KR100573141B1 - Plasma display panel - Google Patents

Abstract

According to the present invention, a plasma display panel is disclosed. The plasma display panel includes an upper substrate, an upper plate including a plurality of electrodes formed under the upper substrate, a lower substrate disposed to face the upper substrate, and upper electrodes on the lower substrate so as to correspond to electrodes on the upper substrate. And a lower plate including a plurality of electrodes formed thereon, wherein the region overlapping the upper plate and the lower plate includes a display area in which a plurality of discharge cells are discharged and a peripheral area surrounding the display area. In the plasma display panel having an exhaust port formed in the area, a finish cutting part is formed at a corner portion connecting the lower surface and the side cross-section of the lower substrate. According to the plasma display panel, in the multi-faceted method in which at least two substrates are designed in one substrate member, breakage of the exhaust port is prevented and manufacturing cost is reduced.

Description

Plasma display panel {Plasma display panel}

1 is a plan view illustrating a typical plasma display panel;

2 is a cross-sectional view showing the structure of a light emitting cell shown in FIG. 1;

3 is a plan view showing a substrate member when three lower substrates are designed in one substrate member;

4 is a view showing the substrate member of FIG. 3, a cross-sectional view taken along line III-III of FIG.

5 is a view for explaining a design variable of the present invention, a plan view showing a lower substrate,

6 is a profile of the exhaust port failure rate according to the ratio of the first separation distance to the exhaust port diameter,

7 is a profile of an air outlet failure rate according to a ratio of a second separation distance to an air outlet diameter;

8 is a perspective view showing a lower substrate employable in one preferred embodiment of the present invention;

9 is a perspective view showing a lower substrate employable in another embodiment of the present invention,

10 is a profile of the exhaust port failure rate according to the ratio of the finish cutting depth to the lower substrate thickness,

11 is a plan view showing a substrate member when four lower substrates are designed in one substrate member;

12 is a view showing the substrate member of FIG. 11, a cross-sectional view taken along the line A-A of FIG.

FIG. 13 is a view illustrating the substrate member of FIG. 11, and taken along line B-B of FIG. 11;

14 is a perspective view illustrating a lower substrate employable in a plasma display panel according to another embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10 ... top board 11 ... top board

12 ... scanning electrode 13 ... display electrode

12a, 13a ... transparent electrodes 12b, 13b ... bus electrodes

14 upper dielectric layer 15 protective layer

16.Discharge sustaining electrode pair 20 ... Lower

21 Lower substrate 22 Address electrode

23 Lower dielectric layer 24 Bulkhead

25.Phosphor 30.Exhaust vent

121. Substrate member

AP ... cross section of the bottom board AC ... edge of the bottom board cross section

BP ... lower substrate longitudinal section BC ... lower substrate longitudinal section edge

CP ... Cutting Section

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel, and more particularly, in a multi-faceted method in which at least two substrates are designed in one substrate member, an improved structure of a plasma display panel in which an exhaust port is prevented from being damaged. It is about.

The plasma display panel is a flat panel display panel which displays an image by using gas discharge phenomenon, and is excellent in various display capabilities such as display capacity, brightness, contrast, afterimage, and viewing angle. In addition, it is being spotlighted as a next-generation flat panel display panel that can replace a CRT because it is thin and can display a large screen.

1 shows a typical plasma display panel. As shown in the figure, the plasma display panel includes an upper plate 10 and a lower plate 20 bonded to each other. The upper plate 10 and the lower plate 20 are joined with a sealing material 26, for example, by a frit, and the region 101 where the upper plate 10 and the lower plate 20 overlap is seen in the drawing. As described above, the display device may include a display area 103 in which a plurality of light emitting cells 104 are discharged and a peripheral area 102 surrounding the display area 103. The display area 103 is an area where an image is realized by performing display discharge.

An exhaust port 30 is formed in the peripheral region 102, through which the impurity gas in the panel is exhausted, and the discharge gas is filled in the panel. At least one exhaust device 30 may be formed in the peripheral area 102.

2 is a cross-sectional view of the light emitting cell 104. Here, the top plate 10 is shown rotated 90 degrees for convenience of description. The upper plate 10 includes the upper substrate 11, the discharge sustaining electrode pairs 16 disposed on the lower surface of the upper substrate 11, for example, on the lower surface of the upper substrate 11, and the discharge sustaining electrode. An upper dielectric layer 14 covering the pairs 16 is provided, and preferably, a protective layer 15 formed of MgO covering the upper dielectric layer 14 is further provided.

