KR100336163B1 - System and method of generating three-dimensional structure for numerical analysis - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a numerical analysis technique for simulation of semiconductor processes, and in particular, an initial step required to generate a mesh structure to perform numerical analysis on a structure having a complex three-dimensional geometric shape formed on a wafer during semiconductor manufacturing. Provides a technique for generating structure generation files.

According to the present invention, in order to generate node information, polygon information, polyhedron information, initial condition information, etc. for a numerical analysis mesh structure for a three-dimensional structure, two-dimensional mask data, three-dimensional structure transformation information, structure loading information, material information, By providing a graphic user environment for inputting curved surface information and a file generation module, an initial structure generation file including node information, polygon information, polyhedron information, and initial condition information required for mesh generation may be generated. In addition, by creating a surface data file containing coordinate data for complex structures with curved surfaces, it is possible to refer to complex structures with curved surfaces during meshing. As a result, it is possible to reduce the time required to generate the mesh structure required for the numerical simulation simulation of the complex structure, and to easily regenerate the mesh even with the structural change.

Description

3D structure generation system and method for numerical analysis {SYSTEM AND METHOD OF GENERATING THREE-DIMENSIONAL STRUCTURE FOR NUMERICAL ANALYSIS}

The present invention relates to a three-dimensional structure modeling and mesh generation technology, and in particular to the three-dimensional shape representation and recognition technology for a structure having a complex geometric shape on the wafer in order to simulate the semiconductor structure formed on the wafer by a numerical analysis method It is about.

With the development of integrated circuit processing technology, the minimum line width is decreasing to deep-sub-quarter-micron. As a result, the chip density increases, and the number of transistors included in the chip exceeds about 20 million, and the metal wiring for interconnecting the transistors included in the chip for the operation of the chip also has 6-7 layers. As multilayer wiring is used, the complexity of the chip is increasing.

On the other hand, the chip in the development stage is to perform the experiment or computer simulation that can predict the chip performance in order to predict the chip performance. However, the method of predicting performance through experiments has a huge experiment cost, and recently, computer simulations have been performed. That is, the chip performance is predicted through simulation through the numerical calculation of the physical phenomena that dominates the chip performance.

However, as the minimum line width used in the integrated circuit process decreases to increase the chip density and the complexity of the chip, a three-dimensional trend is prominent in the physical phenomena that dominates the chip performance. Only three-dimensional simulations of the physical phenomena governing can predict chip performance.

As an example of the prediction of the operation delay time by the metal wiring in the chip, the operation delay time by the metal wiring in the chip calculates the parasitic capacitance and the resistance component in the metal wiring connecting the transistors, and predicts the operation delay time from this. In the past, parasitic capacitances and resistance components of metal wirings connecting transistors were calculated by applying them to physical equations based on the two-dimensional layout shape of the metal wirings.

However, as the metal wires interconnecting the transistors as described above have complex three-dimensional geometrical shapes with multi-layered wires having 6 to 7 layers, the method of the past no longer accurately predicts them. The parasitic capacitance is calculated numerically by calculating the three-dimensional electromagnetic field distribution in the multilayer wiring and the insulating film surrounding the multilayer wiring by the voltage applied to the multilayer wiring, and calculating the energy loss in the multilayer wiring and the energy accumulated in the insulating film. And resistance components can be accurately predicted.

That is, in order to accurately predict the operating characteristics of the chip, three-dimensional numerical simulations must be performed on the physical phenomena related to the factors that govern the operating characteristics.

Meanwhile, in performing three-dimensional numerical simulations of physical phenomena, numerical values such as the finite element method (FEM), finite differential method (FDM), and boundary element method (BEM) Interpretation techniques are widely used.

The numerical method described above requires a mesh structure that stores data necessary for numerical analysis in order to perform numerical simulation. The mesh structure includes coordinates of each node constituting the mesh structure and initial conditions and boundary conditions necessary for numerical analysis.

Recently, the finite element method using tetrahedral elements is the most widely used due to the accuracy of numerical analysis and the possibility of expressing complex structures. In addition, in creating a mesh structure consisting of tetrahedral elements, mesh generation using a three-dimensional delaunay or an advancing front method to maintain a constant mesh quality for complex geometric shapes. The method is used, and such a mesh generation method must define an initial structure for mesh generation.

However, for chips with increased integration and complexity, even though the prediction of physical phenomena for three-dimensional shapes is possible through numerical methods, there are many difficulties in generating the mesh structure required to perform numerical analysis, in particular, mesh generation. There is a lot of difficulty in creating an initial structure.

1 illustrates an embodiment of an initial structure definition method for generating a mesh structure required to perform a three-dimensional numerical analysis according to the prior art. Referring to FIG. 1, text constructs 40, 50, 60 to define the shape of the initial structures 10, 20, 30 and the initial structures 10, 20, 30 necessary for generating the mesh required for numerical analysis. ) Is shown.

According to the prior art, the text syntax 50 for generating the initial structure 20 is a header 51 for declaring the shape and shape of the structure 20, the coordinates for the two-dimensional cross section 25 of the structure 20 ( 52, two vectors 53, 54 for calculating the three-dimensional extension vector 26 of the two-dimensional cross section 25.

