KR100455425B1 - Surface treatment device of heat exchanger - Google Patents
Surface treatment device of heat exchanger Download PDFInfo
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- KR100455425B1 KR100455425B1 KR10-2002-0017511A KR20020017511A KR100455425B1 KR 100455425 B1 KR100455425 B1 KR 100455425B1 KR 20020017511 A KR20020017511 A KR 20020017511A KR 100455425 B1 KR100455425 B1 KR 100455425B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/62—Plasma-deposition of organic layers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/182—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing especially adapted for evaporator or condenser surfaces
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/02—Coatings; Surface treatments hydrophilic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3322—Problems associated with coating
- H01J2237/3323—Problems associated with coating uniformity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/338—Changing chemical properties of treated surfaces
- H01J2237/3382—Polymerising
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physical Vapour Deposition (AREA)
Abstract
본 발명 전원공급이 조절되는 열교환기 표면처리장치는 챔버의 내부 양측에 상,하부 전극(131)(131')을 배치하고, 챔버의 외부에는 상기 상,하부 전극(131)(131')에 각각 별도로 전원을 인가할 수 있도록 상,하부 전원공급기(132)(132')를 설치하여, 크기가 서로 다른 2종의 열교환기(200)를 표면처리 할때에 캐리어(101)의 상측 1열에는 크기가 큰 열교환기(200')를 장착하고, 하측 2열에는 크기가 작은 열교환기(200")를 장착한 다음, 캐리어(101)가 챔버의 내부에 위치하면 상부 전극(131)에는 전원공급을 세게 인가하고, 하부 전극(131')에는 전원공급을 상대적으로 약하게 인가하며 표면처리를 함으로써, 크기가 다른 열교환기의 표면처리가 연속적으로 균일하게 이루어지는 효과가 있다.In the heat exchanger surface treatment apparatus of which the power supply is controlled, the upper and lower electrodes 131 and 131 'are disposed on both sides of the chamber, and the upper and lower electrodes 131 and 131' are disposed on the outside of the chamber. The upper and lower power supplies 132 and 132 ′ are installed to apply power separately to each other, so that the surface of two heat exchangers 200 having different sizes may be treated in the upper one row of the carrier 101. Is equipped with a large heat exchanger 200 ′, a small heat exchanger 200 ″ is mounted in the lower two rows, and the upper electrode 131 is supplied with power when the carrier 101 is located inside the chamber. By strongly applying the supply and applying the power supply relatively weakly to the lower electrode 131 ′ and surface treatment, the surface treatment of heat exchangers having different sizes is continuously and uniformly performed.
Description
본 발명은 열교환기 표면처리장치에 관한 것으로, 특히 캐리어에 장착되는 열교환기의 크기에 따라 해당되는 전극에 전원공급을 적절하게 조절하여 균일한 표면처리가 이루어질 수 있도록 한 전원공급이 조절되는 열교환기 표면처리장치에 관한 것이다.The present invention relates to a heat exchanger surface treatment apparatus, and in particular, a heat exchanger in which a power supply is controlled so that a uniform surface treatment is performed by appropriately adjusting power supply to a corresponding electrode according to the size of a heat exchanger mounted on a carrier. It relates to a surface treatment apparatus.
열교환기는 냉장고와 같은 냉동기기나 에어콘과 같은 공조기기에 설치되어, 주변의 더운 공기를 차가운 공기로 열교환하는 기기로서, 기액분리를 위한 어큐믈레이터, 냉매를 통과시키는 냉매 파이프, 방열을 위한 방열핀, 냉매 파이프의 양단부를 고정하기 위한 앤드 플레이트 등으로 구성되어 진다.The heat exchanger is installed in refrigeration equipment such as refrigerators or air conditioning equipment such as air conditioners, and heat exchanges the surrounding hot air with cold air. And end plates for fixing both ends of the pipe.
