KR100274598B1 - Apparatus for sensing wafer in load lock chamber - Google Patents

Apparatus for sensing wafer in load lock chamber Download PDF

Info

Publication number
KR100274598B1
KR100274598B1 KR1019970015216A KR19970015216A KR100274598B1 KR 100274598 B1 KR100274598 B1 KR 100274598B1 KR 1019970015216 A KR1019970015216 A KR 1019970015216A KR 19970015216 A KR19970015216 A KR 19970015216A KR 100274598 B1 KR100274598 B1 KR 100274598B1
Authority
KR
South Korea
Prior art keywords
wafer
load lock
loading
lock chamber
unloading
Prior art date
Application number
KR1019970015216A
Other languages
Korean (ko)
Other versions
KR19980077891A (en
Inventor
노수광
최성훈
장기중
이영건
Original Assignee
윤종용
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윤종용, 삼성전자주식회사 filed Critical 윤종용
Priority to KR1019970015216A priority Critical patent/KR100274598B1/en
Publication of KR19980077891A publication Critical patent/KR19980077891A/en
Application granted granted Critical
Publication of KR100274598B1 publication Critical patent/KR100274598B1/en

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: An apparatus for sensing a wafer in a load lock chamber is provided to detect correctly a loading state and an unloading state of a wafer by installing a plurality of sensor on a loading position and an unloading position of a wafer. CONSTITUTION: A plurality of sensor(20) is installed at a wafer transfer position in order to prepare a discharging operation of a wafer transferred to a loading load lock chamber(10) and an unloading load lock chamber(14). The sensors(20) are installed on each cover of the loading lock chamber(10) and the unloading load lock chamber(14) in order to sense a loading state and an unloading state of the wafer. A control portion is used for receiving a sense signals from the sensors(20) and controlling each device. A lifter(16) is used for loading the wafer on a loading arm(11). The sensors(20) are used for sensing a normal state of the transferred wafer.

Description

로드락챔버의 웨이퍼 감지장치Load Lock Chamber Wafer Sensing Device

본 발명은 로드락챔버의 웨이퍼 감지장치에 관한 것으로서, 보다 상세하게는 웨이퍼의 로딩 및 언로딩위치에 센서를 장착함으로써 웨이퍼 로딩 및 언로딩동작이 정확하고 오동작이 없는 로드락챔버의 웨이퍼 감지장치에 관한 것이다.The present invention relates to a wafer sensing device of a load lock chamber, and more particularly, to a wafer sensing device of a load lock chamber in which wafer loading and unloading operations are accurate and there is no malfunction by mounting a sensor at a loading and unloading position of a wafer. It is about.

일반적으로 웨이퍼가공은 최적의 공정조건을 유지하는 공정챔버에서 이루어진다. 따라서 반도체 공정설비는 이전 공정의 가공조건이나 일반 대기상태에 노출되어 있는 웨이퍼를 공정챔버에서 가공하기 위해 웨이퍼가 공정챔버로 로딩되기전 공정챔버 내부의 공정조건을 유지하기 위해서 외부와 밀폐되어 공정챔버와 동일한 조건으로 웨이퍼의 환경을 조성해주고 웨이퍼를 공정챔버의 내부로 로딩하는 로드락챔버를 구비한다.In general, wafer processing takes place in process chambers that maintain optimum process conditions. Therefore, the semiconductor processing equipment is sealed to the outside to maintain the process conditions inside the process chamber before the wafer is loaded into the process chamber to process the wafer exposed to the processing conditions of the previous process or the general atmospheric state in the process chamber. A load lock chamber for creating an environment of the wafer under the same conditions as the above and for loading the wafer into the process chamber.

로드락챔버의 종류는 공정순서에 따라 공정챔버에 웨이퍼를 투입하는 로딩로드락챔버가 있으며 공정이 모두 끝난 웨이퍼를 다시 대기상태나 후속공정챔버로 이송하도록 배출하는 언로딩로드락챔버가 있다.Types of load lock chambers include a loading load lock chamber for injecting wafers into the process chamber according to the process sequence, and an unloading load lock chamber for discharging the finished wafers to be transferred to the standby state or subsequent process chambers.

