KR100571522B1 - Solid state joining method of fine grain metal plate by surface moving friction welding method - Google Patents
Solid state joining method of fine grain metal plate by surface moving friction welding method Download PDFInfo
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- KR100571522B1 KR100571522B1 KR1020040047599A KR20040047599A KR100571522B1 KR 100571522 B1 KR100571522 B1 KR 100571522B1 KR 1020040047599 A KR1020040047599 A KR 1020040047599A KR 20040047599 A KR20040047599 A KR 20040047599A KR 100571522 B1 KR100571522 B1 KR 100571522B1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
- B23K20/123—Controlling or monitoring the welding process
- B23K20/1235—Controlling or monitoring the welding process with temperature control during joining
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/121—Control circuits therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
- B23K20/1245—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding characterised by the apparatus
- B23K20/126—Workpiece support, i.e. backing or clamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
- B23K20/1275—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding involving metallurgical change
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
- B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/286—Al as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
Abstract
본 발명은 얇은 판상의 용접부재를 마찰열로 접합하는 표면이동마찰용접법에 관한 것이며, 특히, 미세립구조를 가지는 용접부재를 그 미세립의 크기를 변화하지 않고 접합할 수 있는 표면이동마찰용접법에 관한 것이다.The present invention relates to a surface moving friction welding method for joining a thin plate-like welding member with frictional heat, and more particularly, to a surface moving friction welding method capable of joining a welding member having a fine grain structure without changing its size. will be.
본 발명은 표면부에서 프로브와 접합부재 사이에 발생한 강한 소성변형을 활용하여 미세립 금속판재를 결정립의 크기를 그대로 유지하거나 혹은 더욱 작게 하면서 접합하는 표면이동마찰용접법을 제공하고, 또한 두꺼운 미세립 판재의 용접시 1차 접합면의 반대쪽 면에 재차 한번의 용접을 실시하는 표면이동마찰용접법을 제공하고, 또한 두꺼운 미세립판재의 용접시 환봉의 프로브를 대칭형으로 설치하여 이중패스용접을 실시하는 표면이동마찰용접법을 제공한다.The present invention provides a surface friction friction welding method for joining the micro-grain metal sheet while maintaining or reducing the size of the crystal grains by utilizing the strong plastic deformation generated between the probe and the joining member at the surface portion, and also thick micro-grain plate Provides a surface transfer friction welding method that once again performs welding on the opposite side of the primary joint surface during welding, and also double-pass welding by installing a round bar probe symmetrically when welding thick fine plate material. Provide friction welding method.
본 발명에 따르면, 미세립 금속판재의 맞대기 접합시 표면이동 마찰용접법을 활용하여 미세화된 결정립의 크기를 그대로 유지하거나, 혹은 더욱 작게함으로써 재료의 미세조직적 손실없이 미세립 금속판재를 접합시킬 수 있다.According to the present invention, when the butt joints of the fine grain metal sheets are bonded to each other by using the surface moving friction welding method, the size of the fine grains can be maintained as it is, or by making them smaller.
표면이동마찰용접, 결정입도, 미세립, 판재Surface moving friction welding, grain size, fine grain, plate
Description
도 1은 표면이동마찰용접법의 용접장치 및 공정의 개략도,1 is a schematic view of a welding apparatus and process of the surface movement friction welding method,
도 2는 이중패스용접의 공정 개략도,2 is a process schematic diagram of double pass welding;
도 3은 동시이중패스용접의 공정 개략도,3 is a process schematic diagram of simultaneous double pass welding;
도 4는 두께 1.0mm의 1050알루미늄 미세립 판재의 표면이동 마찰용접후 단면사진과 부위별 결정립도,Figure 4 is a cross-sectional photograph and grain size of each part after the surface movement friction welding of 1050 aluminum fine grain plate of 1.0mm thickness,
도 5는 두께 1.0mm의 1050알루미늄 미세립 판재의 표면이동 마찰용접후 단면사진과 부위별 결정립간 방위차 분포도,5 is a cross-sectional photograph of the 1050 aluminum fine grain plate having a thickness of 1.0 mm and the orientation difference distribution between the grains according to the site after friction welding;
도 6은 두께 1.0mm의 1050알루미늄 미세립 판재의 TIG 용접후 단면사진과 부위별 결정립도.Figure 6 is a cross-sectional photograph and grain size after the TIG welding of 1050 aluminum fine grain plate of 1.0mm thickness.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
1, 2 : 접합부재 3, 3', 7, 7' : 환봉형 프로브1, 2: joining
4 : 용접부위 6 : 소성영역 4
본 발명은 얇은 판상의 용접부재를 마찰열로 접합하는 표면이동마찰용접법에 관한 것이며, 특히, 미세립구조를 가지는 용접부재를 그 미세립의 크기를 변화하지 않고 접합할 수 있는 표면이동마찰용접법에 관한 것이다.The present invention relates to a surface moving friction welding method for joining a thin plate-like welding member with frictional heat, and more particularly, to a surface moving friction welding method capable of joining a welding member having a fine grain structure without changing its size. will be.
