KR100442646B1 - Bonding method of TR probe - Google Patents
Bonding method of TR probe Download PDFInfo
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- KR100442646B1 KR100442646B1 KR10-1999-0061368A KR19990061368A KR100442646B1 KR 100442646 B1 KR100442646 B1 KR 100442646B1 KR 19990061368 A KR19990061368 A KR 19990061368A KR 100442646 B1 KR100442646 B1 KR 100442646B1
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- Prior art keywords
- bonding
- ultrasonic sensor
- piezoelectric vibrator
- split type
- type ultrasonic
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000523 sample Substances 0.000 title 1
- 239000004926 polymethyl methacrylate Substances 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 13
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229940102838 methylmethacrylate Drugs 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 238000004528 spin coating Methods 0.000 claims abstract description 5
- -1 acryl Chemical group 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 description 6
- 238000013007 heat curing Methods 0.000 description 2
- 238000009659 non-destructive testing Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H17/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves, not provided for in the preceding groups
Abstract
본 발명은 접착제를 지연재와 동일한 재질로 사용함으로써, 접합층이 없으며 접합력이 우수하여 접합층의 불균일로 인한 초음파센서의 특성저하를 방지할 수 있는 분할형 초음파센서의 접합방법을 제공하는 데 그 목적이 있다.The present invention provides a bonding method of a split type ultrasonic sensor that can prevent the deterioration of characteristics of the ultrasonic sensor due to the non-uniformity of the bonding layer and excellent bonding force by using the same material as the retardant, the adhesive. There is a purpose.
위와 같은 목적을 달성하기 위한 본 발명은, 분할형 초음파센서를 제조하기 위하여 압전진동자와 아크릴로 제조된 지연재(delay line)를 접합하는 방법에 있어서, 상기 압전진동자(1)의 접합면에 상기 지연재(2)와 동일한 재질의 액상의 PMMA (Poly-methyl-methacrylate)를 스핀코팅 방식으로 5㎛정도로 도포하여 균일한 두께의 PMMA 막을 형성하여 경화시키고, 상기 지연재(2)와 상기 PMMA 막이 경화된 압전진동자(1)의 접합면에 MMA(Methyl-methacrylate) 용액을 각각 도포하여 치구를 이용하여 가압하면서 상온에서 경화시킴으로써, 접합층이 없는 분할형 초음파센서를 제조한다.The present invention for achieving the above object, in the method of bonding a piezoelectric vibrator and a delay line (delay line) made of acrylic in order to manufacture a split type ultrasonic sensor, the piezoelectric vibrator (1) in the joining surface A liquid PMMA (poly-methyl-methacrylate) of the same material as that of the retardant 2 is applied by spin coating to a thickness of about 5 μm to form a PMMA film having a uniform thickness, and to be cured. The retardant 2 and the PMMA film MMA (Methyl-methacrylate) solution is applied to the bonded surface of the cured piezoelectric vibrator 1 and cured at room temperature while pressurized using a jig to produce a split type ultrasonic sensor without a bonding layer.
Description
본 발명은 분할형 초음파센서의 제조시 압전진동자와 지연재(delay line)의 접합방법에 관한 것이며, 특히, 압전진동자의 표면에 액상의 PMMA(Poly-methyl-methacrylate)를 스핀코팅 방식으로 도포하여 일반적인 방식으로 열처리 경화한 후 MMA(Methyl-methacrylate)용액을 이용하여 지연재인 아크릴과 접합하는 방법에 관한 것이다.The present invention relates to a method of joining a piezoelectric vibrator and a delay line in the manufacture of a split type ultrasonic sensor, and in particular, by applying a liquid coating of polymethyl-methacrylate (PMMA) to the surface of the piezoelectric vibrator by spin coating. After the heat treatment and curing in a general manner relates to a method of bonding with acrylic as a delay material using MMA (Methyl-methacrylate) solution.
