KR0108395Y1 - Sputtering system for semiconductor device - Google Patents
Sputtering system for semiconductor deviceInfo
- Publication number
- KR0108395Y1 KR0108395Y1 KR93025950U KR930025950U KR0108395Y1 KR 0108395 Y1 KR0108395 Y1 KR 0108395Y1 KR 93025950 U KR93025950 U KR 93025950U KR 930025950 U KR930025950 U KR 930025950U KR 0108395 Y1 KR0108395 Y1 KR 0108395Y1
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- sputtering system
- sputtering
- semiconductor
- Prior art date
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR93025950U KR0108395Y1 (en) | 1993-12-01 | 1993-12-01 | Sputtering system for semiconductor device |
JP6298246A JP2669602B2 (en) | 1993-12-01 | 1994-12-01 | Sputtering equipment for semiconductor device manufacturing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR93025950U KR0108395Y1 (en) | 1993-12-01 | 1993-12-01 | Sputtering system for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR0108395Y1 true KR0108395Y1 (en) | 1997-10-21 |
Family
ID=19369476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR93025950U KR0108395Y1 (en) | 1993-12-01 | 1993-12-01 | Sputtering system for semiconductor device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2669602B2 (en) |
KR (1) | KR0108395Y1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100517550B1 (en) * | 2002-12-04 | 2005-09-29 | 삼성전자주식회사 | Atomic layer deposition apparatus |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58177463A (en) * | 1982-04-12 | 1983-10-18 | Hitachi Ltd | Method and device for formation of thin film |
JPH05311419A (en) * | 1992-04-01 | 1993-11-22 | Nec Corp | Magnetron type sputtering device |
JPH06299346A (en) * | 1993-04-13 | 1994-10-25 | Nippon Steel Corp | Sputtering device |
JP3366391B2 (en) * | 1993-08-17 | 2003-01-14 | 東京エレクトロン株式会社 | Sputtering apparatus and sputtering film forming method |
-
1993
- 1993-12-01 KR KR93025950U patent/KR0108395Y1/en not_active IP Right Cessation
-
1994
- 1994-12-01 JP JP6298246A patent/JP2669602B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07211640A (en) | 1995-08-11 |
JP2669602B2 (en) | 1997-10-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20080728 Year of fee payment: 12 |
|
EXPY | Expiration of term |