KR100436580B1 - PTC Device Manufacturing Method With Ingredient Of Excellent Resistance Repair Specific Property - Google Patents
PTC Device Manufacturing Method With Ingredient Of Excellent Resistance Repair Specific Property Download PDFInfo
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- KR100436580B1 KR100436580B1 KR10-2001-0069892A KR20010069892A KR100436580B1 KR 100436580 B1 KR100436580 B1 KR 100436580B1 KR 20010069892 A KR20010069892 A KR 20010069892A KR 100436580 B1 KR100436580 B1 KR 100436580B1
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- H—ELECTRICITY
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- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
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Abstract
본 발명은 우수한 저항복구 특성의 조성을 갖는 PTC 디바이스 제조방법에 관한 것으로, 70 중량%의 저융점 수지와, 15 중량%의 중융점 수지 및 15 중량%의 고융점 수지로 이루어진 고분자 수지 100 중량에 대해 DBP 수치가 100g당 100 ㎤ 내지 140㎤인 95 중량비의 카본블랙과, 0.5 중량비의 가교제 및 1중량%의 첨가제와, 3 중량비 내지 15 중량비의 폴리에틸렌 왁스를 투입하여 PTC복합수지를 배합하는 단계와, 상기 PTC복합수지를 단축스크류 압출기로 135℃에서 시트형태로 압출하는 단계와, 상기 시트형태의 PTC복합수지의 양면에 니켈도금되어진 구리박판을 합착하는 단계와, 상기 구리박판이 합착된 상기 PTC복합수지를 온도 220℃, 압력 200kgf/㎠에서 30분 동안 프레스로 가교 및 냉각한 뒤, 소정형상의 금형으로 펀칭하여 일정크기의 몸체를 형성하는 단계 및 상기 몸체의 양측에 주석-납 솔더크림으로 전원연결을 위한 니켈 리드를 부착하고, 고온의 리플로우를 통과시킨 후 강제냉각 및 결착하여 PTC디바이스를 완성하는 단계로 이루어지는 것을 특징으로 한다.The present invention relates to a method for manufacturing a PTC device having a composition of excellent resistance recovery characteristics, with respect to 100 weight of the polymer resin consisting of 70% by weight of the low-melting resin, 15% by weight of the melting point resin and 15% by weight of the high melting point resin Blending PTC composite resin by adding 95 weight ratio of carbon black having a DBP value of 100 cm 3 to 140 cm 3 per 100 g, 0.5 weight ratio of crosslinking agent and 1 weight percent of additive, and 3 weight ratio to 15 weight ratio of polyethylene wax; Extruding the PTC composite resin into a sheet form at 135 ° C. with a single screw extruder; and bonding the nickel plated copper thin plates to both surfaces of the sheet-shaped PTC composite resin; and the PTC composite to which the copper thin plates are bonded. The resin is crosslinked and cooled in a press for 30 minutes at a temperature of 220 ° C. and a pressure of 200 kgf / cm 2, and then punched into a mold of a predetermined shape to form a body having a predetermined size and the body Tin on both sides of - attaching a nickel lead for the power supply lead connected to the solder cream, and then passed through a high-temperature reflow by forced cooling and a binder characterized in that comprising the step of completing the PTC device.
Description
본 발명은 PTC를 제조하는데 있어서의 그 조성에 따른 제조방법에 관한 것으로, 보다 상세하게는 수지의 조성을 크게 변화시키지 않고 각 조성성분의 개별적인 특성을 유지시키면서 소정량의 폴리에틸렌 왁스를 첨가함으로써, 공정성 및 제품 특성을 향상시킬 수 있는 우수한 저항복구 특성의 조성을 갖는 PTC 디바이스 제조방법에 관한 것이다.The present invention relates to a method for producing a PTC according to its composition, and more particularly, by adding a predetermined amount of polyethylene wax while maintaining individual characteristics of each component without significantly changing the composition of the resin, It relates to a PTC device manufacturing method having a composition of excellent resistance recovery characteristics that can improve product characteristics.
종래 PTC복합수지로 이루어진 PTC디바이스에 대한 제조공정 중 카본블랙 콤파운딩 공정시 전단력에 의한 카본블랙 구조의 파괴는 상온저항의 상승을 유발한다.Destruction of the carbon black structure due to the shearing force during the carbon black compounding process during the manufacturing process for a PTC device made of a conventional PTC composite resin causes an increase in room temperature resistance.
