KR100273203B1 - Wafer cooling apparatus for semiconductor manufacturing device using thermo module - Google Patents

Wafer cooling apparatus for semiconductor manufacturing device using thermo module Download PDF

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KR100273203B1
KR100273203B1 KR1019920021666A KR920021666A KR100273203B1 KR 100273203 B1 KR100273203 B1 KR 100273203B1 KR 1019920021666 A KR1019920021666 A KR 1019920021666A KR 920021666 A KR920021666 A KR 920021666A KR 100273203 B1 KR100273203 B1 KR 100273203B1
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wafer
thermo module
semiconductor manufacturing
wafer chuck
cooling
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KR1019920021666A
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Korean (ko)
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KR940012481A (en
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유용식
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김영환
현대반도체주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: A wafer cooling device for a semiconductor manufacturing apparatus is provided to accurately and conveniently control a desired cooling condition and to improve product quality by adapting a thermo module to drive the same with electric mode. CONSTITUTION: A wafer cooling device for a semiconductor manufacturing apparatus discharges heat generated during process. The wafer cooling device comprises a radiator plate(14), a thermo module(13), a thermocouple(15) and a micom(16). The radiator plate is installed back of a wafer chuck(12) installed to a process chamber(11). The thermo module is installed between the radiator plate and the wafer chuck to cool the wafer chuck. The thermocouple is connected to the middle portion of the thermo module to detect temperature of the wafer chuck. The micom controls power of thermo module with detection signals of the thermocouple.

Description

써머모듈을 이용한 반도체 제조장비용 웨이퍼 쿨링장치Wafer Cooling Device for Semiconductor Manufacturing Equipment Using Thermo Module

제1(a)도, 제1(b)도는 종래 반도체 제조장비용 웨이퍼 쿨링장치의 개략적인 구조를 보인 도면으로서,1 (a), 1 (b) is a view showing a schematic structure of a conventional wafer cooling apparatus for semiconductor manufacturing equipment,

제1(a)도는 종래 냉각수를 이용한 웨이퍼 쿨링장치의 계통도.1 (a) is a schematic diagram of a wafer cooling apparatus using conventional cooling water.

제1(b)도는 종래 질소가스를 이용한 웨이퍼 쿨링장치의 계통도.1 (b) is a schematic diagram of a wafer cooling apparatus using a conventional nitrogen gas.

제2도는 본 발명 써머모듈을 이용한 반도체 제조장비용 웨이퍼 쿨링장치의 구조를 보인 계통도.Figure 2 is a schematic diagram showing the structure of a wafer cooling device for semiconductor manufacturing equipment using the thermal module of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

11 : 공정챔버 12 : 웨이퍼척11 process chamber 12 wafer chuck

13 : 써머모듈 14 : 방열판13: thermo module 14: heat sink

15 : 써머커플 16 : 마이콤15: Thermocouple 16: Micom

본 발명은 반도체 제조장비에 있어서, 공정시 발생되는 열을 냉각시켜주기 위한 웨이퍼 쿨링(Wafer Cooling)장치에 관한 것으로, 특히 사용자가 원하는 쿨링조건을 보다 정확하면서도 간편하게 컨트롤할 수 있도록 한 써머모듈(Thermo Module)을 이용한 반도체 제조장비용 웨이퍼 쿨링장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer cooling device for cooling heat generated during a process in a semiconductor manufacturing equipment, and more particularly, to provide a more precise and simple control of cooling conditions desired by a user. It relates to a wafer cooling device for semiconductor manufacturing equipment using a module.

일반적으로 반도체 제조장비에는 공정시 발생되는 열을 냉각시켜 주기 위한 웨이퍼 쿨링장치가 구비되어 있다.In general, semiconductor manufacturing equipment is equipped with a wafer cooling device for cooling the heat generated during the process.