도 1은 종래 냉장고에 장착되는 열교환기의 일예를 보인 정면도로서, 도시된 바와 같이, 냉매가 통과됨과 아울러 긴시간동안 냉매가 통과될 수 있도록 지그재그형상으로 절곡되어 있는 알루미늄 재질의 관체로된 냉매 파이프(1)의 양단부가 철판재질의 앤드 플레이트(END PLATE)(2)(2')로 고정되어 있고, 그 앤드 플레이트(2)(2')의 사이에는 열교환면적일 넓게 형성되도록 상기 냉매 파이프(1)에 삽입됨과 아울러 일정간격이 유지되도록 알루미늄 재질의 판체로된 방열핀(3)들이 결합되어 있으며, 이 도면에서는 생략되어 있으나 통상적으로 냉매 파이프(1)의 단부에 기액분리를 위한 어큐믈레이터(ACCUMULATOR)(미도시)가 연결되어 있다.1 is a front view showing an example of a heat exchanger installed in a conventional refrigerator, as shown in the figure, a refrigerant pipe made of a tubular aluminum material that is bent in a zigzag shape to allow the refrigerant to pass through and a refrigerant to pass for a long time. Both ends of (1) are fixed by an end plate (2) (2 ') made of a steel plate, and the refrigerant pipe (2) is formed so as to have a wide heat exchange area between the end plates (2) and (2'). 1) and the heat dissipation fins 3 made of an aluminum plate body are combined to be inserted into 1) and are maintained at a predetermined interval. Although not shown in this drawing, the accumulator for gas-liquid separation at the end of the refrigerant pipe 1 is typically omitted. ACCUMULATOR (not shown) is connected.
상기와 같이 구성되어 있는 종래의 열교환기는 소정크기로 가공된 방열핀(3)들을 냉매 파이프(1)에 삽입하여 조립하고, 그와 같이 방열핀(3)들이 조립된 냉매 파이프(1)의 양단부에 앤드 플레이트(2)(2')를 결합하여 고정되도록 한다.The conventional heat exchanger configured as described above inserts and assembles the heat dissipation fins 3 processed to a predetermined size into the refrigerant pipe 1, and ends at both ends of the refrigerant pipe 1 to which the heat dissipation fins 3 are assembled. The plates 2 and 2 'are combined to be fixed.
그리고, 상기와 같은 방열핀(3)에는 경우에 따라 열교환기의 효율을 향상시키기 위하여 표면에 표면처리를 함으로써 친수성 또는 소수성 및 내부식성의 향상을 위한 처리를 하게 되는데, 이와 같은 표면처리의 대표적인 방법으로 플라즈마를 이용한 친수성막을 부품의 표면에 증착시키는 방법이 소개되고 있다.In addition, the heat dissipation fins 3 may be treated to improve hydrophilicity or hydrophobicity and corrosion resistance by surface treatment in order to improve the efficiency of the heat exchanger in some cases. A method of depositing a hydrophilic film using plasma on the surface of a component has been introduced.
또한, 최근에는 플라즈마 증착장치에서 시트상태의 소재 표면에 연속적으로 친수성 막을 증착하여 대량으로 소재를 제작한 다음, 그 소재를 가공하여 방열핀(3)으로 이용함으로써 열교환기를 대량생산할 수 있도록 하는 기술에 대한 연구도 함께 진행되고 있다.Also, in recent years, a plasma vapor deposition apparatus continuously deposits a hydrophilic film on a sheet material surface to fabricate a large amount of material, and then processes the material and uses it as a heat radiation fin (3) to mass-produce a heat exchanger. Research is also ongoing.
한편, 여러 연구자들에 의하여 친수성을 극대화시키려는 연구도 활발하게 이루어지고 있는데, 그 대표적인 예가 조립되어진 열교환기를 표면처리장치에 연속적으로 통과시키며 대량으로 표면처리를 하는 방법이며, 그러나, 이와 같은 방법은 증착면적이 다른 열교환기를 동시에 작업하는 경우에 표면처리 두께차이가 발생되어 균일하고 안정적인 품질유지가 되지 못하는 문제점이 있었다.On the other hand, various researchers have been actively researching to maximize hydrophilicity, a representative example of which is a method of mass-treatment by continuously passing an assembled heat exchanger through a surface treatment apparatus, but such a method is a deposition method. When different heat exchangers are used at different areas at the same time, there is a problem that the surface treatment thickness difference does not occur to maintain a uniform and stable quality.
상기와 같은 문제점을 감안하여 안출한 본 발명의 목적은 크기가 다른 열교환기의 표면처리가 동시에 안정적으로 이루어질 수 있도록 하는데 적합한 전원공급이 조절되는 열교환기 표면처리장치를 제공함에 있다.The object of the present invention devised in view of the above problems is to provide a heat exchanger surface treatment apparatus whose power supply is adjusted to ensure that the surface treatment of heat exchangers of different sizes can be made at the same time stable.
