruder (TWIN EXTRUDER) to prevent the cross-linking reaction in the nitrogen atmosphere while setting the die (DIE) temperature to 220 ℃ was pelletized by extrusion processing the composition as shown in Table 1. During the extrusion process, the die temperature was kept at a temperature not exceeding 220 ° C., and a constant temperature was maintained. The linear low density polyethylene (LLDPE) used here is Samsung Total Chemical 4220S (melt index: 0.9 g / 10 min, density: 0.922 g / cm 3), and the low density polyethylene (LDPE) is Samsung Total Chemical 530 G (melt index: 2.8 g / 10 min, Density: 0.925 g / cm 3), and the mixing ratio of LLDPE / LDPE was 50:50. Vinyl trimethoxy silane (VTMOS) was used as a vinyl-silane type compound, and dicumyl peroxide (DCP) used in Japan was used as a peroxide compound. In addition, the antioxidant used the IRGANOX-1010 (I-1010), IRGAFOS-168 (I-168) complex system of CIBA GEIGY.
* I-1010 : 펜타에리트리티 테트라비스[3-3,5-디-터셔리-부틸-4-하이드록 * I-1010: pentaerythrite tetrabis [3-3,5-di-tert-butyl-4-hydroxy]
시페놀)프로피오네이트, 부자유 페놀계 화합물Ciphenol) Propionate, Independent Free Phenolic Compound
* I-168 : 페놀, 2,4-비스(1,1-디메틸 포스파이트)포스파이트계 화합물* I-168: phenol, 2,4-bis (1,1-dimethyl phosphite) phosphite compound
* VTMOS와 DCP 및 산화방지제의 함량은 LLDPE와 LDPE의 총량 100을 기준으로 * The content of VTMOS, DCP and antioxidants is based on the total amount of LLDPE and LDPE 100
한 것이다.It is.
< B > 수지 조성물(B)의 제조<B> Preparation of Resin Composition (B)
LDPE는 삼성종합화학 530G를 사용하였으며 가교촉진제인 디라우틸 틴 디아우메이트(DLTDL)를 표 2와 같이 혼합하여 2축 압출기에서 압출하여 펠렛화 하였다.Samsung PE 530G was used as LDPE, and crosslinking accelerator dilautyl diamate (DLTDL) was mixed as shown in Table 2 and extruded in a twin screw extruder to pelletize.
< C > 고내열성 필름의 제조<C> Preparation of High Heat Resistance Film
상기 < A >와 < B >에서 제조한 수지 조성물(A) 95중량%와 수지 조성물(B) 5중량%를 혼합하여 단일층 LLDPE 필름 M/C를 이용하여 압출가공하였다. 가공조건은 L/D=25, BUR=2.0, 스크류 사이즈=50㎜, 다이 온도는 220℃이고, 스크류 RPM은 분당 50이며, 필름두께는 30㎛이었다. 혼합조합 및 히트 실링 평가결과는 하기 표 3과 같으며, 일반적인 LLDPE/LDPE 혼합 필름에서 나타나는 히트 실링은 90℃ 내외이나 본 발명에 따라 제조한 가교필름은 135∼145℃ 정도의 히트 실링 특성을 나타내어 약 50%까지 특성이 향상되는 결과를 얻었다.95% by weight of the resin composition (A) prepared in the above <A> and <B> and 5% by weight of the resin composition (B) were mixed and extruded using a single layer LLDPE film M / C. The processing conditions were L / D = 25, BUR = 2.0, screw size = 50 mm, die temperature was 220 ° C., screw RPM was 50 per minute, and the film thickness was 30 μm. The results of the mixing combination and the heat sealing evaluation are shown in Table 3 below, and the heat sealing appearing in the general LLDPE / LDPE mixed film is about 90 ° C., but the crosslinked film prepared according to the present invention exhibits heat sealing properties of about 135 to 145 ° C. The result is that the characteristic is improved by about 50%.
실시예 2Example 2
< A > 수지 조성물(A)의 제조<A> Preparation of Resin Composition (A)
2축 압출기를 이용하여 질소 분위기하에서 가교반응이 일어나지 않도록 하면서 다이 온도를 220℃로 세팅하여 하기 표 4와 같은 조성으로 수지 조성물(A)을 압출가공하여 펠렛화 하였다. 압출가공시 다이 온도는 220℃를 넘지 않도록 유의하며 일정온도가 유지되도록 하였다. 여기서 사용한 LLDPE와 LDPE는 실시예 1과 동일하였고, LLDPE/LDPE의 혼합비는 70:30으로 하였다. 비닐-실란계 화합물로서는 비닐 트리메톡시 실란을, 퍼록사이드계 화합물로서는 디큐밀퍼록사이드를 실시예 1과 동일하게 사용하였다.The resin composition (A) was extruded and pelletized to a composition as shown in Table 4 below by setting the die temperature to 220 ° C. while preventing a crosslinking reaction under a nitrogen atmosphere using a twin screw extruder. During the extrusion process, the die temperature was kept at a temperature not exceeding 220 ° C., and a constant temperature was maintained. LLDPE and LDPE used herein were the same as in Example 1, and the mixing ratio of LLDPE / LDPE was 70:30. Vinyl trimethoxy silane was used as the vinyl-silane compound and dicumyl peroxide was used as the peroxide compound in the same manner as in Example 1.
