KR100286128B1 - Testing relay for semiconductor and method of manufacturing thereof - Google Patents

Abstract

PURPOSE: A semiconductor testing relay and a manufacturing method thereof are provided to exactly test electric features of a semiconductor by having good cold and heat resistances. CONSTITUTION: A base(9) is located under a flange(1). A bracket(10) is mounted at one upper side of the base(9). The bracket(10) is made by a synthetic resin forming material. The base(9) is connected to a housing. A conductive pipe(11) passes through a hollow portion(5) of a coil bobbin(4). A lead switch(8) is inserted into the conductive pipe(11). The conductive pipe(11) includes a brass pipe for a noise removal. A metal housing(12) is an electromagnetic wave shielding member which protects the lead switch(8) and an excitation coil(3) from an ambient electromagnetic wave in combination with the bracket(10).

Description

Relay for semiconductor test and manufacturing method thereof

The present invention relates to a relay for testing a semiconductor and a method of manufacturing the same for testing electrical characteristics of a semiconductor.

Conventionally, a reed switch, which is a type of relay, has been known as Japanese Patent No. 01289027A and Korean Utility Model Publication No. 87-1298.

The reed switch disclosed in Japanese Patent Application No. 01289027A contains SF ₆ in a glass tube in which lead pieces consisting of two magnetic members whose sealing operation is made by an external magnetic field are sealed in order to have a large withstand voltage without degrading manufacturing characteristics. The sealed gas was added.

The reed switch shown in Korean Utility Model Publication No. 87-1298 relates to a reed switch which is easy to assemble and can be automatically assembled, and has two conductive pieces and an insulated tube which keeps these pieces facing each other. Conductive pieces are provided with both sides of the contact pieces protruding from both sides of the insulated tube with a predetermined length, and coil bobbins with the contact parts wound around the hollow parts inserted into the hollow parts. In a reed switch for separating and contacting end portions of the contact pieces, a conductive contact piece is inserted into the hollow portion of the coil bobbin, but a positioning portion for preventing passage of the insulated tube is provided, and outward flanges are provided on both sides of the coil bobbin, respectively. The groove is formed in the flange portion, and one end of the insulating tube of the folded body inserted into the hollow portion is placed in the positioning portion. Position of the contact piece in the coil bobbin in contact with each other, and the ends of the conductive contact pieces protruding from both sides of the coil bobbin are bent in a direction substantially orthogonal to the insertion direction of the contact piece, and the ends are inserted into the grooves. By fixing the position of the folding body at the same time the two sides of the flange portion different from each other by the difference in the appearance of the flange portion so that the insertion side of the folding body can be easily determined.

Such conventional reed switches are structurally insufficient in cold resistance and heat resistance, and thus cannot be used for semiconductor tests requiring accurate operation even at -20 ° C to 125 ° C. It is not suitable for testing the electrical characteristics of semiconductors that require high precision because the contacts or contacts are likely to malfunction due to electromagnetic waves generated from other electronic and electrical devices. When the contact or contact is operated by the magnetic field generated when the current is energized, the contact or contact is affected by the electric field caused by static electricity other than the magnetic field caused by the excitation coil, so that the electrical characteristics of the semiconductor cannot be accurately tested. there was.

The present inventors have studied to solve all the problems of the prior art, as a result, can be operated correctly under the harsh use conditions of about -20 ℃ ~ 125 ℃, shielding the electromagnetic waves around, In order to complete the present invention, it is possible to accurately test the electrical characteristics of a semiconductor as long as it can prevent the coil feeling from being affected by noise (harmful factors) such as static electricity other than the magnetic field set by the number. Reached.

Therefore, the present invention has excellent cold resistance and heat resistance, and thus can operate normally under the usage conditions of about -20 ° C to 125 ° C, and has excellent electromagnetic shielding and noise removing characteristics, and is suitable for accurately testing the electrical characteristics of semiconductors. And to provide a method of manufacturing the technical problem.

1 is an exploded perspective view of a relay according to the present invention.

2 is a perspective view showing the assembled state of the relay according to the present invention.

