KR100350778B1 - A medium of heat composition - Google Patents

A medium of heat composition Download PDF

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KR100350778B1
KR100350778B1 KR1019990054388A KR19990054388A KR100350778B1 KR 100350778 B1 KR100350778 B1 KR 100350778B1 KR 1019990054388 A KR1019990054388 A KR 1019990054388A KR 19990054388 A KR19990054388 A KR 19990054388A KR 100350778 B1 KR100350778 B1 KR 100350778B1
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heat medium
weight
heat
medium
present
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KR1019990054388A
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KR20010053850A (en
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오석재
김호균
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(주)테크노 켐
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/10—Liquid materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Lubricants (AREA)
  • Paints Or Removers (AREA)

Abstract

본 발명은 디메틸에테르(dimethylether) 88.5∼89.5중량%, 에탄올(ethanol) 8.5∼9.5중량%, 에틸렌글리콜(Ethylene Glycol) 2.5∼3.0중량% 그리고 실리콘오일(silicon oil) 1.0∼1.5중량%으로 조성된 저온용 히트파이프에 사용되는 열매체에 관한 것이다.The present invention is composed of 88.5 to 89.5% by weight of dimethylether, 8.5 to 9.5% by weight of ethanol, 2.5 to 3.0% by weight of ethylene glycol and 1.0 to 1.5% by weight of silicone oil. It relates to a heat medium used for low temperature heat pipes.

Description

저온용 히트파이프에 사용하는 열매체 {A MEDIUM OF HEAT COMPOSITION}Thermal medium for low temperature heat pipes {A MEDIUM OF HEAT COMPOSITION}

본 발명은 저온용 히트파이프에 사용하는 열매체에 관한 것으로서, 디메틸에테르(dimethylether), 에탄올(ethanol), 에틸렌글리콜(Ethylene Glycol) 및 실리콘 오일(silicon oil)로 조성된 저온용 히트파이프에 사용하는 열매체에 관한 것이다.본 발명의 열매체는 히트파이프에 사용하는 열매체로서 환경 친화적이며 인체에 무해하며 히트파이프 소재에 부식을 일으키지 않는 특성을 가지며, -40∼70℃에서의 저온용으로서 사용되는 것이다.기존의 히트파이프에 사용하는 열매체에는 CHClF2, CCl2F2, 물(H2O) 그리고 CH2ClCF3등이 있다. CHClF2의 사용온도범위는 -40∼30℃, CCl2F2은 -30∼50℃, 물(H2O)은 30∼200℃ 그리고 CH2ClCF3은 -10∼140℃이다. 사용 가능한 재질에 있어서 물(H2O)은 동, 스테인레스 그리고 연강에만 적합하고 알루미늄에는 적합하지가 않다. CHClF2, CCl2F2 그리고 CH2ClCF3은 알루미늄에 사용 가능하다(표1 참조). 기존의 히트파이프용 열매체는 장기간 사용하였을 때 히트파이프 내부에 수분이 맺히게 됨으로써 그 수분이 열매체 수명 저하 및 히트파이프 재질에 부식의 영향을 주고 열매체가 열을 전달하는데 방해를 한다. 따라서 수명도 3∼5년 정도가 되는 반면 본 발명의 열매체는 흡수되는 수분과 잘 작동될 수가 있어 내구성을 훨씬 증대시킬 수가 있다.The present invention relates to a heat medium for use in low temperature heat pipes, which is used in low temperature heat pipes composed of dimethylether, ethanol, ethylene glycol and silicon oil. The heat medium of the present invention is a heat medium used in heat pipes, which is environmentally friendly, harmless to humans, does not cause corrosion to heat pipe materials, and is used for low temperature at -40 to 70 ° C. The heat medium used for the heat pipe of CHClF2, CCl2F2, water (H2O) and CH2ClCF3. The operating temperature range of CHClF2 is -40 to 30 ° C, CCl2F2 is -30 to 50 ° C, water (H2O) is 30 to 200 ° C and CH2ClCF3 is -10 to 140 ° C. In the materials available, water (H2O) is only suitable for copper, stainless and mild steel, not aluminum. CHClF2, CCl2F2 and CH2ClCF3 are available for aluminum (see Table 1). The existing heat medium for heat pipes forms moisture in the heat pipe when used for a long time, so that the moisture affects the life of the heat medium and the corrosion of the heat pipe material and prevents the heat medium from transferring heat. Therefore, the lifespan is about 3 to 5 years, while the heat medium of the present invention can work well with the absorbed water, which can further increase durability.

