KR100401249B1 - Method of manufacturing laminate film for semiconductor fail protecting - Google Patents

Abstract

The present invention relates to a method for manufacturing a fail-shielding plate for preventing a semiconductor foil in a main PCB of a monitor, a TV, and an HDTV. More particularly, the present invention relates to a method of manufacturing a fail shield plate for preventing a semiconductor fail caused by the influence of magnetic and electromagnetic waves in a semiconductor and a peripheral device.

According to the present invention, a method for manufacturing a flat panel shielding plate for preventing a semiconductor fail, which is mounted between a shielding plate of a monitor, a TV, and an HDTV and a printed circuit board (PCB), wherein the first PET fabric is selected. Passing the roller through the tension; Coating the first PET fabric with an adhesive by a gravure coating roller; Passing the coated first PET fabric through a chamber to dry it; After passing through the chamber, laminating the aluminum (Al) foil together with a roller through which the adhesive-coated first PET fabric passes; Provided is a method for manufacturing a fail-safe shielding plate for semiconductor fail, comprising the step of winding up the laminated first PET fabric with a predetermined tension.

Thus, the present invention has the function of 1) shielding to eliminate electrical failures that can occur between the gap between the CRT and the PCB of the monitor, TV, HDTV; 2) EMI shielding, which absorbs and grounds the effects of electric and electromagnetic waves from the aluminum part of the sheet, which is coated with graphite (non-conductive) on the CRT back surface of TVs and HDTVs. Has a function; 3) It has the function of insulator to prevent short phenomena due to the earth of electromagnetic generated from PCB semiconductor and electromagnetic generated from CRT.

Description

Fail shielding plate manufacturing method for semiconductor fail prevention {METHOD OF MANUFACTURING LAMINATE FILM FOR SEMICONDUCTOR FAIL PROTECTING}

The present invention relates to a method for manufacturing a semiconductor shielding fail shield plate. More particularly, the present invention relates to a method of manufacturing a fail shield plate for preventing a semiconductor fail caused by the influence of magnetic and electromagnetic waves in a semiconductor and a peripheral device.

In general, a computer monitor and a TV are usually composed of a case, a cathode ray tube, a circuit board for applying a signal to the cathode ray tube. Some monitors and TVs have a separate shield between the cathode ray tube and the case to block electromagnetic waves emitted to the outside.

In addition, an electromagnetic shielding plate is installed to cover the second half of the printed circuit board (hereinafter referred to as PCB) to block harmful electromagnetic waves generated from the cathode ray tube (hereinafter referred to as CRT).

However, although the electromagnetic shielding plate is provided as described above, as the gap between the CRT of the monitor and the TV and the PCB is close to each other, a semiconductor failure in the PCB occurs.

This interferes with the normal operation of each semiconductor device, resulting in malfunctions such as screen off and image color bleeding.

Accordingly, an object of the present invention is to provide a fail shield for preventing a semiconductor fail caused by the influence of magnetic and electromagnetic waves in a semiconductor and a peripheral device.

Another object of the present invention is to provide a method for manufacturing a fail shield plate for preventing a semiconductor fail.

As a technical idea for achieving the above object of the present invention

In the manufacturing method of the fail-shielding plate mounted between the shielding plate of the monitor or TV and the printed circuit board (PCB) to prevent the semiconductor fail (fail),

Passing the first PET fabric through the roller with a predetermined tension;

Coating the first PET fabric with an adhesive by a gravure coating roller;

Passing the coated first PET fabric through a chamber to dry it;

After passing through the chamber, laminating the aluminum (Al) foil together with a roller through which the adhesive-coated first PET fabric passes;

Provided is a method for manufacturing a semiconductor shielding fail shield, comprising the steps of winding up the laminated first PET fabric with a predetermined tension.

1 is a structure of a fail shield plate for preventing a semiconductor fail according to the present invention.

Figure 2 is a state diagram of the installation of the fail-shielding plate according to the present invention.

3 is a flowchart of a fail-shielding plate manufacturing process according to an embodiment of the present invention.

4 is a flowchart illustrating a fail shielding plate manufacturing process according to another exemplary embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10: fail shield 20: electromagnetic shield

30: printed circuit board (PCB)

Hereinafter, with reference to the accompanying drawings, the configuration and operation of the embodiment of the present invention will be described in detail.

1 is a structural block diagram of a fail-safe plate for preventing a semiconductor fail according to the present invention, Figure 2 is a state diagram of the installation of the fail-shield plate according to the present invention.

1 and 2, the fail shield plate 10 for preventing a semiconductor fail caused by a close distance between the CRT and the PCB is mounted only on the front portion of the shield plate 20 installed behind the PCB 30. Various electronic components are mounted on the PCB 30 on which the fail shield 10 is mounted.

