KR0172663B1 - Method of manufacturing epoxy resin for sealing semiconductor device - Google Patents

Method of manufacturing epoxy resin for sealing semiconductor device Download PDF

Info

Publication number
KR0172663B1
KR0172663B1 KR1019960010884A KR19960010884A KR0172663B1 KR 0172663 B1 KR0172663 B1 KR 0172663B1 KR 1019960010884 A KR1019960010884 A KR 1019960010884A KR 19960010884 A KR19960010884 A KR 19960010884A KR 0172663 B1 KR0172663 B1 KR 0172663B1
Authority
KR
South Korea
Prior art keywords
semiconductor device
epoxy resin
sealing semiconductor
manufacturing epoxy
manufacturing
Prior art date
Application number
KR1019960010884A
Other languages
Korean (ko)
Inventor
Hwan-Kun Kim
Byung-Won Lee
Ji-Yoon Lee
Original Assignee
Cheil Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cheil Ind Inc filed Critical Cheil Ind Inc
Priority to KR1019960010884A priority Critical patent/KR0172663B1/en
Application granted granted Critical
Publication of KR0172663B1 publication Critical patent/KR0172663B1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019960010884A 1991-11-30 1996-04-08 Method of manufacturing epoxy resin for sealing semiconductor device KR0172663B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960010884A KR0172663B1 (en) 1991-11-30 1996-04-08 Method of manufacturing epoxy resin for sealing semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019910021872A KR960010307B1 (en) 1991-11-30 1991-11-30 Epoxy resin composition for encapsulating semiconductor element
KR1019960010884A KR0172663B1 (en) 1991-11-30 1996-04-08 Method of manufacturing epoxy resin for sealing semiconductor device

Publications (1)

Publication Number Publication Date
KR0172663B1 true KR0172663B1 (en) 1999-03-30

Family

ID=19323947

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019910021872A KR960010307B1 (en) 1991-11-30 1991-11-30 Epoxy resin composition for encapsulating semiconductor element
KR1019960010884A KR0172663B1 (en) 1991-11-30 1996-04-08 Method of manufacturing epoxy resin for sealing semiconductor device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1019910021872A KR960010307B1 (en) 1991-11-30 1991-11-30 Epoxy resin composition for encapsulating semiconductor element

Country Status (1)

Country Link
KR (2) KR960010307B1 (en)

Also Published As

Publication number Publication date
KR960010307B1 (en) 1996-07-30
KR930010117A (en) 1993-06-22

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