KR100365371B1 - Fixed structure of light emitting diode - Google Patents
Fixed structure of light emitting diode Download PDFInfo
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- KR100365371B1 KR100365371B1 KR1019990041194A KR19990041194A KR100365371B1 KR 100365371 B1 KR100365371 B1 KR 100365371B1 KR 1019990041194 A KR1019990041194 A KR 1019990041194A KR 19990041194 A KR19990041194 A KR 19990041194A KR 100365371 B1 KR100365371 B1 KR 100365371B1
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- South Korea
- Prior art keywords
- light emitting
- emitting diode
- metal plate
- metal
- emitting diodes
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- 239000002184 metal Substances 0.000 claims abstract description 70
- 229910052751 metal Inorganic materials 0.000 claims abstract description 70
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011551 heat transfer agent Substances 0.000 description 1
- RYZCLUQMCYZBJQ-UHFFFAOYSA-H lead(2+);dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Pb+2].[Pb+2].[Pb+2].[O-]C([O-])=O.[O-]C([O-])=O RYZCLUQMCYZBJQ-UHFFFAOYSA-H 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/19—Attachment of light sources or lamp holders
- F21S43/195—Details of lamp holders, terminals or connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/002—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips making direct electrical contact, e.g. by piercing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/05—Two-pole devices
- H01R33/06—Two-pole devices with two current-carrying pins, blades or analogous contacts, having their axes parallel to each other
- H01R33/09—Two-pole devices with two current-carrying pins, blades or analogous contacts, having their axes parallel to each other for baseless lamp bulb
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
- H01R4/2416—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
- H01R4/2445—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members having additional means acting on the insulation or the wire, e.g. additional insulation penetrating means, strain relief means or wire cutting knives
- H01R4/245—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members having additional means acting on the insulation or the wire, e.g. additional insulation penetrating means, strain relief means or wire cutting knives the additional means having two or more slotted flat portions
- H01R4/2454—Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members having additional means acting on the insulation or the wire, e.g. additional insulation penetrating means, strain relief means or wire cutting knives the additional means having two or more slotted flat portions forming a U-shape with slotted branches
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Led Device Packages (AREA)
Abstract
광 이용효율이나 제조효율면에서 우수한 발광다이오드의 고정구조를 제공한다.Provided is a light emitting diode fixing structure excellent in light utilization efficiency and manufacturing efficiency.
금속플레이트(8)에 발광다이오드(3)의 광을 반사가능한 면적을 갖는 표면부(9)가 형성되어 있기 때문에, 발광다이오드(3) 개개의 광의 이용효율이 높게 되고, 동등한 밝기를 얻는다고 하더라도 종래보다 발광다이오드(3)의 수량을 적게 할 수 있다. 따라서, 이 발광다이오드(3)를 이용한 램프구조의 간략화 및 비용의 저감을 도모할 수 있다.Since the surface portion 9 having an area capable of reflecting the light of the light emitting diodes 3 is formed on the metal plate 8, the utilization efficiency of the light of each of the light emitting diodes 3 becomes high, and even if the same brightness is achieved, The quantity of light emitting diodes 3 can be further reduced. Therefore, the lamp structure using the light emitting diodes 3 can be simplified and the cost can be reduced.
Description
본 발명은, 발광다이오드의 고정구조, 특히 차량용 램프장치에 적합한 발광다이오드의 고정구조에 관한 것이다.The present invention relates to a fixing structure of a light emitting diode, in particular to a fixing structure of a light emitting diode suitable for a vehicle lamp device.
차량용의 램프등에 사용되고 있는 발광다이오드로서는 일본 특개평 10-188614호 공보에 도시하는 바와 같이, 발광다이오드의 바닥면에 형성된 리드다리를, 램프에 설치된 프린트기판에 대하여, 납땜함으로써 고정하고 있다.As a light emitting diode used in a lamp for a vehicle, as shown in Japanese Patent Laid-Open No. 10-188614, a lead leg formed on the bottom surface of the light emitting diode is fixed by soldering to a printed board provided in the lamp.