상기 로딩로드락챔버와 언로딩로드락챔버에는 각각 웨이퍼를 이송시키는 웨이퍼 이송장치가 있으며 이송장치로는 로봇암이나 리프터 등 여러 가지의 형태가 있다. 그리고 로드락챔버에는 공정챔버와 동일한 조건을 만들기 위해 각종의 진공라인, 가스공급라인, 배기라인 등을 갖추고 있으며 웨이퍼의 통로 및 통로 개폐장치를 구비하고 있다.The loading load lock chamber and the unloading load lock chamber each have a wafer transfer device for transferring wafers, and various types of transfer devices include a robot arm or a lifter. In addition, the load lock chamber is equipped with various vacuum lines, gas supply lines, exhaust lines, etc. in order to create the same conditions as the process chambers, and includes a wafer passage and a passage opening and closing device.

또한, 상술한 이송장치가 공정프로그램에 따라 움직이도록 언로딩로드락챔버는 통로를 통해서 웨이퍼가 이송되는 상태를 감지하도록 통로의 측면에 웨이퍼 감지장치를 구비하고 있다.In addition, the unloading load lock chamber is provided with a wafer sensing device on the side of the passage so as to sense a state in which the wafer is transferred through the passage so that the above-mentioned transfer apparatus moves according to the process program.

통상적인 로드락챔버의 웨이퍼 감지장치를 도1에 도시하였다.A wafer sensing device of a conventional load lock chamber is shown in FIG.

도1에서와 같이 로드락챔버의 웨이퍼 감지장치는, 언로딩로드락챔버(14)에 웨이퍼 배출통로에 위치하며 웨이퍼의 움직임을 감지하는 센서(13)와, 도시하지는 않았지만 센서(13)의 신호를 수신하여 설비를 제어하는 제어부가 있다.As shown in FIG. 1, the wafer sensing device of the load lock chamber includes a sensor 13 positioned in the wafer discharge passage in the unloading load lock chamber 14 and detecting a movement of the wafer, and a signal of the sensor 13 although not shown. There is a control unit for controlling the facility by receiving the.

이러한 웨이퍼 감지장치의 동작을 설명하면 리프터(16)가 이전 공정의 가공을 마친 웨이퍼를 로딩암(11)에 올려 놓음으로써 웨이퍼를 인계한다. 웨이퍼를 인계받은 로딩암(11)은 통로를 통해 로딩로드락챔버(10)의 내부로 웨이퍼를 이송하고 통로를 닫아 로딩로드락챔버(10)를 밀폐한다. 가스공급라인을 통해 로딩로드락챔버(10)의 조건이 공정챔버(12)의 조건과 동일해지면 공정챔버(12)의 투입통로가 개방되고 투입통로를 통해 로딩암(11)이 웨이퍼를 공정챔버(12) 내부의 핀 또는 척 상에 올려 놓는다. 로딩암(11)이 로딩로드락챔버(10)로 돌아가면 공정챔버(12)가 밀폐되고 공정이 수행된다. 이때 공정이 수행되는 도중 로딩암(11)은 다음에 가공할 웨이퍼를 다시 리프터(16)로부터 인계받아 공정챔버(12)로의 다음 웨이퍼 투입을 준비한다.Referring to the operation of the wafer sensing device, the lifter 16 takes over the wafer by placing the wafer, which has been processed in the previous process, on the loading arm 11. The loading arm 11 taking over the wafer transfers the wafer into the loading load lock chamber 10 through the passage and closes the passage to seal the loading load lock chamber 10. When the loading load lock chamber 10 becomes equal to the process chamber 12 through the gas supply line, the input passage of the process chamber 12 is opened and the loading arm 11 passes the wafer through the input passage. (12) Place it on the pin or chuck inside. When the loading arm 11 returns to the loading load lock chamber 10, the process chamber 12 is sealed and the process is performed. At this time, the loading arm 11 takes over the wafer to be processed next from the lifter 16 and prepares the next wafer input to the process chamber 12 during the process.

