KR0174368B1 - Manufacturing method of semiconductor memory device - Google Patents
Manufacturing method of semiconductor memory deviceInfo
- Publication number
- KR0174368B1 KR0174368B1 KR1019980018968A KR19980018968A KR0174368B1 KR 0174368 B1 KR0174368 B1 KR 0174368B1 KR 1019980018968 A KR1019980018968 A KR 1019980018968A KR 19980018968 A KR19980018968 A KR 19980018968A KR 0174368 B1 KR0174368 B1 KR 0174368B1
- Authority
- KR
- South Korea
- Prior art keywords
- manufacturing
- memory device
- semiconductor memory
- semiconductor
- memory
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4097—Bit-line organisation, e.g. bit-line layout, folded bit lines
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C8/00—Arrangements for selecting an address in a digital store
- G11C8/14—Word line organisation; Word line lay-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
- H10B12/315—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor with the capacitor higher than a bit line
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/48—Data lines or contacts therefor
- H10B12/482—Bit lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/48—Data lines or contacts therefor
- H10B12/488—Word lines
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63206470A JP2703275B2 (en) | 1988-08-22 | 1988-08-22 | Semiconductor storage device |
JP63228579A JPH0278270A (en) | 1988-09-14 | 1988-09-14 | Semiconductor memory device and manufacture thereof |
KR1019890011635A KR0166056B1 (en) | 1988-08-22 | 1989-08-16 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR0174368B1 true KR0174368B1 (en) | 1999-10-01 |
Family
ID=27328641
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980018969A KR0174367B1 (en) | 1988-08-22 | 1998-05-26 | Semiconductor memory device |
KR1019980018965A KR0174371B1 (en) | 1988-08-22 | 1998-05-26 | Semiconductor memory device |
KR1019980018967A KR0174369B1 (en) | 1988-08-22 | 1998-05-26 | Semiconductor memory device |
KR1019980018966A KR0174370B1 (en) | 1988-08-22 | 1998-05-26 | Semiconductor memory device |
KR1019980018968A KR0174368B1 (en) | 1988-08-22 | 1998-05-26 | Manufacturing method of semiconductor memory device |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980018969A KR0174367B1 (en) | 1988-08-22 | 1998-05-26 | Semiconductor memory device |
KR1019980018965A KR0174371B1 (en) | 1988-08-22 | 1998-05-26 | Semiconductor memory device |
KR1019980018967A KR0174369B1 (en) | 1988-08-22 | 1998-05-26 | Semiconductor memory device |
KR1019980018966A KR0174370B1 (en) | 1988-08-22 | 1998-05-26 | Semiconductor memory device |
Country Status (1)
Country | Link |
---|---|
KR (5) | KR0174367B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102193413B1 (en) | 2020-05-08 | 2020-12-21 | 김진호 | Synthetic resin panel manufacture method and box using the same |
-
1998
- 1998-05-26 KR KR1019980018969A patent/KR0174367B1/en not_active IP Right Cessation
- 1998-05-26 KR KR1019980018965A patent/KR0174371B1/en not_active IP Right Cessation
- 1998-05-26 KR KR1019980018967A patent/KR0174369B1/en not_active IP Right Cessation
- 1998-05-26 KR KR1019980018966A patent/KR0174370B1/en not_active IP Right Cessation
- 1998-05-26 KR KR1019980018968A patent/KR0174368B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102193413B1 (en) | 2020-05-08 | 2020-12-21 | 김진호 | Synthetic resin panel manufacture method and box using the same |
Also Published As
Publication number | Publication date |
---|---|
KR0174369B1 (en) | 1999-10-01 |
KR0174371B1 (en) | 1999-10-01 |
KR0174370B1 (en) | 1999-10-01 |
KR0174367B1 (en) | 1999-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A107 | Divisional application of patent | ||
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
G170 | Re-publication after modification of scope of protection [patent] | ||
FPAY | Annual fee payment |
Payment date: 20111019 Year of fee payment: 14 |
|
LAPS | Lapse due to unpaid annual fee |