The upper substrate 11 is generally formed of a transparent material mainly made of glass.

The discharge sustaining electrode pair 16 refers to electrodes for which a discharge is performed. One discharge sustaining electrode of the discharge sustaining electrode pair 16 is the scan electrode 12, and the other discharge sustaining electrode is the display electrode 13. )to be.

Each of the scan electrode 12 and the display electrode 13 may include transparent electrodes 12a and 13a and bus electrodes 12b and 13b. The transparent electrodes 12a and 13a may be formed of indium tin oxide (ITO), which is a light transmissive electrode material. The bus electrodes 12b and 13b are formed at the outer ends of the discharge sustaining electrode pair 16, and the bus electrodes 12b and 13b are used to improve the electrical resistance of the discharge sustaining electrode pair 16. Can be formed of an excellent metal material, for example, an aluminum material.

 The upper dielectric layer 14 prevents cations or electrons from directly colliding with the discharge sustaining electrode pair 16, thereby damaging the discharge sustaining electrode pair 16, and assists accumulation of wall charges. The upper dielectric layer 14 may be formed of PbO, B 2 O 3, SiO 2, or the like.

The protective layer 15 prevents cations and electrons from colliding with the upper dielectric layer 14 during the discharge and damages the upper dielectric layer 14. The protective layer 15 is formed as a material having good light transmittance and emitting a large amount of secondary electrons during discharge. As is preferred, MgO is usually used.

On the other hand, the lower plate 20 is the lower substrate 21 disposed to face the upper plate 11, the upper side of the lower substrate 21, for example, the discharge holding electrode on the upper surface of the lower substrate 21 Address electrodes 22 formed to intersect the pair 16, a lower dielectric layer 23 covering the address electrodes 22, and a lower dielectric layer 23 formed on the lower dielectric layer 23 to define a plurality of light emitting cells 104. A partition 24 and a phosphor 25 coated over the light emitting cells 104.

The lower substrate 21 functions to support the address electrodes 22, the lower dielectric layer 23, and the like, and is typically formed of glass as a main material.

The address electrodes 22 extend in a direction crossing the discharge sustaining electrode pair 16. These address electrodes 22 perform an address discharge to facilitate a discharge between the scan electrode 12 and the display electrode 13.

The lower dielectric layer 23 prevents cations or electrons from colliding with the address electrode 22 and damages the address electrode 22 during discharge, and induces charge. It may be formed of B ₂ O ₃ , SiO ₂ and the like.

The partition wall 24 partitions a region to which the fluorescent layer 25 is applied and prevents erroneous discharge from occurring between the light emitting cells 104.

A plurality of light emitting cells 104 are partitioned by the partition walls 24, and phosphors 25 are coated inside the light emitting cells 104. The phosphor 25 may be composed of three color phosphors of red, green, and blue.

The discharge gas is filled in the light emitting cells 104, and a Ne-Xe mixed gas is mainly used as the discharge gas.

  On the other hand, in recent years, in order to reduce costs, a multi-faceted method is used in which at least two upper substrates and / or lower substrates are designed in one substrate member. 3 is a plan view illustrating the substrate member 121 when three lower substrates 21 are designed on one substrate member 121. Three lower substrates 21 designed on one substrate member 121 are separated into respective lower substrates 21 through a cutting process. Here, reference numeral CP, which is not described, is a cutting plane in the cutting process, and reference numerals AP and BP are cross-sectional and longitudinal sections of the lower substrate 21, respectively.

According to the multi-sided method, after address electrodes, lower dielectric layers, barrier ribs, phosphors, etc. are sequentially formed on the substrate member 121 (see FIG. 2), a drilling operation for forming the exhaust port 30 and each lower substrate are performed. Cutting to be separated into 21 is made. However, in order to form the structures on the substrate member 121, a plurality of thermal processes are performed. For example, in order to form the partition wall 24, a partition material is applied on the lower dielectric layer 23, a pattern is formed, and finally a firing step is performed.

As illustrated in FIG. 4, the substrate member 121 that has undergone such a plurality of thermal processes may be somewhat deformed by heat applied in the manufacturing process. Therefore, as can be seen in the drawing, the substrate member 121 has a very weak support structure supported by the corner portion AC of the bottom surface LP. By the way, a punching operation is performed to form the exhaust port 30 in the substrate member 121, and after the exhaust port 30 is formed, a cutting operation of separating the lower substrates 21 is performed. AC) to the exhaust port 30 adjacent to the corner (AC), such as a problem occurs.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and other problems. In the multi-faceted method in which at least two substrates are designed in one substrate member, the plasma display panel has an improved structure in which the exhaust port is prevented from being damaged. The purpose is to provide.