산업현장에서 비파괴 검사용으로 사용되는 초음파센서는 수직형과 분할형 그리고 검사형으로 나눌 수 있으며, 대부분의 경우 비파괴 검사시 피검사체와의 완벽한 접촉을 위하여 물을 정합층으로 사용하고 있다. 이 때, 수직형의 경우는 압전진동자가 직접 피검사체에 노출되면 손상을 입어 센서가 망가질 수 있으므로 보통 마모방지를 위한 얇은 두께의 판을 압전진동자에 접착하게 된다.Ultrasonic sensors used for nondestructive testing in industrial sites can be divided into vertical, split, and inspection types. In most cases, water is used as a mating layer for perfect contact with an object under nondestructive testing. In this case, since the piezoelectric vibrator is directly exposed to the object under test, the sensor may be damaged because the piezoelectric vibrator is directly exposed to the test object. Therefore, a thin plate for preventing abrasion is usually attached to the piezoelectric vibrator.
이 경우는 일반적인 접착제를 사용하여 접합두께에 대한 정확한 제어를 하게 되면, 접합의 문제는 많이 발생하지 않지만, 분할형이나 수직형의 경우 압전진동자 전면에 불감대를 줄여 피검사체의 표면부분에 대한 검사가 가능하도록 음향임피던스가 약 3.2Mrayl정도 되는 아크릴을 지연재로 사용한다. 이 때, 아크릴의 경우 일반 접착제로 접착할 경우 두께조절과 균일한 접합층을 얻기 어렵고 또한 완전한 접합력을 확보하기에 많은 문제점이 있다.In this case, if the precise control of the bonding thickness is made by using a general adhesive, the problem of bonding does not occur much, but in the case of the split type or the vertical type, the dead band is reduced on the front of the piezoelectric vibrator to inspect the surface of the subject. To achieve this, acrylics with an acoustic impedance of about 3.2 Mrayl are used as the retardant material. In this case, in the case of acryl, it is difficult to obtain a thickness control and a uniform bonding layer when bonding with a general adhesive, and there are many problems in ensuring complete bonding strength.
도 1에는 종래의 분할형 초음파센서의 접합방법에 따른 접합면의 단면도가 도시되어 있다.1 is a cross-sectional view of the bonding surface according to the conventional method of bonding the split type ultrasonic sensor.
도 1에 보이듯이, 압전진동자(1)와 지연재(2)를 서로 접합하기 위해서는, 먼저, 압전진동자(1)의 표면에 형성된 전극(3)과 지연재(2)의 접착면에 에폭시를 각각 도포한 후, 치구를 이용하여 압전진동자(1)와 지연재(2)를 결합한다. 그런 다음, 전기오븐 등을 사용하여 에폭시를 가열 경화시켜 에폭시 접합층(4)을 형성함으로써, 압전진동자(1)와 지연재(2)를 서로 결합한다.As shown in FIG. 1, in order to bond the piezoelectric vibrator 1 and the retarder 2 to each other, first, an epoxy is applied to an adhesive surface of the electrode 3 and the retarder 2 formed on the surface of the piezoelectric vibrator 1. After each application, the piezoelectric vibrator 1 and the retarder 2 are combined using a jig. Then, the piezoelectric vibrator 1 and the retarder 2 are bonded to each other by forming an epoxy bonding layer 4 by heat curing the epoxy using an electric oven or the like.
그러나, 종래의 접합방법은 접착제인 에폭시에 의한 접합층(4)이 형성되는데, 이 때, 접착제로 사용되는 에폭시와 지연재(2)의 주성분인 아크릴 수지의 결합성이 나쁘기 때문에, 접합층(4)이 분리되는 문제점이 발생한다. 그리고, 아크릴 지연재(3)의 접합면 가공이 불량할 경우, 접합층(4)의 두께가 불균일한 현상이 발생하여 초음파센서의 특성에 나쁜 영향을 주는 단점이 있다.However, in the conventional bonding method, a bonding layer 4 made of epoxy as an adhesive is formed. At this time, the bonding layer between the epoxy used as the adhesive and the acrylic resin as the main component of the retardant 2 is poor. 4) the problem of separation. And, when the bonding surface processing of the acrylic retardation material 3 is poor, there is a disadvantage that the non-uniform thickness of the bonding layer 4 occurs to adversely affect the characteristics of the ultrasonic sensor.