따라서 적절한 혼합에너지를 투입하여 카본블랙의 구조를 보호하면서도 균일한 혼합을 도모하는 것이 바람직하다.Therefore, it is desirable to achieve uniform mixing while protecting the structure of the carbon black by inputting appropriate mixing energy.
그러나 균일한 혼합을 위해 스크류(Screw) 조합, 온도, 분당회전수(rpm), 시간당 투입량 등이 정해지면 수지의 점도를 변경시키지 않는 한 카본블랙에 가해지는 전단력를 낮추기가 어려운데, 수지 자체의 점도 혹은 MI를 변경 시키는 것은 결정화도나 wettability 등에 영향을 주고 이는 곧 다른 특성에 이어서 영향을 주기 때문에 그 변경에 한계가 있는 문제점이 있다.However, if the screw combination, temperature, rpm, and hourly dosage are determined for uniform mixing, it is difficult to lower the shear force applied to the carbon black unless the viscosity of the resin is changed. Changing the MI affects crystallinity, wettability, and so on, which in turn affects other properties, which limits the change.
본 발명은 상기와 같은 문제점을 감안하여 안출된 것으로, 본 발명의 제 1목적은 PTC복합수지의 조성은 변경됨이 없이 폴리에틸렌 왁스를 소정량 첨가시켜 제품의 공정성 및 특성을 향상시킬 수 있는 우수한 저항복구 특성의 조성을 갖는 PTC 디바이스 제조방법을 제공하는 것이다.The present invention has been made in view of the above problems, the first object of the present invention is excellent resistance recovery that can improve the processability and properties of the product by adding a predetermined amount of polyethylene wax without changing the composition of the PTC composite resin It is to provide a PTC device manufacturing method having a composition of properties.
그리고, 본 발명의 제 2목적은 다른 성분의 조성변화는 없이 소정량의 폴리에틸렌 왁스만을 첨가함으로써, 고온저항은 그대로 유지시키면서 상온저항은 낮출 수 있는 우수한 저항복구 특성의 조성을 갖는 PTC 디바이스 제조방법을 제공하는 것이다.In addition, the second object of the present invention is to provide a method for manufacturing a PTC device having a composition of excellent resistance recovery characteristics which can lower the room temperature resistance while maintaining the high temperature resistance by adding only a predetermined amount of polyethylene wax without changing the composition of other components. It is.
이러한 본 발명의 목적들은, 70 중량%의 저융점 수지와, 15 중량%의 중융점 수지 및 15 중량%의 고융점 수지로 이루어진 고분자 수지 100 중량에 대해 DBP 수치가 100g당 100 ㎤ 내지 140㎤인 95 중량비의 카본블랙과, 0.5 중량비의 가교제 및 1중량%의 첨가제와, 3 중량비 내지 15 중량비의 폴리에틸렌 왁스를 투입하여 PTC복합수지를 배합하는 단계(S100);The objects of the present invention are DBP values of 100 cm 3 to 140 cm 3 per 100 g based on 100 weight of the polymer resin composed of 70 wt% low melting point resin, 15 wt% medium melting point resin and 15 wt% high melting point resin. Compounding a PTC composite resin by adding 95 weight ratio of carbon black, 0.5 weight ratio of crosslinking agent and 1 weight percent of additive, and 3 weight ratio to 15 weight ratio of polyethylene wax (S100);
상기 PTC복합수지를 단축스크류 압출기로 135℃에서 시트형태로 압출하는 단계(S200);Extruding the PTC composite resin into a sheet form at 135 ° C. using a single screw extruder (S200);
상기 시트형태의 PTC복합수지의 양면에 니켈도금되어진 구리박판(20)을 합착하는 단계(S300);Bonding the nickel plated copper foil 20 to both sides of the sheet-shaped PTC composite resin (S300);
상기 구리박판(20)이 합착된 상기 PTC복합수지를 온도 220℃, 압력 200kgf/㎠에서 30분 동안 프레스로 가교 및 냉각한 뒤, 소정형상의 금형으로 펀칭하여 일정크기의 몸체(10)를 형성하는 단계(S400); 및The PTC composite resin to which the copper foil 20 was bonded was crosslinked and cooled by a press for 30 minutes at a temperature of 220 ° C. and a pressure of 200 kgf / cm 2, and then punched into a mold of a predetermined shape to form a body 10 having a predetermined size. Step (S400); And
상기 몸체(10)의 양측에 주석-납 솔더크림으로 전원연결을 위한 니켈 리드 (30)를 부착하고, 고온의 리플로우를 통과시킨 후 강제냉각 및 결착시켜 PTC디바이스(100)를 완성하는 단계(S500);로 이루어지는 것을 특징으로 하는 우수한 저항복구 특성의 조성을 갖는 PTC 디바이스 제조방법에 의하여 달성된다.Attaching the nickel lead 30 for power connection with tin-lead solder cream on both sides of the body 10, passing the high temperature reflow, and forced cooling and binding to complete the PTC device 100 ( S500); is achieved by a PTC device manufacturing method having a composition of excellent resistance recovery characteristics.