Another object of the present invention is to provide an improved plasma display panel in which a manufacturing cost is reduced in a multi-faceted method.

In order to achieve the above object, the plasma display panel of the present invention,

An upper plate comprising an upper substrate and a plurality of electrodes formed under the upper substrate; And

A lower substrate disposed opposite the upper substrate, and a lower substrate including a plurality of electrodes formed on the upper side of the lower substrate to correspond to the electrodes of the upper substrate;

In the region where the upper plate and the lower plate overlap each other, the display panel includes a display area in which a plurality of discharge cells are discharged and a peripheral area surrounding the display area, and an exhaust port is formed in the peripheral area of the lower plate.

The edge portion connecting the lower surface and the side cross-section of the lower substrate is characterized in that the finish cutting portion is formed.

The lower substrate may be one of at least two lower substrates formed by cutting one substrate member.

In addition, the side cross section may be a cross section or a longitudinal cross section of the lower substrate.

The exhaust port is formed in a circular shape, and the center of the exhaust port is spaced apart by a first separation distance in a cross section adjacent to the exhaust port, and the first separation distance is preferably at least 2.5 times the diameter of the exhaust port.

In addition, the exhaust port is formed in a circular shape, the center of the exhaust port is spaced apart by a second separation distance in the longitudinal section adjacent to the exhaust port, the second separation distance is preferably at least 1.5 times the diameter of the exhaust port.

The finishing cutting unit may be a curved surface connecting the bottom surface and the side cross-section of the lower substrate or the inclined surface connecting the lower surface and the side cross-section of the lower substrate.

The depth of the finishing cut portion is preferably at least 0.108 times the thickness of the lower substrate.

The upper plate of the plasma display panel includes an upper substrate, discharge sustaining electrode pairs formed on the lower side of the upper substrate and extending along light emitting cells continuously arranged in one direction, an upper dielectric layer covering the discharge sustaining electrode pairs, and the upper dielectric layer. A protective layer covering the

The lower plate is formed on an upper side of the lower substrate, the address electrodes extending along the light emitting cells continuously arranged in different directions, a lower dielectric layer covering the address electrodes, and formed on an upper side of the lower dielectric layer to partition the light emitting cells. And a phosphor disposed in the light emitting cells, and a discharge gas may be filled in the light emitting cells.

Hereinafter, a plasma display panel according to an exemplary embodiment of the present invention will be described in detail.

5 illustrates a lower substrate employable in the plasma display panel according to an exemplary embodiment of the present invention. Referring to the figure, the exhaust port 30 can be drilled in a circle having a diameter D. The center of the exhaust port 30 is spaced apart from the cross section AP of the lower substrate 21 by the first spacing distance L1, and spaced apart from the end surface BP of the lower substrate by the second spacing L2.

6 is a profile showing a failure rate of the exhaust port according to the change of the first separation distance L1 / D with respect to the exhaust port diameter. Here, the defective rate of the exhaust port refers to the rate at which cracks occur or break around the exhaust port 30 in a punching process in which the exhaust port is formed or a cutting process thereafter. As can be seen in the figure, the failure rate of the exhaust port decreases as the ratio of the first separation distance (L1 / D, hereinafter referred to as 'the ratio of the first separation distance') to the diameter D increases. That is, when the ratio L1 / D of the first separation distance to the diameter D of the exhaust port 30 is less than about 2, all the exhaust ports are broken, and if it exceeds this, the defective rate is drastically reduced. When the ratio of 1 separation (L1 / D) is 2.2, the failure rate is reduced to almost 10 percent. Here, when the ratio L1 / D of the first separation distance is 2.5 or more, the defect of the exhaust port does not occur. Therefore, it is preferable that the ratio of the first separation distance L1 / D is 2.5 or more to prevent the exhaust port from being damaged.

FIG. 7 is a profile showing the failure rate of the exhaust port according to the change of the second separation distance L2 / D with respect to the diameter of the exhaust port. Here, the defective rate of the exhaust port refers to the rate at which cracks occur or break around the exhaust port during the punching process in which the exhaust port is formed or after the cutting process. As can be seen in the figure, the failure rate of the exhaust port decreases as the ratio L2 / D of the second separation distance increases. That is, when the ratio L2 / D of the second separation distance is less than about 1, the failure rate is 100 percent, and damage occurs at all the exhaust ports. If the ratio L2 / D of the second separation distance exceeds 1, the failure rate is drastically reduced, and when 1.3 is reached, the failure rate is almost 10 percent, and the ratio L2 / D of the second separation distance is further increased. Increasing to 1.5, the breakage of the exhaust port does not occur. Therefore, it is preferable that the ratio L2 / D of the second separation distance be designed to be at least 1.5 or more in order to prevent breakage of the exhaust port.