마찰용접법은 용접하고자 하는 부재를 대상으로 마찰에 의하여 열이 발생하는 원리를 이용하여 마찰을 조절하여 적당량의 열을 발생시키고, 마찰부와 인접한 영역에 소성유동을 생성시켜 접합하는 용접법이다. 이 마찰용접법은 수십년간 연구개발되어 오고 있으며, 기존의 용융용접과 대비하여 볼 때 고상용접이라는 장점을 가지고 있으나, 용접부재 하나가 반드시 축대칭이어야 하며, 특정한 방향의 연속용접을 필요하는 구조물에는 사용할 수 없다는 결점도 가지고 있다.The friction welding method is a welding method in which an appropriate amount of heat is generated by controlling friction using a principle that heat is generated by friction for a member to be welded, and plastic plastic flow is generated in an area adjacent to the friction part to be joined. This friction welding method has been researched and developed for decades and has the advantage of solid phase welding compared to conventional melt welding. However, one welding member must be axisymmetric and used for structures requiring continuous welding in a specific direction. It also has the drawback of not being able to.
이러한 종래의 단순한 마찰용접법을 개선한 방법으로 제3의 단단한 프로브(Probe)와 프로브핀(Probe pin)을 도입한 마찰교반용접(WO93/10935, WO95/26254)이 개발되었다. 이 마찰교반용접의 원리는 접합부재 이음부의 맞대기 면을 따라 특수한 나사한 형태의 돌기를 가지는 환봉모양의 경질재료로 된 프로브핀을 고속으로 회전시키면서 삽입하면 프로브핀과 접합부재와의 상호마찰에 의해 열이 발생한다. 이 마찰열에 의해 주변의 소재는 열적으로 연화되며 프로브 핀의 회전에 의한 강제적인 소성유동으로 혼합되어 접합이 이루어진다. 그러나, 마찰교반용접에서는 프로브 핀의 존재로 인해 지금까지 알려진 바로는 접합부재의 두께가 적어도 1.2mm 이상에서만 적용이 가능하고, 용접말단에서 프로브 핀의 삽입으로 인해 생기는 빈 공간을 채울 있는 재료가 선단부에 더 이상 존재하지 않아서 용접결 함(Key hole)이 유발되는 단점이 있다.As a method of improving the conventional simple friction welding method, friction stir welding (WO93 / 10935, WO95 / 26254) introducing a third hard probe and a probe pin has been developed. The principle of this friction stir welding is to insert the probe pin made of a hard rod-shaped hard material with a special screw-shaped protrusion along the butt face of the joining member joint at high speed, and then the friction between the probe pin and the joining member. Heat is generated. By the frictional heat, the surrounding material is thermally softened and mixed in a forced plastic flow by the rotation of the probe pin to form a joint. However, in friction stir welding, it is possible to apply only the thickness of the joining member to at least 1.2 mm or more because of the existence of the probe pin, and the material to fill the empty space caused by the insertion of the probe pin at the welding end is known. There is a disadvantage that the key hole is caused because it no longer exists in the.