한편 핀 또는 척 상에서 언로딩암(15)이 공정을 마친 웨이퍼를 들어올려 배출통로를 통해서 이송하게 되고 이때 공정챔버(12)의 배출통로 측면에 설치된 센서(13)가 이송되는 웨이퍼를 감지하여 제어부로 송신하고 웨이퍼의 배출을 감지한 제어부는 다음 웨이퍼의 가공작업을 지시하게 된다.On the other hand, the unloading arm 15 lifts the finished wafer on the pin or chuck and transfers the wafer through the discharge passage. At this time, the sensor 13 installed on the side of the discharge passage of the process chamber 12 detects the wafer to be transferred. The controller, which senses the discharge of the wafer, sends the next wafer processing operation.

일반적으로 웨이퍼의 이송 도중 웨이퍼의 움직임을 감지하는 종래의 방법은 공정챔버에서 가공중이던 웨이퍼가 가공불량이나 제품결함으로 파손되었을 때 언로딩암에 이송되는 웨이퍼조각이 전체 웨이퍼크기의 25% 이상일 경우 센서가 이를 정상적인 웨이퍼의 이송으로 감지하여 제어부가 다음 웨이퍼의 가공작업을 지시하게 되고 따라서 공정챔버 내부에 잔존하는 웨이퍼조각들 위에 다음 웨이퍼가 로딩되어 결국 웨이퍼가 반복하여 파손되는 설비의 오동작이 발생하였다.In general, the conventional method of detecting the movement of the wafer during the transfer of the wafer is a sensor when the wafer being transferred to the unloading arm is more than 25% of the total wafer size when the wafer being processed in the process chamber is damaged due to defects or product defects. The sensor detects this as a normal wafer transfer, and the controller instructs the next wafer to be processed. Accordingly, the next wafer is loaded on the remaining wafer pieces inside the process chamber, and the wafer is repeatedly malfunctioned.

또한, 종래의 로드락챔버의 웨이퍼 감지장치는 언로딩로드락챔버에만 설치되어 리프터의 작동불량이나 로딩로드락챔버의 로딩암 작동불량에 대한 감지가 이루어지지 않아 오동작에 의한 웨이퍼의 이송이 비정상적일 때 설비의 가동을 중단시킬 수 없기 때문에 웨이퍼의 파손이나 불량 및 깨진 웨이퍼조각들로 인한 설비의 고장 등 손실이 증가되는 문제점이 있었다.In addition, the wafer detection device of the conventional load lock chamber is installed only in the unloading load lock chamber, so that the transfer of the wafer due to the malfunction may be abnormal because the detection of the lifter operation failure or the loading arm operation failure of the loading load lock chamber is not made. When the facility can not be stopped, there is a problem that the loss is increased, such as failure of the wafer due to wafer breakage or failure and broken wafer pieces.

본 발명은 상기와 같은 종래의 문제점을 해결하기 위한 것으로, 그 목적은 웨이퍼의 로딩 및 언로딩위치에 센서를 장착함으로써 보다 정밀하고 오류가 없는 웨이퍼의 로딩을 감지하여 웨이퍼의 가공불량이나 웨이퍼의 가공불량이 다음 웨이퍼나 설비에 영향을 주는 것을 방지할 수 있는 로드락챔버의 웨이퍼 감지장치를 제공함에 있다.The present invention is to solve the conventional problems as described above, the object is to mount the sensor at the loading and unloading position of the wafer to detect the wafer loading more precise and error-free, the processing of the wafer or wafer processing It is to provide a wafer sensing device of a load lock chamber that can prevent defects from affecting the next wafer or equipment.

본 발명의 다른 목적은 로딩로드락챔버에 센서를 장착함으로써 리프터나 로딩암의 오동작을 감지하여 웨이퍼의 가공불량이나 웨이퍼의 가공불량이 다음 웨이퍼나 설비에 영향을 주는 것을 방지할 수 있는 로드락챔버의 웨이퍼 감지장치를 제공함에 있다.Another object of the present invention is to install a sensor in the loading load lock chamber to detect the malfunction of the lifter or loading arm to prevent the processing failure of the wafer or the processing failure of the wafer to affect the next wafer or equipment To provide a wafer sensing device.

도 1은 종래의 로드락챔버의 웨이퍼 감지장치를 나타낸 개략도이다.1 is a schematic view showing a wafer sensing apparatus of a conventional load lock chamber.