이러한 웨이퍼 쿨링장치는 웨이퍼가 고정되는 웨이퍼 척의 후면에 냉각수나 질소가스등과 같은 냉매를 순환시킴으로써 공정시 발생된 열을 방출시키는 구조로 되어있다.The wafer cooling device is configured to release heat generated during the process by circulating a coolant such as cooling water or nitrogen gas on the rear surface of the wafer chuck on which the wafer is fixed.

제1도는 종래 반도체 제조장비용 웨이퍼 쿨링장치의 계통도로서, 도면에서 1은 웨이퍼척을 보인 것이고, 2는 냉매순환라인을 보인 것으로, 도면에 도시되어 있는 바와 같이, 종래의 웨이퍼 쿨링장치는 웨이퍼척(1)의 후면에 냉매순환라인(2)을 설치하여 냉매를 순환시킴으로써 웨이퍼(3) 표면에 발생된 열을 방출시키는 구조로 되어있다.1 is a schematic diagram of a wafer cooling apparatus for a conventional semiconductor manufacturing equipment. In the drawing, 1 shows a wafer chuck and 2 shows a refrigerant circulation line. As shown in the drawing, a conventional wafer cooling apparatus is a wafer chuck ( The refrigerant circulation line 2 is provided on the rear surface of 1) to circulate the refrigerant, thereby releasing heat generated on the surface of the wafer 3.

상기 냉매로는 제1(a)도에 도시한 바와 같이 냉각수를 사용하거나 제1(b)도에 도시한 바와 같이 질소(N2)가스를 사용하고 있었다.As the refrigerant, cooling water was used as shown in FIG. 1 (a) or nitrogen (N2) gas was used as shown in FIG. 1 (b).

도면에서 미설명 부호 4는 웨이퍼클램프를 보인 것이다.Reference numeral 4 in the drawings shows a wafer clamp.

그러나, 상기한 바와 같은 종래의 웨이퍼 쿨링장치는 웨이퍼척(1)이 고진공 및 고온의 공정챔버내에 위치하게 됨에 따라 쿨링워터공급 및 배수라인을 챔버내부까지 설치하여야 하므로 누수(Leak)발생가능성이 있는 것이었고, 쿨링조건(온도) 컨트롤이 매우 어려운 단점이 있었다.However, in the conventional wafer cooling apparatus as described above, as the wafer chuck 1 is located in a high vacuum and high temperature process chamber, a cooling water supply and drain line must be installed up to the inside of the chamber, which may cause leakage. The cooling conditions (temperature) was very difficult to control.

이를 감안하여 창안한 본 발명의 주목적은 사용자가 원하는 쿨링조건을 보다 정확하면서도 간편하게 컨트롤할 수 있도록 한 써머모듈을 이용한 반도체 제조장비용 웨이퍼 쿨링장치를 제공함에 있다.In view of this, an object of the present invention is to provide a wafer cooling apparatus for semiconductor manufacturing equipment using a thermal module that enables a user to more accurately and easily control a desired cooling condition.

본 발명의 다른 목적은 냉매의 사용을 배제하고, 써머모듈을 채용함으로써 전기적인 신호로 웨이퍼척을 쿨링시키는 등 온도컨트롤이 간편하고, 설치가 용이한 써머모듈을 이용한 반도체 제조장비용 웨이퍼 쿨링장치를 제공함에 있다.Another object of the present invention is to provide a wafer cooling device for semiconductor manufacturing equipment using a thermo module that is simple to control and easy to install, such as cooling the wafer chuck with an electrical signal by eliminating the use of a refrigerant and employing a thermo module. Is in.