That is, the coordinates 52 of the cross section 25 defined on a specific plane such as the XZ plane or the XY plane are moved in the direction of an arbitrary extension vector 26 to generate a new coordinate 55, and the existing cross section 25 is used. Using the coordinates 52 and the new coordinates 55 of the three-dimensional structure is generated.

However, the related art generates a structure by parsing it based on a text syntax input by a user, and thus, a high probability of error occurs while inputting a syntax for generating a structure. In addition, as the structure to be created becomes more complicated, the amount of data to be input is enormous, making it impossible to generate the structure.

Accordingly, a first object of the present invention is to provide a three-dimensional structure generation system and method for recognizing a three-dimensional structure on a substrate as a structure capable of numerical analysis, for the calculation of the complex three-dimensional structure manufactured on a semiconductor substrate To provide.

A second object of the present invention is to provide a three-dimensional structure generation system and method that can recognize a three-dimensional structure having a curved surface on the substrate as a structure capable of numerical analysis, in addition to the first object.

It is a third object of the present invention to provide a system and method for generating an initial structure required to generate a numerical analysis mesh for a structure having a complex geometric shape in addition to the first object.

1 is a view showing a three-dimensional structure generation method according to the prior art.

2 is a block diagram of a three-dimensional structure generating system according to an embodiment of the present invention.

3A-3E illustrate a graphical user environment of a three-dimensional structure generation system in accordance with a preferred embodiment of the present invention.

Figures 4a to 4d is a working flow diagram showing a method of generating a three-dimensional structure according to the present invention.

5a to 5i are views showing one embodiment of a three-dimensional structure generated according to the three-dimensional structure generation method according to the present invention.

<Explanation of symbols for main parts of the drawings>

100: 3D structure generation system

120: initial structure generation file generation module

130: surface data file generation module

140: database means

150: initial structure definition file

160: surface data file

200: mask data input module

300: material information input module

400: surface information input module

500: 3D structure transformation information input module

600: 3D structure loading information input module

In order to achieve the above object, in the three-dimensional structure generation system for creating a three-dimensional structure having a complex geometric shape, two-dimensional mask data having a graphical user environment that can input the two-dimensional coordinate data required for generating the structure Input module; A 3D structure conversion information input module and a structure loading information input module capable of receiving data necessary for converting the 2D coordinate data input by the 2D mask data into 3D coordinate data; A curved surface information input module capable of receiving curved surface data necessary for representing a non-flat curved surface of the structure; A material information input module capable of receiving material information necessary for setting an initial simulation condition of the structure; Database means for storing the input two-dimensional mask data, three-dimensional structure transformation information, three-dimensional structure loading information, curved surface information, material information; An initial structure generation file generation module for converting the input data to generate an initial structure generation file required for mesh generation; And a curved data file generation module for generating a curved data file including curved surface data of the initial structure.

In order to achieve another object of the present invention, a three-dimensional structure generation method for generating a three-dimensional structure having a complex geometric shape, comprising the steps of: inputting and storing the two-dimensional mask data in a database means; Setting a simulation area in the input mask data; Inputting curved surface information and storing it in a database means; Inputting three-dimensional structure conversion information for each input mask and storing in the database means; Inputting three-dimensional structure loading information and storing in database means; Extracting coordinate data of a mask object of a portion corresponding to the set simulation area from the input mask object; Separating each simulation mask region using the extracted mask object, and storing the separated mask region segment data and polygon data; Reading 3D structural load information from the database and determining an order of generating a tomographic structure; Reading the three-dimensional structure transformation information of the mask according to the order of generating the single-layer structure, generating a single-layer structure and generating a multi-layer structure without contact; Regenerating the multilayer structure by reading contact information from the 3D structure loading information and adding a contact polyhedron to the multilayer structure; And generating an initial structure generation file and a surface data file for generating the three-dimensional structure.

Hereinafter, an initial mesh structure generation technique of a three-dimensional structure for numerical analysis according to the present invention will be described in detail with reference to the accompanying drawings.

2 is a block diagram of a three-dimensional structure definition system for generating a mesh of a complex geometry in accordance with the present invention. Referring to Figure 2, the three-dimensional structure definition system 100 according to the present invention is a mask data input module 200, material information input module 300, a curved surface that the user can easily input the data required for the structure definition A graphical user environment 110 is provided, such as an information input module 400, a three-dimensional structure conversion information input module 500, and a three-dimensional structure loading information input module 600.

In addition, an initial structure definition file generation module 120 and a surface data file for generating an initial structure definition file 150 and a surface data file 160 for generating a mesh using data input through the graphic user environment 110. The generation module 130 is provided. In addition, the database unit 140 includes an initial structure generation information database, a material information database, a curved surface information database, and the like, capable of storing data input through the graphical user environment 110.

When a user inputs data necessary for defining a 3D structure through the graphic user environment 110, the input data is processed to generate node data polygon data and polyhedron data defining the 3D structure, and an initial structure required for mesh generation. The definition file 150 and the surface data file 160 are generated.

As a preferred embodiment according to the present invention, the data required to define the three-dimensional structure may include two-dimensional mask data, three-dimensional structural transformation information, three-dimensional structure loading information, material information, curved surface information.

