KR100542369B1 - Pre-etching solution of thin metal sheet for shadowmask and pre-etching method using the same - Google Patents
Pre-etching solution of thin metal sheet for shadowmask and pre-etching method using the same Download PDFInfo
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- KR100542369B1 KR100542369B1 KR1020030088855A KR20030088855A KR100542369B1 KR 100542369 B1 KR100542369 B1 KR 100542369B1 KR 1020030088855 A KR1020030088855 A KR 1020030088855A KR 20030088855 A KR20030088855 A KR 20030088855A KR 100542369 B1 KR100542369 B1 KR 100542369B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
- H01J9/142—Manufacture of electrodes or electrode systems of non-emitting electrodes of shadow-masks for colour television tubes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2229/00—Details of cathode ray tubes or electron beam tubes
- H01J2229/07—Shadow masks
- H01J2229/0727—Aperture plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
- H01J29/06—Screens for shielding; Masks interposed in the electron stream
- H01J29/07—Shadow masks for colour television tubes
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Abstract
염화철(FeCl2)로 금속박판을 에칭하여 통공을 형성하기 전에 금속박판을 에칭하는 섀도우마스크용 금속박판의 프리에칭용액 및 이를 이용한 프리에칭방법이 개시된다. 상기 상기 섀도우마스크용 금속박판의 프리에칭용액 및 프리에칭방법은 황산이 주성분이다. 그러므로, 금속박판을 에칭하면 황산니켈이 생성되는데, 황산니켈은 물에 완전히 용해되므로, 석출물이 발생하지 않는다. 즉, 금속박판을 프리에칭한 후에도 석출물이 발생되지 않으므로 금속박판의 표면으로부터 감광막이 뜨는 현상이 해소된다. 그러므로, 프리에칭후 염화철로 금속박판을 에칭하여 통공을 형성할 때, 균일한 통공을 형성할 수 있다. 그리고, 프리에칭용액에도 석출물이 발생하지 않으므로 석출물을 제거하기 위한 고가의 필터가 필요없다. 그러므로, 경제적이다.Disclosed is a pre-etching solution of a shadow thin metal plate for etching a thin metal sheet before etching the thin metal plate with iron chloride (FeCl 2 ) to form a through hole, and a pre-etching method using the same. Sulfuric acid is a main component of the preetching solution and the preetching method of the shadow mask metal sheet. Therefore, when the metal sheet is etched, nickel sulfate is produced. Since nickel sulfate is completely dissolved in water, no precipitate is generated. That is, since the precipitate does not occur even after preetching the metal thin plate, the phenomenon that the photosensitive film floats from the surface of the metal thin plate is eliminated. Therefore, when the metal thin plate is etched with iron chloride after preetching to form a through hole, a uniform through hole can be formed. In addition, since no precipitates are generated in the pre-etching solution, an expensive filter for removing the precipitates is not necessary. Therefore, it is economical.
Description
본 발명은 염화철(FeCl2)로 금속박판을 에칭하여 통공을 형성하기 전에 금속박판을 에칭하는 섀도우마스크용 금속박판의 프리에칭용액 및 이를 이용한 프리에칭방법에 관한 것이다.The present invention relates to a preetching solution of a shadow thin metal sheet for etching a thin metal sheet before etching the thin metal plate with iron chloride (FeCl 2 ) to form a through hole and a preetching method using the same.
섀도우마스크의 제조공정을 설명하면, 소재인 금속박판을 세정한 후, 금속박판에 감광막을 형성한다. 그리고, 빛을 감광막에 조사하여 감광막을 경화시킨 다음, 경화되지 않는 감광막의 부위를 현상액으로 제거한다. 그리고, 감광막이 제거된 금속박판의 부위를 염화철(FeCl2)로 부식시켜 통공을 형성한다.Referring to the manufacturing process of the shadow mask, after cleaning the metal thin plate as a raw material, a photosensitive film is formed on the metal thin plate. Then, light is irradiated to the photosensitive film to cure the photosensitive film, and then the portion of the photosensitive film that is not cured is removed with a developer. Then, the portion of the metal plate from which the photoresist film is removed is corroded with iron chloride (FeCl 2 ) to form a through hole.
