KR100526519B1 - Radio electronic unit - Google Patents

Abstract

TECHNICAL FIELD The present invention relates to the field of electronics, and can be used in the construction of electronic units for receiving and processing signals of a satellite radio navigational system (SRNS). The present invention relates to an electronic unit having a multi-layer printed circuit card, wherein the conductors for screening the connection signal conductors are disposed on the surface thereof and are formed at least at the beginning and the end of each screening wire. The technical feature is to form a closed electrical circuit connected to the ground plane by a metallization hole.

Description

Wireless electronic unit {RADIO ELECTRONIC UNIT}

The present invention relates to the construction of an electronic unit for receiving and processing signals of a satellite radio navigation system.

A unique feature in the design of electronic units used to receive and process SRNS signals is that analog electronics and high frequencies allow the electronic unit to implement the process of receiving and converting different functional devices, ie SRNS signals. Complete with a variety of analog-digital devices, such as devices and correlators, synthesizers, and processors that perform correlation search, tracing, and digital processing of the received signal {Onboard Devices of Satellite Radio Navigation, II Kudryavtsev, IN Mishchenko, AI Volynkin et al. Edited by VS Shebashevich, Moscow, Transport, 1988), page 112, Figures 47 and 126. }. Another unique feature lies in the different degrees of integration of electronic components that realize the different functions described above. For example, microcircuits with small, average and large densities can be used. In this regard, electromagnetic compatibility, spurious, when the different functional units and elements described above are combined into a single compact structure element having the different functional units and elements for processing signals having generally different frequencies, And mutual effects on each level of spurious and induced interference.

One method known as a technical solution to the above problem is an electronic device in which separate printed circuit cards are associated with similar (homogeneous) functional groups, for example, processing signals of similar shape and frequency as in conventional structures. To develop a multi-unit (multi-card) structure that includes: (Onboard Devices of Satellite Radio Navigation, II Kudryavtsev, IN Mishchenko, AI Volynkin et al. Edited by VS Shebashevich, Moscow, Transport, 1988), P. 112, FIG. 47}. In this case, the problem of reducing spurious and induced interference by, for example, simple means based on intercard screening can be solved. However, this method is associated with an increase in the size of the structure to be developed.

Where size consideration is an important factor, heterogeneous functional units and elements may be structured in common design units, eg {Onboard Devices of Satellite Radio Navigation, II Kudryavtsev, IN Mishchenko, AI Volynkin et al. Edited by VS Shebashevich, Moscow, Transport, 1988), p. 132, is used a single block structure included in the printed circuit card of the electronic unit of the receiver / processor of the SRNS signals. The problems caused by the spurious and induced interference can be solved by known methods when screening separate functional units with the aid of the corresponding metal screen.

Additional methods for reducing spurious and induced interference can be found in other useful designer's techniques, in particular {USSR inventor's Certificate No 1826853, H05 K 5/00, November 20, 1996] and the Russian Federation Patent. (Patent of Russian Federation) No 2047947, H05 K 1/02, November 10, 1995, {Patent of Russian Federation No 2013897, H05 K 7/00, May 30, 1994}, {printed Printed circuit components into the housing of the unit in a special configuration of signal conductors on a printed circuit card as in Lund P. Precision Printed-Circuit Cards.Design and Production. Moscow, Energoatomizdat, 1983, pp. 112-115. It may include a technique for installing an additional external matching element that connects them. For example, special layouts of grounding and power conductors may be used, such as (Lund P. Precision Printed-Circuit Cards. Design and Production. Moscow, Energoatomizdat, 1983), pages 113-114. In doing so, there is no common solution to solve a given problem in all cases, and in each specific case a set of designer tools are used to ensure that solution is solved under specific circumstances.

Selected prior art of the electronic unit of the present invention is described in Majorov S. A et al., Electronic Computers.Handbook on Design.Edited by SA Majorov, Moscow Sovetskoe Radio, 1975, which consists of a single card structure. 12.2, page 261]. The electronic unit, selected as a prior art, is characterized in that the inner layer connection of printed conductors is carried out by metallization holes in the inner layer connection and the outer conductive layers have conductors, junction contact areas and embedded electronic elements while the inner conductive layers have different conductors. And a window around the metallization hole of the inner layer connection having a metallized ground plane and a power supply plane and not electrically connected to the metallized ground plane and the power plane. Is a multilayer printed-circuit card. For example, in the case of a printed circuit card having ten conductive layers, the ground plane and the power plane are disposed in the fourth and fifth conductive layers, respectively.