The present invention converts coordinate points of several two-dimensional figures on an XY plane into three-dimensional nodes using three-dimensional structural transformation information and three-dimensional loading information, and combines three-dimensional nodes to constitute a fault structure and each fault structure. You will create a complex multilayered structure. The mask object referred to in the present invention means a figure on a plane, and the mask means a group of several mask objects.

Coordinates of each figure are divided and stored in a mask unit. In addition, the three-dimensional structural transformation information and the structural loading information is necessary information to generate the three-dimensional coordinates by moving the coordinates of each mask object, the three-dimensional structural transformation information is information required to define the tomographic structure using the mask data, Structural loading information refers to the information needed to define a complex structure using a fault structure.

In a preferred embodiment according to the present invention, the initial structure definition file 160 may include coordinates of nodes, polygon information consisting of nodes, and polyhedron information consisting of polygons as data required for generating a mesh. In addition, the curved surface data file may include a plurality of three-dimensional coordinates included in the complex curved surface.

3A illustrates a two-dimensional mask data input module of a three-dimensional structure definition system according to the present invention. Referring to FIG. 3A, the mask data input module 200 may select a layout area 210 in which a mask object 201 having respective mask information is drawn and a mask selection area 220 in which one of the defined masks may be selected. It consists of a toolbar area 230 that contains tools for drawing mask objects and tools for executing other modules that can enter data needed for creating structures.

The user selects a mask to include the mask object 201 to be drawn by clicking the mask selection button 221 in the mask selection area 220. Subsequently, the shape of the mask object may be selected by clicking the mask object shape button 231 of the toolbar area 230.

The user may draw the mask object 201 and input the coordinates using the coordinate points when the user clicks or releases by repeating the clicking, dragging, and releasing operation with the mouse in the layout area 210. have. In addition, the shape of the mask object 201 may be modified by using a mask editing tool button in the toolbar area 230.

As a preferred embodiment of the present invention, the mask object shape button 114 may include a circle, a rectangle, a polygon, a certain width line. In addition, the mask editing tool button 115 may be a button for connecting a function of moving the coordinates of the drawn mask object 111 and may include flipping of coordinates, rotational movements, and coordinate editing functions. In addition, the user may add or delete a mask by clicking the add mask button 233 or the delete mask button 234 of the toolbar area 230 to define a complex structure.

As a preferred embodiment of the present invention, the user has a simulation area setting button 232 in the toolbar area 230 to simulate the area of the mask layout defined in the layout area 210 to be simulated. Is drawn using the mouse.

In addition, as a preferred embodiment of the present invention, the three-dimensional structure definition system is provided with a two-dimensional mask data conversion module to convert the input two-dimensional mask data can be used as new mask data.

Figure 3b is a view showing a material information input module of the three-dimensional structure definition system according to the present invention. Referring to FIG. 3B, the material information input module 300 is a module that receives data necessary for simulation of a structure defined by a 3D structure definition system. The toolbar area 230 of the 2D mask data input module 200 is input. It can be executed by clicking the substance information input module execution button 237 in the.

The substance information input module 300 according to the present invention may input a substance information referrer name list 310 showing a list of defined substances, a substance information referrer name 320, and substance specific characteristic data 330. It contains an input section. The user may input the substance information by inputting the substance information reference name 320 and the substance specific characteristic data 330 and clicking the substance information add button 340.

According to a preferred embodiment of the present invention, the inputted substance information is selected by clicking on a desired substance information reference in the substance information reference name list 310 and then deleting by clicking the delete substance information button 350, or the substance specific characteristic data ( After modifying 330, the substance information may be modified by clicking the substance information modification button 360. In addition, when the input for the material information is finished, press the confirm button 370 to end.

In a preferred embodiment of the present invention, the material specific characteristic data 330 that can be input from the material information input module 300 may be the permittivity, electrical conductivity, thermal conductivity, etc. of the material. Can be.

Figure 3c is a diagram showing the surface data input module of the three-dimensional structure definition system according to the present invention. Referring to FIG. 3C, the curved surface data input module 400 is a module that receives data necessary for expressing a complex curvature of a structure defined by a three-dimensional structure definition system. The toolbar of the two-dimensional mask data input module 200 is input. The curved data input module execution button 238 in the area 230 may be clicked to execute.

The surface data input module 400 according to the present invention may include a surface data set list 410 showing a list of surface data sets defined by a user, a surface data set name 420, a reference mask 430, and surface data 440. It is provided with the input part which can input.

Meanwhile, in order to generate a surface data set, the user inputs a surface data set name 420 and clicks the add surface data set button 450. Subsequently, the curved data input auxiliary line generation buttons 481 and 482 are clicked, and then the curved data input auxiliary lines 483 and 484 are generated in the layout area 210 of the mask data input module 200.

Next, when the surface data input point generation button 485 is clicked, the surface data input point 486 is generated in the layout area 210. The user selects the curved data input point 487 to input data using a mouse, inputs the curved data 440, and clicks the modify button 460.

As a preferred embodiment of the present invention, two or more curved data input points may be simultaneously selected to input data. In addition, as a preferred embodiment of the present invention, the reference mask 430 may be selected to refer to the curved data input auxiliary lines 483 and 484.