< B > 수지 조성물(B)의 제조<B> Preparation of Resin Composition (B)
수지 조성물(B)는 실시예 1과 동일하게 제조하였으며, 조성은 상기 표 2와 같다.Resin composition (B) was prepared in the same manner as in Example 1, the composition is shown in Table 2 above.
< C > 고내열성 필름 제조<C> High heat resistant film production
상기 < A >와 < B >에서 제조한 수지 조성물(A) 95중량%와 수지 조성물(B) 5중량%를 혼합하여 단일층 LLDPE 필름 M/C를 이용하여 압출가공하였다. 가공조건은 L/D=25, BUR=2.0, 스크류 크기=50㎜, 다이 온도는 220℃이고, 스크류 RPM은 분당 50이며, 필름두께는 30㎛이었다. 혼합조합 및 히트 실링 평가결과는 하기 표 5와 같으며, 역시 미가교 일반필름의 히트 실링 온도가 95℃ 정도인데 반해 본 발명에 따른 가교필름은 136∼147℃ 정도로 최대 54%까지 성능이 증대되는 결과를 얻었다.95% by weight of the resin composition (A) prepared in the above <A> and <B> and 5% by weight of the resin composition (B) were mixed and extruded using a single layer LLDPE film M / C. The processing conditions were L / D = 25, BUR = 2.0, screw size = 50 mm, die temperature was 220 ° C., screw RPM was 50 per minute, and film thickness was 30 μm. The mixed combination and heat sealing evaluation results are shown in Table 5 below, and the heat-sealing temperature of the non-crosslinked general film is about 95 ° C., while the crosslinked film according to the present invention increases performance by up to 54% at about 136 to 147 ° C. The result was obtained.
이상에서 볼 수 있는 바와 같이, 본 발명에 의하여 제조된 가교 폴리올레핀 수지 조성물은 균일한 가교도 및 필름의 성형에 적당한 가교도 조절 및 필름성형을 가능하게 하며, 상온 및 고온에서 비교적 안정하여 보관 및 운송에 매우 유리한 특성을 갖고 내열성이 상당히 우수한 효과를 갖는다.As can be seen from the above, the crosslinked polyolefin resin composition prepared according to the present invention enables uniform crosslinking degree and crosslinking degree control and film forming suitable for molding the film, and is relatively stable at room temperature and high temperature and is stored and transported. It has very advantageous properties and has excellent heat resistance.
Claims (6)
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| KR1019990003744A KR100578391B1 (en) | 1999-02-04 | 1999-02-04 | Crosslinkable polyolefin resin composition with high heat sealing properties |
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| KR1019990003744A KR100578391B1 (en) | 1999-02-04 | 1999-02-04 | Crosslinkable polyolefin resin composition with high heat sealing properties |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60250033A (en) * | 1984-05-28 | 1985-12-10 | Showa Electric Wire & Cable Co Ltd | Silane-crosslinked polyethylene molding |
| KR950008474B1 (en) * | 1991-12-31 | 1995-07-31 | 엘지전선주식회사 | Resin composition of cable insulation |
| KR960022752A (en) * | 1994-12-31 | 1996-07-18 | 황선두 | Polyolefin resin composition for wire coating |
| KR0177303B1 (en) * | 1996-03-20 | 1999-05-15 | 성재갑 | Crosslinkable polyolefin composition for insulating high-voltage power cable |
-
1999
- 1999-02-04 KR KR1019990003744A patent/KR100578391B1/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60250033A (en) * | 1984-05-28 | 1985-12-10 | Showa Electric Wire & Cable Co Ltd | Silane-crosslinked polyethylene molding |
| KR950008474B1 (en) * | 1991-12-31 | 1995-07-31 | 엘지전선주식회사 | Resin composition of cable insulation |
| KR960022752A (en) * | 1994-12-31 | 1996-07-18 | 황선두 | Polyolefin resin composition for wire coating |
| KR0177303B1 (en) * | 1996-03-20 | 1999-05-15 | 성재갑 | Crosslinkable polyolefin composition for insulating high-voltage power cable |
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| KR20000055229A (en) | 2000-09-05 |
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