8 is a perspective view showing a lower substrate that can be employed in one preferred embodiment of the present invention. Here, for convenience of description, the lower substrate 21 is shown rotated so that the lower surface LP faces upward.

Referring to the drawings, a finish cutting portion 50 is formed at the corner portion AC connecting the lower surface LP and the cross section AP of the lower substrate 21. This finishing cut 50 may be formed by each chamfer. Here, reference numeral C denotes the depth of the finish cutting part 50, and becomes a chamfering dimension when the finish cutting part 50 is formed by chamfering. As can be seen in the drawing, the finishing cutting part 50 may be formed to be inclined at 45 degrees with respect to the bottom surface LP of the lower substrate 21. Reference numeral T, which has not been described, is the thickness of the lower substrate 21.

9 illustrates a lower substrate employable in a plasma display panel according to another embodiment of the present invention. Referring to the drawings, a finish cutting part 50 is formed at the corner portion AC connecting the lower surface LP and the cross section AP of the lower substrate 21, and the finishing cutting part 50 is formed in a round chamfer. It can be formed by. Here, reference numeral C denotes the depth of the finish cutting part 50, and as shown in the drawing, the finishing cut part 50 has the same dimensions in the lower surface LP and the cross section AP of the lower substrate 21. Can be cut. Unexplained reference numeral T is the thickness of the lower substrate.

As such, when the finish cutting unit 50 is formed at the corner portion AC of the lower substrate 21, when forming the lower plate using the multi-faceted method, by dispersing the stress concentrated on the corner, the corner portion and the corner An exhaust port formed adjacent the portion can be protected (see FIG. 4).

FIG. 10 is a profile showing a defective rate according to the finish cutting depth (C / T) with respect to the lower substrate thickness. Here, the defective rate refers to the rate at which cracks are generated or damaged around the exhaust port during the punching process in which the exhaust port is formed or after the cutting process.

Referring to the drawings, the failure rate decreases as the finish cut depth (C / T, hereinafter referred to as 'the ratio of the finish cut depth') to the lower substrate thickness increases. That is, when the ratio C / T of the depth of the cut portion is 0, that is, when the finish cut portion 50 is not formed, breakage occurs at all the exhaust ports. As the ratio of finish cut depth (C / T) increases, the failure rate decreases, and when the ratio of finish cut depth (C / T) reaches 0.036, the failure rate becomes almost 30 percent. If the ratio of finish cut depth (C / T) is further increased, the failure rate of the exhaust port drops sharply, and if the depth ratio is 0.071, the failure rate reaches almost 10 percent, and when 0.108, the failure of the exhaust port does not occur. do. Therefore, it is preferable that the ratio C / T of the cut depth to be designed to be at least 0.108 or more to prevent damage of the exhaust port.

As described above, the failure rate decreases as the ratio C / T of the depth of the cut portion increases, so that the stress concentrated on the edge portion AC increases as the depth of the cut portion C increases. 50) is dispersed in the plane.

11 is a plan view showing a substrate member in a multi-faceted method in which four lower substrates are designed in one substrate member. 12 and 13 are cross-sectional views illustrating the substrate member illustrated in FIG. 11, and are cross-sectional views taken along the lines A-A and B-B of FIG. 11, respectively.

Here, CP represents a cutting surface for separating the substrate member into each lower substrate.

As shown in FIGS. 12 and 13, when four lower substrates 21 are vertically and horizontally designed on the substrate member 121, the substrate member 121 is accompanied by a bending deformation that cannot be ignored in the longitudinal and transverse directions. do. Therefore, not only the corner portion AC of the cross section AP of the lower substrate 21 but also the edge portion BC of the longitudinal section BP are formed at the edge portions AC and BC and adjacent thereto. It is preferable for the protection of the exhaust port 30 to be made.

14 is a perspective view illustrating a lower substrate employable in a plasma display panel according to another embodiment of the present invention. Referring to the drawings, not only the edge portion AC of the cross section AP of the lower substrate 21, but also the finishing cut portion 50 is formed at the edge portion BC of the longitudinal section BP.

