KR0117077Y1 - Plcc package - Google Patents
Plcc package Download PDFInfo
- Publication number
- KR0117077Y1 KR0117077Y1 KR2019940015990U KR19940015990U KR0117077Y1 KR 0117077 Y1 KR0117077 Y1 KR 0117077Y1 KR 2019940015990 U KR2019940015990 U KR 2019940015990U KR 19940015990 U KR19940015990 U KR 19940015990U KR 0117077 Y1 KR0117077 Y1 KR 0117077Y1
- Authority
- KR
- South Korea
- Prior art keywords
- pin
- package
- grooves
- coupling portion
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
- B23H1/04—Electrodes specially adapted therefor or their manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
본 고안은 I.C 팩케이중 일종인 PLCC(Plastic Leaded Chip Carrier)팩케이지의 리드핀을 구부리기 위하여 핀포켓트를 방전가공하도록 안출한 피엘씨씨 팩케이지의 핀포켓트가공용 전극에 관한 것이다.The present invention relates to a pin pocket processing electrode of a PPC package which is designed to discharge the pin pocket in order to bend the lead pin of the PLCC (Plastic Leaded Chip Carrier) package, which is a kind of I.C package.
도전체인 끝단에 사각형의 결합부(411)를 돌출되게 형성한 뒤 그 외주면 끝단에 다수개의 홈(412)을 일정간격으로 형성된 샹크(410)와 사각형의 결합구멍(421)이 형성된 내주면에 상기 홈(412)과 대향되게 다수개의 홈(422)을 형성하여 PLCC팩케이지(10)의 핀포켓트(12)와 동일한 형상이 형성되도록 결합부(411)의 끝단에 끼우는 동시에 접착고정되는 핀포켓트성형판(420)과 내주면에 사각형의 결합구멍(431)을 형성하여 상기 결합부(411)에 끼워지는 동시에 접착제로 접착고정되어 핀포켓트성형판(420)을 받쳐주는 받침대(430)로 구성한 것을 특징으로 하는 피엘씨씨 팩케이지의 핀포켓트가공용 방전전극이다.The groove is formed on the inner circumferential surface of the shank 410 and the rectangular coupling hole 421 formed at a predetermined interval with a plurality of grooves 412 formed at a predetermined distance from the end of the conductor to form a rectangular coupling portion 411. A plurality of grooves 422 are formed to face the plurality of grooves 422 so as to form the same shape as the pin pocket 12 of the PLCC package 10, and the pin pocket is inserted into the end of the coupling portion 411 and adhesively fixed. Formed into the forming plate 420 and the inner circumferential surface formed of a square coupling hole 431 is fitted to the coupling portion 411 and is fixed with an adhesive and is composed of a pedestal 430 to support the pin pocket molding plate 420 It is a discharge electrode for pin-pocket processing of a PPC package.
Description
제1도는 PLCC팩케이지의 종단면도 및 저면도.1 is a longitudinal cross-sectional view and a bottom view of a PLCC package.
제2도는 제1도의 A부의 확대도.2 is an enlarged view of a portion A of FIG.
제3도 (a)(b)는 리드프레임의 평면도 및 저면도.Figure 3 (a) (b) is a plan view and a bottom view of the lead frame.
제4도는 금형에 핀포켓트의 방전가공예시도.4 is a discharge machining example of the pin pocket in the mold.
제5도는 본 고안 방전전극의 분해사시도.5 is an exploded perspective view of the discharge electrode of the present invention.
제6도는 본 고안 방전전극의 조립단면도.6 is an assembled cross-sectional view of the discharge electrode of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
40 : 방진전극 410 : 샹크40: dustproof electrode 410: shank
411 : 결합부 412,422 : 홈411: coupling portion 412, 422: groove
420 : 핀포켓트성형판 421,431 : 결합구멍420: pin pocket molding plate 421, 431: coupling hole
430 : 받침대430 pedestal
본 고안은 I.C 팩케이중 일종인 PLCC(Plastic Leaded Chip Carrier)팩케이지의 리드핀을 구부리기 위하여 핀포켓트를 방전가공하도록 안출한 피엘씨씨 팩케이지의 핀포켓트가공용 전극에 관한 것이다.The present invention relates to a pin pocket processing electrode of a PPC package which is designed to discharge the pin pocket in order to bend the lead pin of the PLCC (Plastic Leaded Chip Carrier) package, which is a kind of I.C package.