도 2는 본 발명에 따른 로드락챔버의 웨이퍼 감지장치를 나타낸 개략도이다.2 is a schematic view showing a wafer sensing device of a load lock chamber according to the present invention.

도 3a,3b는 본 발명의 다른 실시예를 나타낸 개략도이다.3A and 3B are schematic diagrams showing another embodiment of the present invention.

도 4는 도 2의 웨이퍼 감지상태를 나타낸 단면도이다.4 is a cross-sectional view illustrating a wafer sensing state of FIG. 2.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

10 : 로딩로드락챔버 11 : 로딩암10 loading rod lock chamber 11: loading arm

12 : 공정챔버 13, 20, 30 : 센서12: process chamber 13, 20, 30: sensor

14 : 언로딩로드락챔버 15 : 언로딩암14: unloading rod lock chamber 15: unloading arm

16 : 리프터 17, 18 : 덮개16: lifter 17, 18: cover

이와 같은 상기의 목적을 달성하기 위한 본 발명은 가공을 마친 웨이퍼가 로딩암에 의해 덮개를 갖는 로딩로드락챔버로 이송되고, 이 이송상태를 제어부가 확인하여 작업을 수행한 후 로딩로드락챔버의 조건니 공정챔버의 조건과 동일해지면 로딩암이 웨이퍼를 공정챔버내로 이송시켜 공정을 수행하며, 이 공정이 완료된 웨이퍼를 언로딩암이 덮개를 갖는 언로딩로드락챔버로 이송시키는 과정에서 웨이퍼의 파손이나 오동작으로 인한 웨이퍼의 이탈을 감지하는 로드락챔버의 웨이퍼 감지장치에 있어서, 상기 로딩로드락챔버덮개 및 언로딩로드락챔버덮개의 저면에는 웨이퍼의 정상상태를 정획히 감지하기 위한 센서가 다수개 설치됨을 특징으로 한다.In order to achieve the above object, the present invention is processed wafer is transferred to the loading load lock chamber having a cover by the loading arm, the control unit confirms the transfer state of the loading load lock chamber after If the condition is equal to the condition of the process chamber, the loading arm transfers the wafer into the process chamber to perform the process, and the wafer is broken in the process of transferring the completed wafer to the unloading load lock chamber having the cover of the unloading arm. In the wafer detection device of the load lock chamber for detecting the departure of the wafer due to the failure or malfunction, there are a plurality of sensors on the bottom of the loading load lock chamber cover and the unloading load lock chamber cover to accurately detect the normal state of the wafer Characterized in that it is installed.

또한, 본 발명에 따른 로드락챔버의 웨이퍼 감지장치에 있어서, 상기 웨이퍼의 로딩 및 언로딩을 감지하고 웨이퍼의 이동상태까지 모두 감지할 수 있도록 로딩암 및 언로딩암에 다수개의 센서가 설치됨이 바람직하다.In addition, in the wafer detection apparatus of the load lock chamber according to the present invention, it is preferable that a plurality of sensors are installed on the loading arm and the unloading arm so as to detect the loading and unloading of the wafer and to detect the movement state of the wafer. Do.

이하, 본 발명의 구체적인 실시예를 첨부된 도면을 참조하여 상세히 설명 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 로드락챔버의 웨이퍼 감지장치의 바람직한 실시예를로딩로드락챔버(10)2 shows a preferred embodiment of the wafer sensing device of the load lock chamber according to the present invention.

도 2를 참조하여 설명하면 로드락챔버의 웨이퍼 감지장치는, 웨이퍼가 로딩로드락챔버(10) 및 언로딩로드락챔버(14) 내로 이송되어 공정챔버(12)로의 투입 또는 다음 공정으로의 배출을 준비하는 웨이퍼 이송위치에 설치된 복수개의 센서(20)로 이루어지고 이 센서(20)는 상하좌우로 배치하고 도 4에서와 같이 로딩로드락챔버(10) 및 언로딩로드락챔버(14)의 덮개(17)(18)에 설치하며 웨이퍼의 로딩 및 언로딩의 완료를 감지하도록 한다. 또한 도시하지는 않았지만 상기 복수개의 센서(20)로부터 감지신호를 수신하여 설비를 제어하는 제어부를 구비한다.Referring to FIG. 2, in the wafer detection apparatus of the load lock chamber, the wafer is transferred into the loading load lock chamber 10 and the unloading load lock chamber 14 to be introduced into the process chamber 12 or discharged to the next process. It consists of a plurality of sensors 20 installed in the wafer transfer position to prepare the sensor 20 is arranged up, down, left and right and as shown in Figure 4 of the loading load lock chamber 10 and the unloading load lock chamber 14 Installed on the lids 17 and 18 to detect the completion of loading and unloading of the wafer. In addition, although not shown is provided with a control unit for receiving a detection signal from the plurality of sensors 20 to control the facility.