여기서, 상기 폴리에틸렌 왁스는 열에 대한 유동온도가 90 내지 135℃이고, 용융점도(Melt Viscosity)가 100 내지 1500 cps이며, 밀도가 0.915 내지 0.965인 것이 바람직하다.Herein, the polyethylene wax preferably has a flow temperature of 90 to 135 ° C., a melt viscosity of 100 to 1500 cps, and a density of 0.915 to 0.965.
그리고, 상기 고융점수지는 HDPE(High Density Polyethylene), MDPE(MediumDensity Polyethylene)를 포함하는 결정성 수지군으로 선택되는 어느 하나인 것이 바람직하다.In addition, the high melting point resin is preferably any one selected from the group of crystalline resins including HDPE (High Density Polyethylene), MDPE (Medium Density Polyethylene).
아울러, 상기 중융점수지는 LDPE(Low Density Polyethylene), LLDPE(Linear Low Density Polyethylene), 메탈로센 수지를 포함하는 결정성 수지군으로부터 선택되는 어느 하나인 것이 바람직하다.In addition, the middle melting point resin is preferably any one selected from the group of crystalline resins including low density polyethylene (LDPE), linear low density polyethylene (LLDPE), metallocene resin.
또한, 상기 저융점수지는 EEA와 EAA의 혼합물 중에서 선택되는 에틸렌아크릴레이트 공중합체인 것이 바람직하다.In addition, the low melting point resin is preferably an ethylene acrylate copolymer selected from a mixture of EEA and EAA.
본 발명의 그 밖의 목적, 특정한 장점들 및 신규한 특징들은 첨부된 도면들과 연관되어지는 이하의 상세한 설명과 바람직한 실시예들로부터 더욱 분명해질 것이다.Other objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and the preferred embodiments associated with the accompanying drawings.
도 1은 본 발명에 따른 우수한 저항복구 특성의 조성을 갖는 PTC 디바이스 제조방법의 공정순서도,1 is a process flowchart of a method for manufacturing a PTC device having a composition of excellent resistance recovery characteristics according to the present invention;
도 2는 본 발명에 따른 PTC디바이스의 평면도,2 is a plan view of a PTC device according to the present invention;
도 3은 본 발명에 따른 PTC디바이스의 측면도이다.3 is a side view of a PTC device according to the present invention.
< 도면의 주요부분에 관한 부호의 설명 ><Description of the code | symbol about the principal part of drawing>
10: 몸체 20: 구리박판10: body 20: copper foil
30: 니켈리드 100: PTC디바이스30: nickel lead 100: PTC device
다음으로는 본 발명에 따른 우수한 저항복구 특성의 조성을 갖는 PTC제조방법에 관하여 첨부되어진 도면과 더불어 설명하기로 한다.Next, a PTC manufacturing method having a composition of excellent resistance recovery characteristics according to the present invention will be described with reference to the accompanying drawings.
도 1은 본 발명에 따른 우수한 저항복구 특성의 조성을 갖는 PTC 디바이스 제조방법의 공정순서도이고, 도 2는 본 발명에 따른 PTC디바이스의 평면도이며, 도 3은 본 발명에 따른 PTC디바이스의 측면도이다.1 is a process flowchart of a method for manufacturing a PTC device having a composition of excellent resistance recovery characteristics according to the present invention, FIG. 2 is a plan view of a PTC device according to the present invention, and FIG. 3 is a side view of a PTC device according to the present invention.