상기와 같은 본 발명의 목적을 달성하기 위하여 공정시 발생되는 열을 방출시키기 위한 반도체 제조장비용 웨이퍼 쿨링장치를 구성함에 있어서, 공정챔버(11)에 설치된 웨이퍼척(12)의 이면에 방열판(14)을 설치하며, 상기 방열판(14)과 웨이퍼척(12)사이에 웨이퍼척 냉각용 써머모듈(13)을 장착하고, 상기 냉각용 써머모듈(13)의 중간부에 접속되어 웨이퍼척(12)의 온도를 감지하는 써머커플(15)과, 상기 써머커플(15)의 감지신호에 따라 써머모듈(16)의 파워를 제어하는 마이콤(16)을 구비하여, 사용자가 원하는 쿨링조건을 보다 정확하면서도 간편하게 컨트롤 할 수 있도록 구성한 것을 특징으로 하는 써머모듈을 이용한 반도체 제조장비용 웨이퍼 쿨링장치가 제공된다.In the construction of a wafer cooling apparatus for semiconductor manufacturing equipment for releasing heat generated during the process to achieve the object of the present invention as described above, the heat sink 14 on the rear surface of the wafer chuck 12 installed in the process chamber 11 A wafer chuck cooling thermal module 13 is disposed between the heat sink 14 and the wafer chuck 12, and is connected to an intermediate portion of the cooling thermal module 13 to provide a wafer chuck 12. The thermocouple 15 which senses temperature and the microcomputer 16 which controls the power of the thermo module 16 according to the sensing signal of the thermocouple 15 are provided, so that the cooling conditions desired by the user can be more accurately and conveniently. Provided is a wafer cooling apparatus for semiconductor manufacturing equipment using a thermo module, which is configured to be controlled.

이와 같이 된 본 발명에 의한 써머모듈을 이용한 반도체 제조장비용 웨이퍼 쿨링장치는 마이콤을 이용한 전기적인 신로로 써머모듈을 선택적으로 구동시켜 웨이퍼척을 쿨링하므로 온도컨트롤이 간편용이할 뿐만아니라 정확한 온도컨트롤이 가능하게 되고, 전기적인 쿨링방식을 채택함으로써 고진공 챔버내에 설치가 용이하게 되며, 종래와 같은 누수 및 진동발생가능성을 일소함으로써 제품의 품질향상을 기할 수 있다는 효과가 있고, 웨이퍼 냉각속도를 컨트롤할 수 있다는 등의 효과도 있다.The wafer cooling device for semiconductor manufacturing equipment using the thermal module according to the present invention thus cools the wafer chuck by selectively driving the thermal module with an electric furnace using a microcomputer, so that the temperature control is simple and accurate temperature control is possible. By adopting the electric cooling method, it is easy to install in a high vacuum chamber, and it is possible to improve the quality of the product by eliminating the possibility of leakage and vibration as in the past, and to control the wafer cooling speed. There is also an effect.

이하, 상기한 바와 같은 본 발명에 의한 써머모듈을 이용한 반도체 제조장비용 웨이퍼 쿨링장치를 첨부도면에 의거하여 보다 상세히 설명한다.Hereinafter, the wafer cooling apparatus for semiconductor manufacturing equipment using the thermal module according to the present invention as described above will be described in more detail with reference to the accompanying drawings.

첨부한 제2도는 본 발명 써머모듈을 이용한 반도체 제조장비용 웨이퍼 쿨링장치의 구조를 보인 계통도로서 이에 도시한 바와 같이, 본 발명에 의한 웨이퍼 쿨링장치는 공정챔버(11)의 일측벽 내부에 위치하도록 웨이퍼척(12)이 고정설치되어 있고, 상기 웨이퍼척(12)의 이면에는 인가되는 파워에 따라 구동되어 웨이퍼척(12)을 냉각시키는 써머모듈(13) 및 방열판(14)이 설치되어 있으며, 상기 써머모듈(13)의 중간부에는 웨이퍼척(12)의 온도를 감지하는 써머커플(15)이 접속되어 이 써머커플(15)의 감지신호에 의해 상기 써머모듈(13)에 선택적으로 파워를 인가하는 마이콤(16)과 연결되어 있다.2 is a schematic diagram showing the structure of a wafer cooling apparatus for semiconductor manufacturing equipment using the thermal module of the present invention. As shown in the drawing, the wafer cooling apparatus according to the present invention is located within one side wall of the process chamber 11. The chuck 12 is fixedly installed, and a thermo module 13 and a heat sink 14 are installed on the rear surface of the wafer chuck 12 to cool the wafer chuck 12 by driving according to the applied power. A thermocouple 15 for sensing the temperature of the wafer chuck 12 is connected to an intermediate portion of the thermo module 13 to selectively apply power to the thermo module 13 by the detection signal of the thermocouple 15. Is connected to the microcomputer 16.

