KR100542318B1 - Field emission display device and method for manufacturing the same - Google Patents

Abstract

The present invention discloses a field emission display device and a method of manufacturing the same. The disclosed invention comprises the steps of: (a) forming a cathode electrode in the form of a stripe on the cathode substrate; (b) forming a gate insulating film on the cathode substrate on which the cathode electrode is formed; (c) forming a gate electrode on the gate insulating layer to intersect the cathode electrode; (d) forming a hole to expose the cathode electrode by partially patterning a gate electrode and a gate insulating film at an intersection of the gate electrode and the cathode electrode; (e) forming a tip in each of the holes; (f) forming an insulating paste line in a matrix form so as to surround an intersection of the cathode and gate electrode on which the tip is formed; And (g) forming a conductive paste line on the insulating paste.

Description

FIELD EMISSION DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

1 is a cross-sectional view of a conventional field emission display device.

2 is a cross-sectional view of a cathode substrate of a field emission display device according to another conventional technique.

3A and 3B are perspective views illustrating a cathode substrate of a field emission display device according to the present invention;

4 is a cross-sectional view of the cathode substrate taken along the line x-x 'of FIG. 3b.

(Explanation of symbols for the main parts of the drawing)

21-substrate 22-cathode electrode

23-gate insulating film 24-gate electrode

25-metal tip 27-insulating paste line

28-conductive paste line

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a field emission display device and a method of manufacturing the same, and more particularly, to a field emission display device capable of improving electron focusing characteristics and a method of manufacturing the same.

Field emission display devices are typically used as display panels in devices such as electron guns, microwave tubes, ion sources, scanning tunneling microscopes, and the like. Is used.

In the conventional field emission display device, as illustrated in FIG. 1, a cathode electrode 2 is formed on a first substrate 1 (hereinafter, a cathode substrate) in a striped state, and a cathode electrode is formed on the cathode electrode 2. The gate electrode 3 is disposed so as to expose a predetermined portion. A metal tip 4 for emitting electrons is disposed on the exposed cathode electrode 2.

The anode electrode 11 is formed of a transparent conductive layer on the inner surface of the second substrate 10 (hereinafter referred to as an anode substrate) facing the cathode substrate 1 so as to intersect with the cathode electrode 2 and the upper portion of the anode electrode 11. R, G, and B phosphors 12a, 12b, and 12c are disposed at portions that cross and correspond to the cathode electrode 2. In addition, the black matrix 13 is formed on both sides of the phosphors 12a, 12b, and 12c so as to border the phosphors. In addition, a spacer 14 is interposed between the upper and lower substrates 1 and 10 to maintain a gap between the substrates.

In the field emission device having such a configuration, electrons emitted and accelerated from the tip 4 of the cathode electrode 2 excite the phosphor 12 to generate light.

 However, the field emission display device has the following problems.

The electrons accelerated from the tip 4 of the cathode electrode 2 go straight toward the upper anode substrate to excite the corresponding phosphor 12b as well as to excite the adjacent phosphors 12a and 12b and cross them. Cause crosstalk. As a result, the R, G, and B phosphors 12a, 12b, and 12c emit light at the same time, color mixing of the field emission display element occurs, and not only the image quality characteristic is lowered, but also the electron focusing characteristic is also lowered.

In order to solve this problem, as illustrated in FIG. 2, a technique of forming a focusing electrode on the gate electrode has been proposed.

2 is an enlarged cross-sectional view of a cathode electrode portion of a cathode substrate, in which a metal film such as Cr, Mo, Al, ITO, MoW, etc. is deposited on a glass substrate 31, and then a predetermined shape is formed. Patterned to form the cathode electrode 32. Next, the gate insulating layer 33 and the gate electrode layer are sequentially stacked on the cathode electrode 32, and then the gate electrode material is patterned to form a gate electrode 34. Then, the interlayer insulating film 35 and the focusing electrode layer 36 are deposited on the gate electrode 32 and the gate insulating film 33. At this time, the interlayer insulating film 35 is preferably formed thick in order to improve charge focusing characteristics. Next, the focusing electrode layer is partially patterned to form the focusing electrode 36, and then the interlayer insulating film 35 is patterned using the focusing electrode as a mask. Thereafter, the gate insulating film 33 is patterned again using the gate electrode 34 as a mask to form a hole. Thereafter, a tip 37 is formed in the hole.

As described above, when the focusing electrode 36 is formed on the gate electrode 34, the focusing electrode 36 is focused toward the phosphor of the corresponding cell at the time of electron emission, thereby greatly improving the electron focusing characteristic. . However, forming the focusing electrode 36 as described above requires several etching processes, making it difficult to form holes of the correct size and difficult to adjust the etching uniformity. In addition, the contamination of the device is aggravated by several etching processes, and defects are likely to occur.