따라서, 본 발명은 앞서 설명한 바와 같은 종래 기술의 문제점을 해결하기 위하여 안출된 것으로서, 접착제를 지연재와 동일한 재질로 사용함으로써, 접합층이 없으며 접합력이 우수하여 접합층의 불균일로 인한 초음파센서의 특성저하를 방지할 수 있는 분할형 초음파센서의 접합방법을 제공하는 데 그 목적이 있다.Therefore, the present invention has been made to solve the problems of the prior art as described above, by using the same material as the retarder, there is no bonding layer and excellent bonding strength characteristics of the ultrasonic sensor due to non-uniform bonding layer It is an object of the present invention to provide a method of bonding a split type ultrasonic sensor that can prevent degradation.
도 1은 종래의 분할형 초음파센서의 접합방법에 따른 접합면의 단면도이고,1 is a cross-sectional view of a bonding surface according to a bonding method of a conventional split ultrasonic sensor,
도 2는 본 발명의 한 실시예에 따른 분할형 초음파센서의 접합방법에 대한 공정도이며,2 is a process chart for the bonding method of the split type ultrasonic sensor according to an embodiment of the present invention,
도 3은 도 2에 도시된 분할형 초음파센서의 접합방법에 따른 접합면의 단면도.3 is a cross-sectional view of the bonding surface according to the bonding method of the split type ultrasonic sensor shown in FIG.
♠ 도면의 주요부분에 대한 부호의 설명 ♠♠ Explanation of symbols on the main parts of the drawing ♠
1 : 압전진동자 2 : 지연재1: piezoelectric vibrator 2: delay material
3 : 전극 4 : 에폭시 접합층3: electrode 4: epoxy bonding layer
5 : PMMA 접합면5: PMMA joint surface
위와 같은 목적을 달성하기 위한 본 발명에 따르면, 분할형 초음파센서를 제조하기 위하여 압전진동자와 아크릴로 제조된 지연재(delay line)를 접합하는 방법에 있어서, 상기 압전진동자의 접합면에 상기 지연재와 동일한 재질의 액상의 PMMA (Poly-methyl-methacrylate)를 스핀코팅 방식으로 5㎛정도로 도포하여 균일한 두께의 PMMA 막을 형성하여 경화시키고, 상기 지연재와 상기 PMMA 막이 경화된 압전진동자의 접합면에 MMA(Methyl-methacrylate) 용액을 각각 도포하여 치구를 이용하여 가압하면서 상온에서 경화시킴으로써, 접합층이 없는 분할형 초음파센서를 제조하는 분할형 초음파센서의 접합방법이 제공된다.According to the present invention for achieving the above object, in the method for bonding a piezoelectric vibrator and a delay line (delay line) made of acrylic in order to manufacture a split type ultrasonic sensor, the retarder on the bonding surface of the piezoelectric vibrator Liquid PMMA (Poly-methyl-methacrylate) of the same material as in the spin coating method is applied to about 5㎛ to form a PMMA film of uniform thickness and cured, and the retarder and the PMMA film on the bonding surface of the piezoelectric vibrator cured By applying MMA (Methyl-methacrylate) solution and curing at room temperature while pressurizing using a jig, there is provided a bonding method of a split type ultrasonic sensor for producing a split type ultrasonic sensor without a bonding layer.
아래에서, 본 발명에 따른 분할형 초음파센서의 접합방법의 양호한 실시예를 첨부한 도면을 참조로 하여 상세히 설명하겠다.In the following, with reference to the accompanying drawings a preferred embodiment of the method of bonding the split type ultrasonic sensor according to the present invention will be described in detail.