센서(20)의 형태는 광센서, 전파센서 등 비접촉식의 센서가 바람직하며 센서(20)의 설치 개수는 웨이퍼의 정상상태를 감지하도록 웨이퍼의 상하좌우로 배치하여 도 4에 도시된 바와 같이 로딩로드락챔버(10) 및 언로딩로드락챔버(14) 내부의 덮개(17)(18)에 위치하며 웨이퍼 상부에 상하좌우 4개씩을 설치하는 것이 적당하다.The shape of the sensor 20 is preferably a non-contact sensor such as an optical sensor, a radio wave sensor, and the number of installations of the sensor 20 is arranged up, down, left, and right of the wafer so as to detect the normal state of the wafer, as shown in FIG. It is appropriate to install four upper, lower, left, and right positions on the cover 17 and 18 inside the lock chamber 10 and the unloading load lock chamber 14.

이러한 로드락챔버의 웨이퍼 감지장치의 동작을 설명하면, 먼저 도 2에 도시된 바와 같이 리프터(16)가 이전 공정의 가공을 마친 웨이퍼를 로딩암(11)에 올려 놓음으로써 웨이퍼를 인계하고 웨이퍼를 인계받은 로딩암(11)은 통로를 통해 로딩로드락챔버(10)의 내부로 웨이퍼를 이송하고 통로를 닫아 로딩로드락챔버(10)를 밀폐한다. 이때 웨이퍼의 상측 로딩로드락챔버(10)의 덮개에 형성된 센서(20)가 웨이퍼를 감지하고 감지신호를 수신받은 제어부는 웨이퍼의 정상적인 이송을 확인하여 다음 작업을 수행한다. 다음으로 가스공급라인을 통해 로딩로드락챔버(10)의 조건이 공정챔버(12)의 조건과 동일해지면 공정챔버(12)의 투입통로가 개방되고 로딩암(11)이 투입통로를 통해 웨이퍼를 챔버 내부의 핀 또는 척 상에 올려 놓는다.Referring to the operation of the wafer detection device of the load lock chamber, first, as shown in FIG. 2, the lifter 16 lifts the wafer by placing the wafer, which has been processed in the previous process, on the loading arm 11, and lifts the wafer. The inherited loading arm 11 transfers the wafer into the loading load lock chamber 10 through the passage and closes the passage to seal the loading load lock chamber 10. At this time, the sensor 20 formed on the cover of the upper loading rod lock chamber 10 of the wafer detects the wafer and the control unit receiving the detection signal checks the normal transfer of the wafer and performs the following operation. Next, when the condition of the loading load lock chamber 10 is the same as that of the process chamber 12 through the gas supply line, the input passage of the process chamber 12 is opened and the loading arm 11 moves the wafer through the input passage. Place it on a pin or chuck inside the chamber.

핀 또는 척 상에서 공정을 마친 웨이퍼는 언로딩암(15)이 들어올려 배출통로를 통해서 이송하게 된다. 이때 웨이퍼의 상측 언로딩로드락챔버(14)의 덮개에 형성된 센서(20)가 웨이퍼를 감지하고 감지신호를 수신받은 제어부는 웨이퍼의 정상적인 이송을 확인하여 다음 웨이퍼의 가공을 준비한다.After the process is completed on the pin or chuck, the unloading arm 15 is lifted and transferred through the discharge passage. At this time, the sensor 20 formed on the cover of the upper unloading load lock chamber 14 of the wafer detects the wafer and the control unit receiving the detection signal checks the normal transfer of the wafer to prepare for processing of the next wafer.

