KR0148494B1 - Method and apparatus for hot-dipping steel strip - Google Patents

Method and apparatus for hot-dipping steel strip Download PDF

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KR0148494B1
KR0148494B1 KR1019920004703A KR920004703A KR0148494B1 KR 0148494 B1 KR0148494 B1 KR 0148494B1 KR 1019920004703 A KR1019920004703 A KR 1019920004703A KR 920004703 A KR920004703 A KR 920004703A KR 0148494 B1 KR0148494 B1 KR 0148494B1
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steel sheet
sheet strip
plating
strip
vacuum chamber
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KR920018234A (en
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야스시 후쿠이
타다 아키 미오노
카즈 나리 나카모토
쯔구 야스 요시이
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카이 쯔요시
니씬 세이코오 카부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
    • C23C2/16—Removing excess of molten coatings; Controlling or regulating the coating thickness using fluids under pressure, e.g. air knives
    • C23C2/18—Removing excess of molten coatings from elongated material
    • C23C2/20—Strips; Plates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
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    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/003—Apparatus
    • C23C2/0034—Details related to elements immersed in bath
    • C23C2/00342—Moving elements, e.g. pumps or mixers
    • C23C2/00344—Means for moving substrates, e.g. immersed rollers or immersed bearings
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/003—Apparatus
    • C23C2/0035—Means for continuously moving substrate through, into or out of the bath
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/003—Apparatus
    • C23C2/0038—Apparatus characterised by the pre-treatment chambers located immediately upstream of the bath or occurring locally before the dipping process
    • C23C2/004—Snouts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/022—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by heating
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    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C23C2/024—Pretreatment of the material to be coated, e.g. for coating on selected surface areas by cleaning or etching

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  • Chemical & Material Sciences (AREA)
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  • Engineering & Computer Science (AREA)
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Abstract

강판 스트립(1)의 표면에 알곤이온 빔(19),(20)을 조사하여 스퍼터링-에칭을 실시하므로서, 강판 스트립(1)의 표면을 세척한다.The surface of the steel sheet strip 1 is cleaned by sputtering-etching by irradiating the argon ion beams 19 and 20 to the surface of the steel sheet strip 1.

이렇게 스퍼터링-에칭을 하므로서, 크롬이나 실리콘 등과 같은 산화하기 쉬운 원소의 산화성 피막이 제거되며, 그 후, 세척된 강판 스트립(1)에 용융 도금을 실시한다.By sputtering-etching in this way, the oxidizing film of an element which is easy to oxidize, such as chromium and silicon | silicone, is removed, and the plated steel strip 1 wash | cleaned is then hot-plated.

Description

강판 스트립의 연속 용융 도금방법 및 그 장치Continuous hot dip plating method of steel strip and its apparatus

제1도는 본 발명의 실시예에 의한 연속 용융 도금장치의 개략도이다.1 is a schematic diagram of a continuous hot dip plating apparatus according to an embodiment of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 강판 스트립 5 : 진공실1: steel strip 5: vacuum chamber

8 : 이온 빔 조사장치 9 : 가열장치8 ion beam irradiation device 9 heating device

11 : 용융상태의 도금조11: plating bath in molten state

본 발명은, 강판 스트립(steel strip)을 전처리하므로서 도금의 상태가 개선되는, 강판 스트립의 연속 용융 도금방법과 그 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuous hot dip galvanizing method and apparatus for steel sheet strips in which the state of plating is improved by pretreating the steel strips.

강판 스트립의 표면에 도금을 실시하기 전에 강판 스트립의 표면의 산화성 피막을 제거하는 전처리장치를 강판 스트립의 용융 도금장치에 설치하므로서, 강판 스트립의 표면에서의 도금 불량을 방지하고, 강판에서의 도금 피막의 접착성을 향상시킬 수 있게 된다.A pretreatment device for removing the oxidizing film on the surface of the steel sheet strip is provided in the hot-dip plating apparatus of the steel sheet strip before plating on the surface of the steel sheet strip, thereby preventing the plating failure on the surface of the steel sheet strip, and the plating film on the steel sheet. It is possible to improve the adhesion of the.