도면에서, 도 2는 본 발명의 한 실시예에 따른 분할형 초음파센서의 접합방법에 대한 공정도이고, 도 3은 도 2에 도시된 분할형 초음파센서의 접합방법에 따른 접합면의 단면도이다.2 is a process diagram for the bonding method of the split type ultrasonic sensor according to an embodiment of the present invention, Figure 3 is a cross-sectional view of the bonding surface according to the bonding method of the split type ultrasonic sensor shown in FIG.
도 2 및 도 3에 보이듯이, 먼저, 압전진동자(1)를 세척한다. 그런 다음, 접합하고자 하는 압전진동자(1)의 전극(3)의 표면에 액상의 PMMA를 스핀코팅 방식으로 5㎛정도로 도포하여 균일한 두께의 PMMA 막을 형성한다. 그리고, 이렇게 균일하게 도포된 액상의 PMMA 막을 프로그래밍이 가능한 전기오븐을 이용하여 2시간 가열경화시킨다. 그러면, 압전진동자(1)의 접합면에 경화된 PMMA 막이 형성된다.2 and 3, first, the piezoelectric vibrator 1 is washed. Then, a liquid PMMA is applied to the surface of the electrode 3 of the piezoelectric vibrator 1 to be bonded by spin coating to about 5 μm to form a PMMA film having a uniform thickness. Then, the uniformly applied liquid PMMA film is heat cured for 2 hours using a programmable electric oven. Then, a cured PMMA film is formed on the bonding surface of the piezoelectric vibrator 1.
한편, 사용 목적에 적합한 용도로 설계된 루프 앵글(roof angle)을 갖는 지연재(2)를 아크릴로 가공한다. 이렇게 아크릴로 가공된 지연재(2)와 PMMA 막이 경화된 압전진동자(1)의 접합면에 MMA 용액을 각각 도포하여 치구를 이용하여 가압하면서 상온에서 경화시킨다.On the other hand, the retarder 2 having a roof angle designed for a purpose suitable for use is processed into acrylic. The MMA solution is applied to the joint surface of the retarder 2 processed with acryl and the piezoelectric vibrator 1 cured with the PMMA film, respectively, and cured at room temperature while pressurized using a jig.
앞서 설명한 바와 같은 접합방법을 이용할 경우에는, 도 3에 도시된 바와 같이 압전진동자(1)와 지연재(2)의 사이에는 PMMA 접합면(5)이 형성된다.In the case of using the bonding method as described above, as shown in FIG. 3, the PMMA bonding surface 5 is formed between the piezoelectric vibrator 1 and the retarder 2.
즉, 본 발명의 접합방법에 의해 접합한 초음파센서의 접합면은 종래의 접합층과는 달리 동일한 재질로 이루어져 있기 때문에, 압전진동자(1)와 지연재(2)의 사이에 접합층이 형성되지 않는 특징이 있고, 또한 접합력도 동일한 재질로 서로 접합되므로 우수한 특성을 갖는 초음파센서의 제조가 가능하다.That is, since the bonding surface of the ultrasonic sensor bonded by the bonding method of the present invention is made of the same material as the conventional bonding layer, the bonding layer is not formed between the piezoelectric vibrator 1 and the retarder 2. It does not feature, and the bonding force is also bonded to each other by the same material, it is possible to manufacture an ultrasonic sensor having excellent characteristics.
앞서 상세히 설명한 바와 같이 본 발명의 분할형 초음파센서의 접합방법은접착제를 지연재와 동일한 재질로 사용함으로써, 접합층이 없으며 접합력이 우수하여 접합층의 불균일로 인한 초음파센서의 특성저하를 방지하는 효과가 있다.As described in detail above, the bonding method of the split type ultrasonic sensor of the present invention uses an adhesive as the same material as the retardant material, so that there is no bonding layer and the bonding force is excellent, thereby preventing the deterioration of the characteristics of the ultrasonic sensor due to the nonuniformity of the bonding layer. There is.