따라서, 정상상태의 웨이퍼 이송과정을 제어부가 제어하여 웨이퍼의 파손이나 로딩암(11) 및 언로딩암(15)의 오동작으로 인한 웨이퍼의 이탈을 즉각 감지하고 설비를 중단한 후 웨이퍼나 설비의 문제를 해결할 수 있다.Therefore, the controller controls the wafer transfer process in a steady state to immediately detect the detachment of the wafer due to the breakage of the wafer or the malfunction of the loading arm 11 and the unloading arm 15. Can be solved.

또한, 더욱 정확한 웨이퍼의 로딩 및 언로딩을 감지하고 웨이퍼의 이동상태까지 모두 감지할 수 있는 구조로는 도 3a,3b에서 제시된 바와 같이 로딩암(11) 및 언로딩암(15)에 접촉식 또는 비접촉식의 센서(30)를 형성하여 로딩암(11) 및 언로딩암(15)이 웨이퍼를 얹어놓고 내려놓는 순간까지 웨이퍼의 이송상태를 항상 확인할 수 있는 로드락챔버의 웨이퍼 감지장치도 가능하다. 센서(30)의 개수는 로딩암(11) 및 언로딩암(15)의 형상에 따라 웨이퍼가 맞닫는 곳에 단수 또는 복수개를 설치 가능하고 바람직하기로는 암의 끝단에 각각 1개씩과 암의 연결부에 설치하여 모두 3개를 설치하는 것이 적당하다.In addition, as a structure that can detect the loading and unloading of the wafer more accurately, and even the movement state of the wafer, as shown in FIGS. 3a and 3b, the contact arm or the loading arm 11 and the unloading arm 15 may be contacted or not. It is also possible to form a non-contact sensor 30, the wafer detection device of the load lock chamber that can always check the transfer state of the wafer until the loading arm 11 and the unloading arm 15 put the wafer on and off. The number of sensors 30 may be provided in singular or plural places where the wafers are in close contact with each other according to the shape of the loading arm 11 and the unloading arm 15. Preferably, the number of sensors 30 is one at each end of the arm and the connection portion of the arm. It is suitable to install all three by installing.

이상에서와 같이 본 발명에 따른 로드락챔버의 웨이퍼 감지장치에 의하면, 웨이퍼의 로딩위치에 센서를 장착함으로써 보다 정밀하고 오류가 없는 웨이퍼의 로딩 및 언로딩 상태를 감지하고 리프터, 로딩암, 언로딩암의 오동작을 감지하여 웨이퍼의 가공불량이나 웨이퍼의 가공불량이 다음 웨이퍼나 설비에 영향을 주는 것이 방지되는 효과를 갖는 것이다.According to the wafer detection device of the load lock chamber according to the present invention as described above, by mounting the sensor in the loading position of the wafer to detect the loading and unloading state of the wafer more precise and error-free, lifter, loading arm, unloading By detecting the malfunction of the arm, the wafer defect or the wafer defect is prevented from affecting the next wafer or equipment.

이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.

Claims (2)

