KR0108395Y1 - Sputtering system for semiconductor device - Google Patents

Sputtering system for semiconductor device

Info

Publication number
KR0108395Y1
KR0108395Y1 KR93025950U KR930025950U KR0108395Y1 KR 0108395 Y1 KR0108395 Y1 KR 0108395Y1 KR 93025950 U KR93025950 U KR 93025950U KR 930025950 U KR930025950 U KR 930025950U KR 0108395 Y1 KR0108395 Y1 KR 0108395Y1
Authority
KR
South Korea
Prior art keywords
semiconductor device
sputtering system
sputtering
semiconductor
Prior art date
Application number
KR93025950U
Other languages
Korean (ko)
Inventor
Kyung-Soo Cho
Original Assignee
Hyundai Electronics Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Ind filed Critical Hyundai Electronics Ind
Priority to KR93025950U priority Critical patent/KR0108395Y1/en
Priority to JP6298246A priority patent/JP2669602B2/en
Application granted granted Critical
Publication of KR0108395Y1 publication Critical patent/KR0108395Y1/en

Links

KR93025950U 1993-12-01 1993-12-01 Sputtering system for semiconductor device KR0108395Y1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR93025950U KR0108395Y1 (en) 1993-12-01 1993-12-01 Sputtering system for semiconductor device
JP6298246A JP2669602B2 (en) 1993-12-01 1994-12-01 Sputtering equipment for semiconductor device manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR93025950U KR0108395Y1 (en) 1993-12-01 1993-12-01 Sputtering system for semiconductor device

Publications (1)

Publication Number Publication Date
KR0108395Y1 true KR0108395Y1 (en) 1997-10-21

Family

ID=19369476

Family Applications (1)

Application Number Title Priority Date Filing Date
KR93025950U KR0108395Y1 (en) 1993-12-01 1993-12-01 Sputtering system for semiconductor device

Country Status (2)

Country Link
JP (1) JP2669602B2 (en)
KR (1) KR0108395Y1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100517550B1 (en) * 2002-12-04 2005-09-29 삼성전자주식회사 Atomic layer deposition apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58177463A (en) * 1982-04-12 1983-10-18 Hitachi Ltd Method and device for formation of thin film
JPH05311419A (en) * 1992-04-01 1993-11-22 Nec Corp Magnetron type sputtering device
JPH06299346A (en) * 1993-04-13 1994-10-25 Nippon Steel Corp Sputtering device
JP3366391B2 (en) * 1993-08-17 2003-01-14 東京エレクトロン株式会社 Sputtering apparatus and sputtering film forming method

Also Published As

Publication number Publication date
JPH07211640A (en) 1995-08-11
JP2669602B2 (en) 1997-10-29

Similar Documents

Publication Publication Date Title
TW371512U (en) Semiconductor device
GB2269935B (en) Semiconductor device
EP0564204A3 (en) Semiconductor device
EP0594441A3 (en) Semiconductor device
SG43018A1 (en) Semiconductor device
AU659002B2 (en) Semiconductor device
GB9218882D0 (en) Tracking device
KR960012648B1 (en) Resin-seal type semiconductor device
GB2285175B (en) Semiconductor device
AU6110096A (en) Ice restraining device
KR970006537B1 (en) Semiconductor device
AU5437194A (en) Device for protection
AU3393493A (en) Semiconductor device
GB2267996B (en) Semiconductor device
GB2274203B (en) Semiconductor device
EP0730347A3 (en) Semiconductor device
EP0635883A3 (en) Semiconductor device inspection system.
AU2275792A (en) Device for shaping-dough portions
SG49206A1 (en) Semiconductor device
HU9400804D0 (en) Device for serving shelves
KR970006538B1 (en) Semiconductor device
KR970003890B1 (en) Semiconductor device
GB2281046B (en) Device for tightening screwed connections
KR0108395Y1 (en) Sputtering system for semiconductor device
EP0608478A3 (en) Device for cathodic sputtering.

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20080728

Year of fee payment: 12

EXPY Expiration of term