상기 마이콤(16)은 파워라인(17)에 의해 써머모듈(13)과 접속연결되어 있고, 써머모듈의 파워를 컨트롤할 수 있도록 프로그램되어 사용자가 원하는 웨이퍼척의 온도가 셋팅되어 있다.The microcomputer 16 is connected to the thermal module 13 by a power line 17, and is programmed to control the power of the thermal module so that the temperature of the wafer chuck desired by the user is set.

즉, 써머커플(15)에 의해 현재의 웨이퍼척(12) 온도가 감지되고, 이 감지신호는 써머커플(15)과 마이콤(16)을 연결하는 연결라인(18)의 도중에 개재된 증폭부(19)에 의해 증폭되어 마이콤(16)으로 전달되며, 마이콤(16)은 감지신호의 온도와 미리 셋팅된 웨이퍼척(12)의 온도를 비교하여 비교치만큼의 신호로 써머모듈(13)의 파워를 컨트롤함으로써 써머모듈(13)이 선택적으로 구동되어 웨이퍼척(12)의 온도를 컨트롤하도록 구성되어 있다.That is, the temperature of the current wafer chuck 12 is sensed by the thermocouple 15, and the detection signal is amplified in the middle of the connection line 18 connecting the thermocouple 15 and the microcomputer 16. 19) is amplified and transferred to the microcomputer 16, the microcomputer 16 compares the temperature of the sensing signal with the temperature of the wafer chuck 12 preset, and the power of the thermo module 13 with a signal equal to the comparison value. The thermo module 13 is selectively driven to control the temperature of the wafer chuck 12 by controlling.

도면중 미설명 부호 12a는 웨이퍼를 보인 것이다.In the figure, reference numeral 12a shows a wafer.

이와 같이된 본 발명에 의한 웨이퍼 쿨링장치는 웨이퍼척(12)과 방열판(14)사이에 웨이퍼척 냉각용 써머모듈(13)을 장착하여 공정시 발생되는 열을 써머모듈(13)을 통하여 챔버(11) 외부로 방출시키는 작용을 하게 되는 바, 써머커플(15)에 의해 웨이퍼척(12)의 실제온도가 리딩(Reading)되어 마이콤(16)에 인식되고 마이콤(16)에 셋팅된 온도(사용자가 콘트롤 하려하는 웨이퍼척온도, 미리설정된 값)와 비교되어 비교치 만큼의 신호로 마이콤(16)에서 써머모듈(13)로 파워가 인가됨으로써 써머모듈(13)이 구동되어 냉각작용을 수행하게 된다. 즉, 마이콤(16)에서 웨이퍼척(12)의 현재 온도에 따라 써머모듈(13)의 파워를 컨트롤함으로써 사용자가 원하는 웨이퍼척 온도를 컨트롤하는 것이다. 따라서 온도컨트롤이 용이하게 이루어지고 보다 정확한 온도컨트롤이 가능하게 되는 것이다.In the wafer cooling apparatus according to the present invention as described above, the wafer chuck cooling thermal module 13 is mounted between the wafer chuck 12 and the heat sink 14, and the heat generated during the process is transferred to the chamber through the thermal module 13. 11) The external temperature of the wafer chuck 12 is read by the thermocouple 15 so that the actual temperature of the wafer chuck 12 is recognized by the microcomputer 16 and set in the microcomputer 16 (user Is compared to the wafer chuck temperature to be controlled, and a predetermined value) and the power is applied from the microcomputer 16 to the thermo module 13 with a signal equivalent to the comparison value, thereby driving the thermo module 13 to perform a cooling operation. . That is, the microcomputer 16 controls the wafer chuck temperature desired by the user by controlling the power of the thermo module 13 according to the current temperature of the wafer chuck 12. Therefore, temperature control is made easily and more accurate temperature control is possible.

