KR100256493B1 - Pressure control apparatus of the molding press - Google Patents

Pressure control apparatus of the molding press Download PDF

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Publication number
KR100256493B1
KR100256493B1 KR1019970065062A KR19970065062A KR100256493B1 KR 100256493 B1 KR100256493 B1 KR 100256493B1 KR 1019970065062 A KR1019970065062 A KR 1019970065062A KR 19970065062 A KR19970065062 A KR 19970065062A KR 100256493 B1 KR100256493 B1 KR 100256493B1
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South Korea
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link
plate
pressure
fixed end
driving
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KR1019970065062A
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Korean (ko)
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KR19990046903A (en
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최녹일
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최녹일
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/68—Mould opening, closing or clamping devices hydro-mechanical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/7653—Measuring, controlling or regulating mould clamping forces

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE: A pressure regulator of a forming press is provided to injection-mold a resin molding in a semiconductor chip conveniently by regulating the pressure in forming, and to reduce costs and failure rate by minimizing a hydraulic system. CONSTITUTION: A pressure regulating apparatus is composed of a fixed end(141) formed at a pressurized plate(140); a driving motor(300) fastened in the fixed end with pulleys(310,420) in the lower part; an idling screw(400) idling in actuating the driving motor with being assembled with a fixing shaft(410) in the middle of the pressurized plate, and having the pulley connected to a driving belt(320) to receive the driving force from the driving motor; a nut(500) combined with the idling screw, and integrated with a moving link(510); a turning link(600) connected to the end of the moving link in the middle, to a fixed end of a driving plate(130) in the upper part and to the fixed end of the pressurized plate in the lower part to move the driving plate up in moving the nut up; and a pressure piston(700) connected to a hydraulic unit(200) to combine upper and lower molds(110,120) by moving the driving plate up in lifting the lower mold by the turning link. The resin molding is formed in a semiconductor chip conveniently by regulating pressure with lifting the lower mold mechanically and hydraulically.

Description

성형프레스의 가압력 조절장치Pressure control device of molding press

본 발명은 성형프레스의 가압력 조절장치에 관한 것으로, 특히 상부금형과 형합되는 하부금형을 1차는 기계식(링크)으로 상승시키고 2차는 유압식으로 상승되게 하므로서 성형시 가압력을 조절하여 용이하게 반도체 칩에 수지몰딩이 성형되도록 하는 동시에 유압장치의 유압시스템을 최소화하여 생산원가를 절감하고 고장율을 저하시킬 수 있도록 한 성형프레스의 가압력 조절장치에 관한 것이다.The present invention relates to a pressing force control device of a molding press, and in particular, the lower mold to be combined with the upper mold is raised mechanically (link) and the secondary is hydraulically raised, thereby controlling the pressing force during molding to easily resin to the semiconductor chip. The present invention relates to a pressing force control device of a molding press that allows molding to be molded and at the same time minimizes the hydraulic system of the hydraulic system to reduce production cost and lower failure rate.

종래 전자제품의 회로기판에 사용되는 반도체는 중간에 칩이 형성되어 있고 이 칩의 양단에는 회로기판에 고정되는 리드프레임이 형성되어 있다. 또한 반도체에는 칩을 보호하기 위한 직사각형상의 수지몰딩이 성형되는데, 이러한 수지몰딩은 재질이 수지로 이루어지며 성형프레스의 상하부금형의 형합시 사출실린더에 의해 반도체 칩에 사출 성형된다.A semiconductor used in a circuit board of a conventional electronic product has a chip formed in the middle, and lead frames fixed to the circuit board are formed at both ends of the chip. In addition, a rectangular resin molding is formed in the semiconductor to protect the chip. The resin molding is made of a resin, and is injection molded into the semiconductor chip by an injection cylinder when molding the upper and lower molds of the molding press.

이를 간단하게 설명하면 반도체 칩에 수지몰딩을 사출 성형하는 성형프레스는 크게 고정판의 저면에 고정되는 상부금형과, 상기 상부금형과 형합되고 반도체가 안착되는 하부금형과, 상기 하부금형에 반도체 칩이 안착되면 가동판을 상승시켜 상하부금형을 형합시키는 유압장치로 구성되어 있다.Briefly described, a molding press for injection molding resin molding onto a semiconductor chip is largely fixed to a bottom surface of a fixed plate, a lower mold to be combined with the upper mold and to which a semiconductor is seated, and a semiconductor chip to be seated on the lower mold. It is composed of a hydraulic device for lifting the movable plate to form the upper and lower molds.