도 1은 종래 열교환기의 구조를 보인 정면도.1 is a front view showing the structure of a conventional heat exchanger.
도 2는 본 발명에 따른 연속처리가 가능한 열교환기 표면처리장치를 개략적으로 보인 구성도.Figure 2 is a schematic view showing a heat treatment apparatus surface treatment apparatus capable of continuous processing according to the present invention.
도 3은 본 발명에 따른 전극배치구조를 보인 종단면도.Figure 3 is a longitudinal sectional view showing an electrode arrangement structure according to the present invention.
* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
101 : 캐리어 102 : 표면처리부101: carrier 102: surface treatment unit
103 : 이송부 104 : 트랜스퍼103: transfer unit 104: transfer
105 : 전원인가부 200 : 열교환기105: power supply unit 200: heat exchanger
131,131' : 상,하부 전극 132,132' : 상,하부 전원공급기131,131 ': upper and lower electrode 132,132': upper and lower power supply
상기와 같은 본 발명의 목적을 달성하기 위하여조립되어진 열교환기가 장착되는 다수개의 캐리어와, 그 다수개의 캐리어를 순차적으로 이송시키기 위한 이송부와, 그 캐리어에 의하여 이송되는 열교환기들의 전체 표면에 표면처리막을 연속적으로 형성시키기 위한 표면처리부와, 그 표면처리부의 양측에 배치되어 열교환기들이 장착된 캐리어를 표면처리부에 로딩/언로딩하기 위한 트랜스퍼와, 상기 캐리어가 표면처리부를 통과할때에 캐리어에 장착된 열교환기에 전원을 인가하기 위한 전원인가부로 구성되어 있는 열교환기 표면처리장치에 있어서,상기 전원인가부는 챔버 내부의 양측 상부와 하부에 2열로 상부 전극과 하부 전극을 배치하고,상기 열교환기를 캐리어의 중심부 상측과 하측에 2열로 장착하며,In order to achieve the object of the present invention as described above, a plurality of carriers on which a heat exchanger is assembled, a transfer unit for sequentially transferring the plurality of carriers, and a surface treatment film on the entire surface of the heat exchangers transferred by the carriers A surface treatment portion for continuously forming, transfers for loading / unloading a carrier having heat exchangers disposed on both sides of the surface treatment portion, and mounted on the carrier when the carrier passes through the surface treatment portion. In the heat exchanger surface treatment apparatus consisting of a power supply unit for applying power to the heat exchanger, the power supply unit arranges the upper electrode and the lower electrode in two rows at both upper and lower sides of the chamber, and the heat exchanger in the center of the carrier It is installed in two rows on the upper side and the lower side,
상기 상부 전극과 하부 전극이 -에 연결되고 2열로 장착된 열교환기가 +에 연결되어 각기 다르게 전원을 공급할 수 있도록 챔버의 외부에 상,하부 전원공급기를 각각 설치하여 구성되는 것을 특징으로 하는 전원공급이 조절되는 열교환기 표면처리장치가 제공된다.The upper electrode and the lower electrode are connected to-and the heat exchanger mounted in two rows is connected to + so that the power supply, characterized in that the upper and lower power supply is installed to the outside of the chamber so as to supply power differently, respectively A controlled heat exchanger surface treatment apparatus is provided.
이하, 상기와 같이 구성되는 본 발명에 따른 전원공급이 조절되는 열교환기 표면처리장치를 첨부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, with reference to the embodiment of the accompanying drawings, the heat exchanger surface treatment apparatus is controlled power supply according to the present invention configured as described above in detail as follows.
도 2는 본 발명에 따른 연속처리가 가능한 열교환기 표면처리장치의 개략적으로 보인 구성도이고, 도 3은 본 발명에 따른 전극배치상태를 보인 종단면도이다.Figure 2 is a schematic configuration diagram of a heat exchanger surface treatment apparatus capable of continuous processing according to the present invention, Figure 3 is a longitudinal sectional view showing an electrode arrangement state according to the present invention.