종래에는 I.C 팩케이중 일종인 PLCC팩케이지(10)는 제1도 및 제2도와 같이 리드핀(11)을 구부려서 저면에 형성된 핀포켓트(12)에 위치하도록 포밍하여야 된다.Conventionally, the PLCC package 10, which is a type of I.C package, needs to be formed to be located at the pin pocket 12 formed on the bottom by bending the lead pin 11 as shown in FIGS. 1 and 2.
즉, PLCC팩케이지(10)는 제3도와 같이 다수개로 연속 배열되어 리드프레임(20)으로 제작된 뒤 리드핀(11)의 절곡작업을 위한 금형으로 이동시켜 포밍작업을 하도록 되어 있다.That is, the PLCC package 10 is arranged in a plurality of continuous as shown in FIG. 3 to be produced as a lead frame 20 and then moved to a mold for bending work of the lead pin 11 to form a work.
따라서 리드핀(11)의 포밍작업을 위하여 PLCC팩케이지(10)의 저면에 사각형을 그리면서 다수개의 핀포켓트(12)를 형성하여야 리드핀(11)의 끝단이 핀포케트(12)내로 포밍할 수가 있다.Therefore, in order to form the lead pin 11, a plurality of pin pockets 12 must be formed while drawing a rectangle on the bottom of the PLCC package 10 so that the ends of the lead pin 11 are formed into the pin pocket 12. You can do it.
따라서 PLCC팩케이지(10)의 저면에 사각형을 그리면서 다수개의 핀포켓트(12)를 성형하기 위하여 제4도와 같이 금형(30)에 PLCC팩케이지(10)의 핀포케트(12)와 대응되게 이와 동일한 형상의 캐비티(31)를 돌출성형하여야 되므로 그 캐비티(31)의 성형을 위하여 방전전극(40)에 핀포케트(12)와 동일한 성형부를 가공하여 금형(30)에 캐비티(31)를 방전가공하였던 것이다.Therefore, in order to mold a plurality of pin pockets 12 while drawing a quadrangle on the bottom of the PLCC package 10, the mold 30 is formed to correspond to the pin pockets 12 of the PLCC package 10 in FIG. Since the cavity 31 having the same shape must be protruded, the same molding portion as the pin pocket 12 is processed on the discharge electrode 40 to form the cavity 31 to discharge the cavity 31 from the mold 30. It was processed.
그러나 이러한 방전전극(40)을 기계가공으로 하여야 되는데 따르는 어려움과 가공비의 고가용인이 되는 문제점이 있었던 것이다.However, there was a problem in that the discharge electrode 40 has to be machined and has difficulty in high cost and processing cost.
본 고안은 이러한 종래의 문제점을 해결하고자 안출한 것으로, 피엘씨씨 팩케이지의 핀포켓트가공용 방전전극을 다수개의 부품으로 분할 가공한 뒤 이를 다시 조립하도록 하므로서 가공이 편리하면서 가공비의 절감을 도모하고자 하는데 그 목적이 있다.The present invention was devised to solve such a conventional problem, and it is intended to reduce the processing cost and to simplify the process by splitting the pin pocket processing discharge electrode of the PPC package into a plurality of parts and reassembling it. The purpose is.
이하 본 고안을 첨부도면에 의하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
도면 제5도 및 제6도는 본 고안의 실시예로써, 도전체인 끝단에 사각형의 결합부(411)를 돌출되게 형성한 뒤 그 외주면 끝단에 다수개의 홈(412)을 일정간격으로 형성된 샹크(410)와 사각형의 결합구멍(421)이 형성된 내주면에 상기 홈(412)과 대향되게 다수개의 홈(422)을 형성하여 PLCC팩케이지(10)의 핀포케트(12)와 동일한 형상이 형성되도록 결합부(411)의 끝단에 끼우는 동시에 접착고정되는 핀포케트성형판(420)과 내주면에 사각형의 결합구멍(431)을 형성하여 상기 결합부(411)에 끼워지는 동시에 접착제로 접착고정되어 핀포케트성형판(420)을 받쳐주는 받침대(430)로 피엘씨씨 팩케이지의 핀포켓트가공용 방전전극(40)을 구성한 것이 본 고안의 특징이다.5 and 6 are embodiments of the present invention, and the shank 410 formed with a plurality of grooves 412 formed at regular intervals after forming the coupling portion 411 of the rectangular shape at the end of the conductor to protrude. And a plurality of grooves 422 formed on the inner circumferential surface of the coupling hole 421 having a rectangular shape to face the groove 412 to form the same shape as the pin pocket 12 of the PLCC package 10. Pin pocket molding plate 420 which is inserted into the end of the 411 and adhesively fixed at the same time to form a rectangular coupling hole 431 on the inner circumferential surface is fitted to the coupling portion 411 and adhesively fixed with an adhesive pin pocket molding plate It is a feature of the present invention that a pin pocket processing discharge electrode 40 of the PPC package is constructed as a support 430 supporting the 420.
이와같이 구성된 본 고안은, 샹크(410)와 핀포케트성형판(420), 받침대(430)를 각각 분리 가공한 뒤 샹크(410)의 결합부(411)에 받침대(430)의 결합구멍(431)을 끼워서 순간접착제 등으로 접착하여 일체화하고, 그 후 상기 결합부(411)에 핀포켓트성형판(420)의 결합구멍(421)을 끼우는 동시에 상술한 바와같이 순간접착제로 일체로 접착하여 일체화하여 주므로서 핀포켓트가공용 방전전극(40)이 완성되는 것이다.According to the present invention configured as described above, the shank 410, the pin pocket molding plate 420, and the pedestal 430 are separately processed, and then the coupling hole 431 of the pedestal 430 is coupled to the coupling portion 411 of the shank 410. By inserting the adhesive into the instantaneous adhesive or the like, and then inserting the coupling hole 421 of the pin-pocket molding plate 420 into the coupling part 411 and simultaneously integrating it with the instantaneous adhesive as described above. As a result, the pin pocket processing discharge electrode 40 is completed.
이때, 상기 결합부(411)의 홈(412)과 핀포켓트성형판(420)의 홈(422)을 상호 일치되게 대향되도록 조립하여 핀포켓트와 동일한 형상의 성형부로 형성하여 주므로서 금형(30)에 핀포케트성형용 캐비티(31)를 성형할 수가 있는 것이다.At this time, the grooves 412 of the coupling portion 411 and the grooves 422 of the pin pocket molding plate 420 are assembled to face each other to form a molded part having the same shape as that of the pin pocket. The pin pocket molding cavity 31 can be formed in 30).
이와같이 본 고안은 피엘씨씨 팩케이지의 핀포켓트가공용 방전전극을 다수개의 부품으로 분할 가공한 뒤 이를 다시 조립하도록 하므로서 가공이 편리하면서 가공비의 절감을 도모할 수가 있는 등 매우 실용적인 것이다.In this way, the present invention is very practical, such as to facilitate the processing and to reduce the processing cost by splitting the pin electrode processing discharge electrode of the PPC package into a plurality of parts and then reassembled.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940015990U KR0117077Y1 (en) | 1994-06-30 | 1994-06-30 | Plcc package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940015990U KR0117077Y1 (en) | 1994-06-30 | 1994-06-30 | Plcc package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960003144U KR960003144U (en) | 1996-01-22 |
| KR0117077Y1 true KR0117077Y1 (en) | 1998-04-22 |
Family
ID=19387265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019940015990U KR0117077Y1 (en) | 1994-06-30 | 1994-06-30 | Plcc package |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0117077Y1 (en) |
-
1994
- 1994-06-30 KR KR2019940015990U patent/KR0117077Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR960003144U (en) | 1996-01-22 |
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