이러한 종래 성형프레스는 하부금형에 반도체를 안착시킨 후 유압장치를 작동시키면 유압이 공급됨에 따라 가동판이 상부로 상승하면서 상부금형과 하부금형을 형합되고 이때 사출실린더가 작동하여 반도체 칩에 수지몰딩을 사출 성형한다.Such a conventional molding press seats a semiconductor in a lower mold and operates a hydraulic device, and as the hydraulic pressure is supplied, the movable plate rises to the upper side, the upper mold and the lower mold are combined, and the injection cylinder operates to inject the resin molding into the semiconductor chip. Mold.

그러나 이러한 종래 성형프레스의 유압장치는 가동판을 상부로 상승시켜 상하부금형을 형합한 후 반도체 칩에 수지몰딩을 사출 성형할 수는 있으나, 가동판을 일정구간 상부로 상승시키기 위해서는 많은 양의 유압을 한번에 공급해야 하기 때문에 많은 파워가 요구되고 이에따라 유압회로 시스템이 커지게 되어 생산원가가 상승되었으며 이에따라 장기간 사용시 쉽게 고장이 발생되는 제반 문제점이 있었다.However, the hydraulic device of such a conventional molding press can be molded by molding the upper and lower molds by raising the movable plate to the upper part, and then molding the resin molding onto the semiconductor chip. Since a lot of power is required at a time, the hydraulic circuit system increases accordingly, the production cost is increased, and there is a problem that easily breaks down during long-term use.

따라서 본 발명은 이러한 종래 기술의 문제점을 근본적으로 해결하기 위하여 안출한 것으로 그 목적은 상부금형과 형합되는 하부금형을 1차는 기계식(링크)으로 상승시키고, 2차는 유압식으로 상승되게 하므로서 성형시 가압력을 조절하여 용이하게 반도체 칩에 수지몰딩이 사출 성형되도록 하는 동시에 유압장치의 유압시스템을 최소화하여 생산원가를 절감하고 고장율을 저하시킨 성형프레스의 가압력 조절장치를 제공 하는데 있다.Therefore, the present invention has been made to fundamentally solve the problems of the prior art, the purpose of which is to raise the lower mold to be combined with the upper mold to the first mechanical (link), the second is to raise the hydraulic pressure while forming the hydraulic pressure The present invention provides a pressurization control device for a molding press that allows resin molding to be easily injection molded on a semiconductor chip, and at the same time minimizes the hydraulic system of the hydraulic device to reduce the production cost and lower the failure rate.

제1도는 본 발명에 따른 가압력 조절장치가 성형프레스에 설치된 상태를 나타낸 단면도.1 is a cross-sectional view showing a state in which the pressing force adjusting device according to the present invention is installed in the molding press.

제2도는 본 발명에 따른 가압력 조절장치에 의해 가동판이 1차 상승한 상태를 나타낸 단면도.2 is a cross-sectional view showing a state in which the movable plate is first raised by the pressing force adjusting device according to the present invention.

제3도는 본 발명에 따른 가압력 조절장치에 의해 가동판과 가압판이 2차 상승한 상태를 나타낸 단면도.3 is a cross-sectional view showing a state in which the movable plate and the pressure plate are raised second by the pressing force adjusting device according to the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