상기와 같은 문제점을 해결하기 위하여 본 발명은 스테인레스, 알루미늄, 동 그리고 연강 등의 소재로 만들어진 히트파이프 안에 사용되는 열매체로서, 종래의 가장 많이 사용되어온 CFC계의 열매체는 지구의 오존층을 파괴하고 있어 이 문제점을 해결하고 히트파이프 소재의 내부 부식을 발생시키지 않게 하며 사용온도영역을 -40∼70℃로 하는 열매체 조성물 제공을 목적으로 한다.In order to solve the above problems, the present invention is a heat medium used in a heat pipe made of materials such as stainless steel, aluminum, copper, and mild steel, and the CFC-based heat medium, which has been used the most, is destroying the earth's ozone layer. The purpose of the present invention is to provide a thermal medium composition which solves the problem and does not cause internal corrosion of the heat pipe material and has a use temperature range of -40 to 70 ° C.

상기와 같은 목적을 달성하고자 본 발명은 디메틸에테르(dimethyl ether) 88.5∼89.5중량%, 에탄올(ethanol) 8.5∼9.5중량%, 에틸렌글리콜(Ethylene Glycol) 2.5∼3.0중량% 그리고 실리콘 오일(silicon oil) 1.0∼1.5중량%로 구성된 저온용 히트파이프에 사용하는 열매체에 관한 것이다.이하 본 발명을 실시예를 통하여 상세히 설명하기로 하겠다.실시예먼저 반응 믹서기 내부를 물로 세정하고, 그 안에 이물질이 없음을 확인 한 후 증류수로 다시 세정한 후 건조한 다음,에탄올(ethanol) 8.5∼9.5중량%, 에틸렌글리콜(Ethylene Glycol) 2.5∼3.0중량% 그리고 실리콘 오일(silicon oil) 1.0∼1.5중량%로 조성된 조성물을 상기 반응 믹서기에 투입하여 밀폐를 한 후에, 주입기를 이용하여 디메틸에테르(dimethyl ether) 88.5∼89.5중량%를 넣고 초음파를 사용하여 20분 교반 하여 저온용 히트파이프에 사용하는 열매체를 제조하였다.실험예상기 실시예 에서 제조한 저온용 히트파이프에 사용하는 열매체를 다음과 같은 실험을 하였다.스테인레스, 알루미늄, 황동, 청동 그리고 연강의 소재로 된 히트파이프를 표 2의 조건으로 2200시간 부식실험 하였다. 그러나 부식은 발생하지 않았다. 이렇게 제조한 열매체 조성물의 원리와 성질(특성)은 다음과 같다. 먼저 본 발명의 열매체는 지구온난화 및 오존층 파괴에 영향이 없는 화합물들이며, 산소와 만났을 때 -40∼70℃에서 산화력이 없는 물질들이므로 부식의 염려가 없으며 특히 실리콘 오일의 첨가는 열매체에 섞이어 작동유체의 물리화학적 성질에 영향을 주어 디메틸 에테르의 극성 성질을 알코올과 에틸렌글리코올이 용해시켜 주고 있어 히트파이프의 상단으로 이동시 이들 화합물들은 동시 다발적으로 이동이 되며 실리콘오일의 첨가는 이들 분자들의 인력과 척력의 평형상태를 유지시켜 주는 기능을 담당하고 있어 증발 시 빠르게 이동을 할 수 있게 하는 역할을 한 것이다. 그리고 실리콘오일과 에틸렌글리코올의 첨가 비율에 따라 열매체 내의 분자들의 인력과 척력에 의한 상호작용에 영향을 미치므로(에틸렌글리코올은 hydroxy 기가 두 개가 있다.) 이 조성의 정확한 설정이 필요하다(표3 참조). 가장 좋은 비율은 본 발명의 열매체 조성임을 알았다. 본 발명의 열매체 성질은 색상: 백색, 형상: 액체, 조성: 비이온성, 냄새: 없음, PH: 6.5±0.5이며 일반LPG용기에 약 85%를 넣고 포장하여 출하할 수 있다. 이상과 같이 본 발명의 열매체는 히트파이프에 부식을 발생시키는 일이 없고 스테인레스 등의 철제, 황동 또는 청동 등의 동제, 알루미늄등 재료의 종류 여하를 막론하고 사용 가능하다. 장기간 열매체의 변질이 없고 가격면에서도 경제적인 장점이 있다.In order to achieve the above object, the present invention provides 88.5 to 89.5% by weight of dimethyl ether, 8.5 to 9.5% by weight of ethanol, 2.5 to 3.0% by weight of ethylene glycol, and silicone oil. The present invention relates to a heat medium used for a low temperature heat pipe composed of 1.0 to 1.5% by weight. Hereinafter, the present invention will be described in detail with reference to Examples. First, the inside of the reaction mixer is washed with water and there is no foreign matter therein. After confirmation, the mixture was washed again with distilled water and dried, and then the composition consisting of 8.5 to 9.5% by weight of ethanol, 2.5 to 3.0% by weight of ethylene glycol and 1.0 to 1.5% by weight of silicone oil was prepared. After closing the product by adding it to the reaction mixer, 88.5 to 89.5% by weight of dimethyl ether was added using an injector, and stirred for 20 minutes using ultrasonic waves to be used for a low temperature heat pipe. Experimental Example The heat medium used for the low temperature heat pipe manufactured in the above example was subjected to the following experiment. Heat pipes made of stainless steel, aluminum, brass, bronze and mild steel were subjected to the conditions shown in Table 2. Corrosion test for 2200 hours. But no corrosion occurred. The principle and properties (characteristics) of the heat medium composition thus prepared are as follows. First of all, the heat medium of the present invention is a compound which does not affect global warming and ozone layer destruction, and it is a non-oxidizing material at -40 to 70 ° C. when it encounters oxygen, so there is no fear of corrosion. It affects the physicochemical properties of the fluid, so that the polarity of dimethyl ether is dissolved by alcohol and ethylene glycol. These compounds move simultaneously when moving to the top of the heat pipe, and the addition of silicon oil is the attraction of these molecules. It is responsible for maintaining the equilibrium of the repulsive force, so that it can move quickly when evaporating. The addition of silicon oil and ethylene glycol affects the attractive force and repulsive interaction of molecules in the heat medium (ethylene glycol has two hydroxy groups). 3). It was found that the best ratio was the heat medium composition of the present invention. The heat medium properties of the present invention are color: white, shape: liquid, composition: nonionic, odor: none, PH: 6.5 ± 0.5 and can be shipped shipped in a normal LPG container in about 85%. As described above, the heat medium of the present invention does not cause corrosion in the heat pipe, and can be used regardless of any kind of materials such as iron such as stainless steel, copper such as brass or bronze, and aluminum. There is no deterioration of heat medium for a long time and there is an economic advantage in terms of price.

<표1> 기존의 열매와 본 발명의 열매체의 성질.TABLE 1 Existing fruits and properties of the heat medium of the present invention.

*ODP: zone epletion otential* ODP: zone epletion otential

**GWP: lobal armming otential** GWP: lobal armming otential

<표2> 재질의 호환성 실험.<Table 2> Compatibility experiment of materials.

조 건 : 길이 50cm, 내경 10mm의 히트파이프 안에 열매체를 넣고 밀폐한 후 130℃의 항온조에 1시간 유지 2시간 방치 등의 조건으로 총 4400시간을 실험하였다.Condition: A total of 4400 hours were tested under conditions such as 1 hour holding and 2 hours standing in a thermostatic chamber at 130 ° C after the heat medium was sealed in a heat pipe having a length of 50 cm and an inner diameter of 10 mm.

<표3> 열매체 조성에 따른 물리적 성질 실험 결과.<Table 3> Experimental results of physical properties according to the heat medium composition.

*ODP: zone epletion otential* ODP: zone epletion otential

**GWP: lobal armming otential** GWP: lobal armming otential

상기와 같은 본 발명은 기존 열매체들과 비교하여 소재의 부식, 작동하는 시간의 길어짐 그리고 환경과 인체에 영향을 주므로 이러한 단점을 보안한 경제적인 열매체를 제공하며 특히 저온용으로 사용하는 효과가 있다.As described above, the present invention provides an economical heat medium that secures these disadvantages because it affects the corrosion of the material, the length of operating time, and the environment and the human body in comparison with the existing heat medium, and is particularly effective for low temperature use.

Claims (1)

저온용 히트파이프에 사용하는 열매체에 있어서,In the heat medium used for a low temperature heat pipe, 디메틸에테르(dimethyl ether) 88.5∼89.5중량%, 에탄올(ethanol) 8.5∼9.5중량%, 에틸렌글리콜(EthyleneGlycol) 2.5∼3.0중량% 그리고 실리콘 오일 1.0∼1.5중량%로 조성되어 있음을 특징으로 하는 저온용 히트파이프에 사용하는 열매체.For low temperature, it is composed of 88.5 to 89.5% by weight of dimethyl ether, 8.5 to 9.5% by weight of ethanol, 2.5 to 3.0% by weight of ethylene glycol and 1.0 to 1.5% by weight of silicone oil. Heat medium used for heat pipe.
KR1019990054388A 1999-12-02 1999-12-02 A medium of heat composition KR100350778B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0724003A2 (en) * 1995-01-25 1996-07-31 Oho, Suk Jae Refrigerant composition
WO1999029799A1 (en) * 1997-12-11 1999-06-17 Cho, Suk, Jae A refrigerant composition for self-cooling beverage can and a process for producing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0724003A2 (en) * 1995-01-25 1996-07-31 Oho, Suk Jae Refrigerant composition
WO1999029799A1 (en) * 1997-12-11 1999-06-17 Cho, Suk, Jae A refrigerant composition for self-cooling beverage can and a process for producing the same

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