이때, 금속박판을 염화철로 에칭하기 전에 금속박판의 표면을 프리에칭(Pre-etching)한다. 프리에칭을 하는 주된 이유는 제거되지 않고 금속박판의 표면에 잔존하는 산화피막 및 감광막을 완전히 제거함과 동시에 금속박판의 표면적을 넓게하여 염화철로 금속박판을 에칭하여 통공을 형성할 때 균일한 통공을 형성하기 위함 이다.At this time, the surface of the metal sheet is pre-etched (pre-etched) before the metal sheet is etched with iron chloride. The main reason for pre-etching is not removed, but it completely removes the oxide film and the photoresist film remaining on the surface of the metal thin plate and at the same time widens the surface area of the metal thin plate to form uniform through holes when etching the thin metal plate with iron chloride To do so.
프리에칭시 사용되는 프리에칭용액은 금속박판에 형성된 산화피막을 완전히 제거할 수 있고, 금속박판과 감광막 사이에 입자가 석출되지 않게 하며, 프리에칭용액에도 입자가 석출되지 않게 하는 특성을 가져야 한다.The preetching solution used in the preetching process must completely remove the oxide film formed on the metal foil, prevent the particles from being deposited between the metal foil and the photosensitive film, and prevent the particles from being deposited even in the preetching solution.
종래의 프리에칭용액은 물 1ℓ에 대하여 황산 0.06중량％, 과산화수소 0.51중량％ 및 수산 1.93중량％를 용해시켜 사용하였다. 상기와 같이 수산이 주성분인 종래의 프리에칭용액을 사용하여 금속박판을 프리에칭할 때, 금속박판이 니켈을 36％ 함유한 인바재일 경우에는 감광막과 금속박판 사이의 경계면 및 프리에칭용액에 안정된 입자인 수산니켈이 석출된다.The conventional pre-etching solution was used by dissolving 0.06% by weight sulfuric acid, 0.51% by weight hydrogen peroxide and 1.93% by weight per 1 liter of water. When the metal thin plate is pre-etched using the conventional pre-etching solution mainly composed of oxalic acid as described above, when the metal thin plate is an Invar material containing 36% of nickel, the particles are stable particles at the interface between the photosensitive film and the metal thin plate and the pre-etching solution. Nickel oxalate precipitates.
수산니켈이 감광막과 금속박판 사이의 경계면에서 석출되면, 감광막이 금속박판으로부터 뜨게 된다. 그러면, 염화철로 금속박판을 에칭하여 통공을 형성할 때, 과도한 에칭 및 불균일한 에칭으로 인하여 통공이 불균일하게 형성되는 단점이 있다.When nickel hydroxide precipitates at the interface between the photosensitive film and the metal thin plate, the photosensitive film floats from the metal thin plate. Then, when forming the through hole by etching the metal thin plate with iron chloride, there is a disadvantage that the through hole is formed unevenly due to excessive etching and uneven etching.
또한, 수산니켈이 프리에칭용액에 존재하면, 금속박판에 묻은 프리에칭용액을 제거하기 위한 롤러에 수산니켈에 붙게 된다. 그러면, 롤러를 이용하여 금속박판에 묻은 프리에칭용액을 제거할 때, 감광막에 흠이 생기게 되므로 에칭불량이 야기되는 단점이 있다. 이러한 단점을 해소하기 위해서는, 프리에칭용액 속에 존재하는 수산니켈을 제거하여야 하는데, 수산니켈을 제거하기 위해서는 미세한 세공이 형성된 고가의 필터를 이용하여 하므로 비경제적인 단점이 있다.If nickel hydroxide is present in the preetching solution, the nickel hydroxide is attached to the roller for removing the preetching solution from the metal thin plate. Then, when removing the pre-etching solution adhered to the metal thin plate by using a roller, there is a disadvantage that the etching is caused because the photosensitive film is scratched. In order to solve such a disadvantage, it is necessary to remove nickel hydroxide present in the pre-etching solution, but to remove the nickel hydroxide, there is an uneconomical disadvantage because an expensive filter having fine pores is formed.
본 발명은 상기와 같은 종래 기술의 문제점을 해소하기 위하여 안출된 것으로, 본 발명의 목적은 금속박판의 프리에칭시 석출물이 발생되지 않도록 황산을 프리에칭용액의 주성분으로 한 섀도우마스크용 금속박판의 프리에칭용액 및 이를 이용한 프리에칭방법을 제공함에 있다. The present invention has been made in order to solve the problems of the prior art as described above, the object of the present invention is to free the shadow of the metal sheet for the shadow mask with sulfuric acid as the main component of the pre-etching solution so that no precipitates are generated during the pre-etching of the metal sheet An etching solution and a preetching method using the same are provided.