100 : 성형프레스 110 : 상부금형100: molding press 110: upper mold

120 : 하부금형 130 : 가동판120: lower mold 130: movable plate

131,142 : 연결부 140 : 가압판131,142: connection portion 140: pressure plate

141 : 고정단 150 : 프레스기둥141: fixed end 150: press pillar

200 : 유압장치 210 : 유압배관200: hydraulic device 210: hydraulic piping

300 : 구동모터 310,420 : 풀리300: drive motor 310,420: pulley

320 : 구동벨트 400 : 공회전스크류320: driving belt 400: idling screw

410 : 고정축 500 : 너트410: fixed shaft 500: nut

510 : 이동링크 600 : 회전링크510: moving link 600: rotating link

700 : 가압피스톤700: Pressurized piston

상기한 목적을 달성하기 위한 수단으로 본 발명은 가압판의 한쪽에 형성되는 고정단과, 상기 고정단에 고정되고 하부에 풀리가 형성되는 구동모터와, 상기 구동모터의 구동력을 전달받을 수 있도록 구동벨트와 연결되는 풀리가 하단에 형성되고 가압판의 중간에 설치된 고정축에 결합되어 구동모터가 구동하면 공회전하는 공회전스크류와, 상기 공회전스크류와 나사 결합되고 한쪽에 이동링크가 일체로 형성된 너트와, 중간은 상기 이동링크의 끝단과 절첩 가능하게 연결된 상태에서 상단은 가동판의 연결부와 연결되고 하단은 가압판의 연결부와 연결되며 너트가 상부로 이동하면 수직으로 펼쳐져 가동판을 상부로 1차 이동시키는 회전링크와, 상기 회전링크에 의해 하부금형이 일정구간 상승하면 2차로 가압판을 상승시켜 상하부금형을 형합시키도록 유압장치와 연결되는 가압피스톤으로 구성되는 것을 그 기술적 구성상의 기본 특징으로 한다.The present invention as a means for achieving the above object is a fixed end formed on one side of the pressure plate, the drive motor is fixed to the fixed end and the pulley is formed at the bottom, the drive belt to receive the driving force of the drive motor and The pulley is connected to the fixed shaft is installed at the bottom and is installed in the middle of the pressure plate and the driving motor is driven when the idling screw, the idling screw and the screw is coupled to the idling screw and the moving link is integrally formed on one side, the middle of the The upper end is connected to the connecting portion of the movable plate and the lower end is connected to the connecting portion of the pressure plate in the state that is foldably connected to the end of the movable link, and the nut is extended vertically when the nut moves to the upper side, and the movable link is first moved to the upper portion, When the lower mold rises by a certain period by the rotary link, the pressure plate is secondly raised to form the upper and lower molds. And it is configured as a pressure piston which is connected with the hydraulic system as a basic characteristic on the technical configuration.

이하 본 발명의 바람직한 실시예를 첨부도면을 참조하여 보다 상세하게 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[실시예]EXAMPLE

제1도는 본 발명에 따른 가압력 조절장치가 프레스에 설치된 상태를 나타낸 단면도이고, 제2도는 본 발명에 따른 가압력 조절장치에 의해 가동판이 1차 상승한 상태를 나타낸 단면도이며, 제3도는 본 발명에 따른 가압력 조절장치에 의해 가압판이 2차 상승한 상태를 나타낸 단면도이다.1 is a cross-sectional view showing a state in which the pressing force adjusting device according to the present invention is installed in the press, and FIG. 2 is a cross-sectional view showing a state in which the movable plate is first raised by the pressing force adjusting device according to the present invention, and FIG. It is sectional drawing which showed the state which the pressure plate was raised 2nd by the pressure control device.

본 발명은 제1도 내지 제3도에서와 같이 성형프레스(100)의 상하부금형 (110,120)이 서로 형합될 수 있도록 하기 위해 가동판(130)과 가압판(140)의 저면에 가압력 조절장치(A)가 설치되는데, 이 가압력 조절장치(A)는 가동판(130)을 기계식으로 1차 상승시키는 회전링크(600), 너트(510), 이송스크류(400), 및 구동모터(300)가 동원되고, 가압판(140)에는 유압식으로 2차 상승시키는 가압피스톤(700)으로 구성된다.In the present invention, as shown in FIGS. 1 to 3, the upper and lower molds 110 and 120 of the molding press 100 can be joined to each other so that the pressing force adjusting device A is provided on the bottom surface of the movable plate 130 and the pressing plate 140. ), The pressing force control device (A) is mobilized by the rotary link 600, the nut 510, the transfer screw 400, and the drive motor 300 for mechanically raising the movable plate 130 first. And, the pressure plate 140 is composed of a pressure piston (700) to be secondary lifted hydraulically.

구동모터(300)는 가압판(140)의 한쪽에 형성된 고정단(141)에 고정되고 하부에는 풀리(310)가 형성되는데, 이 풀리(310)는 공회전스크류(400)의 풀리(420)와 구동벨트(320)로 연결되며, 이러한 공회전스크류(400)는 구동모터(300)의 구동력을 전달받을 수 있도록 가압판(140)의 중간에 설치된 고정축(410)에 결합된다.The drive motor 300 is fixed to the fixed end 141 formed on one side of the pressure plate 140 and the pulley 310 is formed at the bottom, the pulley 310 is driven with the pulley 420 of the idle screw 400. Is connected to the belt 320, the idle screw 400 is coupled to the fixed shaft 410 installed in the middle of the pressure plate 140 to receive the driving force of the drive motor (300).

너트(500)는 공회전스크류(400)와 나사 결합되고 한쪽에는 이동링크(510)가 일체로 형성된다. 또한, 이동링크(510)의 끝단과 절첩 가능하게 연결된 상태에서 상단은 가동판(130)의 연결부(131)와 연결되고 하단은 가압판(140)의 연결부(142) 연결되며 너트(500)가 상부로 이동하면 수직으로 펼쳐져 가동판(130)을 상부로 1차 이동시키는 회전링크(600)가 형성된다.The nut 500 is screwed with the idling screw 400 and the moving link 510 is integrally formed on one side thereof. In addition, the upper end is connected to the connecting portion 131 of the movable plate 130, the lower end is connected to the connecting portion 142 of the pressure plate 140 in the state that is foldable and connected to the end of the mobile link 510, the nut 500 is the upper When moved to the vertically unfolded rotatable link 600 for firstly moving the movable plate 130 is formed.

가압피스톤(700)은 회전링크(600)에 의해 하부금형(120)이 일정구간 상승하면 2차로 가압판(140)을 상승시켜 상하부금형(110,120)을 형합시키도록 유압장치 (200)와 연결되는데, 이러한 유압장치(200)와 가압피스톤(700)측에 연결되는 유압배관(210)은 통상 사용되는 기술이므로 구체적인 설명은 생략 하였다.The pressure piston 700 is connected to the hydraulic device 200 to form the upper and lower molds 110 and 120 by raising the pressure plate 140 secondly when the lower mold 120 rises by a predetermined time by the rotary link 600. Since the hydraulic pipe 210 connected to the hydraulic device 200 and the pressure piston 700 is a commonly used technology, a detailed description thereof has been omitted.

미설명 부호 150은 가동판(130)과 가압판(140)을 상하 안내하는 프레스기둥이다.Reference numeral 150 is a press pillar for guiding the movable plate 130 and the pressure plate 140 up and down.

이와 같이 구성된 본 발명을 사용하기 위해서는 먼저 반도체 칩을 하부금형 (120)에 안착시킨 후, 구동모터(300)에 전원을 인가하면 풀리(310)가 회전하고 이 풀리(310)에 의해 구동벨트(320)가 구동되면서 풀리(420)에 구동력을 전달하면 공회전스크류(400)는 그 구동력을 전달받아 고정축(410)에서 공회전하게 된다.In order to use the present invention configured as described above, the semiconductor chip is first seated on the lower mold 120, and then, when power is applied to the driving motor 300, the pulley 310 rotates and the driving belt ( When the driving force is transmitted to the pulley 420 while the 320 is driven, the idling screw 400 receives the driving force and idles on the fixed shaft 410.

이때 공회전하는 공회전스크류(400)와 나사결합된 너트(500)가 이동링크 (510)와 함께 상부로 상승하면 절첩된 회전링크(600)는 수직으로 펼쳐지면서 가동판(130)을 상승시켜 제2도에서와 같이 하부금형(120)을 1차적으로 일정구간 상부로 이동시킨다.At this time, when the idling screw 400 and the screw 500 coupled to the idling is raised upward with the movable link 510, the folded rotary link 600 is vertically unfolded and the movable plate 130 is raised to raise the second plate. As shown in FIG. 1, the lower mold 120 is primarily moved upwardly in a predetermined section.

상기와 같이 하부금형(120)이 일정구간 이동되면 유압장치(200)가 작동하여 유압을 발생시키고, 발생된 유압은 유압배관(210)을 따라 하단으로 공급되면서 가압피스톤(600)을 상승시킨다.As described above, when the lower mold 120 is moved for a certain period, the hydraulic apparatus 200 operates to generate hydraulic pressure, and the generated hydraulic pressure is raised to the lower side along the hydraulic pipe 210 to raise the pressure piston 600.

이때 가압피스톤(700)의 상승력에 의해 제3도에서와 같이 가압판(140)이 상승하면서 가동판(130)을 상승시키기 때문에 하부금형(120)은 2차로 나머지 이동구간으로 이동되면서 상부금형(110)과 형합된다.At this time, since the pressing plate 140 ascends the movable plate 130 as shown in FIG. 3 by the lifting force of the pressing piston 700, the lower mold 120 is moved to the remaining moving section secondly, and the upper mold 110 is moved. ) Is combined.