3 is a cross-sectional view taken along line II of FIG. 2.

4 is a cross-sectional view taken along the line II-II of FIG.

In the relay for semiconductor test according to the present invention, as illustrated in FIGS. 1 to 4, the coil bobbin 4 in which the excitation coil 3 is wound around the outer periphery 2 between the flange 1 and the flange 1 ′. The lead piece (1) having a contact (a) and a contact (b) corresponding to each other at the hollow portion 5) of the excitation coil 3 so as to be opened and closed by an external magnetic field generated in the energized state of the excitation coil 3, respectively. 6), In the case of inserting a normal reed switch 8 sealed with an insoluble gas inside an insulating tube 7 such as a glass tube in which 6 'is sealed, the flanges 1, 1' Bracket 10 formed with bases 9 and 9 ', which are fixed to the terminals to be described later from below, and coupled with a housing which is an electromagnetic shielding member, and hollow portion 5 of the coil bobbin 4; A conductive tube 11 such as a brass tube which is a noise removing member through which the reed switch 8 is inserted, and the bra Be combined with a site (10) is made of a reed switch (8) and the exciting coil 3, the electromagnetic wave shielding member made of metal housing 12 that protect from the surrounding cells to gipa.

In the present invention, the bracket 10 is made of a synthetic resin molded article such as a thermosetting resin that does not deform even at a high temperature of about 170 ° C after molding.

Both ends 3a and 3b of the excitation coil 3 are connected to the power input terminals 13a and 13b fixed to the bases 9 and 9 'of the bracket 10.

In the conductive pipe 11 penetrating the hollow portion 5 of the coil bobbin 4, an electrode terminal 13a of the input terminals 13a and 13b is connected to the ground conductor 14. The conductive tube 11 is connected to the ground terminal 15 fixed to the base 9 '.

A reed switch 8 is inserted into the conductive tube 11, and both lead pieces 6 and 6 'of the reed switch 8 are fixed to the bases 9 and 9'. 16a) and 16b.

The bracket 10 is inserted into the opening portion 18 of the housing 12 into which the edges 17 and 17 'of the bases 9 and 9' are fitted to engage the housing 12. .

The space 19 between the bracket 10 and the housing 12 is filled with a filler 20, such as a conventional antistatic and insulating epoxy resin, as is well represented in FIG. (12) Excitation coil (3), input terminal wound on coil bobbin (4) through which conductive tube (11) into which reed switch (8) inserted, which is a component on top of bracket (10), is inserted 13a and 13b, the ground lead 14 and the ground terminal 15 and the output terminals 16a and 16b are insulated.

In the present invention, in order to facilitate the filling of the filler 20, it is preferable to form the through holes 21 and 21 'in the bases 9 and 9' of the bracket 10. In order to maintain the bonding strength between the bracket 10 and the housing 12 while allowing the filler 20 to be filled in the space 19 between the bracket 10 and the housing 12 without gaps, 1 and 2, the protrusions 22 and 22 'are formed above the flanges 1 and 1' to provide a space for the filler 20 to pass therethrough, and the base It is preferable to form the indentations 23 and 23 'at the edges 17 and 17' of (9) and (9 ') so that the filler 20 can be filled.

The relay according to the present invention configured as described above is used to be fixed to the printed circuit board 30 as a normal electronic component, as illustrated in FIG. 3. The input terminals 13a and 13b have a power supply of about DC 3.8 to 5V. The 31 is connected, and the ground terminal 15 is grounded and used.

That is, the relay according to the present invention has a contact (a) of the reed switch (8) by a magnetic field generated by energizing the excitation coil (3) through the power supply input terminals (13a), (13b) as conventionally The contact part (b) is in contact with and outputs an electrical signal through the output terminals (16a, 16b) to operate the semiconductor test circuit, the representation is omitted in the exemplary drawing, the hollow portion of the coil bobbin (4) (-) Electrode terminal 13b and ground lead 14 connected to one end 3a of excitation coil 3 through which conductive tube 11 through which reed switch 8 is inserted is inserted. Is connected to the ground terminal 15 which is grounded, and noise such as static electricity having a frequency different from the frequency of the normal magnetic field generated when the excitation coil 3 is energized is contacted (a) of the reed switch 8. It does not affect the operation of the over contact (b).

