KR100276118B1 - Head / Slider Assembly with Integrated Track Actuator Micro Actuator and Manufacturing Method Thereof - Google Patents

Abstract

The head / slider assembly incorporates a track following electrostatic micro driver. The manufacturing method of the head / slider assembly includes the steps of forming a structure layer of a micro driver on a slider substrate such that a cavity is formed therebetween, forming a metal signal line on the structure layer of the micro driver, and a structure layer of the micro driver. Forming a read / write magnetic head in the center of the microcavity, etching to separate the micro driver from the read / write magnetic head, and forming a protective cover on the micro driver and the read / write head to form a head / slider. And forming an assembly, which is applicable to an ultra high density HDD system having a track pitch of 1 μm.

Description

Head / slider assembly with integrated track tracking micro actuator and method of manufacturing the same

The present invention relates to a head / slider assembly for a hard disk drive (HDD); In particular, it relates to a head / slider assembly incorporating a track tracking micro actuator and a method of manufacturing the same.

As is well known, HDDs use track coil motor (VCM) actuators to perform track seeking and track following. However, the precision of such a VCM actuator is limited, and the maximum recording density is 5Gb / in ^2, so for example, an ultra-high density HDD having a track pitch of 1 μm capable of realizing a recording density of 10 Gb / in ² or more. Not applicable in the system.

Therefore, in driving and controlling the displacement of the 1 탆 track pitch, a VCM actuator which performs track search only, and a read / write head in 2-3 tracks having a predetermined area, for example, about 2-3 탆. Dual stage servo systems are generally used that move the pin precisely to the required track.

1 illustrates such a dual stage servo system. As shown, the dual stage servo system is rotatably installed about the rotating shaft 2 by the operation of the VCM 1, so that the track search can be performed while pivoting in the radial direction of the disk 6. Suspension 3 to be carried out, a micro actuator 5 and a read / write magnetic head (not shown) are assembled to a slider 4 to provide a suspension 3. And a head / slider assembly installed at the tip and track-tracking to drive and control the displacement of the 1 탆 track pitch to write or read data to the track on the disc 6. Track tracking of such a conventional head / slider assembly includes a slider driving method and a head driving method.

The slider drive system attaches a micro driver between a suspension arm made of gimbal spring and a slider fixedly assembled with a read / write magnetic head, and drives the slider by operation of the micro driver. Track tracking. Therefore, this method has to produce a micro driver capable of driving a slider that is about 1000 times more than the weight of the head, so that the thickness and size are relatively large, and the process is complicated.

2 shows an electrostatic micro driver used in the head drive method. As shown, the electrostatic type micro driver attached to the slider has a plurality of comb frames, and each of the comb shapes has n fingers formed thereon, and are disposed to face each other at a predetermined distance from each other. It has a plurality of stationary combs 9 and a plurality of comb-shaped bodies, respectively, and n + 1 fingers are formed for each comb-shaped body so that these fingers are linearly between the fingers of each stator 9. A movable comb 10 mounted to the left and right reciprocating motion, a head mounting board 11 provided at the center of the mover 10, and one side of the head mounting board 11; Consisting of a read / write head 12.

On the other hand, the stator 9 is electrically insulated and bonded to the slider 4, and the mover 10 is supported by a flexible spring 13 having a predetermined elastic modulus at both ends thereof.

In the electrostatic micro driver 5 configured as described above, when a control signal voltage is applied to the stator 9, a change in capacitance occurs, and a constant power proportional to the change is generated between the mover 10 and the stator 9. It acts to pull the mover 10 toward the stator 9. At this time, since the mover 10 is connected to the flexible spring 13, the mover 10 moves in a state where the electrostatic force and the spring force are in balance to track the track.

By the way, the technique for combining the micro driver and the magnetic head with such a track tracking slider has been extremely difficult, and no head / slider assembly has been developed to protect the micro driver from the intrusion of impurities.

SUMMARY OF THE INVENTION An object of the present invention is to provide a head / slider assembly and a method for manufacturing the same, which are applicable to an ultra high density HDD system by integrating a track tracking micro actuator.

In order to achieve the above object, the head / slider assembly of the present invention is a method of manufacturing a track following head / slider assembly in which an electrostatic micro actuator is integrated, and forms a structural layer of a micro driver on a slider substrate such that a cavity is formed therebetween. Forming a metal signal line on the structure layer of the micro driver, forming a read / write magnetic head in the center of the structure layer of the micro driver, and distinguishing the micro driver from the read / write magnetic head. Etching to form a protective cover on top of the micro-driver and the read / write head to form a head / slider assembly.