Accordingly, an object of the present invention is to solve the above-mentioned conventional problems and to provide a field emission display device capable of improving electron focusing characteristics.

Another object of the present invention is to provide a method of manufacturing a field emission display device capable of improving electron focusing characteristics without a plurality of etching processes.

In order to achieve the above object of the present invention, in accordance with one aspect of the present invention, a cathode substrate and an anode substrate disposed in parallel to each other at a predetermined interval; A plurality of cathode electrodes formed in a stripe form on opposite surfaces of the cathode substrate; A plurality of gate electrodes formed in a stripe shape on the opposite surface of the cathode substrate and on the cathode electrode to intersect the cathode electrode; A gate insulating layer disposed between the cathode electrode and the gate electrode to insulate the cathode electrode and the gate electrode; A plurality of electron emission tips formed on an upper portion of the cathode electrode at an intersection of the cathode electrode and the gate electrode; And a wall formed in a matrix so as to surround the intersections of the cathode electrodes and the gate electrodes, wherein the walls are formed by stacking insulating paste lines and conductive paste lines.

Here, the wall of the insulating paste line and the conductive paste line is disposed between the first portion respectively intersecting the cathode electrode and adjacent to the cathode electrode, and between the adjacent gate electrode intersecting the first portion and respectively. And a second part. In addition, the cathode electrode is preferably formed of an ITO material, and the wall may be repeatedly stacked with one or more insulating paste lines and conductive paste lines.

In addition, according to another aspect of the invention, (a) forming a plurality of cathode electrodes arranged in a stripe form on the cathode substrate; (b) forming a gate insulating film on the cathode substrate on which the cathode electrodes are formed; (c) forming a plurality of gate electrodes arranged in a stripe shape on the gate insulating layer to intersect the cathode electrode; (d) forming a hole to expose the cathode by partially patterning a gate electrode and a gate insulating film at an intersection of the gate electrodes and the cathode electrodes; (e) forming a tip in each of the holes; (f) forming an insulating paste line in a matrix form so as to surround an intersection of the cathode electrode and the gate electrode on which the tip is formed; And (g) forming a conductive paste line on the insulating paste.

Here, the insulating paste lines and the conductive paste lines in the steps (f) and (g) are formed in place by screen printing techniques. In addition, after forming the insulating paste line and the conductive paste line in the (f) and (g) step on the cathode substrate, it is preferable to proceed with the drying and firing step, respectively. At this time, the drying process is carried out at 50 to 150 ℃, the firing process is characterized in that proceeds at 300 to 600 ℃. In addition, in step (a), the cathode electrode is characterized in that formed as an ITO electrode. In addition, after step (g), step (f) and (g) is characterized in that it is carried out at least once or more.

According to the present invention, the insulating paste line and the conductive paste line are formed by screen printing in a matrix form so as to surround the intersection of the cathode electrode and the gate electrode. Accordingly, since the unit cell is surrounded by the insulating paste line and the conductive paste line, electrons emitted from the tip do not bend toward the adjacent phosphor, and only the phosphor is excited and emits light. Therefore, the focusing efficiency is greatly improved. Further, by forming the insulating paste line and the conductive paste line by a screen printing technique without a separate etching process, problems due to etching can be solved.

(Example)

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3A and 3B are perspective views illustrating a cathode substrate of the field emission display device according to the present invention, and FIG. 4 is a cross-sectional view of the cathode substrate cut along the line x-x 'of FIG. 3.

First, referring to FIG. 3A, an indium tin oxide (ITO) film is deposited on a glass substrate 21, and then patterned into a plurality of stripes to form a cathode electrode 22. The cathode electrodes 22 are spaced apart at equal intervals. Thereafter, a gate insulating film (not shown) is deposited on the substrate 21 on which the cathode electrode 22 is formed, and then a gate electrode layer is deposited. Subsequently, the gate electrode layer is partially patterned to form a plurality of stripe-shaped gate electrodes 24 orthogonal to the cathode electrode 22. Next, the gate electrode 24 and the gate insulating film (not shown) are etched in a portion where the gate electrode 24 and the cathode electrode 22 intersect so that the cathode electrode 22 is partially opened, and a plurality of holes are formed. To form. Subsequently, the tip 25 for electron emission is formed by a known method so as to contact the cathode electrode 22 exposed in each hole.