그렇지만, 종래와 같이 프린트기판에 발광다이오드를 납땜하는 구조에서는, 발광다이오드의 광의 이용효율이 낮고, 필요한 밝기를 얻기 위하여 수많은 발광다이오드를 필요로 하고, 비용면에서 불리하다.However, in the structure in which the light emitting diodes are soldered to the printed circuit board as in the related art, the utilization efficiency of light of the light emitting diodes is low, and many light emitting diodes are required to obtain the required brightness, which is disadvantageous in terms of cost.
또, 발광다이오드의 리드다리를 1개씩 프린트기판에 납땜하기 때문에, 발광다이오드를 고정하는 작업이 번잡하고, 제조효율이 나쁘다. 또, 일단 고정된 후에 고쳐서 부착하는 작업도 곤란하다.In addition, since the lead legs of the light emitting diodes are soldered one by one to the printed circuit board, fixing the light emitting diodes is complicated and the manufacturing efficiency is poor. Moreover, it is also difficult to fix and attach once fixed.
본 발명은, 이와 같은 종래의 기술에 착안하여 이루어진 것이며, 광 이용효율이나 제조효율면에서 우수한 발광다이오드의 고정구조를 제공하는 것이다.The present invention has been made in view of such a conventional technology, and provides a fixing structure of a light emitting diode excellent in light utilization efficiency and manufacturing efficiency.
도 1은 본 발명의 한 실시형태에 관한 발광다이오드의 고정구조를 도시하는 평면도,1 is a plan view showing a fixing structure of a light emitting diode according to an embodiment of the present invention;
도 2는 발광다이오드의 고정구조를 도시하는 사시도,2 is a perspective view showing a fixing structure of a light emitting diode;
도 3은 발광다이오드의 고정구조를 도시하는 부분사시도,3 is a partial perspective view showing a fixing structure of a light emitting diode;
도 4는 코드에 대한 절결홈의 압입후의 상태를 도시하는 단면도.4 is a cross-sectional view showing a state after press-fitting of a notch groove for a cord;
(부호의 설명)(Explanation of the sign)
1: 하우징 2: 코드1: housing 2: cord
2a: 심선 2b: 외피2a: core 2b: sheath
3: 발광다이오드 8: 금속플레이트3: light emitting diode 8: metal plate
9: 표면부 10: 다리부9: surface portion 10: leg portion
11: 구멍부 13: 절결홈11: hole 13: notch groove
15: 리드 다리 16: 점퍼선15: lead leg 16: jumper wire
청구항 1에 기재된 발명은, 발광다이오드의 리드다리를 금속플레이트에 걸어맞춤하고, 이 금속플레이트를 하우징에 배정된 코드에 고정하는 발광다이오드의 고정구조로서, 상기 금속플레이이트에 발광다이오드의 광이 반사가능한 면적을 갖는 표면부가 형성되어 있다.The invention according to claim 1 is a fixing structure of a light emitting diode in which a lead leg of a light emitting diode is engaged with a metal plate, and the metal plate is fixed to a cord assigned to a housing, wherein light of the light emitting diode is reflected on the metal plate. The surface part which has an area which is possible is formed.
청구항 1에 기재된 발명에 의하면, 금속플레이트에 발광다이오드의 광이 반사가능한 면적을 갖는 표면부가 형성되어 있기 때문에, 발광다이오드 개개의 광의이용효율이 높게 되고, 동등한 밝기를 얻는다 하더라도 종래보다 발광다이오드의 수량을 적게 할 수 있다. 따라서, 이 발광다이오드를 이용한 램프구조의 간략화 및 코스트의 저감을 도모할 수 있다.According to the invention as set forth in claim 1, since the surface portion of the light emitting diode reflecting the light is formed on the metal plate, the utilization efficiency of each light of the light emitting diode becomes high, and the number of light emitting diodes is higher than before even if the equivalent brightness is obtained. Can be less. Therefore, the lamp structure using this light emitting diode can be simplified and the cost can be reduced.