1 is a schematic diagram illustrating a dual stage servo system used in a hard disk drive,

2 is a schematic view showing a micro driver used in the head driving method,

Figure 3 is an exploded perspective view showing a planar head / slider assembly according to an embodiment of the present invention,

4A to 4N are process diagrams illustrating a method of manufacturing the planar head / slider assembly of FIG. 3.

<Explanation of Signs of Major Parts of Drawings>

100: head / slider assembly 110: slider body

112: slider substrate 114: mask layer

116: cavity 120: protective cover

200: fine driver 202: fine driver structure layer

204: insulating layer 206: metal signal line

315: lower magnetic yoke portion 330: upper magnetic yoke portion

340: coil portion 330: upper magnetic yoke portion

344: via hole 350: magnetoresistive layer

360: magnetic field concentration

3 shows a planar head / slider assembly according to one preferred embodiment of the present invention. As shown, the planar head / slider assembly 100 of the present invention includes a slider body 110 made of a silicon wafer having a cavity 116 thereon, and a slider body having a read / write head 300 formed thereon. Electrostatic micro-driver 200 mounted on the 110 and a protective cover 120 bonded to the upper circumference of the slider body 110 to protect the head / slider assembly from external impurities.

Since the electrostatic micro driver 200 is as shown in FIG. 2, a detailed description thereof will be omitted.

4 is a process diagram illustrating a method of manufacturing the planar head / slider assembly 100 according to one preferred embodiment of the present invention.

First, as shown in FIG. 4A, a mask layer 114 made of thermal oxide silicon (SiO ₂ ) is deposited on a slider substrate 112 made of a silicon wafer, and the slider substrate 112 is formed. Patterning is to expose a portion of the. Then, as shown in FIG. 4B, the exposed portion of the slider substrate 112 is etched until the desired depth is obtained.

Next, a micro driver structure layer 202 made of a silicon wafer in the structure shown in FIG. 4B is fused bonded to cover the etched portion, as shown in FIG. 4C. Thereafter, the microdriver structure layer 202 is polished by a chemical mechanical polishing (CMP) method until the desired thickness is obtained, as shown in FIG. 4D). As a result of bonding and polishing the microdriver structure layer, a cavity 116 is formed.

Thereafter, as shown in FIG. 4E, after depositing a first insulating layer 204 of silicon nitride (Si ₃ N ₄ ) on the silicon structure layer 202. 4F, the microdriver structure layer 202 is patterned to partially expose it. A metal layer is then deposited over the first insulating layer 204 and patterned to partially expose the microdriver structure layer 202 and the first insulating layer 204 to form a metal signal line 206. do.

The next step is to form a read / write head 300 on top of the track-following micro driver structure layer 202, as shown in Figs. 4G-4L, to form a lower magnetic yoke portion. , A coil part forming step, an intermediate magnetic yoke part forming step, and an upper magnetic yoke part forming step.

That is, the lower magnetic yoke portion 315 deposits an oxide layer 312 on top of the metal signal line 206, the first insulating layer 204, and the micro driver structure layer 202, and as shown in FIG. 4G, After planarization, the oxide layer 312 is partially etched until a portion of the first insulating layer 204 is exposed, and then over the exposed portion of the first insulating layer 204, as shown in FIG. 4H. The first conductive thin film 313 and the first magnetic thin film 310 of FeNi are sequentially deposited by electroplating, so that the thin films 310 and 312 are formed on the oxide layer 312. The etched part is completely filled.

In addition, in the coil forming process, as illustrated in FIG. 4I, a second insulating layer 322 is deposited on the lower magnetic yoke portion 315, and a via hole is formed to electrically connect the metal signal line 206. After the hole 344 is formed, the conductive thin film is deposited on the second insulating layer 322 and patterned to form the coil part 340.

In FIG. 4J, after the third insulating layer 342 is deposited on the second insulating layer 322 including the coil part 340, the portion separated by the lower magnetic yoke part 315 is formed. Portions of the second and third insulating layers 322 and 342 are etched until the first magnetic thin film 310 is exposed, and then the etched portions of the insulating layers 322 and 342 are filled with a magnetic material. To form the first intermediate magnetic yoke portion 320a.

Thereafter, as shown in FIG. 4K, a magnetic field concentrator 360 is formed on the first intermediate magnetic yoke portion 320a and then patterned to expose a portion of the third insulating layer 342. do. Subsequently, the fourth insulating layer 324 is deposited on the third insulating layer 342 including the magnetic concentration film 360, and the magnetoresistive layer is positioned at a position corresponding to the center of the magnetic concentration film 360. MR) 350 is formed. This magnetoresistive layer 350 is used to read the recorded information.

