KR0130870B1 - Method for preparing hat-melt adhesive composition - Google Patents

Method for preparing hat-melt adhesive composition

Info

Publication number
KR0130870B1
KR0130870B1 KR1019940010837A KR19940010837A KR0130870B1 KR 0130870 B1 KR0130870 B1 KR 0130870B1 KR 1019940010837 A KR1019940010837 A KR 1019940010837A KR 19940010837 A KR19940010837 A KR 19940010837A KR 0130870 B1 KR0130870 B1 KR 0130870B1
Authority
KR
South Korea
Prior art keywords
resin
weight
hma
parts
melt adhesive
Prior art date
Application number
KR1019940010837A
Other languages
Korean (ko)
Other versions
KR950032552A (en
Inventor
조병우
유태방
이현종
Original Assignee
조병우
주식회사양지고분자
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 조병우, 주식회사양지고분자 filed Critical 조병우
Priority to KR1019940010837A priority Critical patent/KR0130870B1/en
Publication of KR950032552A publication Critical patent/KR950032552A/en
Application granted granted Critical
Publication of KR0130870B1 publication Critical patent/KR0130870B1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04Homopolymers or copolymers of ethene
    • C09J123/08Copolymers of ethene
    • C09J123/0846Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0853Vinylacetate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The thermal fusion adhesive composition composing (a) 50~60wt% of ethylene vinylacetate copolymer(EVA) resin whose vinylacetate content is 25~30% and fusion index is over 150dg/min, (b) 8~12wt% of wax whose emulsification temperature is over 65 deg.C as viscosity coordinator, (c) 20~30wt% of a mixture in which styrene copolymer is mixed with petroleum resin with water(C5, C9) whose emulsification temperature is 80-110 deg.C as adhesive giver, (d) 8~12wt% of polybutene series' resin to give surface adhesiveness and balance in cohesive power and (e) 1~2wt% of oxidation preventing agent.

Description

필름형 열용융 접착제 조성물과 그 제조방법Film type hot melt adhesive composition and its manufacturing method

본 발명은 에틸렌 비닐아세테이트 공중합체( EVA : Ethylene Vinyl Acetate Copolymer)를 기본 수지로 한 필름(Film)형 열용융형 접착제 조성물과 그 제조방법에 관한 것이다.The present invention relates to a film-type hot melt adhesive composition based on an ethylene vinyl acetate copolymer (EVA) and a manufacturing method thereof.

통상, 기본 폴리머 조성으로 되어 있는 필름형 열용융 접착제(HMA: Hot Melt Adhesive)는 종이, 목재, 유리, 플라스틱, 스폰지, 금속 등의 피착제에 대해 접착이 용이하고 강한 접착 작용으로 각종 투명 필름과 코팅 제품의 제조, 방수처리, 보강제 및 기능성 복합소재 제조등의 여러 산업분야에서 다양하게 사용된다.In general, a film type hot melt adhesive (HMA) having a basic polymer composition is easily adhered to an adhesive such as paper, wood, glass, plastic, sponge, and metal, and has a strong adhesive action. It is widely used in various industries such as manufacturing coating products, waterproofing, reinforcing agents and functional composite materials.

종래 기술의 경우, EVA에멀죤을 사용하여 오리지널 폴리프로필렌(OPP)필름 코팅을 하고, 도포량으로 EVA에멀죤을 대략 7∼10g/㎡ 도포하는 등 다량 도포에도 불구하고 균일한 광택성이 결여되는 등 문제가 있었다. 또한, 상온 박리강도도 종래의 경우 1∼2㎏/㎠이나 본 발명의 경우 3∼4㎏/㎠로 획기적으로 증가된다.In the case of the prior art, the original polypropylene (OPP) film is coated using an EVA emulsion zone, and the uniform amount of gloss is lacking in spite of the large amount of application, such as by applying the EVA emulsion zone by approximately 7 to 10 g / m 2 as the coating amount. There was a problem. In addition, the room temperature peel strength is also drastically increased to 1 to 2 kg / cm 2 in the conventional case but to 3 to 4 kg / cm 2 in the present invention.