상기의 마찰용접과는 달리 1.2mm 이하의 박판용접이 가능하고, 용접말단에 용접결함을 남기지 않고 연속용접이 가능한 표면이동 마찰용접법(대한민국 특허출원 10-2003-68113)이 본 발명자들에 의하여 개발된 바 있다. Unlike the friction welding described above, a surface-moving friction welding method (Korean Patent Application No. 10-2003-68113), which enables thin sheet welding of 1.2 mm or less and enables continuous welding without leaving a welding defect at the welding end, is developed by the present inventors. It has been.
한편, 최근 합금성분이나 치수의 변화없이 강도와 연성이 우수한 금속판재의 제조를 위해 결정립을 미세화시키는 기술이 많이 개발되고 있다. 그러나 통상의 용융용접법으로는 접합부위의 금속이 일단 용융되었다가 응고되는 현상을 거치게 됨으로써 재료의 미세립구조를 더 이상 유지하는 것이 불가능하게 된다. 더욱이 응고조직의 형성으로 인해 기계적 성질이 크게 나빠지게 된다. 그러므로 미세화된 금속판재를 실제품에 활용하기 위해서는 미세화된 결정립의 크기를 그대로 유지하거나 혹은 더욱 작게 함으로써 재료의 미세조직적 손실없이 미세립 금속판재를 접합시키는 기술이 필수적이다. On the other hand, in recent years, many techniques have been developed for miniaturizing grains for the production of metal sheets having excellent strength and ductility without changing alloying components or dimensions. However, in the usual melt welding method, the metal at the junction portion is melted and solidified once, thereby making it impossible to maintain the fine grain structure of the material. Moreover, due to the formation of coagulation tissue, the mechanical properties are greatly deteriorated. Therefore, in order to utilize the refined metal sheet material in a real product, it is essential to maintain the size of the refined crystal grains intact or to make the size of the fine metal sheet material bonded without the microstructure loss of the material.
본 발명은 상기와 같은 문제점을 달성하기 위하여 미세립의 결정립을 갖는 미세립 금속판재에 대한 맞대기 접합에 있어서, 접합시 접합부위의 결정립 크기가 금속판재의 결정립크기를 유지하는 표면이동 마찰용접법을 제공하는데 그 목적이 있다.The present invention provides a surface-moving friction welding method in the butt joint to a fine metal sheet having a fine grain in order to achieve the above problems, the grain size of the joining portion at the time of joining to maintain the grain size of the metal sheet Its purpose is to.
본 발명은 상술한 기술적 과제를 달성하기 위하여 표면부에서 프로브와 접합부재 사이에 발생한 강한 소성변형을 활용하여 미세립 금속판재를 결정립의 크기를 그대로 유지하거나 혹은 더욱 작게 하면서 접합하는 표면이동마찰용접법을 제공한다.The present invention utilizes a strong plastic deformation generated between the probe and the bonding member in the surface portion in order to achieve the above-described technical problem surface transfer friction welding method for joining the fine grain metal sheet material while maintaining or reducing the size of the crystal grains as it is; to provide.
또한, 본 발명은 두꺼운 미세립 판재의 용접시 1차 접합면의 반대쪽 면에 재차 한번의 용접을 실시하는 표면이동마찰용접법을 제공한다.In addition, the present invention provides a surface movement friction welding method of performing one welding again on the opposite side of the primary bonding surface when welding the thick fine grain plate material.
또한, 본 발명은 두꺼운 미세립판재의 용접시 환봉의 프로브를 대칭형으로 설치하여 이중패스용접을 실시하는 표면이동마찰용접법을 제공한다.In addition, the present invention provides a surface movement friction welding method for performing double pass welding by symmetrically installing the probe of the round bar when welding the thick fine plate material.
이하, 도면을 참조하여 본 발명에 대하여 자세하게 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail with reference to drawings.
도 1은 본 발명에 의한 마찰용접법의 개략도를 나타낸 그림이다.1 is a view showing a schematic diagram of a friction welding method according to the present invention.