Figure 3d is a view showing a three-dimensional structure transformation information input module of the three-dimensional structure definition system according to the present invention. Referring to FIG. 3D, the 3D structure conversion information input module 500 inputs data necessary for converting a plurality of masks including respective mask objects input from the 2D layout data input module 200 into a monolayer structure. The receiving module may be executed by clicking the execution button 222 of the structure conversion information input module in the mask selection area 220 of the 2D mask data input module 200.

On the other hand, the user in the three-dimensional structure conversion information input module 500 for each mask mask name 510, mask color 511, mask pattern 512, a single layer structure name 520 generated from the mask, the mask The height of the metal wiring polyhedron generated from the object 531, the material information reference name of the metal wiring polyhedron produced from the mask object 532, the height of the insulating material polyhedron surrounding the metal wiring polyhedron 541, the material of the insulating material polyhedron The information reference name 542 and the surface data set name 550 necessary to represent the curved surface occurring in the process can be entered through the 3D structural transformation information input module and the OK button 560 can be entered. have.

In a preferred embodiment of the present invention, the user may refer to the material information reference names 532 and 542 and the surface data set name 550 required for the three-dimensional tomographic structure definition, respectively. 400, you can use the name of the user-defined data.

Figure 3e is a view showing a three-dimensional structure loading information input module of the three-dimensional structure definition system according to the present invention. Referring to FIG. 3E, the three-dimensional structure loading information input module 600 is a module that receives data required to load a single-layer three-dimensional structure generated from three-dimensional structure transformation information and convert it into a complex structure with respect to several masks. The execution of the structure loading information input module execution button 222 in the toolbar area 230 of the mask data input module 200 may be performed.

Structural load input module 600 according to the present invention is a contact (contact) generated for the electrical connection of the upper and lower metal wiring in the semiconductor process to the portion to determine the order of loading the large generated three-dimensional single-layer structure and the stacked single-layer structure It can be divided into inputting information for generating a polyhedron.

In addition, the part for determining the stacking order of the fault structure is the fault structure list 610, the move button (611, 612) for moving the fault structure up and down and the delete button (613) for deleting the unnecessary fault structure from the list. Equipped with.

On the other hand, the portion of creating a contact on the loaded tomographic structure is a contact list 620 showing the generated contact name and contact name 631, the contact material information reference name 632, the contact mask to be used to create the contact 633 ), An input unit for inputting an upper tomographic structure name 634 to make a contact and a lower tomographic structure name 635 to make a contact.

4A is a flowchart illustrating a procedure of inputting data required for generating a structure through the 3D structure definition system according to the present invention. Referring to Fig. 4A, the user inputs two-dimensional mask data (step S701) and inputs material information (step S702). Next, a simulation area is set in the layout area (step S703), and curved surface data is input (step S704).

Subsequently, three-dimensional structural transformation information for each mask is input (step S705), and three-dimensional structural loading information for determining a loading order of the unit structure to be generated by the structural transformation information is input (step S706). As a preferred embodiment according to the present invention, the input material information is stored in the database means 140 of the three-dimensional structure definition system and can be input only when necessary.

4B is a flowchart illustrating a data processing method for defining a 3D structure in the 3D structure definition system according to the present invention. Referring to FIG. 4B, when all data input for defining the 3D structure is completed, the coordinate data of the mask object corresponding to the set simulation area is extracted from the input mask object (step S707), and the extracted mask object is used. Each of the simulation mask regions is separated, and line segment data and polygon data of the separated simulation mask region are stored (step S708).

Next, the 3D structure loading information is read out from the database means 140 to determine the order of generating the tomographic structure (step S709), and the 3D structure transformation information of the mask is read according to the order of generating the tomographic structure. After generating the structure and generating the multi-layer structure without contact (step S710), the contact information is read from the 3D structure loading information to add a contact polyhedron to the multi-layer structure and redefine the multi-layer structure (step S711). On the other hand, after the definition of the multi-layer structure is finished, generate the initial structure definition file and the surface data file required for mesh generation (step S712).

Figure 4c is a flow chart illustrating the procedure for creating a contactless multi-layer structure of the three-dimensional structure definition system according to the present invention. Referring to FIG. 4C, the height of the tomographic structure to be generated currently is set (step S713), and the lower polygon of the tomographic structure is combined by combining the height of the currently generated tomographic structure with the two-dimensional coordinates of the simulation region and the two-dimensional coordinates of the mask object. A three-dimensional node constituting the is generated (step S714).

Subsequently, the height of the metal wiring polyhedron or the height of the insulating material polyhedron surrounding the metal wiring polyhedron is added to the generated three-dimensional node to generate an extended three-dimensional node and stored in the database (step S715). Polygon information constituting the metal wiring polyhedron is generated using the generated three-dimensional node and the extended three-dimensional node (step S716).

Subsequently, polygonal information of the insulating material polyhedron surrounding the metal wiring polyhedron is generated (step S717). Polygon information constituting the metal wiring polyhedron, polygon information constituting the insulating material polyhedron surrounding the metal wiring polyhedron, and polyhedral information of the metal wiring and the insulating material polyhedron are stored in the database means (step S718). Subsequently, it is determined whether all the tomographic structures have been generated (step S719), and if all the tomographic structures have not been generated, setting the height of the tomographic structures to be generated (step S713) determines whether all the tomographic structures have been generated. (Step S719) is repeated.