상기 용융접착제(HMA)는 상온에서 고체상태로 되어 있는데 사용할 때에는 가열용융시켜 각종 기재에 도포, 접착시키면 응고되어 접착력을 나타내는 접착제이다. 지금까지 용융접착제(HMA)는 요구되는 물성을 갖기 위해 기본 수지로서 에틸렌 비닐 아세테이트 공중합체, 에틸렌 아크릴레이트 공중합체 등의 에틸렌계 공중합체와, 폴리에틸렌, 열가소성 고무, 폴리아마이드, 폴리에스테르 등의 열가소성 고분자 물질을 사용해서 여기에 점도 조절제인 왁스류와 점착 부여수지인 천연 및 석유수지를 가해 용융 혼합, 제조되어 왔다. 이렇게 하여 제조된 용융접착제(HMA) 적용방법은 용융가열장치에서 어플리케이터(applicator), 즉 접착장치로 송출시키는 기계적 설비상으로는 물론 장기 고온 유지에 따른 용융접착제의 물성변화, 심한 경우는 탄화 현상까지 발생하는 문제점을 갖고 있다. 더욱이 원할한 제품 생산을 위해서 용융접착제도 오픈 타임(Open time), 셋팅 타임(Setting time)을 완벽하게 맞추면서 동시에 충분한 접착력을 유지시키는 데에는 취급상의 많은 주의를 요하는 등의 여러 가지 문제점이 제기되어 왔다.The melt adhesive (HMA) is a solid at room temperature, but when used, it is melted by heating and melting to apply and adhere to various substrates, thereby solidifying and exhibiting adhesive strength. Until now, in order to have required physical properties, a melt adhesive (HMA) is an ethylene copolymer such as ethylene vinyl acetate copolymer and ethylene acrylate copolymer, and thermoplastic polymer such as polyethylene, thermoplastic rubber, polyamide, and polyester as a basic resin. The materials have been melt mixed and prepared by adding waxes as viscosity modifiers and natural and petroleum resins as tackifying resins. The method of applying the melt adhesive (HMA) prepared in this way is not only on the mechanical equipment that is sent from the melt heating device to the applicator, that is, the adhesive device, but also changes in the physical properties of the melt adhesive due to long-term high temperature, and in some cases, carbonization. I have a problem. Furthermore, many problems have been raised, such as the need for handling care to maintain the sufficient adhesion while maintaining the perfect open time and setting time for the melt adhesive to produce a smooth product. .

본 발명상의 필름형 용융접착제는 접착시 필요한 가열 처리만 해주면 피착제에 대한 접착이 가능하기 때문에 용융접착제 제조시 필요한 접착 물성만 갖게 하여 주므로써 종래의 용융접착제의 적용상의 제반 문제를 해소하도록 한 것이다.The film-type melt adhesive according to the present invention solves all problems of application of the conventional melt adhesive by providing only the adhesive properties necessary for the manufacture of the melt adhesive because only the heat treatment necessary for the adhesion is possible. .

따라서 종래 용융접착제에 따른 상기 문제점을 해결하기 위해 본 발명은 각종 피착제에 대해서 우수한 접착성, 내열성, 내한성을 갖춘 용융접착제(HMA)를 필름(Film) 한쪽면 또는 양쪽면에 용융도포하고 이 용융접착제를 기계적으로 맞추기 어려운 제반 조건을 단순 가열만으로 우수한 접착은 물론 재료의 표면 코팅(coating)까지 가능하도록 한 핫 멜트 접착제(Hot melt Adhesive)를 제공하는데 목적이 있다.Therefore, in order to solve the above problems according to the conventional melt adhesive, the present invention melt-coated a melt adhesive (HMA) having excellent adhesion, heat resistance, and cold resistance to various ones on one or both sides of the film. It is an object of the present invention to provide a hot melt adhesive that enables excellent adhesion as well as surface coating of a material by simple heating for various conditions that are difficult to mechanically match an adhesive.