미세립 구조를 가지는 두개의 판상의 두 개의 접합부재(1,2)의 맞대기 용접에서 회전동력원에 결합된 환봉형 프로브(3)가 적절한 마찰열의 발생을 위해 일정한 압력으로 고속회전하면서 두 부재사이의 접합요구선(5)을 수평운동을 통해 연속적으로 지남에 따라 대략 프로브 지름 크기의 너비를 가지는 용접부(4)가 형성되면서 접합된다. 환봉형 프로브(3)의 회전으로 인해 발생한 소성영역(6)은 프로브(3) 직하, 즉 접합부재(1,2)의 표면에서 발생한 마찰열과 소성변형에 의한 가공발열로 인해 연화되고, 강제적이고 극심한 소성유동으로 인해 접합된다. 이러한 방법을 적용할 때 환봉형 프로브의 회전속도와 직선이동속도에 따라 소성영역(6)의 결정립의 크기는 접합부재(1, 2)의 결정립의 크기와 대비할 때 비슷하거나 더 작게 되며, 도 1에서 측면부의 결정립의 형상을 모식적으로 나타내었다.In the butt welding of two plate-shaped joining
접합과정에서 야기되는 극심한 소성유동은 전위쎌 조직의 형성이나 연속 혹은 불연속적인 동적 재결정을 일으켜 고경각 입계를 가지는 미세 결정립의 접합부 를 확보할 수 있게 해준다. 이 경우 가급적 저온에서의 소성변형이 미세결정립을 얻기에 유리하다고 알려져 있다. 하지만 접합시 너무 과도한 프로브의 회전속도 혹은 너무 큰 프로브 반경은 과도한 소성변형을 유발하며 접합부의 온도를 재료의 재결정온도를 훨씬 웃도는 영역까지 올리게 된다. 이렇게 되면 접합부재에 생성된 결정립은 결정립 성장을 하게 되어 더 이상 미세한 상태를 유지할 수 없다. 반면, 임계 크기 이하의 낮은 프로브의 회전속도 혹은 너무 작은 프로브 반경에서는 접합에 필요한 온도상승이나 소성변형양의 확보가 불가능하게 된다. 따라서 본 발명에서는 미세한 결정립을 갖는 미세립 금속판재에 대한 맞대기 접합에 있어서, 접합시 접합부위의 결정립 크기가 금속판재의 결정립크기를 유지하면서도 접합이 가능한 표면이동 마찰용접 방법을 제공하고자 한다. The extreme plastic flows caused by the bonding process can lead to the formation of dislocation 쎌 structures or continuous or discontinuous dynamic recrystallization, thus ensuring the connection of fine grains with high grain boundaries. In this case, plastic deformation at low temperature is known to be advantageous to obtain microcrystalline grains. However, too much probe rotation speed or too large probe radius during bonding will cause excessive plastic deformation and increase the temperature of the junction to an area well above the recrystallization temperature of the material. In this case, the grains generated in the joining member are grain grown and can no longer maintain a fine state. On the other hand, it is impossible to secure the amount of temperature rise or plastic deformation required for bonding at a low rotation speed of the probe below the critical size or too small a probe radius. Accordingly, in the present invention, in butt bonding to a fine metal sheet having fine grains, the present invention seeks to provide a surface-moving friction welding method in which the grain size of the bonding portion can be bonded while maintaining the grain size of the metal sheet.