도 1, 도 2 및 도 3에 도시된 바와 같이, 상기 PTC 디바이스 제조방법은 PTC디바이스(100)의 제조시 카본블랙 구조를 보호하면서도 균일한 혼합을 도모하기 위한 것으로, PTC복합수지의 조성을 크게 변화시키지 않고, 공정성 및 제품 특성을 향상 시키기 위해 폴리에틸렌 왁스(Polyethylene wax)를 첨가하여 제품을 제조하는방법에 관한 것이다.1, 2 and 3, the method for manufacturing the PTC device is to achieve uniform mixing while protecting the carbon black structure during the manufacture of the PTC device 100, significantly changing the composition of the PTC composite resin The present invention relates to a method of manufacturing a product by adding polyethylene wax to improve processability and product characteristics without making it.
상기 제조방법은 다음과 같은 단계로 구성된다.The manufacturing method consists of the following steps.
우선 약 70 중량% 정도의 저융점 수지와, 약 15 중량% 정도의 중융점 수지 및 약 15 중량% 정도의 고융점 수지로 이루어진 고분자 수지 100 중량에 대해 DBP 수치가 100g당 약 100 ㎤ 내지 140 ㎤ 정도인 약 95 중량비의 카본블랙과, 약 0.5 중량비의 가교제 및 약 1중량비의 첨가제와, 약 3 중량비 내지 15 중량비의 폴리에틸렌 왁스를 투입하여 PTC복합수지를 배합한다.(S100)First, the DBP value is about 100 cm 3 to 140 cm 3 per 100 g based on 100 weight of the polymer resin composed of about 70 wt% of the low melting point resin, about 15 wt% of the low melting point resin, and about 15 wt% of the high melting point resin. The PTC composite resin is blended by adding about 95 weight percent carbon black, about 0.5 weight ratio crosslinking agent and about 1 weight ratio additive, and about 3 to 15 weight ratio polyethylene wax.
이 때 상기 폴리에틸렌 왁스는 상기와 같이 PTC복합수지를 100으로 보았을 때 약 중량비로 10 내지 15중량비 정도가 함유되어 있으며, 기존의 폴리에틸렌을 크래킹(Cracking)하여 저분자로 쪼갬으로써, 점도를 크게 낮춘 물질로써 콤파운딩 공정시 윤활성과 분산성을 향상시키기 때문에, 혼합시 각 수지와 카본블랙 혹은 카본블랙과 카본블랙 간의 마찰을 감쇄시켜 카본블랙 구조의 손상을 줄일 수 있으며, 이는 곧 PTC디바이스(100)의 상온저항을 낮추는 결과가 된다.At this time, the polyethylene wax is contained in about 10 to 15% by weight as the weight ratio of PTC composite resin as described above, and cracking the existing polyethylene (Cracking) by splitting into low molecules, as a material that significantly lowered the viscosity Since the compounding process improves lubricity and dispersibility, it is possible to reduce the damage of the carbon black structure by reducing friction between each resin and carbon black or carbon black and carbon black when mixing, which is the normal temperature of the PTC device 100. This results in lower resistance.
또한 상기 왁스는 결정화도가 높아 제품의 냉각 후 카본블랙의 전도성 채널(Channel) 형성에 도움을 주어 결국 상온 저항을 낮출수 있으며, 동시에 결정화도의 증가는 고온 저항을 상승시켜 주어 PTC디바이스(100)의 특성을 향상시키게 되는데, 열에 대한 유동온도가 90 내지 135℃이고, 용융점도(Melt Viscosity)가 100 내지 1500 cps이며, 밀도가 0.915 내지 0.965인 것이 바람직하다.In addition, the wax has a high degree of crystallinity, which helps to form a conductive channel of carbon black after cooling of the product, thereby lowering the room temperature resistance.At the same time, the increase of the crystallinity increases the high temperature resistance and thus the characteristics of the PTC device 100. It is preferable that the flow temperature for heat is 90 to 135 ° C, the melt viscosity is 100 to 1500 cps, and the density is 0.915 to 0.965.
이 때 상기 고융점수지는 HDPE(High Density Polyethylene, 고밀도 에틸렌), MDPE(Medium Density Polyethylene, 중밀도 에틸렌)를 포함하는 결정성 수지인 것이 바람직하다.At this time, the high melting point resin is preferably a crystalline resin containing HDPE (High Density Polyethylene, high density ethylene), MDPE (Medium Density Polyethylene, medium density ethylene).