상기와 같이 상부금형(110)과 하부금형(120)이 형합되면 종래와 같이 수지를 가압하여 반도체 칩에 수지몰딩을 사출 성형하면 되고, 반도체 칩에 수지몰딩이 사출 성형되면 구동모터(300)는 역회전하여 가동판(130)과 가압판(140)을 원상복귀시킨다.When the upper mold 110 and the lower mold 120 are combined as described above, the resin may be press-molded by injection molding to pressurize the resin as in the prior art. When the resin molding is injection-molded on the semiconductor chip, the driving motor 300 The reverse rotation returns the movable plate 130 and the pressure plate 140 to their original shape.

이상에서 살펴본 바와 같이 본 발명에 의하면, 상부금형과 형합되는 하부금형이 1차는 기계식(링크)으로 상승되고 2차는 유압식으로 상승되기 때문에 성형시 가압력이 조절되어 용이하게 반도체 칩에 수지몰딩을 성형할 수 있을 뿐 아니라, 종래와 같이 유압장치의 유압시스템이 크지 않아도 되기 때문에 생산원가가 절감되고 고장율이 크게 저하되는 등의 효과가 있는 것이다.As described above, according to the present invention, since the lower mold to be joined with the upper mold is first raised by a mechanical (link) and the second is raised by a hydraulic pressure, the pressing force is controlled during molding to easily mold the resin molding on the semiconductor chip. In addition, since the hydraulic system of the hydraulic device does not have to be large as in the related art, production cost is reduced and failure rate is greatly reduced.

이상에서는 본 발명을 특정의 바람직한 실시예를 참고하여 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며 본 발명의 요지를 벗어나지 않는 범위에서 당해 발명이 속하는 분야에서 통상의 지식을 가진자에 의해 다양한 변경과 수정이 가능하게 이루어질 수 있는 것이다.In the above, the present invention has been described with reference to specific preferred embodiments, but the present invention is not limited to the above-described embodiments and should be made by those skilled in the art to which the present invention pertains without departing from the gist of the present invention. Various changes and modifications can be made.

Claims (1)

가압판의 한쪽에 형성되는 고정단과; 상기 고정단에 고정되고 하부에 풀리가 형성되는 구동모터와; 상기 구동모터의 구동력을 전달받을 수 있도록 구동벨트와 연결되는 풀리가 하단에 형성되고 가압판의 중간에 설치된 고정축에 결합되어 구동모터가 구동하면 공회전하는 공회전스크류와; 상기 공회전스크류와 나사 결합되고 한쪽에 이동링크가 일체로 형성된 너트와; 중간은 상기 이동링크의 끝단과 절첩 가능하게 연결된 상태에서 상단은 가동판의 고정단과 연결되고 하단은 가압판의 고정단과 연결되며 너트가 상부로 이동하면 수직으로 펼쳐져 가동판을 상부로 1차 이동시키는 회전링크와; 상기 회전링크에 의해 하부금형이 일정구간 상승하면 2차로 가압판을 상승시켜 상하부금형을 형합시키도록 유압장치와 연결되는 가압피스톤으로 구성되는 것을 특징으로 하는 성형프레스의 가압력 조절장치.A fixed end formed on one side of the pressure plate; A driving motor fixed to the fixed end and having a pulley formed at a lower portion thereof; A idle screw provided with a pulley connected to the drive belt at a lower end thereof so as to receive the driving force of the drive motor, coupled to a fixed shaft installed in the middle of the pressure plate, and idling when the drive motor is driven; A nut coupled to the idle screw and having a moving link integrally formed on one side thereof; In the middle, the upper end is connected to the fixed end of the movable plate and the lower end is connected to the fixed end of the pressure plate in a state that is foldably connected to the end of the movable link. A link; When the lower mold rises by a predetermined period by the rotary link, the pressing force adjusting device of the molding press, characterized in that the pressure plate is connected to the hydraulic device to form the upper and lower molds by pressing the second pressure plate.
KR1019970065062A 1997-12-01 1997-12-01 Pressure control apparatus of the molding press KR100256493B1 (en)

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KR101237598B1 (en) * 2011-10-21 2013-02-27 김미경 Composite molding press apparatus
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WO1985002363A1 (en) * 1983-11-24 1985-06-06 Fanuc Ltd Mold clamping apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985002363A1 (en) * 1983-11-24 1985-06-06 Fanuc Ltd Mold clamping apparatus

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