고상접합에 필요한 접합부의 온도는 적어도 접합하고자 하는 소재의 재결정온도를 참조하여 대략 재료의 용융온도(Tm, 단위 : 절대온도)의 70% 이상은 되어야 한다. 반면에 접합소재가 미세립을 유지하기 위해서는 소재의 온도가 용융온도의 90%를 넘어서는 곤란하다. 따라서 소재의 접합조건과 미세립의 유지조건을 감안한 접합부의 온도범위는 식 1로 표현된다.The junction temperature required for solid-state bonding should be at least 70% of the melting temperature (T m , unit: absolute temperature) of the material, with reference to the recrystallization temperature of the material to be joined. On the other hand, in order for the bonded material to maintain fine grains, it is difficult for the temperature of the material to exceed 90% of the melting temperature. Therefore, the temperature range of the joint considering the bonding conditions of the material and the retention conditions of the fine grains is expressed by
[식 1][Equation 1]
한편, 정상상태에서 접합도중 재료에서 발생한 가공발열량과 외부로 빠져나가는 열량과의 관계는 식 2와 같다.On the other hand, the relationship between the calorific value of heat generated from the material during the joining in the steady state and the amount of heat escaping to the outside is shown in
[식 2][Equation 2]
여기서, 는 소성일이 열로 변환되는 정도를 표현하는 계수로 대개 0.9에서 1사이의 값을 갖는다. 는 재료의 전단유동응력으로 온도와 전단변형율속도의 함수이다. 는 접합부에 야기되는 평균 전단변형율 속도이며 프로브의 회전속도와 프로브의 직경에 의존한다. D와 t는 각각 프로브의 직경과 접합부재의 두께이다. k와 h는 접합부재의 열전도도와 프로브와 접합부재 사이의 열전달 계수이며 온도의 함수이다. Te는 주위 온도이며, T와 Te의 단위는 절대온도(K) 이다. 는 접합부 경계에서의 거리에 따른 온도구배이다. here, Is a coefficient representing the degree to which the plastic work is converted into heat, and is usually between 0.9 and 1. Is the shear flow stress of the material, a function of temperature and shear strain rate. Is the average shear strain velocity at the joint and depends on the probe rotation speed and the probe diameter. D and t are the diameter of the probe and the thickness of the joining member, respectively. k and h are the thermal conductivity of the joint and the heat transfer coefficient between the probe and the joint and are a function of temperature. T e is the ambient temperature, and the unit of T and T e is the absolute temperature (K). Is the temperature gradient over distance at the junction boundary.
접합부에 야기되는 평균 전단변형율 속도는 식 3과 같다.The average shear strain rate at the joint is given by
[식 3][Equation 3]
여기서 S는 프로브의 회전속도이다. 식 3을 식 2에 대입하여 풀면 정상상태에서 접합부의 온도를 계산할 수 있다. 이렇게 구한 접합부의 온도가 식 1을 만족하도록 프르브의 직경과 회전속도가 선택되어야만 접합부위의 결정립 크기가 미세한 결정립크기를 유지하면서 접합이 가능한 용접이 가능해 진다.Where S is the rotational speed of the probe. Solving
또한, 본 발명에서는 표면마찰에 의한 소성유동을 재료 내부에까지 침투시켜야 하므로 두꺼운 판재의 용접은 단패스(Single Pass)로 불가능하다. 이러한 경우에는 1차 접합면의 반대쪽 면에 재차 한 번의 용접을 실시하는 이중패스(Double Pass)용접을 실시한다. 도 2에 그 공정 개략도를 나타낸다.In addition, in the present invention, the plastic flow due to the surface friction has to penetrate into the inside of the material, so welding of a thick plate is impossible in a single pass. In this case, double pass welding is performed once again on the opposite side of the primary joint surface. The process schematic diagram is shown in FIG.
이 때 접합하고자 하는 판재(1,2)의 두께에 따라 프로브(3')의 직경을 변화시킬 수 있다.In this case, the diameter of the
도 3에는 또 다른 방법으로 두 개의 환봉의 프로브(7, 7')를 대칭형으로 설치하여 이중패스용접을 한꺼번에 실시하는 동시이중패스용접을 통하여 보다 두꺼운 판재의 접합이 가능하고, 이를 활용하여 결정립을 미세화하거나, 또는 미세한 초기 결정립의 크기를 그대로 유지할 수 있게 된다.In another method of FIG. 3, two
실시예Example