전처리장치에서 강판 스트립은 풀림온도까지 가열되고, 이때, 가연성 이물질은 모두 제거되며, 그 후, 환원성 가스에 의해 환원된다.In the pretreatment apparatus, the steel strip is heated to the annealing temperature, at which time all of the flammable foreign matter is removed and then reduced by the reducing gas.

그러나, 크롬, 실리콘, 알루미늄 등과 같이 산화하기 쉬운 원소가 함유된, 예를들어서, 스테인레스강판과 같은 경우에는, 환원성 가스로는 표면의 산화성 피막의 제거가 불가능하다.However, in the case of, for example, a stainless steel sheet containing an oxidizing element such as chromium, silicon, aluminum, or the like, it is impossible to remove the oxidizing film on the surface with a reducing gas.

결과적으로, 강판 스트립에 전처리를 한다 하더라도 강판 스트립 표면에서의 도금 피막의 접착성은 낮은 것이다.As a result, even if the steel sheet strip is pretreated, the adhesion of the plated film on the surface of the steel sheet strip is low.

전자반응에 의해 용융 도금을 실시하며, 그 반응은 산화하기 쉬운 원소의 영향을 받게 된다.Hot-dip plating is carried out by an electron reaction, and the reaction is affected by an element which is easy to oxidize.

그러므로, 산화하기 쉬운 원소가 함유된 강판의 표면에서는 도금불량과 같은 결함이 발생되기 쉽다.Therefore, defects such as poor plating are likely to occur on the surface of the steel sheet containing an element that is easy to oxidize.

이러한 산화하기 쉬운 원소를 함유한 강판 스트립은, 가열하면 진공증착에 의해 도금을 할 수 있게 된다.The steel sheet strip containing such an element which is easy to oxidize can be plated by vacuum deposition when it heats.

산화하기 쉬운 강판 스트립을 용융상태의 도금액에 넣기 전에 먼저 전기도금을 하면, 강판 스트립에서의 접착성이 개선되어, 결함이 없는 제품을 얻을 수 있게 된다.If electroplating is performed before the steel sheet strip, which is easy to oxidize, is put into the molten plating solution, the adhesiveness on the steel sheet strip is improved, and a product free of defects can be obtained.

그러나, 이러한 제조방법은 제조공정을 복잡하게 할 뿐만 아니라, 결국 제조비용을 상승시키는 결과가 된다.However, such a manufacturing method not only complicates the manufacturing process but also results in increasing the manufacturing cost.

본 발명의 목적은, 강판 스트립의 표면을 스퍼터링(sputtering)-에칭(etching)처리하여 강판 스트립의 표면을 활성화시키므로써, 강판 스트립의 표면에서의 접착성을 향상시키고, 도금 표면에서의 도금 불량의 발생을 방지할 수 있는, 용융 도금의 방법과 그 장치를 제공하고자 하는 것이다.It is an object of the present invention to improve the adhesion on the surface of a steel strip by sputtering-etching the surface of the steel strip to activate the surface of the steel strip, thereby improving the adhesion of plating defects on the plating surface. It is an object of the present invention to provide a method and apparatus for hot dip plating that can prevent occurrence.

본 발명에 의한 용융 도금방법에는, 이온 빔을 조사하여 스퍼터링-에칭을 실시하는 강판 스트립 표면의 정화(淨化)공정과, 강판 스트립을 용융 도금조에 침조(沈槽)시키는 공정으로 구성되어 있다.The hot-dip plating method according to the present invention comprises a step of purifying a surface of a steel sheet strip subjected to sputtering-etching by irradiating an ion beam, and a step of impregnating the steel sheet strip into a hot-dip plating tank.

강판 스트립의 온도가 용융 도금조의 온도보다 낮으면, 스퍼터링-에칭을 실시하면서, 동시에, 강판 스트립을 가열시킨다.If the temperature of the steel sheet strip is lower than that of the hot dip bath, the steel sheet strip is heated while sputtering-etching is performed.

용융 도금장치에는 용융 도금조의 상부에 진공실이 설치되어 있다.In the hot dip plating apparatus, a vacuum chamber is provided on the top of the hot dip plating tank.