청구항 2에 기재된 발명은 발광다이오드에 4개의 리드다리가 형성되고, 이 발광다이오드를, 근접배치한 2개의 금속플레이트에 의해 코드에 고정했다.In the invention according to claim 2, four lead legs are formed in the light emitting diode, and the light emitting diode is fixed to the cord by two metal plates arranged in close proximity.
청구항 2에 기재된 발명에 의하면, 발광다이오드의 리드다리가 4개이기 때문에, 고정후에 쓰러지기 어렵고, 또한 발광다이오드의 방향도 변화하기 어렵다. 또, 2개의 금속플레이트로, 1개의 발광다이오드를 고정하기 때문에, 1개의 금속플레이트의 사이즈를 작게 할 수 있고, 금속플레이트의 제조가 용이하게 된다. 또한, 2개의 금속플레이트가 서로 근접상태이기 때문에, 광의 이용효율에 미치는 영향이 적다.According to the invention of claim 2, since there are four lead legs of the light emitting diode, it is difficult to fall after fixing and the direction of the light emitting diode is also hard to change. In addition, since one light emitting diode is fixed with two metal plates, the size of one metal plate can be reduced, and the metal plate can be easily manufactured. In addition, since the two metal plates are in close proximity to each other, there is little influence on the light utilization efficiency.
청구항 3에 기재된 발명은, 발광다이오드의 리드다리가, 동과 동등이상의 전열성을 갖는 금속으로 형성되어 있다.In the invention according to claim 3, the lead leg of the light emitting diode is formed of a metal having heat conductivity equal to or higher than that of copper.
청구항 3에 기재된 발명에 의하면, 발광다이오드의 리드다리가 동과 동등이상의 전열성을 갖는 금속으로 형성되어 있기 때문에, 발광다이오드의 발열은 리드다리를 통하여 금속플레이트에 확실히 전달된다. 그리고, 그 열이 금속플레이트의 표면부에서 방열되기 때문에, 발광다이오드의 방열성이 향상된다.According to the invention as set forth in claim 3, since the lead legs of the light emitting diodes are made of a metal having heat conductivity equal to or higher than copper, the heat generation of the light emitting diodes is reliably transmitted to the metal plate through the lead legs. Then, since the heat is radiated at the surface portion of the metal plate, the heat radiating property of the light emitting diode is improved.
청구항 4에 기재된 발명은, 금속플레이트에 하우징을 향해서 접어 구부러진 다리부를 형성하고, 이 다리부의 선단에 코드의 외피를 잘라 끼워넣어 심선(芯線)과 도통하는 압입용의 절결홈이 형성되어 있다.In the invention according to claim 4, a bent portion bent toward the housing is formed on the metal plate, and a cutout groove for press-fitting in which the outer sheath of the cord is cut and inserted into the core wire to conduct with the core wire is formed.
청구항 4에 기재된 발명에 의하면, 금속플레이트의 다리부에 형성된 압입용의 절결홈이, 코드의 외피를 잘라 끼워넣어 심선과 도통하기 때문에, 이 절결홈과 코드의 접합력에 의해, 발광다이오드를 원터치로 고정할 수 있다. 종래와 같은 납땜작업이 불필요하기 때문에, 고정작업이 용이하고, 제조효율이 양호하며, 자동화도 가능하다. 또한, 고쳐서 부착하기도 용이하다. 그리고, 금속플레이트의 표면부를, 작업자가 손가락으로 누르기 위한 면으로도 이용할 수 있기 때문에, 코드에 대한 절결홈의 압입작업이 용이하다.According to the invention of claim 4, the cutout grooves for press-fitting formed in the leg portions of the metal plates cut through the outer skin of the cord and conduct with the core wire, so that the light-emitting diode is connected in one touch by the bonding force between the cutout groove and the cord. Can be fixed Since no soldering work as in the prior art is required, fixing work is easy, manufacturing efficiency is good, and automation is also possible. It is also easy to fix and attach. And since the surface part of a metal plate can also be used as a surface for an operator to press by a finger, the press-cut operation of the notch groove | channel with respect to a cord is easy.