아울러, 상기 중융점수지는 LDPE(Low Density Polyethylene, 저밀도 에틸렌), LLDPE(Linear Low Density Polyethylene, 선형 저밀도 에틸렌), 메탈로센 수지를 포함하는 결정성 수지인 것이 바람직하며, 상기 저융점수지는 EEA 와 EAA의 혼합물 중에서 선택되는 에틸렌아크릴레이트 공중합체(CH2 = CHCOOCmH2m+1에서 m은 4미만)인 것이 바람직하다.In addition, the middle melting point resin is preferably a crystalline resin including LDPE (Low Density Polyethylene, low density ethylene), LLDPE (Linear Low Density Polyethylene, linear low density ethylene), metallocene resin, the low melting point resin is EEA And an ethylene acrylate copolymer selected from a mixture of and EAA (wherein CH2 = CHCOOCmH2m + 1, m is less than 4).
여기서, 상기 고융점수지는 약 120℃ 정도의 온도에서 용융되는 것이고, 상기 중융점수지는 약 100 내지 120℃ 정도의 온도에서 용융되는 것이며, 상기 저융점수지는 약 100℃정도 이하의 온도에서 용융되는 것이다.Here, the high melting point resin is melted at a temperature of about 120 ℃, the middle melting point resin is melted at a temperature of about 100 to 120 ℃, the low melting point resin is melted at a temperature of about 100 ℃ or less Will be.
또한, 상기 PTC복합수지에는 배합의 원활함을 위해 소정의 첨가제가 첨가되며, 상기 가교제는 오르가닉 페록사이드(Organic Peroxide)이다.In addition, a predetermined additive is added to the PTC composite resin to facilitate blending, and the crosslinking agent is organic peroxide.
그리고, 상기 PTC복합수지를 단축스크류 압출기(미도시)로 약 135℃정도 에서 시트형태로 압출한다.(S200)In addition, the PTC composite resin is extruded in a sheet form at about 135 ° C. using a single screw extruder (not shown).
아울러, 상기 시트형태의 PTC복합수지의 양면에 니켈도금되어진 구리박판 (20)을 합착하게 된다.(S300)In addition, the nickel plated copper foil 20 is bonded to both sides of the sheet-shaped PTC composite resin. (S300)
다음으로 구리박판(20)이 합착된 상기 PTC복합수지를 온도 220℃, 압력 200kgf/㎠에서 30분 동안 프레스(미도시)로 가교한 뒤, 소정형상의 금형으로 펀칭하여 면적이 약 0.572 ㎠ 정도이며, 두께가 약 0.022 cm 정도인 사각판재 형태의 몸체(10)를 형성한다.(S400)Next, the PTC composite resin, to which the copper foil 20 was bonded, was crosslinked with a press (not shown) at a temperature of 220 ° C. and a pressure of 200 kgf / cm 2 for 30 minutes, and then punched with a mold of a predetermined shape to have an area of about 0.572 cm 2. And, to form a body 10 of the rectangular plate shape having a thickness of about 0.022 cm (S400).
이 때 PTC복합수지에 구리박판(20)이 합착된 상기 몸체(10)가 상기 금형에의해 펀칭되어졌을 경우 그 두께는 약 0.15-0.35mm이고, 일면의 면적은 약 20-80㎟ 정도이다.At this time, when the body 10 to which the copper foil 20 is bonded to the PTC composite resin is punched by the mold, the thickness thereof is about 0.15-0.35 mm, and the area of one surface is about 20-80 mm 2.
아울러, 상기 프레스의 가압공정은 상기 PTCPTC복합수지의 가교가 효율적으로 이루어지고, 가교 과정 동안 카본블랙의 재배열이 이루어지면서 궁극적으로 원하는 제품의 특성을 구현할 수 있도록 하는 조건하에서 이루어져야 하는데, 각 조건은 다음과 같다.In addition, the pressurization process of the press should be carried out under the conditions such that the crosslinking of the PTCPTC composite resin is efficiently performed and rearrangement of the carbon black is performed during the crosslinking process, and ultimately, the desired product characteristics can be realized. As follows.