약 2.17㎛의 결정입도를 가지는 1.0mm 두께의 1050알루미늄 합금판재를 프로브의 지름이 5mm이고 회전속도 1600rpm, 용접속도 100mm/min의 조건에서 본 발명자들이 제안한 방법인 표면이동 마찰용접법을 사용하여 용접하였다. 이러한 용접조건에 대하여 수학식 2와 수학식 3을 이용하여 접합부의 온도를 계산하면 803K (530oC)가 얻어지는데, 이 온도는 일반적인 알루미늄 합금의 용융온도인 933K (660oC)에 대해 0.86Tm에 해당하므로 수학식 1을 만족한다. 따라서 이 용접조건에서는 접합부위의 결정립 크기가 미세한 결정립크기를 유지하면서 접합이 가능하다.A 1.0 mm thick 1050 aluminum alloy sheet with a grain size of about 2.17 μm was welded using the surface-moving friction welding method proposed by the present inventors under conditions of a probe diameter of 5 mm, a rotation speed of 1600 rpm, and a welding speed of 100 mm / min. . For these welding conditions, the temperature of the joint is calculated using
도 4는 상기 재료에 대한 용접부위의 단면사진과 모재와 용접부위의 결정입도를 EBSD (Electron Back Scattered Diffraction) 방법으로 관찰한 사진이다. 소성영역의 형태는 표면부위에서 가장 크고 내부로 갈수록 작아지는 양상을 보인다. 상기 용접조건에서 소성변형이 가장 극심한 표면부위(b)의 결정입도는 1.1㎛으로 가장 작고, 아래로 갈수록(c) 다소 커짐을 알 수 있으나, 대략 2.04㎛ 정도로 모재(a)의 것과 유사하거나 혹은 더욱 미세화되었음을 확인할 수 있었다. FIG. 4 is a cross-sectional photograph of a welded portion of the material and a grain size of the base material and the welded portion are observed by EBSD (Electron Back Scattered Diffraction) method. The shape of the plastic zone is the largest on the surface and decreases toward the inside. In the welding conditions, the grain size of the surface portion (b) with the highest plastic deformation was 1.1 µm, which was the smallest, and it was found that (c) was somewhat larger, but it was similar to that of the substrate (a) at about 2.04 µm. It could be confirmed that further refinement.
도 5는 용접부위에서 결정립들의 방위차이의 분포를 도시하였다. 도 5에서 보듯이 용접부위에서 결정립들의 방위차가 충분히 큰 대각입계의 분포가 많음을 알 수 있으며, 용접부 상층(b)에서는 오히려 모재부(a)보다도 대각입계의 양이 많아 졌음을 알 수 있다. 용접부 중심(c)에서도 모재부(a)와 유사한 수준의 대각입계양을 보이고 있다. 이를 통해 표면이동마찰용접법을 이용하여 안정한 결정립을 얻을 수 있음을 알 수 있다.5 shows the distribution of the orientation difference of the grains in the welded portion. As shown in FIG. 5, it can be seen that there are many distributions of diagonal grain boundaries having sufficiently large azimuth differences of the grains in the welded portion, and that the amount of the diagonal grain boundaries is increased in the upper portion (b) of the weld portion rather than the base material portion (a). The weld center (c) also shows a diagonal grain boundary similar to that of the base material (a). Through this, it can be seen that stable grains can be obtained by using the surface moving friction welding method.
도 6은 비교예로서 동일한 알루미늄 합금판재를 접합함에 있어서, 종래의 용접방법인 TIG 용접을 실시하고 결정립도의 관찰결과를 도시하였다. 용접시 다량의 입열로 인한 온도상승으로 인해 열열향부(a)의 결정립크기는 무려 60㎛ 정도 성장하였으며, 용접부(c)와 경계부(b)의 결정입도도 25㎛ 내외로 상당히 조대해졌음을 확인할 수 있다. 이를 통해 본 발명에서 제시한 표면이동 마찰용접법을 활용하는 방법이 미세립 금속판재를 효과적으로 접합할 수 있음을 알 수 있다.FIG. 6 shows the results of observing the grain size by performing the TIG welding, which is a conventional welding method, in joining the same aluminum alloy plate as the comparative example. Due to the temperature increase due to the large amount of heat input during welding, the grain size of the thermally-heat-directed portion (a) was increased to about 60㎛, and the grain size of the welded portion (c) and the boundary portion (b) was considerably coarse to about 25㎛. have. Through this, it can be seen that the method using the surface moving friction welding method proposed in the present invention can effectively bond the fine metal sheet material.
본 발명에 따르면, 미세립 금속판재의 맞대기 접합시 표면이동 마찰용접법을 활용하여 미세화된 결정립의 크기를 그대로 유지하거나, 혹은 더욱 작게 함으로써 재료의 미세조직적 손실없이 미세립 금속판재를 접합시킬 수 있다.According to the present invention, when the butt joints of the fine grain metal sheets are bonded to each other by using the surface moving friction welding method, the size of the fine grains can be maintained as it is, or even smaller.
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