청구항 5에 기재된 발명은 금속플레이트의 표면부에 금속색이 입혀져 있다.In the invention according to claim 5, a metal color is applied to the surface portion of the metal plate.
청구항 5에 기재된 발명에 의하면 금속플레이트의 표면부에 금속색이 입혀져 있기 때문에, 광이 반사되기 쉽고, 광의 이용효율이 더 향상된다.According to the invention of claim 5, since the metal color is coated on the surface portion of the metal plate, the light is easily reflected, and the utilization efficiency of the light is further improved.
청구항 6에 기재된 발명은 발광다이오드의 리드다리를 금속플레이트에 걸어맞춤하고, 이 금속플레이트를 하우징에 배정된 코드에 고정하는 발광다이오드의 고정구조로서, 상기 금속플레이트에, 인접하는 금속플레이트와 점퍼선으로 접속하기 위한 구멍부가 형성되어 있다.According to the sixth aspect of the present invention, there is provided a fixing structure of a light emitting diode in which a lead leg of the light emitting diode is engaged with a metal plate, and the metal plate is fixed to a cord assigned to a housing. The hole part for connecting is formed.
청구항 6에 기재된 발명에 의하면, 인접하는 금속플레이트 사이의 코드에 단선(斷線)이 생겨도, 그 금속플레이트끼리를 점퍼선에 의해 접속하여 대응할 수 있다.According to the invention of claim 6, even if a disconnection occurs in a cord between adjacent metal plates, the metal plates can be connected to each other by a jumper wire.
(발명의 실시형태)Embodiment of the Invention
이하, 본 발명의 적합한 실시형태를 도 1 ~ 도 4에 의거하여 설명한다. 이 실시형태에서는 자동차의 스톱램프의 경우를 예로 설명한다. 도면중의 부호 1은 이스톱램프의 렌즈내부에 설치된 하우징을 도시하고 있다. 스톱램프 자체가, 차체의 표면형상에 대응한 입체적 형상으로 되어 있기 때문에, 이 하우징(1)도 입체적으로 되도록 복수로 분할된 부착면(1a)이 현격한 차이로 형성되어 있다. 그리고, 각 부착면(1a)을 순번으로 통과하도록 2개의 코드(2)가 평행하게 배정되어 있으며, 이 코드(2)에 대하여 발광다이오드(3)가 고정되어 있다. 코드(2)는 심선(2a)을 외피(2b)로 덮어 씌운 구조를 하고 있다. 각 부착면(1a)에서의 발광다이오드(3)의 고정구조는 어느 것이나 동일하므로, 그 중 하나의 부착면(1a)을 도 3으로 들어서 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described based on FIG. In this embodiment, the case of the stop lamp of a motor vehicle is demonstrated to an example. Reference numeral 1 in the figure shows a housing provided inside the lens of the e-stop lamp. Since the stop lamp itself has a three-dimensional shape corresponding to the shape of the surface of the vehicle body, the housing 1 is also formed with a significant difference between the plurality of attachment surfaces 1a that are three-dimensionally formed. Then, two cords 2 are arranged in parallel so as to pass through each attachment surface 1a in turn, and the light emitting diodes 3 are fixed to the cords 2. The cord 2 has a structure in which the core wire 2a is covered with the shell 2b. Since the fixing structure of the light emitting diodes 3 in each attaching surface 1a is the same, it demonstrates by attaching one attaching surface 1a to FIG.
부착면(1a)에는, 마주보는 2매의 벽(4)이 형성되어 있고, 이 벽(4)의 상단에 형성된 절결부(5)에 각각 코드(2)에 끼워 넣어져 있다. 절결부(5)의 하측에는 코드(2)를 아래로부터 지지하는 대좌(台座)(6)가 형성되어 있다. 또, 벽(4)에는 중앙에 강성을 높이기 위한 리브(7)도 형성되어 있다.Two facing walls 4 are formed on the attaching surface 1a, and the cords 2 are fitted into the cutouts 5 formed at the upper end of the walls 4, respectively. On the lower side of the notch 5, a pedestal 6 for supporting the cord 2 from below is formed. The wall 4 is also provided with a rib 7 for increasing rigidity in the center.