우선 온도범위는 약 180 ~ 240 ℃이고, 압력은 약 150 ~ 200 kgf이며, 시간 은 30분 정도인데, 이러한 시간범위는 가교 반응과 동시에 열과 압력에 의한 PTC복합수지의 내부 모폴로지와 카본블랙의 재배열을 통해 제품의 특성을 만족하도록 설정된다.First, the temperature range is about 180 ~ 240 ℃, the pressure is about 150 ~ 200 kgf, the time is about 30 minutes, this time range is the internal morphology of the PTC composite resin and carbon black ash by heat and pressure simultaneously with the crosslinking reaction The arrangement is set to satisfy the characteristics of the product.
다음으로 상기 몸체(10)의 양측에 주석-납 성분의 솔더크림으로 전원연결을 위한 니켈 리드(30)를 부착하고, 고온의 리플로우를 통과시킨 후 강제냉각시켜 결착한하여 PTC디바이스(100)를 완성한다.(S500)Next, the nickel lead 30 for power connection is attached to the both sides of the body 10 by solder cream of tin-lead component, and after passing through a high temperature reflow, it is forced to cool and bind to the PTC device 100. Complete (S500)
이 때 상기 PTC복합수지를 포함하는 상기 PTC디바이스(100)의 전체저항은 15-60 mohm으로써 몸체(10)의 체적 저항을 기준으로 할 때 1 ohm-cm 이하로 매우 낮으며, 90℃에서 0.2-1 ohm, 100℃에서 2-50 ohm, 110℃에서 50-2000 ohm, 120℃에서 2000 ohm 이상의 값을 각각 가짐으로써, 주변 온도 상승이나 과전류로 인한 온도 상승시 디바이스(100)의 저항이 적당한 시기에 상승함으로써 상기 니켈리드 (30)에 전기적으로 연결되는 배터리나 회로를 보호할 수 있다.In this case, the total resistance of the PTC device 100 including the PTC composite resin is 15-60 mohm, which is very low, 1 ohm-cm or less, based on the volume resistance of the body 10, and 0.2 at 90 ° C. -1 ohm, 2-50 ohm at 100 ° C, 50-2000 ohm at 110 ° C and 2000 ohm at 120 ° C, respectively, so that the resistance of the device 100 is adequate when the temperature rises due to an increase in ambient temperature or overcurrent. By rising in time, a battery or a circuit electrically connected to the nickel lead 30 can be protected.
이와 같이 이루어진 상기 PTC 디바이스 제조방법에서 각 제조조건(온도, 전압, 전류, 압력 등)을 달리하여 제조되는 PTC복합수지 및 그 제품도 본 발명에 포함될 수 있음은 물론이다.In the PTC device manufacturing method made as described above, PTC composite resins manufactured by different manufacturing conditions (temperature, voltage, current, pressure, etc.) and their products may be included in the present invention.
이상에서와 같은 본 발명에 관한 우수한 저항복구 특성의 조성을 갖는 PTC 디바이스 제조방법에 따르면, 기존의 PTC복합수지 조성의 개별적인 성분에 대한 변경이 없이 폴리에틸렌 왁스를 PTC복합수지 배합과정에서 소량 첨가하는 단순한 부분공정이 추가되어 보다 안정적인 고온저항은 그대로 유지하면서도 상온저항은 낮출수 있는 특징이 있다.According to the PTC device manufacturing method having a composition of excellent resistance recovery characteristics according to the present invention as described above, a simple part of adding a small amount of polyethylene wax in the PTC composite resin compounding process without changing the individual components of the existing PTC composite resin composition The additional process allows the room temperature resistance to be lowered while maintaining a more stable high temperature resistance.
아울러, 이렇게 제조된 PTC디바이스를 배터리나 회로보호용으로 사용하여 보다 안정적 회로디자인 및 전력손실을 방지할 수 있는 효과가 있다.In addition, the PTC device manufactured as described above is used for battery or circuit protection, and thus, more stable circuit design and power loss can be prevented.
비록 본 발명이 상기에서 언급한 바람직한 설명과 관련하여 설명되어졌지만, 본 발명의 요지와 범위로부터 벗어남이 없이 다른 다양한 수정 및 변형이 가능할 것이다. 따라서, 첨부된 청구의 범위는 본 발명의 진정한 범위 내에 속하는 그러한 수정 및 변형을 포함할 것이라고 여겨진다.Although the present invention has been described in connection with the above-mentioned preferred description, various other modifications and variations may be made without departing from the spirit and scope of the invention. Accordingly, it is intended that the appended claims cover such modifications and variations as fall within the true scope of the invention.
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