진공실에는, 강판 스트립의 통로에서 마주보는 상태로, 양쪽에, 이온 빔 조사(照射)장치가 설치되어 있다.In the vacuum chamber, ion beam irradiation devices are provided on both sides in a state of facing the passage of the steel sheet strip.

어떠한 종류의 원소나 분자도 스퍼터링-에칭을 실시하기 위한 이온 빔으로 사용할 수 있으며, 특히, 알곤이온 빔을 사용하면 취급이 쉽고, 가격이 저렴하며, 도금 후의 내식성이 강하고, 고속으로 처리공정을 실시할 수 있는 등의 많은 장점을 얻을 수 있게 된다.Any type of element or molecule can be used as an ion beam for sputtering-etching. In particular, using an argon ion beam is easy to handle, inexpensive, corrosion resistance after plating is strong, and a high-speed treatment process is performed. There are many advantages to being able to do so.

스퍼터링-에칭공정에서는, 이온 빔을 강판 스트립의 표면에 충돌시켜서 표면의 이물질을 제거하므로서 스퍼터링효과를 얻고 표면을 에칭하는 것으로, 결론적으로는, 강판 스트립의 표면에 있는 산화하기 쉬운 산화성 피막을 제거하는 것이다.In the sputtering-etching process, the ion beam is collided with the surface of the steel sheet strip to remove foreign substances on the surface, thereby obtaining a sputtering effect and etching the surface. Consequently, the oxidizable film on the surface of the steel sheet strip is removed. will be.

알곤가스가 진공실 내부의 이온 조사장치로부터 누출된다 하더라도, 강판 스트립이 용융상태인 도금조에 침조될때까지 강판 스트립의 표면의 청결상태를 그대로 유지할 수 있다.Even if the argon gas leaks from the ion irradiation device inside the vacuum chamber, the surface of the steel sheet strip can be kept clean until the steel sheet strip is immersed in the molten plating bath.

강판 스트립에 충돌하는 이온 빔이 갖고 있는 운동에너지의 일부는 열에너지로 변환되어, 강판 스트립의 온도를 도금을 하기에 적당한 온도까지 상승시킨다.Some of the kinetic energy possessed by the ion beams striking the steel strip is converted into thermal energy, raising the temperature of the steel strip to a temperature suitable for plating.

강판 스트립의 온도가 용융 도금을 하기에는 불충분한 온도이면, 진공실내에 설치된 가열장치에 의해 강판 스트립은 용융 도금을 하기에 적당한 온도까지 가열된다.If the temperature of the steel sheet strip is insufficient for hot dip plating, the steel sheet strip is heated to a temperature suitable for hot dip plating by a heating apparatus installed in the vacuum chamber.

본 발명의 또다른 목적과 특징은 첨부된 도면을 참고로 한, 다음의 상세한 설명에 의해 이해할 수 있게 될 것이다.Still other objects and features of the present invention will become apparent from the following detailed description with reference to the accompanying drawings.

도면을 참조하면, 강판 스트립(1)이 공급 릴(2)로부터 인출되어 디플렉트 로울러(deflector roller)(3),(4)를 거쳐서 진공실(5)로 공급된다. 진공실(5)의 입구에서는 로울러형 밀봉장치(6)가 설치되어 있다. 진공실(5)에는, 또, 강판 스트립(1)을 아래쪽으로 안내하는 디플렉트 로울러(7), 이온 빔 조사장치(8), 강판 스트립(1)의 통로의 양쪽에서 서로 마주보고 있는 가열장치(9)등이 설치되어 있다.Referring to the figure, the steel sheet strip 1 is drawn out from the supply reel 2 and supplied to the vacuum chamber 5 via the deflector rollers 3 and 4. At the inlet of the vacuum chamber 5, the roller type sealing apparatus 6 is provided. In the vacuum chamber 5, a heating apparatus facing each other in both the deflecting roller 7 for guiding the steel sheet strip 1 downward, the ion beam irradiation device 8, and the passages of the steel sheet strip 1 ( 9) is installed.