By arranging the ground plane and the power plane on different conductive layers of the prior art printed circuit card, the problem of reducing the spurious and induced interference can be solved. Thus, if the electronic unit is equipped with the same kind of electronic elements, and the processed signals are signals in the vicinity of the frequency band as in the case of, for example, a digital computer, a successful solution to the above problem can be achieved. .

1 is a longitudinal cross-sectional view of a printed circuit card of an electronic unit with six conductive layers (the layout of the metallization holes in the conductors and inner surface connections is optional);

FIG. 2 is a plan view showing a state in which electronic elements mounted on a first conductive layer of a printed circuit card of the electronic device are classified into three consecutive arrangement places (a plan view of components of the first conductive layer as a plan view). Are omitted).

3 is a plan view showing a state in which the electronic elements mounted on the sixth conductive layer of the printed circuit card of the electronic device are classified into three consecutive arrangement zones (a plan view as viewed from the components of the first conductive layer). Are omitted).

4 is a plan view showing an example of a printing pattern of a first (outer) conductive layer of a printed circuit card of the electronic device.

FIG. 5 is a plan view showing an example of a printing pattern of a second conductive layer of a printed circuit card of the electronic device (viewing from the surface of the first conductive layer, wherein the conductive layers are selectively transparent). FIG.

Fig. 6 is a plan view showing an example of a printing pattern of a third conductive layer of a printed circuit card of the electronic device (viewing from the surface of the first conductive layer, wherein the conductive layers are selectively transparent).

FIG. 7 is a plan view showing an example of a printing pattern of a fourth conductive layer of a printed circuit card of the electronic device (viewing from the surface of the first conductive layer, wherein the conductive layers are selectively transparent). FIG.

FIG. 8 is a plan view showing an example of a printing pattern of a fifth conductive layer of a printed circuit card of the electronic device (viewing from the surface of the first conductive layer, the conductive layers being selectively transparent). FIG.

Fig. 9 is a plan view showing an example of a printing pattern of a sixth (outer) conductive layer of a printed circuit card of an SRNS electronic device (viewing from the surface of the first conductive layer, wherein the conductive layers are selectively transparent).

Summary of the Invention The object of the present invention is to solve the above problems of the prior art, to realize the function of the SRNS signal receiver / processor and to be implemented on one multi-layer printed circuit card and having different densities (analog, analog-digital, digital A method of designing spurious and inductive interference via a small electronic unit incorporating functional electronics, wherein the frequency band of the signals processed and transformed in the signal block is adjusted down from thousands of megahertz at the input to a few hertz at the output. To provide.

By addressing this problem, it is possible to use existing basic evidence for the design of small aviation receivers / processors intended for a large number of customers to handle SRNS "GLOSNASS" and "NAVSTAR" signals.

According to an embodiment of the present invention, an electronic unit including a multilayer printed circuit card, wherein an interface connection operation of printed conductors is performed by a metallization hole of an interface connection, and the outer conductive layers are formed of conductors, contact regions, and electronic elements. And inner conductive layers thereof having conductors, metallized ground and power supply planes, and a window in which the windows are not electrically connected to the metallized ground and power plane are metallized holes of the interface connection. Are provided around an electronic unit, the electronic unit being classified and arranged in a sequential contiguous area together with the printed conductor and the electronic elements of the multilayer printed circuit card, the first one being satellite radio navigation. In the area for batch assignment of electronic devices that perform analog conversion on signals received by the system. Wherein a second zone corresponds to a zone for batch assignment of electronic components that perform an analog-to-digital conversion process on the received signals, a third zone of which is digital conversion on the received signals. Corresponding to an area for batch allocation of electronic elements performing the process, wherein the electronic elements are mounted on a surface of a printed circuit card having six conductive layers, and an inner second conductive layer of the six conductive layers is Each zone has a ground plane, the third conductive layer has power conductors in the first and second zones and additional conductors in the third zone, and the fourth conductive layer is in the first and second zones. Having an additional conductor and a metalized power supply surface of the third zone, the fifth conductive layer having a ground plane of the first zone and additional conductors of the second and third zones. Wherein, the ground planes formed in the second conductive layer of the multilayer printed circuit card are electrically connected to each other to conduct electrical connection between the regions of the outer first conductive layer and the sixth conductive layer of the multilayer printed circuit card. Screening wires interconnected by direct ground connecting conductors disposed in accordance with the layout of the first zone, the first zone being disposed opposite to each other in the first and sixth conductive layers of the multilayer printed circuit card along its periphery; And the screening wires are interconnected to the ground plane of a given region of the second conductive layer and the fifth conductive layer of the multilayer printed circuit card by the metallization holes formed inside the multilayer printed circuit card. Connected and connected to form a closed electrical circuit and having a break through the respective connecting signal conductors; In this case, the disconnection of the screening wire of the first conductive layer and the sixth conductive layer corresponds to a continuous metallized portion of the ground planes of the second conductive layer and the fifth conductive layer of the multilayer printed circuit card. Characterized in that.