이와 같이 컨트롤된 열은 방열판(14)을 통하여 대기중으로 방출된다.The heat thus controlled is released into the atmosphere through the heat sink 14.

여기서, 써머모듈의 온도차는 최대 60℃이다.Here, the temperature difference of the thermo module is at most 60 ℃.

이상에서 상세히 설명한 바와 같이, 본 발명 써머모듈을 이용한 반도체 제조장비용 웨이퍼 쿨링장치는 마이콤을 이용한 전기적인 신호로 써머모듈은 선택적으로 구동시켜 웨이퍼척을 쿨링시키므로, 온도컨트롤이 간편할 뿐만 아니라 보다 정확한 온도컨트롤이 가능하게 되고, 전기적인 쿨링방식을 채택함으로써 고진공챔버내의 설치가 용이하게 되며, 종래와 같은 누수 및 진동발생 가능성을 일소함으로써 제품의 품질 향상을 기할 수 있다는 효과가 있고, 웨이퍼 냉각속도[램프다운(Ramp Down)속도]를 컨트롤할 수 있는 등의 효과도 있다.As described in detail above, the wafer cooling apparatus for semiconductor manufacturing equipment using the thermal module of the present invention cools the wafer chuck by selectively driving the thermal module with an electrical signal using a microcomputer, so that the temperature control is simple and the temperature is more accurate. It is possible to control, and to adopt the electric cooling method, it is easy to install in the high vacuum chamber, and to improve the quality of the product by eliminating the possibility of leakage and vibration as in the past, the wafer cooling rate [lamp Ramp Down Speed] can be controlled.

Claims (1)

공정시 발생되는 열을 방출시키기 위한 반도체 제조장비용 웨이퍼 쿨링장치를 구성함에 있어서, 공정챔버(11)에 설치된 웨이퍼척(12)의 이면에 방열판(14)을 설치하며, 상기 방열판(14)과 웨이퍼척(12)사이에 웨이퍼척 냉각용 써머모듈(13)을 장착하고, 상기 냉각용 써머모듈(13)의 중간부에 접속되어 웨이퍼척(12)의 온도를 감지하는 써머커플(15)과, 상기 써머커플(15)의 감지신호에 따라 써머모듈(16)의 파워를 제어하는 마이콤(16)을 구비하여, 사용자가 원하는 쿨링조건을 보다 정확하면서도 간편하게 컨트롤 할 수 있도록 구성한 것을 특징으로 하는 써머모듈을 이용한 반도체 제조장비용 웨이퍼 쿨링장치.In constructing a wafer cooling apparatus for semiconductor manufacturing equipment for releasing heat generated during the process, a heat sink 14 is provided on the rear surface of the wafer chuck 12 installed in the process chamber 11, and the heat sink 14 and the wafer are provided. A thermocouple 15 mounted between the chucks 12 and a wafer chuck cooling thermo module 13 connected to an intermediate portion of the cooling thermo module 13 to sense the temperature of the wafer chuck 12; Thermo module characterized in that it comprises a microcomputer 16 for controlling the power of the thermo module 16 in accordance with the detection signal of the thermocouple 15, so that the user can more accurately and easily control the desired cooling conditions Wafer cooling device for semiconductor manufacturing equipment using.
KR1019920021666A 1992-11-18 1992-11-18 Wafer cooling apparatus for semiconductor manufacturing device using thermo module KR100273203B1 (en)

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KR100273203B1 true KR100273203B1 (en) 2001-01-15

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60258923A (en) * 1984-06-05 1985-12-20 Canon Inc Semiconductor manufacturing device
JPS63164442A (en) * 1986-12-26 1988-07-07 Tokyo Electron Ltd Wafer prober

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60258923A (en) * 1984-06-05 1985-12-20 Canon Inc Semiconductor manufacturing device
JPS63164442A (en) * 1986-12-26 1988-07-07 Tokyo Electron Ltd Wafer prober

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