또한, 본 발명은 상술한 과제를 해결하기 위하여 표면에 도포가 용이하고 접착용도에 따라 접착력, 내열성, 내한성, 투명성 등을 가진 핫 멜트 접착제를 제조하기 위한 방법 및 그 접착제 조성물을 제공하기 위한 것으로, 필름에 코팅시킨 핫 멜트 접착제를 고가의 특수한 접착장치나 방법을 사용하지 않고도 용이하게 접착되게 하므로써 범용화가 가능한 접착제 제공은 물론 광택, 방수, 보강 등의 가능성을 부여하도록 한 것이다.In addition, the present invention is to provide a method for producing a hot melt adhesive having an adhesive force, heat resistance, cold resistance, transparency, etc. according to the adhesive use and easy to apply to the surface in order to solve the above problems, and an adhesive composition thereof, The hot melt adhesive coated on the film can be easily bonded without using an expensive special bonding device or method, thereby providing a general-purpose adhesive as well as giving a possibility of gloss, waterproofing, and reinforcement.

즉, 본 발명은 상술한 목적을 위하여 기본적으로, 에틸렌 비닐 아세테이트 공중합체(EVA : Ethylene Vinyl Acetate Copolymer)를 기본 수지로 하되, 기능성 HMA제조를 위하여 비닐 아세테이트(VA) 함량이 25∼30%이고 접착 효율을 높이기 위하여 용융지수(MI: Melt Index)가 150 dg/min이상 되는 EVA 수지를 전체 100중량부에 대하여 50∼60중량부로 혼합 구성하고, 점도 조절제로서 연화점이 65℃이상인 왁스류를 8∼12중량부 첨가하며, 아울러 점착 부여수지는 연화점이 80∼110℃로 되는 석유 수첨수지(C5, C9)와 스티렌 공중합체(Styrene Copolymer)를 혼합하여 20∼30 중량부로 사용하며, 또한 표면점착성과 응집력에 균형을 부여하기 위햐여 폴리부텐(Polybutene)계 수지를 8∼12중량부 첨가하고 필요에 따라 산화방지제를 1∼2중량부 첨가하여 140℃까지 가열하면서 용융혼합하여 연화점 이상에서 각종 필름, 금속 또는 금속증착필름, 각종 종이류 등의 일면 또는 양면에 1∼10㎛도포하여 사용하도록 한 필름 코팅용 용융접착제 조성물 및 그 제조방법으로 되어 있다.That is, the present invention is basically for the purpose of the above-mentioned, ethylene vinyl acetate copolymer (EVA: Ethylene Vinyl Acetate Copolymer) as the base resin, but the vinyl acetate (VA) content for the production of functional HMA is 25 to 30% adhesion In order to increase the efficiency, a melt resin (MI: Melt Index) of 150 dg / min or more is mixed with 50 to 60 parts by weight based on 100 parts by weight of the total, and 8 to waxes having a softening point of 65 ° C or more as a viscosity modifier. Twelve parts by weight is added, and the tackifying resin is mixed with petroleum hydrogenated resin (C 5 , C 9 ) having a softening point of 80 to 110 ° C. and styrene copolymer to be used at 20 to 30 parts by weight. To balance the adhesiveness and cohesion, 8 to 12 parts by weight of polybutene resin is added, and 1 to 2 parts by weight of antioxidant is added if necessary, followed by melt mixing while heating to 140 ° C. The film is a melt adhesive composition for coating a film, and a method for producing the same, which is coated on one surface or both surfaces of various films, metal or metal deposition films, various papers, or the like to be used.