상기 목적을 달성하기 위한 본 발명에 따른 섀도우마스크용 금속박판의 프리에칭용액은 물 1ℓ에 대하여 황산 1∼150g, 무기산염 1∼150g, 유기산 0.1∼40g, 계면활성제 0.001∼0.1g 및 산화제 2∼20g을 용해한다.Preetching solution of the metal thin film for shadow mask according to the present invention for achieving the above object is 1 to 150 g of sulfuric acid, 1 to 150 g of inorganic acid salt, 0.1 to 40 g of organic acid, 0.001 to 0.1 g of surfactant and 2 to oxidant per 1 L of water. Dissolve 20 g.
또한, 상기 목적을 달성하기 위한 본 발명에 따른 섀도우마스크용 금속박판의 프리에칭방법은 물 1ℓ에 대하여 황산 1∼150g, 무기산염 1∼150g, 유기산 0.1∼40g, 계면활성제 0.001∼0.1g 및 과산화수소 2∼20g을 용해한 프리에칭용액에 금속박판 및 백금망을 함침하고, 상기 금속박판과 상기 백금망을 전선으로 연결하여 자연전위로 상기 금속박판을 에칭한다.In addition, the preetching method of the metal sheet for shadow mask according to the present invention for achieving the above object is 1 to 150g sulfuric acid, 1 to 150g inorganic acid salt, 0.1 to 40g organic acid, 0.001 to 0.1g surfactant and hydrogen peroxide per 1 liter of water A metal thin plate and a platinum net are impregnated in a pre-etching solution in which 2-20 g is dissolved, and the metal thin plate and the platinum net are connected by an electric wire to etch the metal thin plate at a natural potential.
이하, 본 발명의 일 실시예에 따른 섀도우마스크용 금속박판의 프리에칭용액 및 이를 이용한 프리에칭방법을 상세히 설명한다.Hereinafter, the pre-etching solution and the pre-etching method using the same for the shadow metal mask thin plate according to an embodiment of the present invention.
염화철(FeCl2)로 금속박판을 에칭하여 통공을 형성하기 전에, 상기 금속박판에 잔존하는 산화피막 및 감광막을 제거함과 동시에 상기 금속박판의 표면을 부식시키기 위한 프리에칭(Pre-etching)을 한다.Before etching the thin metal plate with iron chloride (FeCl 2 ) to form a through hole, pre-etching is performed to remove the oxide film and the photosensitive film remaining on the thin metal plate and to corrode the surface of the thin metal plate.
본 실시예에 따른 프리에칭용액은 물 1ℓ에 대하여 황산 1∼150g, 무기산염 1∼150g, 유기산 0.1∼40g, 계면활성제 0.001∼0.1g 및 과산화수소 2∼20g을 용해하여 사용한다.The pre-etching solution according to this embodiment is used by dissolving 1 to 150 g of sulfuric acid, 1 to 150 g of inorganic acid salt, 0.1 to 40 g of organic acid, 0.001 to 0.1 g of surfactant, and 2 to 20 g of hydrogen peroxide with respect to 1 L of water.
무기산염은 황산이 금속박판과 반응을 잘 일으키도록 촉매역활을 하는 것으로, 황산금속염 및 인산금속염 중에서 선택된 어느 하나를 사용한다. 유기산은 안정제로써 구연산, 사과산, 젖산 및 글루콘산 중에서 선택된 어느 하나, 또는 이들의 혼합물을 사용한다. 계면활성제로는 설폰산계열, 폴리옥시에틸렌알킬아민계열 및 폴리에틸렌그리콜지방산에스터계열 중에서 선택된 어느 하나, 또는 이들의 혼합물을 사용한다. 그리고, 산화제는 과산화수소가 사용된다.Inorganic acid salts are catalytically active so that sulfuric acid reacts with the thin metal plate. Any one selected from metal sulfate and metal phosphate salt is used. The organic acid uses any one selected from citric acid, malic acid, lactic acid and gluconic acid, or a mixture thereof as a stabilizer. As the surfactant, any one selected from sulfonic acid series, polyoxyethylene alkylamine series and polyethylene glycol fatty acid ester series, or a mixture thereof is used. Hydrogen peroxide is used for the oxidizing agent.