Meanwhile, in FIG. 4L, after the fifth insulating layer 326 is deposited on the fourth insulating layer 324 including the magnetoresistive layer 350, the first magnetic field concentration layer 360 is exposed. The portions of the fourth and fifth insulating layers 324 and 326 corresponding to the upper portions of the intermediate magnet yoke portion 320a are etched, and the etched portions are filled with a magnetic thin film to form the second intermediate magnetic yoke portion 320b. To form.

Thereafter, the second conductive thin film 331 is formed on the second intermediate magnet yoke portion 320b, and the sixth insulating layer 332 is formed on the fifth insulating layer 326 including the second conductive thin film 331. After deposition on the substrate, the second conductive thin film 331 is etched until the second conductive thin film 331 is exposed. The etched portion is filled into the second magnetic thin film 333 by electroplating. Then, the second magnetic thin film 333 and the second conductive thin film 331 are etched until the central portion of the fifth insulating layer 326 is exposed. The etched portion is filled with the third conductive thin film 334 by electroplating to form a magnetic head gap. As a result, an upper magnetic yoke 330 including the second conductive thin film 331, the second magnetic thin film 333, and the third conductive thin film 334 is obtained. This upper magnetic yoke portion 330 is used to record data on the disc.

4M and 4N show an etching process for obtaining the final shape of the head and track tracking micro driver configured as described above.

The micro driver 200 and the read / write magnetic head 300 are first adjacent to both sides of the magnetic yoke portions 315, 320, and 330 and one side of the read / write head 300, as shown in FIG. 4M. After performing reactive ion etching (RIE) on the moving part of the micro driver 200, the micro driver 200 is patterned by deep reaction ion etching as shown in FIG. 4N.

Subsequently, as shown in FIG. 3, the protective cover 120 is bonded along the circumference of the slider main body 110 in which the micro driver 200 and the read / write magnetic head 300 are integrated as described above. The head / slider assembly of the present invention is packaged. As a result, the head / slider assembly of the present invention prevents the ingress of impurities from the outside.

As described above, although the preferred embodiment of the present invention has described a planar head / slider assembly, the present invention is not limited thereto, and a vertical head / slider assembly is prepared in which the read / write head is installed perpendicular to the rear of the slider. Of course you can.

As described above, according to the present invention, it is possible to provide a process technology for combining a micro driver and a magnetic head to a track tracking slider, and also to provide a packaging technology for protecting the micro driver from intrusion of impurities. Can be.

Claims (6)

In the manufacturing method of the track tracking head / slider assembly in which the electrostatic micro actuator is integrated, Forming a structural layer of a micro driver on the slider substrate such that a cavity is formed therebetween, Forming a metal signal line on the structure layer of the micro driver, forming a read / write magnetic head in the center of the structure layer of the micro driver; Etching to distinguish the micro driver from the read / write magnetic head; And forming a head / slider assembly by forming a protective cover on top of the micro-driver and the read / write head. The method of claim 1, wherein the cavity, Forming a mask layer made of thermal silicon oxide on the slider substrate, Etching a portion of the slider substrate until the desired depth is obtained, Bonding the micro-driver structure layer to the slider substrate using a melt bonding method. The method of claim 1, wherein the metal signal line, Depositing a first insulating layer over the microdriver, and patterning the first insulating layer to partially expose the microdriver; Depositing a metal layer on the first insulating layer and patterning the metal layer to partially expose the microdriver and the first insulating layer. 2. The micro driver of claim 1, wherein the micro driver and the read / write magnetic head are subjected to reactive ion etching on both sides of the magnetic yoke part and the moving part of the micro driver adjacent to one side of the read / write head, and then pattern the micro driver. A method for producing a method, characterized by separating reactive ion etching. A flat head / slider assembly for an ultra high density hard disk drive, The cavity is formed in the upper portion, the slider body made of silicon wafer, An electrostatic type micro driver installed on the slider body, A read / write magnetic head mounted on the micro driver so as to be parallel to an upper portion of the slider body; And a protective cover joined along the upper edge of the slider body. In a vertical head / slider assembly for an ultra high density hard disk drive, A cavity is formed in the rear, the slider body made of a silicon wafer, An electrostatic type micro driver installed at the rear of the slider body, A read / write magnetic head mounted on the micro driver so as to be perpendicular to the rear of the slider body; And a protective cover joined along a circumferential edge of the slider body.