In addition, the metal housing 12 coupled to the bracket 10 and shielding the reed switch 8, the excitation coil 3, and the terminals and their electrical connection from the outside is provided with a variety of peripheral electronic and electrical devices. By shielding the electromagnetic waves emitted during use to prevent the malfunction of the reed switch (8) by the external electromagnetic waves.

In addition, the filler 20 such as a conventional antistatic and insulating epoxy resin filled in the space 19 between the bracket 10 and the housing 12 passes through the conductive tube 11 into which the reed switch 8 is inserted. Excitation coil 3 wound around coil bobbin 4, input terminals 13a, 13b, ground lead 14, ground terminal 15, output terminals 16a, 16b It not only electrically insulates all flowing components, but also prevents poor electrical connection due to shock or vibration applied from the outside of the relay, and reed switch even when the operating environment such as sudden temperature deviation changes. (8) ensures correct operation.

The semiconductor test relay according to the present invention operates correctly under the usage conditions of about -20 ° C to 125 ° C, and there is no fear of malfunction due to electromagnetic waves emitted from various electronic and electrical devices in the surroundings, Noise can also be removed to accurately test the electrical characteristics of the semiconductor, and excellent durability, such as to extend the life cycle has the advantage.

Claims (4)

The common step of inserting the reed switch 8 into the hollow portion 5 after winding the excitation coil 3 on the outer circumferential portion 2 of the thermosetting synthetic resin bracket 10, and a conductive tube 11 such as a brass tube Is inserted between the hollow portion 5 and the reed switch 8, the power input terminals 13a and 13b of the excitation coil 3, and the output terminals 16a and 16b of the reed switch 8; ) And the ground terminal 15 to the base 9, (9 '), and the conductive tube 11 and the "-" electrode terminal 13a and ground terminal 15 of the excitation coil (3) Connecting the brackets, fitting the bracket 10 into the metal housing 12 having the openings 18, and providing a space 19 between the bracket 10 and the metal housing 12. Method of manufacturing a relay for a semiconductor test, characterized in that the manufacturing through the step of filling with a filler (20), such as antistatic and insulating epoxy resin. A contact a and a contact b are respectively provided in the hollow part 5 of the coil bobbin 4 in which the excitation coil 3 is wound around the outer part 2 between the flange 1 and the flange 1 '. The coil bobbin 4 has both flanges in which a normal reed switch 8 in which an insoluble gas is inserted and sealed is inserted into an insulated tube 7 inside which the lead pieces 6 and 6 'of one end are sealed. (1) and (1 '), which consists of a bracket (10), which is a thermosetting synthetic resin molding comprising a base (9) and (9') extending from the hollow portion (5), a reed switch (8) is provided in the hollow portion (5). A conductive tube 11 such as a brass tube inserted therein penetrates, and the bases 9 and 9 'have power input terminals 13a and 13b and a reed switch 8 of the excitation coil 3. Output terminals 16a, 16b and ground terminals 15 are fixed, and the conductive tube 11 is the "-" electrode terminal of the power input terminals 13a, 13b of the excitation coil 3. It is connected to 13a and the ground terminal 15, and the bracket 10 is made of metal. Gong relay for a semiconductor test, characterized by the opening 18 of 12 in that in combination with the metal housing (12). 3. The semiconductor test relay according to claim 2, wherein the space portion (19) between the bracket (10) and the metal housing (12) is filled with a filler (20) such as an antistatic and insulating epoxy resin. The bases 9 and 9 'of the bracket 10 are provided with holes 21 and 21' through which the filler 20 is injected, and the flange of the bracket 10 is formed. (1) and (1 ') are formed with protrusions (22) and (22') that provide a space for the filler (20) to pass through, and the edges (17) of the bases (9) and (9 '). And 17 'are formed with recesses 23 and 23' to be filled with a filler 20.