본 실시예에 따른 프리에칭용액은 황산이 주성분이므로, 인바재의 금속박판을 에칭할 때 황산니켈이 생성된다. 그런데, 황산니켈은 물에 대한 용해도가 대단히 높은 입자이므로 물에 완전히 용해된다. 그러므로, 본 실시예에 따른 프리에칭용액으로 금속박판을 에칭하면, 본 실시예에 따른 프리에칭용액 및 금속박판에는 석출물이 전혀 생성되지 않는다.Since sulfuric acid is the main component of the preetch solution according to the present embodiment, nickel sulfate is generated when the metal plate of the Invar material is etched. However, since nickel sulfate is a particle having a very high solubility in water, it is completely dissolved in water. Therefore, when the metal thin plate is etched with the preetching solution according to the present embodiment, no precipitates are formed in the preetching solution and the metal foil according to the present embodiment.
본 실시예에 따른 프리에칭방법은 물 1ℓ에 대하여 황산 1∼150g, 무기산염 1∼150g, 유기산 0.1∼40g, 계면활성제 0.001∼0.1g 및 과산화수소 2∼20g을 용해한 프리에칭용액에 금속박판 및 백금망을 함침하고, 상기 금속박판과 상기 백금망을 전선으로 연결하여 자연전위로 상기 금속박판을 에칭한다. 이때, 프리에칭용액의 온도는 10∼35℃가 바람직하다.Pre-etching method according to this embodiment is a metal sheet and platinum in a pre-etching solution in which 1 to 150 g of sulfuric acid, 1 to 150 g of inorganic acid salt, 0.1 to 40 g of organic acid, 0.001 to 0.1 g of surfactant and 2 to 20 g of hydrogen peroxide are dissolved in 1 L of water. Impregnating a net, and connecting the metal thin plate and the platinum network by an electric wire to etch the metal thin plate with a natural potential. At this time, the temperature of the pre-etching solution is preferably 10 to 35 ° C.
이상에서 설명한 바와 같이, 본 발명에 따른 섀도우마스크용 금속박판의 프 리에칭용액은 황산이 주성분이다. 그러므로, 금속박판을 에칭하면 황산니켈이 생성되는데, 황산니켈은 물에 완전히 용해되므로, 석출물이 발생하지 않는다.As described above, sulfuric acid is a main component of the preetching solution of the metal thin plate for shadow mask according to the present invention. Therefore, when the metal sheet is etched, nickel sulfate is produced. Since nickel sulfate is completely dissolved in water, no precipitate is generated.
즉, 금속박판을 프리에칭한 후에도 석출물이 발생되지 않으므로 금속박판의 표면으로부터 감광막이 뜨는 현상이 해소된다. 그러므로, 프리에칭후 염화철로 금속박판을 에칭하여 통공을 형성할 때, 균일한 통공을 형성할 수 있다.That is, since the precipitate does not occur even after preetching the metal thin plate, the phenomenon that the photosensitive film floats from the surface of the metal thin plate is eliminated. Therefore, when the metal thin plate is etched with iron chloride after preetching to form a through hole, a uniform through hole can be formed.
그리고, 프리에칭용액에도 석출물이 발생하지 않으므로 석출물을 제거하기 위한 고가의 필터가 필요없다. 그러므로, 경제적이다.In addition, since no precipitates are generated in the pre-etching solution, an expensive filter for removing the precipitates is not necessary. Therefore, it is economical.
이상에서는, 본 발명의 일 실시예에 따라 본 발명을 설명하였지만, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 변경 및 변형한 것도 본 발명에 속함은 당연하다.In the above, the present invention has been described in accordance with one embodiment of the present invention, but those skilled in the art to which the present invention pertains have been changed and modified without departing from the spirit of the present invention. Of course.
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| KR1020030088855A KR100542369B1 (en) | 2003-12-09 | 2003-12-09 | Pre-etching solution of thin metal sheet for shadowmask and pre-etching method using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR102090198B1 (en) | 2013-03-29 | 2020-03-18 | 삼성디스플레이 주식회사 | Fine Metal Mask and method of manufacturing the same |
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| KR20050055828A (en) | 2005-06-14 |
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