According to another embodiment of the invention, the width of the ground connection conductor interconnected with the ground plane of the second conductive layer of the multilayer printed circuit card is selected to be at least 1 mm.

According to another embodiment of the present invention, the conductors for screening the corresponding connection signal conductors are disposed on the surface thereof and the metallization of the interfacial connection portion formed on at least a beginning and an end of each screening wire. A hole is connected to the ground plane to form a closed electrical circuit, and the spacing between the metallization holes does not exceed 5 mm.

According to another embodiment of the present invention, the width of the screening wire formed along the periphery of the first zone of the first conductive layer and the sixth conductive layer of the multilayer printed circuit card is selected to be at least 2 mm.

According to another embodiment of the present invention, interconnecting the screening conductors formed along the periphery of the first conductive layer and the sixth conductive layer of the multilayer printed circuit card and connecting the screening conductors of the multilayer printed circuit card The spacing between the metallization holes of the interface connecting portion connecting to the ground plane of the second conductive layer and the fifth conductive layer does not exceed 5 mm.

The features of the present invention, the feasibility according to industrial use, are described by way of example of an electronic unit of a navigation receiver / processor for determining navigation parameters by SRNS signals of the "GLOSNASS" and "NAVSTAR" systems. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail with reference to the drawings, and like reference numerals designate like parts throughout the drawings.

The electronic unit of the present invention shown in FIGS. 1 to 9 includes a multilayer printed circuit card 1 having six conductive layers, of which the first outer conductive layer 2 is the multilayer printed circuit card 1. The sixth outer conductive layer 3 forms the back side of the multilayer printed circuit card 1, while forming the surface of the < RTI ID = 0.0 > The inner conductive layer of the multilayer printed circuit card 1, that is, the second conductive layer 4, the third conductive layer 5, the fourth conductive layer 6, and the fifth conductive layer 7 may be an insulating layer 8. ), As well as the external conductive layers (2, 3) (see Fig. 1).

In the outer conductive layers 2 and 3 of the multilayer printed circuit card 1, a printed junction contact region 9, a printed conductor 10 and an electronic element 11 are formed (see FIGS. 1 to 3). Only printed conductors are formed in the inner conductive layers 4, 5, 6, and 7 of the multilayer printed circuit card 1 (see FIGS. 5 to 8). The interface connection between the printed conductors of the multilayer printed circuit card 1 is carried out by the metallization holes 12 of the interface connection.

In FIG. 1, as an example of forming the metallization hole 12 of the interface connecting portion, the first, sixth, and fourth conductive layers 2, 3, and 6, as well as the first, sixth, and second And holes connecting the conductors of the fifth conductive layers 2, 3, 4 and 7.

The electronic elements of the multilayer printed circuit card 1 are mounted using a surface mounting technique that solves the problem of installing a large number of components on a small area.

In an embodiment of the electronic unit, ie SRNS receiver / processor module, the electronic elements and printed conductors of the multilayer printed circuit card 1 are grouped together in three consecutively arranged zones 13, 14 and 15 (Figs. 9).

The first zone 13 of the multilayer printed circuit card 1 is an electronic device for performing analog conversion of SRNS signals, for example, an electronic device having a low integration similar to that of a chip of the MGA-87563 HEWLETT-RACKARD type and the MC13142D MOTOROLA. And a batch allocation area of an electronic device having an average degree of integration similar to that of a chip of UPC2753GR NEC type.

The second zone 14 of the multilayer printed circuit card 1 corresponds to a batch allocation zone of an electronic device which performs analog-to-digital conversion of a signal, for example an electronic device having an average density similar to that of a chip of the MAX962ECA MAXIM type. do.

The third zone 15 of the multilayer printed circuit card 1 is similar to an electronic device that performs digital conversion of signals, for example TMS320 LC203-40 TEXAC INSTRUMENTS (processor) and ASIC SAMSUNG (digital correlator) type chips. Electronic device with superhigh degree of integration, electronic device with high integration similar to KM616V100AT-15 SAMSUNG (ROM) type chip, electronic device with average density similar to DS1302S DALLAS (timer) type chip, And the MAX604CSA MAXIM (stabilizer) type chip, a placement allocation area for electronic devices with low integration.

The printed conductors of the inner conductive layer of the multilayer printed circuit card 1 are distributed as follows.

In the case of the second conductive layer 4 of the multilayer printed circuit card 1, ground planes 16, 17 and 18 are formed in all three zones 13, 14 and 15 (see FIG. 5).

In the case of the third conductive layer 5 of the multilayer printed circuit card 1, power supply conductors 19, 20 are formed in the power zones of the first and second zones 13, 14. In the third zone, additional conductors 21 are formed (see FIG. 6).

In the case of the fourth conductive layer 6 of the multilayer printed circuit card 1, additional conductors 22, 23 are formed in the first and second zones 13, 14, and the third zone ( 15, a power metal screen 24 is formed (see FIG. 7).

In the case of the fifth conductive layer 7 of the multilayer printed circuit card 1, a ground plane 25 is formed in the first zone 13 and added to the second and third zones 14, 15. Typical conductors 26 and 27 are formed (see FIG. 8).

The ground planes 16, 17, 18 formed in the second conductive layer 4 of the multilayer printed circuit card 1 are interconnected by direct ground linking conductors 28 (FIG. 5). Reference). The width of the ground connection conductor 28 is at least 1 mm.

The ground connection conductor 28 (see FIG. 5) is a connection signal conductor electrically connected to the zones of the first outer conductive layer 2 and the sixth outer conductive layer 3 of the multilayer printed circuit card 1. It arrange | positions according to the layout of 29 (refer FIG. 4 and FIG. 9).

Each connecting signal conductor 29 may be screened with the aid of an additional conductor 30 connected to the corresponding ground plane. For example, the screening process may be performed on the connection signal conductor having signals having a sharp interval or having a signal level significantly different from that of adjacent conductors. FIG. 4 is a diagram illustrating an example of a screening process of the connection signal conductor 29 disposed on the first conductive layer 2.

The conductor 30 intended to screen each of the signal connection conductors 29 is connected to a ground plane to form a closed electrical circuit disposed on its surface. The connection process to the ground plane is with the aid of the corresponding metallization holes of the interfacial joints formed at least at the beginning and the end of the conductor 30, in which each metallization hole maintains a spacing of 5 mm or less with respect to each other. Is performed.

The first zone 13 is surrounded by screening wires 31 along its periphery and each other in the second and sixth conductive layers 2, 3 of the multilayer printed circuit card 1, respectively. Are opposed to (see FIGS. 4 and 9). The width of the screening wire 31 is at least 2 mm. The screening wire 31 is connected to the ground planes of the second and fifth conductive layers 4 and 5 of the multilayer printed circuit card 1 by metallization holes formed in the multilayer printed circuit card 1. And interconnected to form a closed electrical circuit. The spacing between these metallization holes does not exceed 5 mm.

The screening wire 31 has a break 32 for passing the corresponding connection signal conductor 29. The break point 32 of the screening wire 31 of the first and sixth conductive layers 2, 3 of the multilayer printed circuit card 1 is formed of the second and seventh conductive layers 2, 7. Corresponds to the continuous metallized portions 33 of the ground planes 16, 25 (see FIGS. 5 and 8).

The design method described above ensures the necessary protection against spurious and induced interference of the electronic elements of the first zone 13 which are very sensitive to induced noise and interference, in which case the break of the screening wire 31 The presence of the metallization 33 of the ground planes 16, 25 corresponding to (32) ensures an optimization of the return circuit for the signal circuit which makes electrical connections between the zones. The necessary protection against spurious and induced interference is very effective in combination with the ground planes and the layout of the power conductors of the different conductive layers of the multilayer printed circuit card 1 according to the invention, thus providing the necessary screening process. have.

Metal at the interface connecting portion by the metallized ground planes 16-18, 25 and the power plane 24 at respective positions of the metallized ground planes 16-18, 25 and the power plane 24 In order to prevent unnecessary short-circuits between the metallization holes 12, a window 34 without metal film for the allocation assignment of the metallization holes 12 is formed (see Fig. 1).

In order to connect the electronic unit of the present invention to an external output device and a power source, a low frequency connector 35 mounted on the surface of the multilayer printed circuit card 1 is used (see Fig. 2).

In order to connect the electronic unit of the invention to the source of the input signal, a high frequency connector 36 mounted on the surface of the multilayer printed circuit card 1 is used (see Fig. 2).

 For operation of the electronic unit of the present invention, the connector 35 is connected to a power source and other peripheral devices such as control panels, indicators of aviation parameters, etc., while the connector 36 is a receiving antenna cable (not shown). Is connected to an input signal source.

Input signals of the electronic unit of the present invention representing analog pseudonoise (broadband) SRNS signals having a frequency band of 1200 MHz-1700 MHz are connected to the first zone 13 of the multilayer printed circuit card 1 through the connector 36. Connected to electronic devices, these signals are amplified, filtered from interference, and frequency downconverted to tens of megahertz. Thus, the signals converted in the first zone 13 of the multilayer printed circuit card 1 undergo a multichannel analog-digital processing in the second zone 14 and then the Correlation processing is performed in the digital processor formed by the electronic elements of the third zone 15.

Thus, in the electronic unit of the present invention, the signals in the process are transmitted at thousands of megahertz at the input of the first zone 13 (arrangement allocation zone of electronic elements for performing analog conversion of the signal). A zone to another zone of the multilayer printed circuit card 1 undergoing a frequency conversion from the output of zone 15 (a batch allocation zone of electronic elements that perform digital conversion of the signal) to several hertz. Sequential pass through

In this case, the classification arrangement of the electronic elements and the printed conductors in the zone according to the invention, the screening process in the first zone according to the invention, as well as the connection signal conductor 29 and the ground connection conductor 28 Due to the combination of the provided design methods comprising the connection between the zones by means of the above, the electronic unit according to the present invention is basically a predetermined condition in which a difference occurs in the characteristic and frequency of the signal and the degree of integration of the electronic elements. It provides a suppression effect of the spurious and induced interference under.

Therefore, in the case of the electronic unit according to the present invention using the provided design method, an optimized return circuit for passing signals interconnecting various zones is provided, thereby minimizing spurious and induced interference in the electronic unit. In particular, the width (at least 1 mm) of the ground connection conductor 28 is an additional condition and minimizes the loss of signal in the loop return circuit for passing signals and reducing the susceptibility to the radiation effect of the passed signals. It is chosen from cross interference conditions through the exclusion of non-optimal current paths with inductance. Further, minimization of signal loss in the loop return circuit for passing the signals is due to the performance of the provided method and the layout of the metallized ground planes 16, 17, 18, 25 and the metallized power plane 24. Is achieved, the metallized ground planes 16, 17, 18, 25 and metallized power supply surface 24 are optimal return circuits corresponding to circuitry for passing signals of the electronic unit in the electronic unit of the invention. Provide a minimum resistance to the direct current so as to avoid the occurrence of parasitic current loops characterized by parasitic inductances and to actually prevent voltage drops in the circuit of the multilayer printed circuit card 1. To ensure.

The parameters of the design described above are as follows: characterized by a pitch of at least 2 mm of the screening wire and a pitch of up to 5 mm between the metallization holes of the interface connections formed in the screening wires 30, 31. In an embodiment the electronic unit according to the invention is implemented.

Thus, due to the combination of design methods considered as described above, the electronic unit according to the present invention is characterized in that the frequency of the signals being processed by the multilayer printed circuit card varies from several thousand megahertz at the input to several hertz at the output. In the case of having different electronic elements having various densities constituting the downlink, aviation SRNS receiver / processor, the problem of elimination of spurious and induced interference under certain conditions can be solved.

Experimental results of a prototype model of an electronic unit structured according to the invention show that under various operating conditions of the electronic unit processing SRNS "GLOSNASS" and "NAVSTAR" signals in various combinations and all frequency ranges. It has been found that the elimination of spurious and induced interference is guaranteed.

Therefore, from the foregoing, the electronic unit according to the present invention is provided with heterogeneous (analog, analog-digital, digital) functional electronic elements which are technically feasible and manufactureable in the industrial field, and which have different integration degrees. It solves the technical problem of eliminating spurious and induced interference under certain conditions for realizing small electronic units that perform the functions of an aviation SRNS receiver / processor realized on a single multilayer printed circuit card. The frequency band of the signals to be processed and converted in the electronic unit is in the range of several thousand megahertz at its input to several hertz at its output.

While the present invention has been illustrated and described with reference to specific embodiments, the foregoing disclosure is merely an application of the present invention, and specific embodiments disclosed herein as best mode for carrying out the present invention. It is not limited to.

In addition, those skilled in the art can readily understand that the present invention may be variously modified and changed without departing from the spirit or scope of the present invention provided by the following claims. Could be.

Therefore, the electronic unit according to the present invention has a frequency of signals being processed by the multilayer printed circuit card from several thousand megahertz at the input to several hertz at the output due to the combination of design methods considered as described above. In the case of having different electronic elements having various densities constituting the downlink, aviation SRNS receiver / processor, the problem of elimination of spurious and induced interference under certain conditions can be solved.

Claims (5)

An electronic unit comprising a multilayer printed circuit card, wherein an interfacial connection operation of printed conductors is performed by means of metallization holes in an interfacial connection, the outer conductive layers having conductors, contact regions and electronic elements, the inner conductive layers being conductors, An electronic unit having a metalized ground and power plane and at the same time a window which is not electrically connected to the metallized ground and power plane is disposed around the metallization holes of the interface connection. The printed conductors and the electronic elements of the multilayer printed circuit card are arranged and sorted sequentially in successive regions, the first of which is an electronic element which performs an analog conversion process on signals received by the satellite radio navigation system. , A second zone corresponds to a zone for batch assignment of electronic components that perform an analog-to-digital conversion process on the received signals, and a third zone corresponds to the third zone. Corresponds to the area for batch assignment of electronic elements for performing digital conversion on the received signals, the electronic elements mounted on a surface of a printed circuit card having six conductive layers, and the six conductive layers The inner second conductive layer has a ground plane in each of the zones, and the third conductive layer has power conductors and phases in the first zone and the second zone. Having additional conductors of an existing third zone, a fourth conductive layer having additional conductors of the first and second zones, and a metalized power plane of the third zone, and a fifth conductive layer having the first conductive zone; Having a ground plane of the zone and additional conductors of the second and third zones, in which case the ground planes formed in the second conductive layer of the multilayer printed circuit card are the outer surface of the multilayer printed circuit card. Interconnected by direct ground connection conductors arranged in accordance with the layout of a connection signal conductor for performing electrical connection between the zones of the first and sixth conductive layers, the first zone being connected along the periphery thereof; The screening wires are surrounded by screening wires disposed opposite to each other in the first conductive layer and the sixth conductive layer of the multilayer printed circuit card, the screening wires being the multilayer printed circuit. The metallization holes formed inside the card interconnect and connect to the ground plane of a given region of the second conductive layer and the fifth conductive layer of the multilayer printed circuit card to form a closed electrical circuit, the respective connections A break for passing through signal conductors, in which case the break of the screening wire of the first conductive layer and the sixth conductive layer is the ground of the second conductive layer and the fifth conductive layer of the multilayer printed circuit card. An electronic unit characterized by a continuous metallized part of the faces. The electronic unit of claim 1, wherein the width of the ground connection conductor interconnected with the ground plane of the second conductive layer of the multilayer printed circuit card is selected to be at least 1 mm. The method of claim 1, wherein the conductors for screening the corresponding connection signal conductors are disposed on the surface thereof and are formed by the metallization holes of the interface connection portions formed at least at the beginning and the end of each screening wire. An electrical unit connected to a ground plane to form a closed electrical circuit, the spacing between the metallization holes being at most 5 mm. The electron of claim 1, wherein the width of the screening wire formed along the periphery of the first zone of the first conductive layer and the sixth conductive layer of the multilayer printed circuit card is at least 2 mm. unit. The method of claim 1, wherein the screening conductors formed along the periphery of the first conductive layer and the sixth conductive layer of the multilayer printed circuit card are interconnected and the screening conductors are connected to the second conductive layer of the multilayer printed circuit card. And an interval between the metallization holes of the interface connecting portion connecting to the ground plane of the fifth conductive layer does not exceed 5 mm.