부호 8은 금속플레이트로서, 표면부(9)의 양단에 부착면(1a) 측을 향해서 접어 구부린 다리부(10)가 형성되어 있다. 이 표면부(9)는 발광다이오드(3)에 덮어 씌우는 부위로서 이 발광다이오드(3)를 지지함과 동시에, 이 발광다이오드(3)를 지지한 상태로 발광다이오드(3)의 측면으로부터 표면부(9)가 크게 노출되는 면이 형성되어 있다. 또, 이 표면부(9)의 양단에는 각각 구멍부(11)가 1개씩 형성되어 있다. 그리고, 이 표면부(9)는 광을 반사하기 쉬운 금속색(은백색)으로 되어 있다. 또한, 표면부(9)에는 서로 접근한 상태로 한쌍의 슬릿(12)이 타발(쳐서 빼내다) 형상되어 있다. 다리부(10)의 선단에는 하방이 경사지게 개방된 형상의 절결구멍(13)과, 외측으로의 절기부(잘라서 세운 부)(14)가 형성되어 있다. 발광다이오드(3)는 네귀퉁이에 4개의 리드다리(15)를 구비하고 있다. 이 리드다리(15)는 전열제의 양호한 동으로 되어 있다.Reference numeral 8 is a metal plate, and leg portions 10 that are bent toward the attachment surface 1a side are formed at both ends of the surface portion 9. The surface portion 9 is a portion which covers the light emitting diodes 3 and supports the light emitting diodes 3 and supports the light emitting diodes 3 from the side surface of the light emitting diodes 3 from the side surface of the light emitting diodes 3. The surface on which (9) is greatly exposed is formed. Moreover, the hole part 11 is formed in the both ends of this surface part 9, respectively. The surface portion 9 has a metallic color (silver white) that is easy to reflect light. Moreover, the pair of slits 12 are punched out by the surface part 9 in the state which approached each other. At the distal end of the leg 10, there is formed a cutout hole 13 having a shape inclined downwardly, and a cutout portion 14 to the outside. The light emitting diode 3 has four lead legs 15 at four corners. This lead leg 15 is made of favorable copper of a heat transfer agent.
다음에 하우징(1)을 고정하는 수순을 설명한다. 먼저, 발광다이오드(3)의 리드다리(15)를 각각 금속플레이트(8)의 슬릿(12)에 꽂아서 걸어맞춤시킨다. 다음에, 금속플레이트(8)의 절결홈(13)을 각 코드(2)의 위에 세팅하고, 금속플레이트(8)의 표면부(9)를 눌러서 절결홈(13)을 각 코드(2)에 대하여 압입한다. 발광다이오드 (3)의 주위에 표면부(9)가 존재하기 때문에, 이 표면부(9)를 손가락으로 누르는 면으로서 이용되며, 압입작업이 용이하다.Next, the procedure for fixing the housing 1 will be described. First, the lead legs 15 of the light emitting diodes 3 are fitted into the slits 12 of the metal plates 8, respectively, and engaged. Next, the notch groove 13 of the metal plate 8 is set on each cord 2, and the cutout groove 13 is pushed on each cord 2 by pressing the surface portion 9 of the metal plate 8. Press in. Since the surface portion 9 exists around the light emitting diode 3, the surface portion 9 is used as a surface for pressing the surface portion 9 with a finger, and the press fitting operation is easy.