At this time, the fail-shielding plate 10 is made of a process in which polyester (hereinafter, PET) + adhesive + aluminum (Al) is laminated or a process in which PET + adhesive + aluminum (Al) + PET + adhesive is laminated. Are manufactured.

3 is a flowchart showing a manufacturing process of a flat plate shield plate according to the first embodiment of the present invention.

Referring to Figure 3, first one of the fabric of PET 0.188T, 0.250T, 0.300T, 0.350T fabric through a roller (tension) with a tension of 2kg (S100).

At this time, the PET fabric is coated with a gravure coating roller in the adhesive container in the process of passing through the roller and coated on the bottom of the PET fabric (S110).

After the adhesive is coated, it is passed through a guide roller and passed through a chamber to dry. At this time, the drying temperature is passed at 80 ℃ to 90 ℃ (S120).

After passing through the chamber, the aluminum foil is inserted into the roller through which the adhesive-coated PET fabric passes between the guide rollers and laminated.

Thereafter, the final laminated and finished material is completed by winding the tension of 4 kg to complete the manufacturing process of the flat plate shield plate (S140).

4 is a flowchart illustrating a manufacturing process of a fail shield plate for bending according to a second embodiment of the present invention.

Looking at Figure 4, first the PET 0.025T fabric is passed through the roller with a tension (tension) of 2kg. (S200)

At this time, the PET 0.025T fabric is buried in the adhesive container with a gravure coating roller in the process of passing through the roller is coated on the bottom of the PET fabric (S210).

The adhesive is coated and then dried while passing through a chamber through a guide roller.

At this time, the drying temperature is passed at 80 ℃ ~ 90 ℃ (S220).

After passing through the chamber, the aluminum (Al) foil is inserted into the roller through which the adhesive-coated PET fabric passes between the guide rollers and laminated.

The finished material is completed by the primary lamination is completed by winding the tension of 4kg and stored for secondary lamination. (S240)

The PET (0.188T, 0.250T, 0.300T, 0.350T) fabric is passed through a roller with a tension of 2 kg. (S250)

In the process of passing the PET fabric roller, the adhesive in the pressure-sensitive adhesive is buried with a gravure coating roller and coated on the bottom of the PET fabric. (S260)

The adhesive is coated and then dried while passing through the chamber through a guide roller. At this time, the drying temperature is passed at 80 ℃ to 90 ℃ (S270).

After passing through the chamber, the first laminated aluminum foil is inserted into the roller passing through the PET (0.025T) fabric between the guide rollers.

Finally, the second laminated material is rolled up to 4 kg to complete another manufacturing process of the fail-shield.

As described above, according to the method for manufacturing a semiconductor fail preventing shield plate according to the present invention, there are advantages as follows.

First, it has the function of shielding to eliminate electrical failures that can occur in close proximity between the CRT and the PCB.

Second, the CRT back graphite (non-conductive) is applied, but has a function of blocking the electromagnetic wave (EMI) to absorb and ground the effects of the electric and electromagnetic waves that can be generated in the uncoated portion in the aluminum (sheet) of the sheet (sheet).

Third, it has a function of an insulator to prevent short phenomena caused by the earth of the electromagnetic generated from the PCB semiconductor and the electromagnetic generated from the CRT.

Fourth, due to the high temperature (about 100 ℃) generated in the PCB capacitor has a function as a flame retardant film for fire.

Claims (4)

In the manufacturing method of the flat plate shield plate for preventing the semiconductor fail (fail) is mounted between the shield plate and the printed circuit board (PCB) of the monitor, TV, HDTV, Passing the first PET fabric through the roller with a predetermined tension; Coating the first PET fabric with an adhesive by means of a gravure coating roller; After passing through the chamber, laminating the aluminum (Al) foil together with a roller through which the adhesive-coated first PET fabric passes; The method of manufacturing a fail-shielding shield for semiconductor fail, comprising the step of winding up the laminated first PET fabric with a predetermined tension. The method of claim 1, wherein the manufacturing process for the bending of the fail-shielding plate Passing the second PET fabric through the roller with a predetermined tension; Coating the second adhesive with a second gravure coating roller using a gravure coating roller; Passing the coated second PET fabric through a chamber to dry it; After passing through the chamber, inserting the first laminated aluminum foil and the first PET fabric together into a roller through which the second PET coated fabric coated with the second adhesive passes through the second lamination; The method of claim 1, further comprising winding up the second laminated second PET fabric with a predetermined tension. delete The method of claim 1 or 2, wherein the first and second PET fabrics are used in manufacturing a shield for preventing a semiconductor foil, wherein a tension of 2 kg and 4 kg is used, respectively.