그리고, 진공실(5) 내부의 압력을 소정의 감압상태로 유지하기 위하여 진공펌프(10)가 진공실(5)과 연결되어 있다. 진공실(5)의 출구는 용융상태로 있는 도금조(11)의 속에 잠겨 있으며, 도금조(11)는 진공실(5)의 출구의 밀봉장치로서의 역활도 겸하고 있다. 강판 스트립(1)은 가열장치(9)에 의해 도금조(11)의 온도와 동일한 온도까지 가열된다.The vacuum pump 10 is connected to the vacuum chamber 5 to maintain the pressure inside the vacuum chamber 5 at a predetermined reduced pressure. The outlet of the vacuum chamber 5 is immersed in the plating bath 11 in a molten state, and the plating bath 11 also serves as a sealing device for the outlet of the vacuum chamber 5. The steel sheet strip 1 is heated to a temperature equal to the temperature of the plating bath 11 by the heating device 9.

도금조(11)의 속에 설치되어 있는 로울러(12),(13)는 도금조(11)의 속에서 강판 스트립(1)을 안내하는 것으로, 로울러(13)에 의해 강판 스트립(1)은 위쪽으로 안내된다.The rollers 12 and 13 installed in the plating vessel 11 guide the steel sheet strip 1 in the plating vessel 11, and the steel sheet strip 1 is moved upward by the roller 13. You are guided to.

도금층의 두께는 가스와이핑(gas wiping)장치에 의해 조정된다.The thickness of the plating layer is adjusted by a gas wiping apparatus.

강판 스트립(1)은 디플렉트 로울러(15),(16),(17)를 거쳐서 릴(18)로 공급되어 릴(18)에 감게 된다.The steel sheet strip 1 is fed to the reel 18 via the deflecting rollers 15, 16, and 17 and wound on the reel 18.

스퍼터링-에칭을 실시하기 위하여, 진공펌프(10)를 사용하여 진공실(5) 내부의 공기를 배출시켜서, 1×10-3Pa 정도의 저압으로 한 후, 이온 빔 조사장치(18)를 사용하여 알곤이온 빔(19),(20)을 강판 스트립(1)에 조사하므로서, 스퍼터링-에칭을 실시한다. 이때, 강판 스트립(1)의 온도는, 이온 빔의 충돌로 인한 열 에너지의 발생으로, 상승되는데, 이 온도가 도금을 하기에 불충분한 경우에는 가열장치(9)가 작동하여 강판 스트립(1)을 가열시킨다.In order to perform sputtering-etching, the air inside the vacuum chamber 5 is discharged using the vacuum pump 10, and 1 × 10-3Pa After the low pressure of the degree, sputtering-etching is performed by irradiating the steel plate strip 1 with the argon ion beams 19 and 20 using the ion beam irradiation apparatus 18. FIG. At this time, the temperature of the steel sheet strip 1 rises due to the generation of thermal energy due to the collision of the ion beam, and when this temperature is insufficient for plating, the heating device 9 is operated so that the steel sheet strip 1 Heat it.

[실시예]EXAMPLE

탈지된 SUS430 스테인레스강판 스트립(마무리등급 2B, 폭 100mm, 두께 0.5mm)을, 표1에 표시된 조건에서, 용융상태의 알루미늄 합금을 도금하였다.The stripped SUS430 stainless steel strip (finish grade 2B, width 100mm, thickness 0.5mm) was plated with molten aluminum alloy under the conditions shown in Table 1.

강판 스트립(1)의 온도는 강판 스트립(1)이 도금조에 참조하기 전에, 이미 가열장치(9)에 의해 650℃로 가열되어 있다.The temperature of the steel sheet strip 1 is already heated to 650 ° C. by the heating device 9 before the steel sheet strip 1 refers to the plating bath.

강판 스트립(1)에 형성된 도금층에 대해서 도금 불량율과 접착성을 측정하여, 그 결과를 표1에 표시하였다.About the plating failure rate and adhesiveness with respect to the plating layer formed in the steel plate strip 1, the result is shown in Table 1.

도금불량율은 0.05㎡당 도금 불량 면적을 의미한다.The plating failure rate means a plating failure area per 0.05 m 2.

도금층의 접착성은 2종류의 굽힘시험을 실시하여 측정하였다.The adhesion of the plating layer was measured by performing two kinds of bending tests.

제1시험은, 강판 스트립(1)을 180°로 절곡하여, 마주보는 두면이 서로 맞닿도록 하였으며(0t 절곡), 제2시험은, 강판 스트립(1)을 180°로 절곡하고, 마주보는 두면의 사이에 실험하는 강판 스트립(1)과 두께가 동일한 강판 스트립을 끼워넣은 채, 서로 밀착시켰다(1t 절곡).In the first test, the steel sheet strip 1 was bent at 180 ° so that two opposite surfaces were in contact with each other (0t bending). The second test was the steel plate strip 1 being bent at 180 ° and the opposite two surfaces were bent. The steel sheet strip 1 having the same thickness as the steel sheet strip 1 to be tested was sandwiched with each other (1t bending).

그리고, 셀로판 테이프를 절곡부에 접착하였다가 떼어내면서, 이때 셀로판 테이프에 묻어나는, 박리된 도금층의 피막을 측정하였다.Then, the cellophane tape was adhered to the bent portion and peeled off, and the film of the peeled plating layer, which was buried on the cellophane tape at this time, was measured.

표에서, 0t 절곡시험에서 도금층의 피막의 박리가 없는 경우는로, 1t 절곡시험에서는 도금층의 피막의 박리가 전혀 없으나, 0t 절곡시험에서 부분적으로 도금층의 피막이 박리된 경우를로 표시하였다.In the table, when there is no peeling of the coating of the plating layer in the 0t bending test In the 1t bending test, there was no peeling of the coating film, but in the 0t bending test, the coating film was partially peeled off. Marked as.

또, 1t 절곡시험에서 부분적으로 도금층의 피막이 박리된 경우는로, 1t 절곡시험에서 절곡부 전체에서 도금층의 피막이 격리된 경우를로 표시하였다.In addition, when the coating of the plating layer is partially peeled off in the 1t bending test, In the 1t bending test, the coating layer was isolated from the entire bend. Marked as.

표2에서 알 수 있듯이, 강판 스트립(1)에, 이온 빔으로 스퍼터링-에칭을 하는 전처리공정을 실시하므로서, 고속의 작업속도에서도 도금의 불량이 없는 접착성이 양호한 도금층을 형성할 수 있다.As can be seen from Table 2, the pre-treatment step of sputtering-etching with an ion beam is performed on the steel sheet strip 1, whereby a plating layer having good adhesion without plating defects can be formed even at a high working speed.

이와는 반대로, 비교예에서는 도금 불량이 발생되었으며, 작업속도가 증가할수록 도금 불량율도 증가하였다.On the contrary, in the comparative example, plating failure occurred, and as the working speed increased, the plating failure rate also increased.

본 발명에 의하면, 이온 빔을 사용하여 스퍼터링-에칭을 하므로서, 도금을 하기 위한 강판 스트립의 표면을 깨끗하게 정화하는 것이다.According to the present invention, by sputtering-etching using an ion beam, the surface of the steel sheet strip for plating is cleanly cleaned.

이온 빔을 강판 스트립의 표면에 충돌시키므로써 강판 스트립의 표면의 이물질을 제거하기 때문에, 산화하기 쉬운 원소를 함유한 강철에서도 충분한 활성화가 이루어진다.Since the foreign matter on the surface of the steel sheet strip is removed by colliding the ion beam with the surface of the steel sheet strip, sufficient activation occurs even in steel containing an element which is easy to oxidize.

그러므로, 도금 불량이 없고 접착성이 개선된, 용융 도금을 실시할 수 있게 된다.Therefore, it is possible to perform hot-dip plating, which is free from plating defects and has improved adhesion.

본 발명에 의한 전처리장치는, 전처리공정의 길이를 짧게 하므로서, 전처리장치의 작동과 정지를 쉽게 할 수 있다.The pretreatment apparatus according to the present invention can easily operate and stop the pretreatment apparatus by shortening the length of the pretreatment process.

지금까지 본 발명의 바람직한 실시예를 상세하게 설명하였으며, 본 명세서에서 설명하는 실시예와, 뒤에 첨부된 청구의 범위에 기재된 것과 같이, 본 발명의 취지에 벗어나지 않는 범위에서의 다양한 변형예는 쉽게 이해할 수 있을 것이다.So far, the preferred embodiments of the present invention have been described in detail, and various modifications within the scope of the present invention are easily understood by the embodiments described herein and as described in the appended claims. Could be.

Claims (4)

강판 스트립(1)의 용융도금방법에 있어서, 입구측의 시일장치(6)와 출구측의 용융도금조(11)에 의해 밀봉된 진공실(5)로 전해진 강판 스트립을, 상기한 진공실 내부에 설치된 이온빔조사장치(8)에서 강판 스트립(1)의 표면을 스퍼터링 에칭하여 청정화하는 공정과, 상기한 용융도금조(11)에 강판 스트립(1)을 도입하여 용융도금하는 공정으로 구성된 것을 특징으로 하는 강판 스트립(1)의 연속용융 도금방법.In the molten plating method of the steel sheet strip 1, the steel sheet strips, which are delivered to the vacuum chamber 5 sealed by the sealing device 6 on the inlet side and the hot dip plating tank 11 on the outlet side, are provided inside the vacuum chamber. Characterized in that it comprises a step of sputter etching etching the surface of the steel sheet strip (1) in the ion beam irradiation apparatus (8) and a step of introducing the steel sheet strip (1) into the molten plating tank (11) to melt plating. Continuous hot dip plating method of steel strip (1). 제1항에 있어서, 진공실(5)의 내부에 배치된 가열장치(9)에서 용융도금조에 도입되는 강판 스트립(1)의 온도를 조절하도록 강판 스트립(1)을 가열하는 공정을 포함하고 있는 것을 특징으로 하는 강판 스트립의 연속용융 도금방법.The method according to claim 1, further comprising the step of heating the steel sheet strip (1) so as to regulate the temperature of the steel sheet strip (1) introduced into the molten plating bath in the heating device (9) disposed inside the vacuum chamber (5). Continuous molten plating method of a steel strip characterized in that. 강판 스트립(1)을 용융도금하는 장치에 있어서, 입구측이 시일장치(6)에 의해 밀봉된 진공실(5)과, 상기한 진공실(5)의 내부에서 강판 스트립(1)의 패스라인 양쪽에 배치된 이온빔조사장치(8)와, 상기한 출구측에는 상기한 진공실(5)을 밀봉하기 위하여 용융도금조(11)를 구비하고 있는 것을 특징으로 하는 강판 스트립의 연속용융도금장치.In the apparatus for hot-plating the steel sheet strip (1), the inlet side of the vacuum chamber (5) sealed by the sealing device (6), and the inside of the vacuum chamber (5) above both the pass line of the steel sheet strip (1) A molten plating tank (11) for arranging the ion beam irradiation device (8) arranged and the vacuum chamber (5) on the outlet side, characterized in that the continuous hot dip plating apparatus of the steel sheet strip. 제3항에 있어서, 강판 스트립(1)의 패스라인의 양쪽에 가열장치(9)를 더 설치한 것을 특징으로 하는 강판 스트립의 연속용융도금장치.4. A continuous hot dip plating apparatus according to claim 3, characterized in that heating devices (9) are further provided on both sides of the pass line of the steel sheet strip (1).
KR1019920004703A 1991-03-26 1992-03-21 Method and apparatus for hot-dipping steel strip KR0148494B1 (en)

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KR920018234A (en) 1992-10-21
CA2063967A1 (en) 1992-09-27
DE69211589D1 (en) 1996-07-25
EP0506304A1 (en) 1992-09-30
EP0506304B1 (en) 1996-06-19
CA2063967C (en) 1999-03-30
DE69211589T2 (en) 1996-10-10
AU1312892A (en) 1992-10-01
JPH04297560A (en) 1992-10-21
US5273634A (en) 1993-12-28

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