Figure 4d is a flow chart showing the sequence of adding a contact polyhedron and redefining a multi-layer structure of the three-dimensional structure definition system according to the present invention. Referring to FIG. 4D, the name of the lower tomography structure and the name of the upper tomography structure are read from the contact information (step S720). Subsequently, the height of the lower polygon constituting the contact polyhedron with the name of the read lower tomography structure is calculated (step S721), and the height of the lower polygon constituting the contact polyhedron with the read upper tomography structure name is calculated (step S721). S722).

A 3D node constituting the lower polygon and the upper polygon is generated using the height of the lower polygon and the upper polygon of the contact polyhedron calculated according to the preferred embodiment of the present invention (step S723). With the generated three-dimensional node, polygon information constituting the contact polyhedron is generated (step S724).

Subsequently, the lower polygon information constituting the contact polyhedron is added to the polygon information of the metal wiring polyhedron included in the lower tomography structure (step S725), and the upper polygon information constituting the contact polyhedron of the metal wiring polyhedron included in the upper tomography structure is added. It adds to the polygon information (step S726). Further, polygonal information in contact with the insulating polyhedron surrounding the contact polyhedron is added to the polygonal information constituting the insulating polyhedron (step S727).

5A illustrates one embodiment of a simulation mask region segmentation of a three-dimensional structure definition system in accordance with the present invention. Referring to FIG. 5A, simulation mask data 810, 820, and 830 extracted from the mask region 811, 821, and 831 corresponding to the simulation region 800 and the simulation region are illustrated.

The simulation area 800 is represented by two-dimensional node data of S1, S2, S3, and S4, and the mask object 811 included in the first mask data 810 is M11, M12, M13, M14, M15, M16. The mask entity 831, which is composed of nodes M17 and M18, and which the third mask data 830 includes, is composed of nodes M31, M32, M33, and M34. Each node is two-dimensional node data on the XY plane.

In a preferred embodiment of the present invention, the first mask data comprises polygons 811, S1, S2, M13, M12, M11, which are composed of nodes M11, M12, M13, M14, M15, M16, M17, and M18 for structure generation. The area is divided into polygons 812 composed of M18 nodes, polygons 813 composed of S3, S4, M17, M16, M15, and M14 nodes, and the third mask data is divided into M31, M32, M33, and M34 nodes. The area is divided into a polygon 832 composed of polygons 831, M32, S2, S3, and M33 nodes, and a polygon 833 composed of S4, S1, M31, and M34 nodes. Further, as a preferred embodiment of the present invention, node data and line segment data constituting the divided polygon are stored in the database means 140.

Figure 5b is a view showing an embodiment of the three-dimensional node data generation of the three-dimensional structure definition system according to the present invention. Referring to FIG. 5B, the height of the current fault structure is added to the S1 to S4 nodes defining the simulation area 800 and the M11 to M18 nodes defining the object 811 of the first mask data as height direction coordinates. Three-dimensional nodes of V1 to V4 may be generated from nodes S1 to S4, and three-dimensional nodes of V5 to V12 may be generated from nodes M11 to M18.

In addition, the three-dimensional node of V13 to V20 by adding the height (H1, 814) of the metal wiring polyhedron generated from the first mask object input from the three-dimensional structure conversion information input module 500 to the height direction coordinates of the nodes V5 to V12. The heights H2 and 815 of the insulating material polyhedron surrounding the metal wiring polyhedron are added to the height direction coordinates of the nodes V1 to V4 to generate three-dimensional nodes of V21 to V24.

Figure 5c is a view showing an embodiment of the metallization polyhedron generation using the three-dimensional node data of the three-dimensional structure definition system according to the present invention. Referring to FIG. 5C, information about nine polygons 816 to 824 constituting metal wirings is generated from the nodes V5 to V12 constituting the first mask object 811 and newly created nodes V13 to V20, and the Generates polyhedron information.

In a preferred embodiment of the present invention, the polygons 816 to the lateral direction of the metallization polyhedron in pairs of the respective line segment data of the polygon 811 composed of the V5 to V12 nodes and the polygon 824 composed of the corresponding V13 to V20 nodes. 823).

In a preferred embodiment of the present invention, the polygon information may be a polygon number, a node number constituting the polygon, and a node connection order. In addition, the polyhedron information may be the number of polygons constituting the polyhedron, the vertical direction of the polygon, the name of the curved data file referenced by the polyhedron, the name of the material information reference of the polyhedron, and the like.

FIG. 5D is a diagram illustrating an embodiment of generating insulating material polyhedron data surrounding a metal wiring polyhedron using three-dimensional node data of a three-dimensional structure definition system according to the present invention. Referring to FIG. 5D, the insulating material polyhedron surrounding the metal wiring polyhedron is included in the metal wiring polyhedron and divided from the polygons 817, 818, 819, 821, 822, 823, and 824 and the second mask which constitute the insulating material polyhedron. Polygons 831, 832, 833 and polygons 825, 826, 827, 828 generated from the edge segments of the first mask and the second mask.