가공을 마친 웨이퍼가 로딩암에 의해 덮개를 갖는 로딩로드락챔버로 이송되고, 이 이송상태를 제어부가 확인하여 작업을 수행한 후 로딩로드락챔버의 조건이 공정챔버의 조건과 동일해지면 로딩암이 웨이퍼를 공정챔버내로 이송시켜 공정을 수행하며, 이 공정이 완료된 웨이퍼를 언로딩암이 덮개를 갖는 언로딩로드락챔버로 이송시키는 과정에서 웨이퍼의 파손이나 오동작으로 인한 웨이퍼의 이탈을 감지하는 로드락챔버의 웨이퍼 감지장치에 있어서,After processing, the wafer is transferred to the loading load lock chamber with the cover by the loading arm, and the control unit confirms the transfer state and performs the operation. After the loading load lock chamber has the same condition as the process chamber, the loading arm is moved. The process is performed by transferring the wafer into the process chamber, and a load lock that detects the detachment of the wafer due to the breakage or malfunction of the wafer during the transfer of the completed wafer to the unloading load lock chamber having the cover of the unloading arm. In the wafer sensing device of the chamber, 상기 로딩로드락챔버덮개 및 언로딩로드락챔버덮개의 저면에는 웨이퍼의 정상상태를 정획한 감지하기 위한 센서가 다수개 설치됨울 특징으로 하는 로드락탬버의 웨이퍼 감지장치Wafer detection device of the load lock tamver, characterized in that a plurality of sensors are installed on the bottom of the loading load lock chamber cover and the unloading load lock chamber cover to detect the normal state of the wafer 제 1항에 있어서, 상기 웨이퍼의 로딩 및 언로딩을 감지하고 웨이퍼의 이동상태까지 모두 감지할 수 있도록 로로딩암 및 언로딩암에 다수개의 센서가 더 설차됨을 특징으로 하는 로드락챔버의 웨이퍼 감지장치.The wafer detection of the load lock chamber of claim 1, wherein a plurality of sensors are further installed on the loading and unloading arms to detect the loading and unloading of the wafer and to detect the wafer movement state. Device.
KR1019970015216A 1997-04-23 1997-04-23 Apparatus for sensing wafer in load lock chamber KR100274598B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019970015216A KR100274598B1 (en) 1997-04-23 1997-04-23 Apparatus for sensing wafer in load lock chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970015216A KR100274598B1 (en) 1997-04-23 1997-04-23 Apparatus for sensing wafer in load lock chamber

Publications (2)

Publication Number Publication Date
KR19980077891A KR19980077891A (en) 1998-11-16
KR100274598B1 true KR100274598B1 (en) 2001-01-15

Family

ID=40749520

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970015216A KR100274598B1 (en) 1997-04-23 1997-04-23 Apparatus for sensing wafer in load lock chamber

Country Status (1)

Country Link
KR (1) KR100274598B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100407568B1 (en) * 2001-06-01 2003-12-01 삼성전자주식회사 Apparatus for processing semiconductor having foup index inside apparatus establishing area

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148546A (en) * 1994-11-22 1996-06-07 Sumitomo Metal Ind Ltd Wafer arrangement detection device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148546A (en) * 1994-11-22 1996-06-07 Sumitomo Metal Ind Ltd Wafer arrangement detection device

Also Published As

Publication number Publication date
KR19980077891A (en) 1998-11-16

Similar Documents

Publication Publication Date Title
KR100440683B1 (en) Vacuum processing apparatus and semiconductor production line using the same
KR100272252B1 (en) Method for carrying wafer cassette
US6113165A (en) Self-sensing wafer holder and method of using
KR20020068779A (en) Loadport for semiconductor processing apparatus
US8215891B2 (en) Substrate treating apparatus, and a substrate transporting method therefor
KR100274598B1 (en) Apparatus for sensing wafer in load lock chamber
JP2002329770A (en) Substrate detector, substrate processing equipment and method of operation thereof
KR200222600Y1 (en) Wafer sensor of load lock chamber for semiconductor process
KR100245650B1 (en) A measuring system in the line for manufacturing semiconductor devicdevices
KR19980042584A (en) Retry control method and apparatus for processing equipment
KR20070049454A (en) Apparatus for treating substrate and controlling method thereof
KR100689696B1 (en) semiconductor device manufacturing system and using method there of
KR100246850B1 (en) Wafer carrier elevator for sensing a wafer incongruent loading after dry etching process
KR100495419B1 (en) Semiconductor manufacturing device
KR20020016072A (en) A load lock chamber for semiconductor device fabrication equipment
KR0141623B1 (en) Battery failure detector
KR20230160732A (en) Abnormality detection method and transfer device
KR20010064306A (en) semiconductor apparatus for protecting breakage of loading/unloding wafers
KR20080023005A (en) Inter-lock device for preventing damage of wafer
KR200169678Y1 (en) Centering apparatus semiconductor exposure and developing track interface unload wafer
KR19980025817A (en) Wafer loading / unloading device and loading / unloading method using same
KR20040009243A (en) cassette loader equipment of semiconductor device manufacturing equipment
KR20010086513A (en) Semiconductor wafer transfer equipment
KR20020037862A (en) Wafer sensor in semiconductor equipment
KR20050117823A (en) Chamber lid of load lock chamber

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20060830

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee