KR100262412B1 - Dc plasma display panel and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A direct current type plasma display panel and a method for manufacturing the same are provided to improve an aperture ratio of a plasma display panel by forming a barrier rib on a front substrate and a dot electrode of a cathode on the barrier rib. CONSTITUTION: A black matrix is formed on a substrate. A cathode line is formed on one side of the black matrix. A barrier rib is formed on the black matrix and a part of the cathode line adjacent to the black matrix. A dot electrode of a cathode is formed on the barrier rib and the exposed cathode line. An anode line, a dot electrode of an anode, and a resistance are formed on the substrate. A dielectric layer is formed between the dot electrodes of the anode. A fluorescent material is formed on the dielectric layer. A front substrate is combined with a rear substrate.

Description

DC plasma display panel and manufacturing method thereof

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel, and more particularly, to a direct current plasma display panel with improved aperture ratio and manufacturing yield and a method of manufacturing the same.

Plasma Display Panel (PDP), which is one of the flat panel display devices, is a display device that uses gas discharge, and can be manufactured with a relatively thin thickness. In addition, the present invention is emerging as a next-generation display device because of the advantage of being able to reduce the size of the display device and easily produce a large display device.

1 is a cross-sectional view of a conventional direct current type PDP. As shown in the drawing, the direct current type PDP is formed by bonding a back substrate 1 and a front substrate 6 on which electrodes are formed, respectively, and the back substrate 1 Anodes 2 for discharging are formed on the dielectric layer, and a dielectric layer 3 is formed on the substrates on both sides of the anode 2, and a unit discharge cell is formed on the central dielectric layer 3 of the adjacent anodes 3. Partition walls 4 for defining are formed respectively. On the front substrate 6, cathodes 7 for causing a discharge are formed in a stripe shape.

In the above, the anode 2 is composed of a stripe-shaped anode bus (not shown), a dot electrode 2a of the anode, and a resistor 2b that electrically connects them and prevents the occurrence of overcurrent, and the dielectric layer ( 3) is formed so as not to cover the upper surface of the dot electrode 2a of the anode. Although not shown, a black matrix is formed on the front substrate which abuts the partition wall to improve the contrast ratio of the PDP.

Subsequently, on the exposed dielectric layer 3, a phosphor 5 is applied to realize colorization of the PDP in a range not covering the upper surface of the anode dot electrode 2a, and a discharge space between the bonded back substrate and the front substrate is applied. A discharge gas 8 such as argon (Ar), neon (Ne) or xenon (Xe) is enclosed therein.

The DC-type PDP uses a gas discharge generated by a negative glow generated near a cathode and a gas discharge generated in a positive column region, which is the center of a discharge space. However, in a general DC type PDP, since the distance between the anode and the cathode is short, gas discharge is mainly caused by negative glow.

On the other hand, the height of the partition wall may be increased in order to increase the distance between the electrodes, but in this case, because of difficulty in the process, it is not practically used.

Therefore, as another conventional method for utilizing gas discharge in the positive column region, a direct current type PDP as shown in Fig. 2 was produced.

FIG. 2 is a diagram illustrating a direct current type PDP according to another exemplary embodiment in which the distance between the anode and the cathode is increased. Although the form is similar to that of the general direct current type PDP shown in FIG. The front substrate is bonded so that the dot electrodes 2a and 7a of the anode and cathode formed on each of them face diagonally. That is, the barrier ribs 4 are formed to be adjacent to the dot electrodes 2a of the anode in the fabrication of the back substrate 1, and the dot electrode 7a of the cathode in the fabrication of the front substrate 6 is the cathode. It is formed in the form of a column extending from one side of the bus bar (7b), the rear substrate (1) and the front substrate 6 is the cathode bus line of the discharge cell adjacent to the partition wall (4) formed to be adjacent to the dot electrode (2a) of the anode It adheres so that it may contact 7b.

Therefore, since the dot electrodes 2a and 7a of the anode and the cathode face in diagonal directions within the unit discharge cell, as shown in FIG. 1, the distance between the electrodes is larger than that in the normal DC-type PDP that faces vertically. It will be longer. As a result, the discharge can use not only the discharge by the negative glow but also the discharge in the positive column region, whereby the discharge efficiency is further improved.

However, the conventional direct current type PDP as described above usually forms the dot electrode of the cathode by the printing method. In this case, since the cathode dot electrode becomes wider due to the flowability of the printing paste, the dot electrode of the cathode There is a problem that the opening ratio of the PDP is reduced by increasing the front substrate portion covered by.

In addition, when the rear substrate and the front substrate are bonded, there is a problem in that manufacturing yield is lowered because alignment between the partition wall and the cathode busbar is difficult.

Therefore, in the present invention, the partition wall is formed on the front substrate, and the dot electrode of the cathode is formed on the partition wall surface by the sputtering process, thereby improving the opening ratio of the PDP and decreasing the manufacturing yield due to misalignment between the partition wall and the cathode bus bar. The purpose is to provide a direct current type PDP that can be prevented.

1 is a cross-sectional view showing a conventional DC plasma display panel.

2 is a cross-sectional view illustrating a DC plasma display panel having a conventional increased distance between an anode and a cathode.

3A to 3D are a series of cross-sectional views for explaining a method of manufacturing a DC plasma display panel according to an embodiment of the present invention.

4 is a plan view schematically showing a DC plasma display panel according to an embodiment of the present invention;

(Explanation of symbols for the main parts of the drawing)

1: back substrate 2: anode

2a: dot electrode of anode 2b: resistance

3: dielectric layer 4: partition wall

5: phosphor 6: front substrate

7: cathode 7a: dot electrode of cathode

7b: cathode bus line 10: black matrix

12: mask 20: discharge cell

30: auxiliary cell 22: priming pass

The above object is a diagonal of the positive electrode and the negative electrode of the positive electrode and the negative electrode of the positive electrode and the positive electrode and the back substrate on which the resistance connecting them and the negative electrode bus and the front substrate on which the negative electrode connected to the dot electrode is formed under the partition wall. A direct-current type plasma display panel bonded to face each other, wherein the cathode bus bar is formed to have a smaller width on one side of the longitudinal direction of the black matrix formed on the front substrate, and the partition wall has a cathode matrix adjacent to the black matrix. And a dot electrode of the cathode is formed on the exposed cathode bus bar and the partition surface on the upper portion thereof, by a direct current plasma display panel according to the present invention.

In addition, the above object, forming a black matrix on the front substrate; Forming a cathode bus bar having a smaller width on one side of the black matrix; Forming a partition on the black matrix and a portion of the cathode bus bar adjacent thereto; Forming a dot electrode of a cathode on the partition surface and the exposed cathode bus bar by a sputtering process; Forming a resistor on the front substrate to electrically connect the positive electrode bus and the dot electrodes of the positive electrode and to prevent generation of overcurrent; Forming a dielectric layer between the anode electrodes of the anode to cover the anode bus and the resistor; Forming a phosphor on the dielectric layer; And bonding the rear substrate and the front substrate to each other so that dot electrodes of the anode and the cathode formed on each of them face diagonally.

According to the present invention, the aperture ratio can be improved by reducing the portion of the front substrate covered by the dot electrode of the cathode, and the partition is formed on the cathode busbar, thereby preventing the decrease in the manufacturing yield due to misalignment between the cathode and the partition. can do.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3A to 3D are cross-sectional views of a series of processes for explaining a method of manufacturing a DC-type PDP according to an embodiment of the present invention. Here, the same parts as in Fig. 1 are denoted by the same reference numerals.

Referring to FIG. 3A, a black matrix 10 having a predetermined width is formed on the front substrate 6, and a stripe-shaped cathode bus bar having a smaller width on one side thereof in the vertical direction only is formed on the black matrix 10. Fields 7b are formed, respectively. Then, the partition wall 4 is formed on the black matrix 10 and a portion of the cathode bus line 7b adjacent thereto.

Referring to FIG. 3B, in the state in which the mask 12 is provided on the partition 4, the dot electrode 7a of the cathode is formed on the cathode bus bar portion and the partition wall surface exposed by the sputtering process. Here, the mask 12 serves to prevent the cathode dot electrode 7a from being formed on the upper surface of the partition wall 4, and the height of the cathode dot electrode 7a is limited by adjusting the incident angle of the metal beam. do.

On the other hand, in forming the dot electrode of the partition wall and the cathode on the front substrate, unlike the above-described method, the partition wall surface and the exposed negative electrode bus bar by the sputtering process in the same manner as described above, in the state in which the partition wall is formed below the desired height After the dot electrode of the cathode is formed on the partition wall, the partition wall may be formed again so that the height of the entire partition wall becomes a desired height.

Subsequently, referring to FIG. 3C, the mask used in the sputtering process is removed to complete fabrication of the front substrate 6.

Referring to FIG. 3D, an anode bus (not shown) on the rear substrate 1, a dot electrode 2a of the anode and a resistor 2b are formed on the front surface of the rear substrate after connecting them and blocking an overcurrent. The dielectric layer 3 is formed in a range that does not cover the upper surface of the dot electrode 2a of the anode, and the phosphor 5 having a predetermined thickness is formed on the dielectric 3.

Then, as shown, the back substrate 1 and the front substrate 6 are sealed so that the dot electrodes 2a and 7a of the anode and cathode face diagonally in the discharge cell, and then discharge into the discharge space. The gas 8 is sealed.

Here, since the cathode dot electrode 7a is formed by the sputtering process, it is possible to achieve high definition. Accordingly, since the portion of the front substrate 6 covered by the dot electrode 7a is reduced, the aperture ratio is improved. In addition, since the dot electrode 7a of the cathode is formed on the partition surface, the distance between the dot electrodes 2a and 7a of the anode and the cathode is further increased, thereby improving the discharge efficiency.

On the other hand, when the rear substrate and the front substrate is bonded, the alignment between the partition and the electrode is a big problem, but in the present invention, since the partition is formed on the black matrix and the cathode busbar on the front substrate, the manufacturing yield decreases due to misalignment of the cathode busbar and the partition. In addition, since the dot electrode of the anode is not protruded, alignment between the partition wall and the dot electrode of the anode is easily performed.

4 is a plan view schematically showing a direct current type PDP according to the present invention. Here, the same parts as in Fig. 3 are denoted by the same reference numerals.

The discharge cells 20 are disposed on both sides of the auxiliary cell 30, and each of the discharge cells and the auxiliary cells 20 and 30 is separated by the partition wall 4 formed in a matrix form. In addition, between the auxiliary cell 30 and each of the discharge cells 20 is provided with a priming pass 22 which is a passage that enables the movement of the priming particles (priming particles) generated in the auxiliary cell 30, Dot electrodes 2a and 7a of the positive electrode and the negative electrode for generating are respectively disposed at the centers of the longitudinal partition walls facing each other in the discharge cell 20 and the auxiliary cell 30, as shown. In the auxiliary cell 30, the dot electrodes 2a and 7a of the cathode and the anode are disposed at the same positions as the arrangement surfaces of the electrodes of the neighboring discharge cells 20, respectively.

As described above, the direct current type PDP of the present invention and the manufacturing method thereof form a partition on the front substrate, and of course, the dot electrode of the cathode is formed on the partition surface and a part of the cathode busbar by using a sputtering process, so that the dots of the cathode It is possible to improve the opening ratio of the PDP by reducing the portion of the front substrate covered by the electrode. In addition, by further increasing the distance between the anode and cathode dot electrodes, the discharge efficiency can be further improved.

Meanwhile, although specific embodiments of the present invention have been described and illustrated, modifications and variations can be made by those skilled in the art. Accordingly, the following claims are to be understood as including all modifications and variations as long as they fall within the true spirit and scope of the present invention.

Claims (4)

The anode substrate and the dot electrode of the anode, and the back substrate on which the resistance connecting them are formed, and the cathode substrate and the front substrate on which the dot electrode of the cathode connected thereto are bonded to each other so that the dot electrodes of the anode and the cathode face the diagonal direction through the partition wall. DC type plasma display panel, The cathode bus bar is formed to have a smaller width on one side of the longitudinal direction of the black matrix formed on the front substrate, the partition wall is formed on a portion of the cathode bus bar adjacent to the black matrix, the dot electrode of the cathode DC-type plasma display panel, characterized in that formed on the exposed cathode bus bar and the partition wall surface thereon. Forming a black matrix on the front substrate; Forming a cathode bus bar having a smaller width on one side of the black matrix; Forming a partition on the black matrix and a portion of the cathode bus bar adjacent thereto; Forming a dot electrode of a cathode on the partition surface and the exposed cathode bus bar by a sputtering process; Forming a resistor on the front substrate to electrically connect the positive electrode bus and the dot electrodes of the positive electrode and to prevent generation of overcurrent; Forming a dielectric layer between the anode electrodes of the anode to cover the anode bus and the resistor; Forming a phosphor on the dielectric layer; And And bonding the rear substrate and the front substrate so that dot electrodes of the anode and the cathode formed on each of them face diagonally. The method of claim 2, wherein the dot electrode of the cathode is formed only at a predetermined height of the partition wall by adjusting an incident angle of the metal beam in a state where a mask is formed on the partition wall. The method of manufacturing a plasma display panel according to claim 2, wherein after forming a dot electrode of a cathode on the partition surface and the exposed cathode bus bar by a sputtering process, a partition wall having a predetermined height is further formed on the partition wall. .

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