5E illustrates an embodiment of a tomographic structure generated by a three-dimensional structure definition system according to the present invention. Referring to FIG. 5E, the first monolayer structures 900 and 910 include a metal wiring polyhedron 900 generated from the first mask and an insulating material polyhedron 910 surrounding the metal wiring polyhedron.

In a preferred embodiment of the present invention, when the upper fault structure is present over the first fault structure, the separated polygons 831, 832, 833 required to create the upper fault structure surround the metallization of the lower fault structure of the polyhedron 910. It will be on top.

5F illustrates another embodiment of three-dimensional coordinate data generation by the three-dimensional structure definition system according to the present invention. Referring to FIG. 5F, the first monolayer structure 900, 910 is a height H3 of the second metal wiring polyhedron at nodes V25 to V28 constituting the mask object 831 required to generate the metal wiring polyhedron of the second single layer structure. , 834), to generate three-dimensional node data of V29 to V32, and to add the height (H4, 835) of the insulating polyhedron that surrounds the second metal wiring polyhedron to the nodes of V21 to V32, to the three-dimensional node data of V33 to V36. Can be generated.

5G is a diagram illustrating a first tomographic structure and a second tomographic structure generated by a three-dimensional structure definition system according to the present invention. Referring to FIG. 5G, the metallization polyhedron 930 generated from the second mask and the polyhedron 940 surrounding the metallization polyhedron are defined on the first single layer structure.

As a preferred embodiment of the present invention, the top polygon 836 constituting the insulating material polyhedron 940 surrounding the second metallization polyhedron when there is no longer a single layer structure above the defined second monolayer structure defines a simulation region. The sum of the total heights of all the tomographic structures created is added to the two-dimensional coordinates of S1 to S4 to create nodes of V33 to V36 and construct the polygons by constructing the generated nodes.

5H is a view showing a structure with a contact between the first and second tomographic structure by the three-dimensional structure definition system according to the present invention. Referring to FIG. 5H, when there is a contact between the metal wiring polyhedron 910 generated by the first mask data and the metal wiring polyhedron 930 generated by the second mask data, the first metal wiring polyhedron 910 and the first metal wiring polyhedron 910 are formed. The polygons constituting the dielectric metal polyhedron 920 surrounding the two metal wiring polyhedron 930 and the first metal wiring polyhedron 930 are changed.

In a preferred embodiment of the present invention, the coordinate data for defining the contact is calculated from the M21 ~ M24 node of the contact mask data defining the contact to calculate the upper height of the lower metal wiring polyhedron of the contact to determine the three-dimensional node of V37 ~ V40 Create a three-dimensional node from V41 to V44 by calculating the bottom height of the upper metallization polyhedron of the contact.

In a preferred embodiment of the present invention, the contact polyhedron can be generated in the same manner as the method for producing the metallized polyhedron.

5i illustrates a modified insulating polyhedron of a structure having contacts created by a three-dimensional structure definition system in accordance with the present invention. Referring to FIG. 5I, polygonal data changes due to contact between the upper polygon 824 of the metallization polyhedron generated by the first mask data and the lower polygon 831 of the metallization polyhedron generated by the second mask data.

In a preferred embodiment of the present invention, the upper polygon 824 of the metallization polyhedron generated by the first mask data includes the lower polygon 833 of the polygon for defining a contact structure therein. In addition, the lower polygon 831 of the metallization polyhedron generated by the second mask data also includes an upper polygon 842 of the polygon for defining a contact structure therein. In addition, as a preferred embodiment of the present invention, the metallization polyhedron generated from the first mask data includes polygons 837, 838, 839, 840, 841, and 842 defining the contact structure.

The foregoing has outlined rather broadly the features and technical advantages of the present invention to better understand the claims of the invention which will be described later. Additional features and advantages that make up the claims of the present invention will be described below. It should be appreciated by those skilled in the art that the conception and specific embodiments of the invention disclosed may be readily used as a basis for designing or modifying other structures for carrying out similar purposes to the invention.

In addition, the inventive concepts and embodiments disclosed herein may be used by those skilled in the art as a basis for modifying or designing other structures for carrying out the same purposes of the present invention. In addition, such modifications or altered equivalent structures by those skilled in the art may be variously changed, substituted, and changed without departing from the spirit or scope of the invention described in the claims.

As described above, the present invention provides two-dimensional mask data, three-dimensional structure transformation information, structure loading in order to generate node information, polygon information, polyhedron information, initial condition information, etc. necessary for generating a mesh structure for a complex three-dimensional structure. Graphical user environment and data conversion module to input information, material information, and surface information, and automatically generate initial structure definition file including node information, polygon information, polyhedron information, and initial condition information necessary for mesh generation can do.

In addition, by generating a surface data file including coordinate data constituting a curved surface for a complex structure having a curved surface, it is possible to refer to a complex structure having a curved surface while performing a mesh operation. As a result, it is possible to reduce the time required to define the mesh structure required for numerical simulation of complex structures, and to easily redefine the mesh structure even with structural changes.