코드(2)에 대하여 절결홈(13)이 압입되면, 이 절결홈(13)이 코드(2)의 외피 (2b)를 잘라 끼워넣어 심선(2a)과 도통하기 때문에(도 4 참조), 이 절결홈(13)과 코드의 접합력에 의해, 발광다이오드(3)가 코드(2)에 대하여 고정된다. 또, 금속플레이트(8)를 통하여, 발광다이오드(3)와 코드(2)가 도통하는 상태도 얻게 된다. 코드(2)의 아래에 대좌(6)가 있기 때문에, 절결홈(13)의 압입을 확실히 행하게 된다. 또, 금속플레이트(8)의 다리부(10)는 서로 마주보는 벽(4)의 사이로 들어감과 동시에, 다리부(10)에 형성된 절기부(14)가 벽(4)에 탄성접합하고, 금속플레이트(8)의 안정된 상태가 얻어진다.When the notch groove 13 is press-fitted to the cord 2, the notch groove 13 cuts and inserts the sheath 2b of the cord 2 and conducts with the core wire 2a (see Fig. 4). The light emitting diodes 3 are fixed to the cords 2 by the bonding force between the cutout grooves 13 and the cords. In addition, a state in which the light emitting diodes 3 and the cords 2 conduct through the metal plate 8 is also obtained. Since the pedestal 6 is located under the cord 2, the notch groove 13 is press-fitted securely. In addition, the leg portion 10 of the metal plate 8 enters between the walls 4 facing each other, and the cutout portions 14 formed on the leg portion 10 are elastically bonded to the wall 4, and the metal A stable state of the plate 8 is obtained.
이와 같이, 절결홈(13)을 원터치로 코드(2)에 압입하는 것만으로, 발광다이오드(3)의 고정이 행해지기 때문에, 종래와 같은 납땜작업이 불필요하게 되고, 고정작업이 용이하며, 제조효율이 양호하고, 자동화도 가능하다. 또한 고쳐서 부착하기도 용이하다. 또, 고정된 발광다이오드(3)는 리드다리(15)가 4개이기 때문에, 고정후에 쓰러지기 어렵고, 발광다이오드(3)의 방향도 변화하기 어렵다. 또한, 1개의 발광다이오드(3)를 2개의 금속플레이트(8)로 고정하기 때문에, 1개의 금속플레이트(8)의 사이즈를 작게 할 수 있어, 금속플레이트(8)의 제조가 용이하다.As described above, since the light emitting diodes 3 are fixed by simply pressing the notch groove 13 into the cord 2 by one touch, the soldering work as in the prior art is unnecessary, and the fixing work is easy, The efficiency is good and automation is also possible. It is also easy to fix and attach. In addition, since the fixed light emitting diodes 3 have four lead legs 15, they are hard to fall down after being fixed, and the direction of the light emitting diodes 3 also hardly changes. In addition, since one light emitting diode 3 is fixed by two metal plates 8, the size of one metal plate 8 can be reduced, and the manufacture of the metal plate 8 is easy.
그리고, 고정된 발광다이오드(3)의 광은, 금속색이 행해진 금속플레이트(8)의 표면부(9)에 의해 확실히 반사되기 때문에, 발광다이오드(3) 개개의 광의 이용효율이 높다. 따라서 동등한 밝기를 얻는다 하더라도 종래보다도 발광다이오드(3)의 수량을 적게 할 수 있으며, 램프구조의 간략화 및 비용의 저감을 도모할 수 있다. 또, 2개의 금속플레이트(8)로 발광다이오드(3)를 고정하고 있는데, 2개의 금속플레이트(8)가 서로 근접해서 동일한 상태이기 때문에, 광의 이용효율이 향상된다. 또한, 발광다이오드(3)의 리드다리(15)가, 전열성이 높은 동제이기 때문에, 발광다이오드(3)의 발열은, 리드다리(15)를 통하여 금속플레이트(8)에 확실히 전해진다. 그리고, 그 열은 금속플레이트(8)의 넓은 표면부(9)에서 방열되기 때문에, 발광다이오드(3)의 방열성이 향상된다.Since the light of the fixed light emitting diode 3 is reliably reflected by the surface portion 9 of the metal plate 8 subjected to the metal color, the utilization efficiency of the light of each of the light emitting diodes 3 is high. Therefore, even if the same brightness is obtained, the quantity of the light emitting diodes 3 can be made smaller than before, and the lamp structure can be simplified and the cost can be reduced. In addition, although the light emitting diodes 3 are fixed by the two metal plates 8, since the two metal plates 8 are in the same state in close proximity to each other, the light utilization efficiency is improved. In addition, since the lead legs 15 of the light emitting diodes 3 are made of copper having high heat conductivity, the heat generated by the light emitting diodes 3 is reliably transmitted to the metal plate 8 through the lead legs 15. The heat is dissipated in the wide surface portion 9 of the metal plate 8, so that the heat dissipation of the light emitting diodes 3 is improved.
또한, 금속플레이트(8)의 표면부(9)에 각각 구멍부(11)가 1개씩 형성되어 있기 때문에, 만일 인접하는 금속플레이트(8)와의 사이의 코드(2)에 단선이 생겨도, 도 1에 도시하는 바와 같이, 점퍼선(16)의 양단부를 각 금속플레이트(8)의 구멍부에 대하여 작은 나사(17)로 고정하는 것으로 되어, 그 금속플레이트(8)끼리를 전기적으로 접속상태로 할 수 있다. 이와 같이 예측불허의 사태에 대한 대응책도 고려되어 있기 때문에 신뢰성이 높다.In addition, since one hole 11 is formed in each of the surface portions 9 of the metal plate 8, even if a wire break occurs in the cord 2 between the adjacent metal plates 8, FIG. As shown in Fig. 2, both ends of the jumper wires 16 are fixed with small screws 17 to the hole portions of the metal plates 8, and the metal plates 8 are electrically connected to each other. Can be. As such countermeasures against unforeseen circumstances are considered, they are highly reliable.
청구항 1에 기재된 발명에 의하면, 금속플레이트에, 발광다이오드의 광을 반사가능한 면적을 갖는 표면부가 형성되어 있기 때문에, 발광다이오드 개개의 광의 이용효율이 높게되고, 동등한 밝기를 얻는다 하더라도 종래보다 발광다이오드의 수량을 적게 할 수 있다. 따라서, 발광다이오드를 이용한 램프구조의 간략화 및 비용의 저감을 도모할 수 있다.According to the invention as set forth in claim 1, since the metal plate has a surface portion having an area capable of reflecting light of the light emitting diode, the utilization efficiency of each light of the light emitting diode is increased, and even if the same brightness is obtained, The quantity can be reduced. Therefore, the lamp structure using the light emitting diode can be simplified and the cost can be reduced.
청구항 2에 기재된 발명에 의하면, 발광다이오드의 리드다리가 4개이기 때문에, 고정후에 쓰러지기 어려우며, 또한 발광다이오드의 방향도 변화하기 어렵다. 또, 2개의 금속플레이트로 1개의 발광다이오드를 고정하기 때문에, 1개의 금속플레이트의 사이즈를 작게 할 수 있고, 금속플레이트의 제조가 용이하게 된다. 또한, 2개의 금속플레이트가 서로 근접상태이기 때문에, 광의 이용효율에 미치는 영향이 작다.According to the invention of claim 2, since there are four lead legs of the light emitting diode, it is difficult to fall after fixing, and the direction of the light emitting diode is also hard to change. In addition, since one light emitting diode is fixed by two metal plates, the size of one metal plate can be reduced, and the metal plate can be easily manufactured. In addition, since the two metal plates are in close proximity to each other, the influence on light utilization efficiency is small.
청구항 3에 기재된 발명에 의하면, 발광다이오드의 리드다리가, 동과 동등 이상의 전열성을 갖는 금속으로 형성되어 있기 때문에, 발광다이오드의 발열은 리드다리를 통하여 금속플레이트에 확실히 전달된다. 그리고, 그 열이 금속플레이트의 표면부에서 방열되기 때문에, 발광다이오드의 방열성이 향상된다.According to the invention as set forth in claim 3, since the lead legs of the light emitting diodes are formed of a metal having heat conductivity equal to or higher than copper, the heat generation of the light emitting diodes is reliably transmitted to the metal plate through the lead legs. Then, since the heat is radiated at the surface portion of the metal plate, the heat radiating property of the light emitting diode is improved.
청구항 4에 기재된 발명에 의하면, 금속플레이트의 다리부에 형성된 압입용의 절결홈이, 코드의 외피를 잘라 끼워넣어 심선과 도통하기 때문에, 이 절결홈과 코드의 접합력에 의해, 발광다이오드를 원터치로 고정할 수 있다. 종래와 같은 납땜작업이 불필요하기 때문에, 고정작업이 용이하고, 제조효율이 양호하며, 자동화도 가능하다. 또한 고쳐서 부착하기도 용이하다. 그리고 금속플레이트의 표면부를 작업자가 손가락으로 누르기 위한 면으로서도 이용할 수 있기 때문에, 코드에 대한 절결홈의 압입작업이 용이하다.According to the invention of claim 4, the cutout grooves for press-fitting formed in the leg portions of the metal plates cut through the outer skin of the cord and conduct with the core wire, so that the light-emitting diode is connected in one touch by the bonding force between the cutout groove and the cord. Can be fixed Since no soldering work as in the prior art is required, fixing work is easy, manufacturing efficiency is good, and automation is also possible. It is also easy to fix and attach. And since the surface part of a metal plate can be used also as a surface for an operator to press by a finger, the press-cutting operation of the notch groove to a cord is easy.
청구항 5에 기재된 발명에 의하면, 금속플레이트의 표면부에 금속색이 입혀져 있기 때문에, 광이 반사되기 쉽고, 광의 이용효율이 더 향상된다.According to the invention of claim 5, since the metal color is coated on the surface portion of the metal plate, light is easily reflected and the utilization efficiency of the light is further improved.
청구항 6에 기재된 발명에 의하면, 인접하는 금속플레이트 사이의 코드에 단선이 생겨도, 그 금속플레이트끼리를 점퍼선에 의해 접속하여 대응할 수 있다.According to the invention of claim 6, even if a disconnection occurs in a cord between adjacent metal plates, the metal plates can be connected to each other by a jumper wire.
Claims (6)
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JP32694198A JP3807131B2 (en) | 1998-11-17 | 1998-11-17 | Light emitting diode fixing structure |
JP98-326941 | 1998-11-17 |
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KR20000034942A KR20000034942A (en) | 2000-06-26 |
KR100365371B1 true KR100365371B1 (en) | 2002-12-18 |
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TW200700795A (en) | 2005-06-30 | 2007-01-01 | Benq Corp | Fixing structure |
JP4916982B2 (en) * | 2007-09-19 | 2012-04-18 | スタンレー電気株式会社 | Connector for multi-core flat cable |
JP2011243512A (en) * | 2010-05-20 | 2011-12-01 | Birumen Kagoshima:Kk | Led lighting tool |
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1999
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0571887U (en) * | 1992-02-26 | 1993-09-28 | 株式会社ナカネ | Signboard with a combination of funnel type reflector and light emitting diode |
JPH065924A (en) * | 1992-06-17 | 1994-01-14 | Seiko Epson Corp | Mounting method for light emitting diode |
KR940014116A (en) * | 1992-12-26 | 1994-07-16 | 윤종용 | Pellet exchanger |
JPH0662926U (en) * | 1993-02-23 | 1994-09-06 | 株式会社日立ホームテック | Display device |
JPH0736180U (en) * | 1993-12-21 | 1995-07-04 | ローム株式会社 | Light emitting display panel structure |
KR950029015U (en) * | 1994-03-30 | 1995-10-20 | 삼성전자주식회사 | LED light reflector |
JP3048433U (en) * | 1997-04-11 | 1998-05-15 | 美治 福元 | Signs that combine a reflective sheet and a light-emitting diode lamp |
Also Published As
Publication number | Publication date |
---|---|
KR20000034942A (en) | 2000-06-26 |
JP3807131B2 (en) | 2006-08-09 |
JP2000151150A (en) | 2000-05-30 |
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