이상에서 본 발명의 분할형 초음파센서의 접합방법에 대한 기술사상을 첨부도면과 함께 서술하였지만 이는 본 발명의 가장 양호한 실시예를 예시적으로 설명한 것이지 본 발명을 한정하는 것은 아니다.Although the technical idea of the method of bonding the split type ultrasonic sensor of the present invention has been described together with the accompanying drawings, this is intended to exemplarily describe the best embodiment of the present invention and not to limit the present invention.
또한, 이 기술분야의 통상의 지식을 가진 자이면 누구나 본 발명의 기술사상의 범주를 이탈하지 않는 범위내에서 다양한 변형 및 모방이 가능함은 명백한 사실이다.In addition, it is obvious that any person skilled in the art can make various modifications and imitations without departing from the scope of the technical idea of the present invention.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-1999-0061368A KR100442646B1 (en) | 1999-12-23 | 1999-12-23 | Bonding method of TR probe |
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| Application Number | Priority Date | Filing Date | Title |
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| KR10-1999-0061368A KR100442646B1 (en) | 1999-12-23 | 1999-12-23 | Bonding method of TR probe |
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| KR20010057944A KR20010057944A (en) | 2001-07-05 |
| KR100442646B1 true KR100442646B1 (en) | 2004-08-02 |
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| KR10-1999-0061368A KR100442646B1 (en) | 1999-12-23 | 1999-12-23 | Bonding method of TR probe |
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| Country | Link |
|---|---|
| KR (1) | KR100442646B1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0362606A (en) * | 1990-07-19 | 1991-03-18 | Matsushita Electric Ind Co Ltd | Manufacture of ultrasonic wave delay line |
| JPH08331695A (en) * | 1995-06-01 | 1996-12-13 | Murata Mfg Co Ltd | Manufacture of ultrasonic sensor and ultrasonic sensor |
| KR19990032406U (en) * | 1997-12-31 | 1999-07-26 | 오상수 | Bonding Structure of Ultrasonic Sensor |
| KR19990067868A (en) * | 1998-01-13 | 1999-08-25 | 무라타 야스타카 | Ultrasonic sensor |
| JPH11266498A (en) * | 1998-01-13 | 1999-09-28 | Murata Mfg Co Ltd | Ultrasonic wave sensor and its manufacture |
| KR100340595B1 (en) * | 1997-08-13 | 2002-07-18 | 신현준 | A Method for Forming Adhesive Layer of Ultrasonic Sensor by using Spin-Coating and Low Tempreature Hardenig |
-
1999
- 1999-12-23 KR KR10-1999-0061368A patent/KR100442646B1/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0362606A (en) * | 1990-07-19 | 1991-03-18 | Matsushita Electric Ind Co Ltd | Manufacture of ultrasonic wave delay line |
| JPH08331695A (en) * | 1995-06-01 | 1996-12-13 | Murata Mfg Co Ltd | Manufacture of ultrasonic sensor and ultrasonic sensor |
| KR100340595B1 (en) * | 1997-08-13 | 2002-07-18 | 신현준 | A Method for Forming Adhesive Layer of Ultrasonic Sensor by using Spin-Coating and Low Tempreature Hardenig |
| KR19990032406U (en) * | 1997-12-31 | 1999-07-26 | 오상수 | Bonding Structure of Ultrasonic Sensor |
| KR19990067868A (en) * | 1998-01-13 | 1999-08-25 | 무라타 야스타카 | Ultrasonic sensor |
| JPH11266498A (en) * | 1998-01-13 | 1999-09-28 | Murata Mfg Co Ltd | Ultrasonic wave sensor and its manufacture |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010057944A (en) | 2001-07-05 |
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