Claims (19)

In the numerical analyzer for computer simulation of the shape and characteristics of the structure produced on the semiconductor substrate, In order to receive two-dimensional coordinate data required for the structure definition, a graphic user environment is provided, and the coordinates of the object included in a specific area are extracted from the coordinates of the input mask object, and one or more coordinates of the input mask object are selected. A mask data input module for separating the data into mask units and storing them in a database unit; A structure conversion information input module for converting the two-dimensional coordinate data into three-dimensional coordinate data; A structure loading information input module configured to receive a stacking order of a metal wiring polyhedron generated by respective mask data and a dielectric material polyhedron surrounding the metal wiring in order to convert the input coordinates of the two-dimensional mask object into three-dimensional coordinates; A curved surface information input module configured to receive coordinate data and a curved surface information referrer's name necessary for representing a non-flat curved surface of the structure; A material information input module capable of receiving material information necessary for setting an initial simulation condition of the structure; Database means for storing the input two-dimensional mask data, three-dimensional structure transformation information, three-dimensional structure loading information, curved surface information, material information; An initial structure definition file generation module for converting the input data to generate an initial structure definition file for generating a mesh; And Surface data file generation module for generating surface data files containing the curved surface data of the initial structure 3D structure numerical analyzer comprising a. The apparatus of claim 1, wherein the structure conversion information input module is configured to convert coordinates of the input two-dimensional mask object into three-dimensional coordinates. A height of the metallization polyhedron generated by the input two-dimensional mask data; A height of the insulating material polyhedron surrounding the metallization polyhedron; Material information of the metallization polyhedron input to the material information input module; Material information of an insulating material polyhedron surrounding the metal wire polyhedron input to the material information input module; Curved surface information input to the curved surface information input module and necessary for representing a non-flat curved surface; And Single layer structure name including the metallization polyhedron and dielectric material polyhedron 3D structure numerical analyzer comprising an input unit for receiving the input. The structure loading information input module of claim 1, wherein the structure loading information input module is configured to generate contact polyhedrons between metallized polyhedrons generated from respective mask data. The name of the monolayer structure comprising the underlying metal wiring polyhedron in contact; The name of the single layer structure comprising the contacting upper metal wiring polyhedron; Material information of the contact polyhedron; And Contact mask data name for calculating three-dimensional coordinates of contact polyhedrons 3D structure numerical analyzer further comprising an input unit for inputting. The material information input module of claim 1, wherein the material information input module sets a material information reference name, a permittivity, electrical conductivity, and heat of a material to set initial conditions when performing the simulation on the 3D structure. A three-dimensional structural numerical analyzer comprising: an input unit for inputting characteristic data of a material including any one or two or more of thermal conductivity. The 3D structure numerical analyzer of claim 1, wherein the 3D structure numerical analyzer further comprises a module capable of replacing new 2D mask data by calculating new 2D coordinates from the input 2D mask data. In the structure generation method of a numerical analyzer for computer simulation of a three-dimensional structure formed on a semiconductor substrate, Receiving two-dimensional mask data and storing in database means; Setting a simulation area in the input mask data; Inputting curved surface information and storing it in a database means; Inputting three-dimensional structure conversion information for each input mask and storing in the database means; Inputting three-dimensional structure loading information and storing in database means; Extracting coordinate data of a mask object of a portion corresponding to the set simulation area from the input mask object; Separating each simulation mask region using the extracted mask object, and storing line segment data and polygon data of the separated simulation mask region; Reading 3D structural load information from the database and determining an order of generating a tomographic structure; Reading the three-dimensional structure transformation information of the mask according to the order of generating the single-layer structure, generating a single-layer structure and generating a multi-layer structure without contact; Redefining the multilayer structure by reading contact information from the 3D structure loading information and adding a contact polyhedron to the multilayer structure; And Generating an initial structure definition file and a surface data file defining the three-dimensional structure 3D structure generation method for numerical analysis comprising a. The method of claim 6, wherein the extracting the coordinate data of the mask object corresponding to the generated simulation area from the input mask object comprises converting the coordinate data into new two-dimensional coordinate data using the input two-dimensional mask object coordinates. 3D structure generation method for a numerical analysis, characterized in that it further comprises. The method of claim 6, wherein the inputting the two-dimensional mask data further comprises inputting material information. The method of claim 6, wherein the step of inputting the curved surface information and storing in the database means Generating curved surface data input auxiliary lines in a simulation area set in the input mask data; Generating curved surface data points in a simulation region set in the input mask data; Inputting data into the curved data point; And Inputting the surface information reference name 3D structure generation method for a numerical analysis, characterized in that it further comprises. 7. The method of claim 6, wherein inputting and storing in the database means the three-dimensional structure transformation information for each mask entered. Name the tomographic structure to be created by the three-dimensional structural transformation; A height of the metallization polyhedron to be generated from a mask object included in the mask; A material information reference name to be referred to by the metallization polyhedron to be generated from the mask entity included in the mask; A height of the insulating material polyhedron surrounding the metallization polyhedron; A material information reference name to which the insulating material polyhedron surrounding the metallization polyhedron will refer; And Surface information reference name to which the metallization polyhedron and the insulating material polyhedron are referred to And storing the data in a database means. The method of claim 6. Inputting the 3D structure loading information and storing in the database means may include loading order of the fault structure to be generated by the 3D structure transformation, name of the lower fault structure required for generating the contact structure between the 3D fault structure, and the upper fault layer. A method of generating a three-dimensional structure for numerical analysis, characterized in that the name of the structure, the name of the contact mask, the name of the contact material information reference is input and stored in the database means. The method of claim 6, wherein the generating of the single-layer structure by reading the 3D structural transformation information of the mask comprises: Creating a three-dimensional node constituting the lower polygon of the tomographic structure by combining the height of the tomographic structure to be generated, the two-dimensional coordinates of the simulation region and the two-dimensional coordinates of the mask object; Generating an extended three-dimensional node by adding the height of the metallization polyhedron to the three-dimensional node or the height of the insulating material polyhedron surrounding the metallization polyhedron and storing in the database; Generating polygonal information constituting a metal wiring polyhedron using the generated three-dimensional node and the extended three-dimensional node; Generating polygonal information constituting an insulating material polyhedron surrounding the metal wiring polyhedron using the generated three-dimensional node and the extended three-dimensional node; And Storing polygonal information constituting the metal wiring polyhedron, polygonal information constituting the insulating material polyhedron surrounding the metal wiring polyhedron, and polyhedral information of the metal wiring and the insulating material polyhedron in database means. 3D structure generation method for a numerical analysis, characterized in that it further comprises. The method of claim 12, wherein the generating of the polygonal information constituting the metallization polyhedron using the generated three-dimensional node and the extended three-dimensional node comprises: Generating polygonal information consisting of the generated three-dimensional nodes; Generating polygonal information consisting of the generated extended three-dimensional nodes; And Generating polygon information from a line segment of the polygon composed of the extended 3D node corresponding to each line segment of the polygon composed of the 3D node 3D structure generation method for a numerical analysis, characterized in that it further comprises. The method of claim 12, wherein the generating of the polygon information constituting the insulating material polyhedron surrounding the metal wiring polyhedron using the generated three-dimensional node and the extended three-dimensional node is performed. Extracting, from the polygon information forming the metal wiring polyhedron, included in the insulating material polyhedron surrounding the metal wiring, and adding the extracted polyhedron to the polygon information forming the insulating material polyhedron surrounding the metal wiring; Adding mask area polygon data separated by the mask object to polygon information constituting an insulating material polyhedron surrounding the metal wiring; When the upper tomography structure exists above the insulating material polyhedron surrounding the metal wiring, the polygon data of the mask object of the upper mask that is the basis for generating the upper tomography structure and the two-dimensional coordinate data of the upper mask area polygon data separated by the mask object Adding a height at which the upper tomographic structure is to be generated to expand to three-dimensional coordinate data, and then add to the polygon information constituting the insulating polyhedron surrounding the metal wiring; Insulating material surrounding the metal wiring, if the upper single-layer structure does not exist above the polyhedron, the total height data of the structure is added to the two-dimensional coordinate data defining the simulation area to expand to three-dimensional coordinate data and then the insulating material surrounding the metal wiring Adding to polygon information constituting the polyhedron; And Adding a polygon generated from a combination of mask region segment data separated by the mask object and mask region segment data separated by the upper mask object to polygon information constituting an insulating material polyhedron surrounding the metal wiring; 3D structure generation method for a numerical analysis, characterized in that it further comprises. 15. The method of claim 12, 13, or 14, wherein the polygonal information constituting the metal wiring and the insulating material polyhedron stored in the database means is any one or a combination of polygon number, node number, node connection order. 3D structure generation method for numerical analysis comprising a. The method according to claim 12, wherein the metal wiring and insulating material polyhedron information stored in the database means includes: the number of polygons constituting the polyhedron, the vertical direction of the polygon, the name of the curved data file referenced by the polyhedron, and the material information reference name of the polyhedron. 3D structure definition method comprising any one or a combination thereof. The method of claim 6, wherein the contact information is read from the 3D structure loading information to add a contact polyhedron to the multilayer structure and the redefinition of the multilayer structure is performed. Reading a name of a lower tomography structure and a name of the upper tomography structure from the contact information; Calculating a height of a lower polygon constituting a contact polyhedron with a name of the read lower fault structure; Calculating a height of a lower polygon constituting a contact polyhedron with the read upper tomographic structure name; Generating a 3D node constituting the lower polygon and the upper polygon using the calculated height of the lower polygon and the upper polygon of the contact polyhedron; Generating polygonal information constituting a contact polyhedron with the three-dimensional node; Adding lower polygonal information constituting the contact polyhedron to polygonal information of the metallized polyhedron included in the lower monolayer structure; Adding upper polygonal information constituting the contact polyhedron to polygonal information of the metallization polyhedron included in the upper tomographic structure; And Adding polygonal information in contact with the insulating polyhedron surrounding the contact polyhedron to the polygonal information constituting the insulating polyhedron Method for generating a three-dimensional structure for numerical analysis further comprising. The method of claim 6, wherein the generating of the initial structure definition file and the surface data file defining the three-dimensional structure comprises node data, polygon information data, polyhedron information data, and material information data stored in the database. 3D structure generation method for numerical analysis, characterized in that for generating a file. The method of claim 6, wherein the generating of the initial structure definition file and the surface data file defining the three-dimensional structure is stored in the database to include a surface information and generate a file using the surface data name as a file name. 3D structure generation method for numerical analysis.