상기 조성을 가진 본 발명상의 용융접착제(HMA)조성물은 연화점이 약 70∼90℃ 또는 조성성분부에 따라서는 그 이상이고 통상 160℃에서 용융코팅시 700∼1200pcs 범위의 점도를 가질 때 필름코팅에 유리하며, 또한 상기 물성을 가진 용융접착제 조성물을 각종 합성 고분자 필름, 금속 또는 금속 증착필름, 각종 종이류에 한쪽면(一面) 또는 양쪽면 도포하여 필름형으로 용융접착이 가능하도록 한 것으로 종래에 비하여 일층 접착효율을 높이면서도 극히 사용이 편리하도록 한 조성물이다.The melt adhesive (HMA) composition of the present invention having the above composition is advantageous for film coating when the softening point is about 70 to 90 ° C. or higher depending on the composition part and usually has a viscosity in the range of 700 to 1200 pcs when melt coating at 160 ° C. In addition, by applying the melt adhesive composition having the above properties to a variety of synthetic polymer film, metal or metal deposition film, various kinds of paper on one side or both sides to enable melt adhesion in the form of a film, one-layer adhesion It is a composition that is extremely easy to use while increasing the efficiency.

본 발명에 사용되는 기본 수지인 에틸렌 비닐 아세테이트 공중합체(EVA)수지는 각종 수지 중에서 선정한 것으로 선정 이유는 도포가 가능하고 용융접착 기능을 충분히 발휘할 수 있는 물성 조절이 유리한 특성을 갖춘 수지이기 때문이다. 이 에틸렌 비닐 아세테이트 공중합체(EVA)수지는 분자 내에 비닐 아세테이트 함량(VA%)과 열용융 유동속도(MFR)정도에 따라 그 그레이드(grade)가 결정되며, 물리적 특성 또한 이들 인자에 의존된다. 아세테이트 함량(VA%)은 EVA수지의 결정화도(Crystallinity)와 극성도(Polarity)의 지표(Index)가 된다. VA%가 증가되면 용융 및 결정화 온도가 낮아지고, 접착력과 배합성은 증가되나 필름의 경도(Hardness)는 감소시키는 경향을 보여주고 있기 때문에 본 발명은 용융접착제(HMA)요구 물성에 맞추기 위해서 VA%이 25∼33%로 되는 EVA수지를 사용하였다. 또한 EVA수지분자량 크기와 상관성이 높은 열용융유동속도(MFR)는 최소 150dg/min(180℃)이상되는 EVA수지물성이 실험적으로 요구되었다.The ethylene vinyl acetate copolymer (EVA) resin, which is a basic resin used in the present invention, is selected from various resins because it is a resin having advantageous properties of controlling physical properties that can be applied and exhibit sufficient melt bonding function. This ethylene vinyl acetate copolymer (EVA) resin is graded according to the vinyl acetate content (VA%) and the degree of hot melt flow rate (MFR) in the molecule, and the physical properties also depend on these factors. Acetate content (VA%) is an index of crystallinity and polarity of the EVA resin. Increasing VA% lowers the melting and crystallization temperature, increases adhesion and formulation, but decreases the hardness of the film. Therefore, the present invention has a VA% in order to meet the properties of the melt adhesive (HMA). An EVA resin of 25 to 33% was used. In addition, the EVA resin properties, which have a high thermal melt flow rate (MFR), which has a high correlation with the EVA resin molecular weight, are required to be at least 150 dg / min (180 ° C).

열용융유동속도(MFR)가 증가하면 용융점도, 연화점(Ring Bell softening point)이 낮아지는 경향을 나타나며 동시에 접착력과 내열성이 감소된다. 따라서, 오리지널 폴리프로필렌 또는 폴리프로필렌필름(OPP Film)과 같은 저용점의 필름에 코팅을 하기 위해서는 열용융유동속도가 상당히 높은 것을 사용하여야 한다. 그러나 응집력과 집착력을 고려하여 지나치게 높지 않은 적정수준의 열용융유동속도가 요구된다.Increasing the melt rate (MFR) tends to lower the melt viscosity and ring bell softening point, and at the same time decreases the adhesion and heat resistance. Therefore, in order to coat a low melting point film such as an original polypropylene or polypropylene film (OPP film), it is necessary to use a very high hot melt flow rate. However, considering the cohesion and cohesion, an appropriate level of heat melting flow rate is required, which is not too high.

본 발명의 특징은 에틸렌 비닐 아세테이트 수지의 기계적 코팅에 유리하도록 비교적 높은 열용융유동속도와 기타 첨가제 즉, 점착제, 합성고무 등의 배합성에 유리한 VA함량을 조화있게 배합시키기 위해서 전체 중량 100부에 대해서 50∼60부 사용으로 본 발명의 기능성 HMA제조를 성공적으로 유도할 수 있다.A feature of the present invention is that 100 parts by weight in order to harmoniously combine a relatively high hot melt flow rate and other VA content favorable for the blendability of the adhesive, synthetic rubber, etc. to favor the mechanical coating of ethylene vinyl acetate resin. The use of 50 to 60 parts can successfully induce the production of the functional HMA of the present invention.

본 발명에 사용된 왁스는 HMA에서 흔히 사용하는 파라핀 왁스, 미세 결정화 왁스(micro crystalline wax), 캐스터 왁스(castor wax), 염소화 왁스(chlorinated wax)등이며, 이들 왁스 중에서 용융점이 65℃ 이상되는 파라핀 왁스가 비교적 양호하였다.The waxes used in the present invention are paraffin waxes, micro crystalline waxes, castor waxes, chlorinated waxes, and the like, which are commonly used in HMA. The wax was relatively good.

점착 부여수지는 석유 수첨 수지계 C9계와 C5계 중 연화점이 100℃정도의 것과 스테렌 공중합체( Tg 36℃, 용융점도: 10 포아즈(poises)에서 138℃)의 연화점이 85℃ 정도의 것을 3:2 비율로 20∼30 중량부를 사용할 때 코팅적성과 양호한 접착력을 나타내는 것임을 실험결과 알게 되었다. 로진(Rosin)계 수지는 접착력만 고려한다면 사용할 수 있으나, 무명 투명 필름 코팅용 HMA는 무색 투명성 유지를 위해서 사용하기 어렵다. 그리고 표면 접착성과 응집력의 균형을 부여하기 위해서 폴리부텐(Polybuten)을 8∼12중량부 사용하였다. 이 폴리부텐은 투명하고 불순물이 함유되지 않은 무독성 액상으로 이소부텐(isobuten)을 주체로 한 일부의 n-부텐(n-buten) 반응해서 얻어진 공중합체로서 평균 분자량이 900∼2300이고, 동점도가 100F에서 300,000cst점도의 것이 양호하였다.Tackifying resins include petroleum hydrogenated resin C 9 based and C 5 as stearyl butylene copolymer of a softening point of about 100 ℃ of the system: the softening point of (Tg 36 ℃, melt viscosity of 10 poise (poises) 138 ℃ in) about 85 ℃ Experimental results show that the coating aptitude and the good adhesion when using 20 to 30 parts by weight of 3: 2 ratio. Rosin-based resin can be used only considering the adhesive force, it is difficult to use HMA for the coating of the clear transparent film to maintain colorless transparency. And 8 to 12 parts by weight of polybutene (Polybuten) was used in order to balance the surface adhesion and cohesion. This polybutene is a copolymer obtained by reaction of a part of n-butene mainly composed of isobutene in a transparent and non-toxic liquid containing no impurities. The average molecular weight is 900-2300 and the kinematic viscosity is 100F. The viscosity of 300,000 cst was good at.

산화방지제로서 벤젠프로판산(benzenpropanic acid), 3, 5-bis(1, 1-dimethylethyl)-4-하이드로옥시옥타텔 에스테르(hydrooxyoctadecyl ester)등의 페놀계를 1%사용하고, 디옥틸파탈레이트(dioctylphthalate)등의 가소제를 부분적으로 첨가할 수 있다.As an antioxidant, 1% of phenolic compounds such as benzenepropanic acid, 3, 5-bis (1, 1-dimethylethyl) -4-hydrooxyoctadecyl ester, and dioctylphthalate ( plasticizers such as dioctylphthalate) may be partially added.

이상과 같이 각종 필름 표면에 도포가 용이하고, 각종 피착제에 접착력이 우수한 HMA가 제조될 수 있기 때문에 필름형HMA를 본 발명에서 제공할 수가 있었다.As described above, since HMA can be easily applied to various film surfaces and excellent in adhesion to various adherends, a film type HMA can be provided in the present invention.

본 발명은 또한 필름형HMA제조를 위하여 HMA코팅을 위한 재료로서 각종 합성고분자 필름(예컨데 폴리비닐클로이드, 폴리프로필렌, 폴리에스텔 등), 금속 또는 금속 증착 필름, 각종 종이류(가공 종이류) 사용할 수 있으며, 이 재료의 용점이 100℃이상이면 HMA용융코팅이 일반적인 기계적 코팅 등이 가능하며, 적용 용도에 따라 코팅 재료(필름류)의 종류가 선정되고, HMA코팅 두께( 1∼10㎛)를 조정하여 제조할 수 있다. 또한 코팅하고자 하는 재료에 HMA코팅을 용이하게 유도하고, 기능성을 부여하기 위해서 전처리(방전처리, 코팅라미네이션 등)을 할 수 있다.The present invention can also use various synthetic polymer films (e.g. polyvinylcloroid, polypropylene, polyester, etc.), metal or metal deposition films, various papers (processed papers) as the material for HMA coating for the production of film type HMA. If the melting point of this material is 100 ℃ or more, HMA melt coating is possible for general mechanical coating, etc., and the type of coating material (films) is selected according to the application purpose and manufactured by adjusting the thickness of HMA coating (1 ~ 10㎛). can do. In addition, HMA coating can be easily induced on the material to be coated, and pretreatment (discharge treatment, coating lamination, etc.) may be performed to impart functionality.

(실시예1)Example 1

EVA수지(VA28%, 열용융유동속도 400dg/min) 55중량부, 파라핀 왁스(연화점 70℃) 10 중량부, 석유수첨 수지(C9, 연화점 100℃) 24중량부, 크리스탈린(crystallin)계 석유수지(연하점 85℃) 10 중량부, 폴리부텐( 동점도 89℃에서 300,000cst) 10 중량부 및 페놀계 산화방지제 1 중량부를 첨가하여 160℃까지 가열하면서 용융혼합하여 필름코팅용 HMA를 제조하였다.55 parts by weight of EVA resin (VA28%, hot melt flow rate 400dg / min), 10 parts by weight of paraffin wax (softening point 70 ° C.), 24 parts by weight of petroleum hydrogenated resin (C 9 , softening point 100 ° C.), crystallin 10 parts by weight of petroleum resin (eg, swallowing point 85 ° C.), 10 parts by weight of polybutene (300,000 cst at kinematic viscosity of 89 ° C.), and 1 part by weight of phenolic antioxidant were added thereto, followed by melt mixing while heating to 160 ° C. to prepare HMA for film coating. .

이 HMA의 물성은 연화점이 75℃이고, 160℃에서 900cps 가 되었다. 이 HMA를 180℃로 용융해서 로울 코터(Roll Coater)로 두께 15μm의 필름 폴리프로필렌필름(표면에 방정처리)에 2.8㎛ 두께로 일면 코팅하여 필름형 HMA를 제조했다. 이 HMA 필름은 그라비아 인쇄용지 표면에 열융착 라미네이팅 처리결과 표면 광택 상태가 양호하고 10㎜폭에 중앙이 되게 하고 20㎜폭에서 90도 박리를 행하였을 때의 접착강도가 3∼4㎏/㎠ 되었다.The physical property of this HMA was 75 degreeC in softening point, and was 900 cps at 160 degreeC. The HMA was melted at 180 ° C. and coated on a single surface of a film polypropylene film (surface treatment) with a thickness of 2.8 μm using a roll coater to produce a film type HMA. As a result of the heat-sealing lamination on the surface of the gravure printing paper, the HMA film had a good surface gloss, was centered on the 10 mm width, and had an adhesive strength of 3 to 4 kg / cm 2 when peeled off at 20 mm width at 90 degrees. .