Next, as illustrated in FIG. 3B, an insulating paste line 27 is formed on the cathode substrate 21 formed with the cathode electrode 22 and the gate electrode 24. In this case, the insulating paste line 27 is perpendicular to the cathode electrode 22 and is disposed between the plurality of first portions 27a and the first portions 27a positioned between the pair of adjacent cathode electrodes 22, respectively. It includes a plurality of second portions 27b which are disposed in a pair of crossing and adjacent gate electrodes 24, respectively. Accordingly, the insulating paste line 27 is formed in a matrix so as to surround the intersection of the cathode electrode 22 and the gate electrode 24. The insulating paste line 27 is formed by a screen printing method formed only in a desired place, dried at a temperature of about 50 to 150 ° C, and then fired at a temperature of 300 to 600 ° C. Subsequently, a conductive paste line 28 is formed on the insulating paste line 27 to serve as a focusing electrode. Like the insulating paste line 27, the conductive paste line 28 also includes a plurality of first portions 28a perpendicular to the cathode electrode 22 and positioned between the adjacent pair of cathode electrodes 22. A plurality of second portions 28b intersecting the one portion 28a and disposed in the adjacent pair of gate electrodes 24, respectively. Like the insulating paste line 27, the conductive paste line 28 is also deposited by screen printing, followed by a drying process at a temperature of 50 to 150 캜, and then a firing process at a temperature of 300 to 600 캜. Proceed.

The insulating paste line 27 and the conductive paste line 28 formed as described above, as shown in FIGS. 3B and 4, each of the unit cells, that is, the intersection portions of the gate electrode 24 and the cathode electrode 22, respectively, are formed. Since it is formed in the form of a matrix wall to wrap, when electrons are emitted from the plurality of tips 25 at the intersections, the electrons are blocked from bending toward the adjacent phosphor. Accordingly, by exciting and emitting only the phosphor to which the electrons correspond, not only the crosstalk phenomenon is prevented, but also the electron focusing efficiency is greatly improved. Here, reference numeral 23 denotes a gate insulating film.

In addition, the insulating paste line 27 and the conductive paste line 28 are repeatedly formed at least once to increase the height of the wall, thereby further increasing the electron focusing efficiency.

As described in detail above, according to the present invention, the insulating paste line and the conductive paste line are formed by screen printing in a matrix form so as to surround the intersection of the cathode electrode and the gate electrode. Accordingly, since the unit cell is surrounded by the insulating paste line and the conductive paste line, electrons emitted from the tip do not bend toward the adjacent phosphor, and only the phosphor is excited and emits light. Therefore, not only the focusing efficiency is greatly improved, but also no crosstalk phenomenon occurs. Further, by forming the insulating paste line and the conductive paste line by a screen printing technique without a separate etching process, problems due to etching can be solved.

In addition, the present invention can be variously modified without departing from the scope thereof.

Claims (11)

A cathode substrate and an anode substrate disposed to be parallel to each other at regular intervals; A plurality of cathode electrodes formed in a stripe form on opposite surfaces of the cathode substrate; A plurality of gate electrodes formed in a stripe shape on the opposite surface of the cathode substrate and on the cathode electrode to intersect the cathode electrode; A gate insulating layer disposed between the cathode electrode and the gate electrode to insulate the cathode electrode and the gate electrode; A plurality of electron emission tips formed on an upper portion of the cathode electrode at an intersection of the cathode electrode and the gate electrode; And It includes a wall formed in a matrix form to surround the intersection of each of the cathode electrode and the gate electrode, And said wall is formed by stacking insulating paste lines and conductive paste lines. The cathode of claim 1, wherein the wall includes a first portion having a plurality of stripe shapes extending to intersect neighboring cathode electrodes without overlapping with the gate electrodes, and extending from the first portion, And a second portion intersecting the gate electrodes without overlapping the gate electrodes, wherein the field emission display device has a matrix shape. The field emission display device of claim 1 or 2, wherein the cathode is formed of an ITO material. 2. The field emission display device of claim 1, wherein the wall comprises a plurality of laminated structures including additional insulating paste lines and conductive paste lines. (a) forming a plurality of cathode electrodes arranged in a stripe form on the cathode substrate; (b) forming a gate insulating film on the cathode substrate on which the cathode electrodes are formed; (c) forming a plurality of gate electrodes arranged in a stripe shape on the gate insulating layer to intersect the cathode electrode; (d) forming a hole to expose the cathode by partially patterning a gate electrode and a gate insulating film at an intersection of the gate electrodes and the cathode electrodes; (e) forming a tip in each of the holes; (f) forming an insulating paste line in a matrix form so as to surround an intersection of the cathode electrode and the gate electrode on which the tip is formed; And (g) forming a conductive paste line on the insulating paste. delete The method of claim 5, wherein the forming of each of the paste lines of the steps (f) and (g) comprises: (a) laminating by screen printing technique in a matrix form so as to surround an intersection of the cathode electrode and the gate electrode; (b) drying the stacked paste lines; And and (c) firing the dried paste line. The method of claim 7, wherein the drying is performed at 50 ° C. to 150 ° C. 9. The method of claim 7, wherein the firing is performed at 300 ° C. to 600 ° C. 10. The method of claim 5, wherein each of the cathode electrodes is formed of an ITO electrode in the forming of the plurality of cathode electrodes. The method of manufacturing a field emission display device according to claim 5, wherein after step (g), step (f) and step (g) are additionally repeated at least once.

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