도시된 바와 같이, 완성품으로 조립되어진 다수개의 열교환기(200)를 장착할 수 있도록 다수개의 캐리어(CARRIER)(101)가 일정간격을 두고 일측에 배열되어 있고, 타측에는 캐리어(101)에 장착되어 있는 열교환기(200)들의 표면에 표면처리를 실시하기 위한 표면처리부(102)가 마련되어 있으며, 상기 캐리어(101)들은 이송부(103)에 의하여 연속적으로 표면처리부(102)의 전방으로 이송될 수 있도록 되어 있고, 그와 같이 이동된 캐리어(101)들은 표면처리부(102)의 양측에 설치된 트랜스퍼(TRANSFER)(104)에 의하여 표면처리부(102)에 로딩 또는 언로딩할 수 있도록 되어 있으며, 상기 표면처리부(102)에는 전원인가부(105)에 의하여 캐리어(101)에 장착된 상태로 이송되는 열교환기(200)에 전원이 인가될 수 있도록 되어 있다.As shown, a plurality of carriers 101 are arranged at one side with a predetermined interval so as to mount the plurality of heat exchangers 200 assembled as a finished product, and the other side is mounted to the carrier 101. The surface treatment unit 102 is provided on the surface of the heat exchangers 200, and the carriers 101 are continuously transferred to the front of the surface treatment unit 102 by the transfer unit 103. The carriers 101 moved as described above may be loaded or unloaded to the surface treatment unit 102 by transfers 104 provided on both sides of the surface treatment unit 102. The power source 102 is configured to apply power to the heat exchanger 200 which is transported while being mounted on the carrier 101 by the power supply unit 105.
그리고, 상기 표면처리부(102)는 전방에서 외부공기가 기기 내부로 유입되는 것을 차단하기 위한 로딩챔버(LOADING CHAMBER)(111), 열교환기에 부착된 이물질을 제거하기 위한 클리닝챔버(CLEANING CHAMBER)(112), 표면처리가 이루어지는 중합챔버(113), 후처리를 위한 포스트챔버(POST CHAMBER)(114), 후방에서 기기내부로 외부공기가 유입되는 것을 차단하기 위한 언로딩챔버(UNLOADING CHAMBER)(115)가 터널형상으로 배치되어 있고, 그 각각의 챔버들의 사이에는 밀폐를 위한 게이트 밸브(GATE VALVE)(116)들이 장착되어 있다.In addition, the surface treatment unit 102 has a loading chamber 111 for blocking external air from flowing into the device from the front, and a cleaning chamber 112 for removing foreign substances attached to the heat exchanger. ), The polymerization chamber 113 is subjected to the surface treatment, the post chamber (Post POST) 114 for the post-treatment, the unloading chamber (UNLOADING CHAMBER) 115 to block the inflow of external air into the equipment from the rear Are arranged in a tunnel shape, and gate valves 116 for sealing are mounted between the respective chambers.
또한, 상기 각 챔버들의 후위에는 챔버들의 내부공기를 외부로 펌핑하기 위한 펌프(121)가 각각 설치되어 있고, 상기 클리닝챔버(112), 중합챔버(113), 포스트챔버(114)에는 가스공급기구(122)가 설치되어 있다.In addition, a pump 121 for pumping internal air of the chambers is provided at the rear of each of the chambers, and a gas supply mechanism is provided in the cleaning chamber 112, the polymerization chamber 113, and the post chamber 114. 122 is provided.
그리고, 상기 전원인가부(105)는 챔버 내부의 양측 상,하부에 2열로 상,하부 전극(131)(131')을 배치하고, 상기 열교환기(200)를 캐리어(101)의 상,하부에 2열로 장착하며, 상기 상,하부 전극(131)(131')과 2열로 장착된 열교환기(200)의 크기에 따라 각기 다르게 전원을 공급할 수 있도록 챔버의 외부에 상,하부 전원공급기(132)(132')를 설치하여서 구성된다.In addition, the power applying unit 105 arranges the upper and lower electrodes 131 and 131 'in two rows on both sides of the chamber and the upper and lower parts of the carrier 101. And the upper and lower power supplies 132 to the outside of the chamber to supply power differently according to the size of the upper and lower electrodes 131 and 131 ′ and the heat exchanger 200 mounted in two rows. 132 ').
즉, 상기 캐리어(101)에 장착되는 열교환기(200)는 크기별로 크기가 큰 열교환기(200')를 상부의 1열에 설치하고, 상대적으로 크기가 작은 열교환기(200")를 하부의 2열에 설치한 상태에서 상,하부 전원공급기(132)(132')에서 공급되는 전원의 세기를 각각 다르게 조절하며 표면처리를 할 수 있도록 되어 있다.That is, the heat exchanger 200 mounted on the carrier 101 installs a heat exchanger 200 'having a large size according to size in a single row at the top, and a relatively small heat exchanger 200 " In the state installed in the heat, the power supply from the upper and lower power supply 132, 132 'is adjusted differently to allow the surface treatment.
상기와 같이 구성되어 있는 본 발명에 따른 전원공급이 조절되는 열교환기 표면처리장치에서 열교환기의 표면처리가 이루어지는 것을 상세히 설명하면 다음과 같다.When the surface treatment of the heat exchanger is made in detail in the heat exchanger surface treatment apparatus is controlled power supply according to the present invention configured as described above are as follows.
먼저, 본 발명의 열교환기 표면처리장치에서의 표면처리 작업은 열교환기가 완전히 조립된 상태에서 이루어진다.First, the surface treatment operation in the heat exchanger surface treatment apparatus of the present invention is performed in a state where the heat exchanger is completely assembled.
즉, 알루미늄 소재의 파이프를 절곡하여 냉매파이프를 제작한 다음 그 냉매파이프에 알루미늄 재질의 방열핀을 삽입하여 결합하고, 냉매파이프의 양단부에 앤드 플레이트를 결합하여 열교환기(200)를 완성한다.That is, the aluminum pipe is bent to form a refrigerant pipe, and then the heat dissipation fin made of aluminum is inserted into the refrigerant pipe and then coupled, and the end plate is coupled to both ends of the refrigerant pipe to complete the heat exchanger 200.
그리고, 그와 같이 조립된 열교환기(200)를 캐리어(101)에 장착하한 후, 이송부(103)에 의하여 연속적으로 표면처리부(102)의 전방으로 이송되어지도록 하면, 표면처리부(102)의 전방에 배치되어 있는 트랜스퍼(104)가 열교환기가 장착된 캐리어(101)를 로딩챔버(111)로 로딩하고, 그와 같이 로딩된 캐리어(101)가 표면처리부(102)의 내부를 통과하게 된다.Then, after the heat exchanger 200 assembled as described above is mounted on the carrier 101, the transfer unit 103 is continuously transported to the front of the surface treatment unit 102, so that the front of the surface treatment unit 102 is maintained. Transfer 104 disposed in the load the carrier 101, the heat exchanger is mounted to the loading chamber 111, the carrier 101 thus loaded passes through the interior of the surface treatment unit (102).
그와 같이, 캐리어(101)가 클리닝챔버(112), 중합챔버(113),포스트챔버(114), 언로딩챔버(115)를 차례로 이동할때는 상,하부 전원공급기(132)(132')에서 공급되는 +전원이 캐리어(101)를 통하여 열교환기(200)에 공급이되고, 각 챔버에 설치된 상,하부 전극(131)(131')에도 -전원이 공급되어 지는데, 각 챔버의 내부에 가스공급기구(122)를 통하여 공급된 가스가 열교환기(200)와 상,하부 전극(131)(131') 사이에 발생되는 플라즈마에 의하여 여기되며 열교환기(200)의 전체 표면에 표면처리막이 증착되어 진다.As such, when the carrier 101 moves the cleaning chamber 112, the polymerization chamber 113, the post chamber 114, and the unloading chamber 115 in order, the upper and lower power supplies 132 and 132 ′ may be used. The + power supplied is supplied to the heat exchanger 200 through the carrier 101, and -power is also supplied to the upper and lower electrodes 131 and 131 'installed in each chamber. The gas supplied through the supply mechanism 122 is excited by the plasma generated between the heat exchanger 200 and the upper and lower electrodes 131 and 131 ′, and the surface treatment film is deposited on the entire surface of the heat exchanger 200. It is done.
또한, 상기와 같이 표면처리작업이 이루어지는 열교환기(200)는 종류에 따라 각기 크기가 다른데, 그와 같이 크기가 다른 열교환기(200)들을 동시에 작업할때는 크기가 큰 열교환기(200')를 상부의 1열에 장착하고, 상대적으로 크기가 작은 열교환기(200")는 하부의 2열에 배치한 상태에서, 상부 전원공급기(132)에서 상부 전극(131)에 전원을 세게 공급하고, 하부 전원공급기(132')에서 하부 전극(131')에 상대적으로 전원을 약하게 공급하며 표면처리작업을 함으로써, 열교환기(200)의 크기에 알맞게 적절한 표면처리막이 증착되어 진다.In addition, as described above, the heat exchanger 200 having the surface treatment is different in size depending on the type, when the heat exchanger 200 is different in size at the same time when the large heat exchanger 200 'top The heat exchanger 200 ", which is mounted in the first row of columns and has a relatively small heat exchanger 200 ", is disposed in the second row of the lower part and supplies power to the upper electrode 131 from the upper power supply 132, and lower power supply ( The surface treatment operation is performed by weakly supplying power to the lower electrode 131 ′ at 132 ′, so that an appropriate surface treatment film is deposited according to the size of the heat exchanger 200.
상기의 표면처리부(102)에서 열교환기의 표면에 이루어지는 대표적인 표면처리는 친수성막을 표면에 증착시키는 친수처리이며, 경우에 따라서는 초소수성막을 증착시키는 초소수성처리 및 내부식성막을 증착시키는 내부식처리 등이 있다.Representative surface treatment of the surface of the heat exchanger in the surface treatment unit 102 is a hydrophilic treatment for depositing a hydrophilic film on the surface, and in some cases, a superhydrophobic treatment for depositing a superhydrophobic film and a corrosion resistance treatment for depositing a corrosion resistant film. There is this.
따라서, 각각의 처리방법에 따라 가스의 종류 및 공정조건은 각각 다르게 설정될 것이며, 단 본 발명에서는 완전히 조립된 1개 또는 여러개의 열교환기를 캐리어(101)에 장착한 상태에서 연속적으로 표면처리가 이루어지므로, 열교환기 전체에 표면처리가 이루어져서 열교환기의 효율을 향상될뿐 아니라, 대량생산이 이루어지게 된다.Therefore, according to each treatment method, the type and processing conditions of the gas will be set differently, except that in the present invention, the surface treatment is continuously performed in a state in which one or several heat exchangers fully assembled are mounted on the carrier 101. Therefore, the surface treatment is performed on the entire heat exchanger, thereby improving not only the efficiency of the heat exchanger but also mass production.
이상에서 상세히 설명한 바와 같이, 본 발명 전원공급이 조절되는 열교환기 표면처리장치는 챔버의 내부 양측에 상,하부 전극을 배치하고, 챔버의 외부에는 상기 상,하부 전극에 각각 별도로 전원을 인가할 수 있도록 상,하부 전원공급기를 설치하여, 크기가 서로 다른 2종의 열교환기를 표면처리 할때에 캐리어의 상측 1열에는 크기가 큰 열교환기를 장착하고, 하측 2열에는 크기가 작은 열교환기를 장착한 다음, 캐리어가 챔버의 내부에 위치하면 상부 전극에는 전원공급을 세게하고, 하부 전극에는 전원공급을 상대적으로 약하게 공급하며 표면처리를 함으로써, 크기가 다른 열교환기의 표면처리가 연속적으로 균일하게 이루어지는 효과가 있다.As described above in detail, the heat exchanger surface treatment apparatus of which the power supply is controlled according to the present invention may arrange upper and lower electrodes on both sides of the inside of the chamber, and may separately apply power to the upper and lower electrodes on the outside of the chamber. When the upper and lower power supplies are installed so that the two heat exchangers of different sizes are surface treated, a large heat exchanger is installed in the upper row 1 of the carrier, and a small heat exchanger is mounted in the lower 2 row. When the carrier is located inside the chamber, the power supply is hardened to the upper electrode, the power supply is relatively weakly supplied to the lower electrode, and the surface treatment is performed, so that the surface treatment of heat exchangers having different sizes can be continuously uniformed. have.
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| JPH0449523A (en) * | 1990-06-18 | 1992-02-18 | Denki Kagaku Kogyo Kk | Method and device for production of magnetic recording medium |
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| JPH0449523A (en) * | 1990-06-18 | 1992-02-18 | Denki Kagaku Kogyo Kk | Method and device for production of magnetic recording medium |
| KR100326345B1 (en) * | 1994-06-06 | 2002-09-27 | 오보닉 배터리 컴퍼니, 아이엔씨. | Device for depositing thin-state solid state battery |
| JPH0853752A (en) * | 1994-08-10 | 1996-02-27 | Idemitsu Material Kk | Vacuum film forming device and its evacuating method therefor |
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