(실시예2)Example 2

EVA수지(VA28%, 열용융유동속도 800dg/min) 60중량부 수지만 변경하고 기타 HMA조성은 (실시예1)와 같게 제조하여 180℃에서 20㎛의 폴리에틸렌 필름에 양면 코팅(코팅 두께3㎛) 처리한 HMA 필름을 제조하였다.Only 60 parts by weight of EVA resin (VA28%, hot melt flow rate 800dg / min) was changed and other HMA compositions were prepared in the same manner as in (Example 1) and coated on both sides of a polyethylene film of 20㎛ at 180 ℃ (coating thickness 3㎛ ) Treated HMA film was prepared.

이 HMA 필름으로 폴리비닐클로라이드(두께 5㎜)판과 폴리에스테르(두께 1.5mm)천을 용융접착 결과 8∼10㎏/㎠ 접착강도를 얻었다.A polyvinyl chloride (thickness 5 mm) plate and a polyester (thickness 1.5 mm) cloth were melt-bonded with this HMA film to obtain 8 to 10 kg / cm 2 adhesive strength.

(실시예3)Example 3

상기 실시예 1의 본 발명상의 필름형 HMA 열융합코팅을 두께 2㎜의 옵션 인쇄된 보드지에 HMA 3.5 g/㎡을 도포하여 접착한 결과 균일한 광택을 얻고 상온 박리강도도 양호한 값인 3.9㎏/㎠를 얻었다.The film-type HMA thermal fusion coating of the present invention of Example 1 was applied by applying 3.5 g / m 2 of HMA to an optional printed cardboard having a thickness of 2 mm to obtain uniform gloss and good peel strength at room temperature of 3.9 kg / ㎠ Got.

Claims (2)

비닐아세테이트(VA)함량이 25∼30%이고 용융지수가 150dg/min이상되는 에틸렌 비닐 아세테이트 공중합체(EVA) 수지 50∼60 중량부, 점도 조절제로서 연화점이 65℃이상되는 왁스류 8∼12 중량부와 또한 점착 부여제로서 연화점이 80∼110℃되는 석유수첨수지(C5, C9)와를 스텔렌 공중합체(styrene copolymer)와 혼합인 것을 20∼30중량부와, 또한 표면 점착성과 응집력상 균형을 부여하기 위하여 폴리부텐계 수지를 8∼12 중량부 및 필요에 따라 산화방지제 1∼2중량부를 첨가하여 140∼180℃까지 가열하면서 용융혼합하여 연화점 이상에서 각종 필름, 금속 또는 금속증착필름, 각종 종이류 등의 일면 또는 양면에 1∼10㎛ 도포하여 사용하도록 한 필름코팅용 용융접착제 조성물의 제조방법50 to 60 parts by weight of an ethylene vinyl acetate copolymer (EVA) resin having a vinyl acetate (VA) content of 25 to 30% and a melt index of 150 dg / min or more, and 8 to 12 weights of waxes having a softening point of 65 ° C or higher as a viscosity modifier. 20-30 parts by weight of a petroleum resin (C 5 , C 9 ) having a softening point of 80 to 110 ° C. as a tackifier and a styrene copolymer, and a surface cohesion and cohesive strength. In order to provide a balance, 8 to 12 parts by weight of polybutene-based resin and 1 to 2 parts by weight of antioxidant are added and melt-mixed while heating to 140 to 180 ° C. to provide various films, metals or metal deposition films, Method for producing a melt adhesive composition for film coating, which is applied to 1 to 10㎛ on one side or both sides of various papers, etc. 제1항에 있어서, 상기 필름코팅용 용융접착제(HMA) 조성물은 연화점이 70∼90℃이고, 통상 160℃에서 700∼1200 cps 의 점도를 가지는 것을 특징으로 하는 필름열용융형 접착제 조성물의 제조방법The method of claim 1, wherein the film coating melt adhesive (HMA) composition has a softening point of 70 to 90 ℃, and usually has a viscosity of 700 to 1200 cps at 160 ℃.
KR1019940010837A 1994-05-17 1994-05-17 Method for preparing hat-melt adhesive composition KR0130870B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940010837A KR0130870B1 (en) 1994-05-17 1994-05-17 Method for preparing hat-melt adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940010837A KR0130870B1 (en) 1994-05-17 1994-05-17 Method for preparing hat-melt adhesive composition