As such, when the finish cutting part 50 is formed in both the cross section AP and the edges AC and BC of the lower surface 21 of the lower substrate 21, the lower substrate 21 is vertically and horizontally formed on the substrate member 121. ) Is designed (see Fig. 11), the breakage of the corner portions AC, BC and the exhaust port 30 formed adjacent thereto due to the bending deformation can be prevented.

In the accompanying drawings, the three chamfering and four chamfering cases are illustrated as an example, but the practical features of the present invention are not limited thereto, and in the case where at least two lower substrates are designed in one substrate member, Of course, the same can be applied.

In addition, in the accompanying drawings, only the case where the lower substrate is multifaceted is illustrated, but even when the upper substrate is multifaceted, the present invention may be applied substantially the same to those of ordinary skill in the art. It will be easily understood by those who have knowledge.

According to the plasma display panel of the present invention, in the multi-faceted method in which at least two lower substrates are designed in one substrate member, a finish cutting portion is formed in the cross-sectional edge portion and / or the longitudinal cross-sectional edge portion of the plasma display panel, so that Breakage is prevented. In particular, according to the present invention, a design criterion is provided for the depth of the finish cut portion where the defect of the exhaust port is prevented.

Although the present invention has been described with reference to the embodiments illustrated in the accompanying drawings, it is merely exemplary, and various modifications and equivalent other embodiments are possible from those skilled in the art to which the present invention pertains. You will understand the point. Therefore, the true scope of protection of the present invention should be defined by the appended claims.

Claims (10)

delete delete delete delete An upper plate comprising an upper substrate and a plurality of electrodes formed under the upper substrate; And A lower substrate disposed opposite the upper substrate, and a lower substrate including a plurality of electrodes formed on the upper side of the lower substrate to correspond to the electrodes of the upper substrate; In the region where the upper plate and the lower plate overlap each other, the display panel includes a display area in which a plurality of discharge cells are discharged and a peripheral area surrounding the display area, and an exhaust port is formed in the peripheral area of the lower plate. The lower substrate is one of at least two lower substrates formed by cutting one substrate member, and a cut surface is formed on at least one side cross section of a cross section and a longitudinal section, In the corner portion connecting the lower surface and the side cross-section of the lower substrate is formed a round cut or inclined finish cutting portion to remove the edge to prevent stress concentration,  Wherein the exhaust port is formed in a circular shape, and a center of the exhaust port is spaced apart by a first separation distance in a cross section adjacent to the exhaust port, and the first separation distance is 2.5 times or more of the diameter of the exhaust port. An upper plate comprising an upper substrate and a plurality of electrodes formed under the upper substrate; And A lower substrate disposed opposite the upper substrate, and a lower substrate including a plurality of electrodes formed on the upper side of the lower substrate to correspond to the electrodes of the upper substrate; In the region where the upper plate and the lower plate overlap each other, the display panel includes a display area in which a plurality of discharge cells are discharged and a peripheral area surrounding the display area, and an exhaust port is formed in the peripheral area of the lower plate. The lower substrate is one of at least two lower substrates formed by cutting one substrate member, and a cut surface is formed on at least one side cross section of a cross section and a longitudinal section, In the corner portion connecting the lower surface and the side cross-section of the lower substrate is formed a round cut or inclined finish cutting portion to remove the edge to prevent stress concentration, Wherein the exhaust port is formed in a circular shape, and a center of the exhaust port is spaced apart by a second separation distance from a longitudinal section adjacent to the exhaust port, and the second separation distance is 1.5 times or more of the diameter of the exhaust port. The plasma display panel of claim 5 or 6, wherein the finish cutting portion is an inclined surface which connects a lower surface of the lower substrate and a side cross section. The plasma display panel of claim 5, wherein the finish cutting part is a rounded curved surface connecting the lower surface and the side cross-section of the lower substrate. The plasma display panel of claim 5 or 6, wherein a depth of the finishing cut portion is 0.108 times or more of a thickness of the lower substrate. The top plate of claim 5 or 6, wherein the upper plate is formed on an upper substrate, a lower side of the upper substrate, and discharge sustaining electrode pairs extending along light emitting cells continuously arranged in one direction, and an upper portion covering the discharge sustaining electrode pairs. A dielectric layer and a protective layer covering the upper dielectric layer, The lower plate is formed on an upper side of the lower substrate, the address electrodes extending along the light emitting cells continuously arranged in different directions, a lower dielectric layer covering the address electrodes, and formed on an upper side of the lower dielectric layer to partition the light emitting cells. A barrier rib, and a phosphor coated inside the light emitting cells, And a discharge gas is filled in the light emitting cells.

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