Publications (2)

Publication Number Publication Date
KR950032552A KR950032552A (en) 1995-12-22
KR0130870B1 true KR0130870B1 (en) 1998-04-20

Family

ID=19383305

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940010837A KR0130870B1 (en) 1994-05-17 1994-05-17 Method for preparing hat-melt adhesive composition

Country Status (1)

Country Link
KR (1) KR0130870B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020048672A (en) * 2000-12-18 2002-06-24 유현식 Ethylenevinylacetate-based adhesive resin composition
KR20200080092A (en) * 2018-12-26 2020-07-06 후이조우 이두 스테이셔너리 서플라이즈 캄파니 리미티드 Thermal Laminating Film for Printed Matter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020048672A (en) * 2000-12-18 2002-06-24 유현식 Ethylenevinylacetate-based adhesive resin composition
KR20200080092A (en) * 2018-12-26 2020-07-06 후이조우 이두 스테이셔너리 서플라이즈 캄파니 리미티드 Thermal Laminating Film for Printed Matter

Also Published As

Publication number Publication date
KR950032552A (en) 1995-12-22

Similar Documents

Publication Publication Date Title
US3232895A (en) Adhesive compositions comprising ethylene/vinyl acetate, chlorinated paraffin, and rosin
JP5709749B2 (en) Hot melt adhesives based on metallocene-catalyzed olefin-α-olefin copolymers
KR102036390B1 (en) Psa containing olefin block copolymers and styrene block copolymer
US3492372A (en) Hot melt adhesive composition based on an ethylene:propylene copolymer
JPH05239285A (en) Hot-melt composition that has good open time and forms creep-resistant bond when applied in thin layer
WO2006107763A2 (en) Hot melt pressure sensitive adhesives based on blends of styrene/butadiene copolymers
JPH02196878A (en) Hot-melt polybutadiene and poly(butylene/ethylene) adhesive and laminated structure using same
US3256228A (en) Compositions comprising ethylene/vinyl acetate copolymers and chlorinated waxes or chlorinated biphenyls
JP2004137297A (en) Hot-melt adhesive and disposable product using the same
US4456649A (en) Low-cost, highly filled, wax-based hot melt adhesives and coatings
CA2192866A1 (en) Adhesive composition
US3577372A (en) Hot melt adhesive compositions
JPS59140277A (en) Semi-crystal ethylene-alpha-olefin copolymer for hot melt adhesive
WO1997029625A1 (en) Bilayer adhesive system for reinforced strapping tape
JPH04236288A (en) Hot melt adhesive composition
KR0130870B1 (en) Method for preparing hat-melt adhesive composition
US4761341A (en) Temporarily bonded constructions
JP2506849B2 (en) Surface protection film
EP0223858B1 (en) Polymer composition and use thereof
JPH07116419B2 (en) Hot melt adhesive for polypropylene
JPH07116410B2 (en) Adhesive film for surface protection
AU612386B2 (en) Hot melt adhesives
US3325431A (en) Wax ethylene-lower alkyl acrylate copolymer hot melt adhesive
JPH0726073B2 (en) Hot melt adhesive composition
US3900361A (en) Hot fusion coating masses

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20061030

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee